Technical Product GuideTriconex General Purpose v2 Systems Introduction .......................................................................... 1 System Overview................................................................. 3 Setting up a Tri-GP System ............................................... 13 Product Specifications ....................................................... 17 Communication Capabilities .............................................. 43 TriStation 1131 Developer’s Workbench ........................... 45 CEM Programming Language Editor................................. 49 Sequence of Events (SOE) Capability............................... 51 Glossary............................................................................. 53 Part No. 9791036-001 November 2010 Preface Information in this document is subject to change without notice. Companies, names and data used in examples herein are fictitious unless otherwise noted. No part of this document may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, without the express written permission of Invensys Systems, Inc. © 2010 by Invensys Systems, Inc. All rights reserved. Invensys, the Invensys logo, Triconex, Tricon, Trident, and TriStation are trademarks of Invensys plc, its subsidiaries and affiliates. All other brands may be trademarks of their respective owners. DISCLAIMER Because of the variety of uses for this equipment and because of the differences between this fault-tolerant equipment and traditional programmable logic and process controllers, the user of, and those responsible for applying, this equipment must satisfy themselves as to the acceptability of each application and the use of the equipment. The illustrations, charts and layout examples shown in this manual are intended solely to illustrate the text of this manual. Because of the many variables and requirements associated with any particular installation, Invensys Systems, Inc. cannot assume responsibility or liability for actual use based upon the illustrative uses and applications. In no event will Invensys Systems, Inc. be responsible or liable for indirect or consequential damages resulting from the use or application of this equipment. INVENSYS SYSTEMS, INC. DISCLAIMS ANY IMPLIED WARRANTY OF FITNESS FOR A PARTICULAR PURPOSE. Invensys Systems, Inc. reserves the right to make changes at any time in order to improve design and to supply the most reliable product. No patent or copyright liability is assumed by Invensys Systems, Inc. with respect to use of information, circuits, equipment or software described in this text. TECHNICAL SUPPORT Customers in the U.S. and Canada can obtain technical support from the Invensys Global Customer Support (GCS) center at the numbers below. International customers should contact their regional support center. Telephone: Fax: E-mail: Toll-free number Toll number Toll number 866-746-6477 508-549-2424 (outside U.S.) 508-549-4999
[email protected] The Tri‐GP controller is state‐of‐the art and provides fault tolerance by means of Triple‐Modular Redundant (TMR) architecture. Introduction What is Fault-Tolerant Control? Fault-tolerance in a control system identifies and compensates for failed system elements and allows repair while continuing to control an industrial process without interruption. A high-integrity control system such as the Triconex® General Purpose (Tri-GP) controller can be used in critical process applications that require a significant degree of safety and availability. What is the Tri-GP Controller? The Tri-GP controller is a state-of-the art programmable logic controller that provides fault tolerance by means of Triple-Modular Redundant (TMR) architecture. TMR integrates three isolated, parallel control systems and extensive diagnostics in one control system. The system uses two-out-ofthree voting to provide high-integrity, error-free, uninterrupted process operation with no single point of failure. The Tri-GP controller uses three identical channels. Each channel independently executes the application in parallel with the other two channels. Specialized hardware and software voting mechanisms qualify and verify all digital inputs and outputs from the field, while analog inputs are subject to a mid-value selection process. Because each channel is isolated from the others, no single-point failure in any channel can pass to another. If a hardware failure occurs on one channel, the other channels override it. Meanwhile, the faulting module can be easily removed and replaced while the controller is online without interrupting the process. Tri-GP System Mounted on a Panel Setting up applications is simplified with the triplicated Tri-GP system, because it operates as a single control system from a customer’s point of view. You can terminate sensors and actua- tors at a single wiring terminal and program the Tri-GP controller with one set of application logic. The Tri-GP controller manages the rest. 1 Introduction Extensive diagnostics on each channel, module, and functional circuit immediately detect and report operational faults by means of indicators or alarms. All diagnostic fault information is accessible to the application and the operator. This diagnostic data can be used to modify control actions or to direct maintenance procedures. Other features of the Tri-GP controller that ensure the highest possible system integrity include: • Ability to withstand harsh industrial environments. • Optimized for applications with small to medium point counts. • Support for remote and distributed I/O. • Wall- or skid-mounting outside of control room and enclosures. • Version 2.x supports 25 total I/O Baseplates. • Hot-spare I/O modules for critical applications where prompt attention from the operator is not possible. • Integral support for redundant field power and logic power sources. • Integration of I/O modules with field termination assemblies. • Field installation and repair at the module level while the controller remains online and without disturbing field wiring • Execution of applications developed and debugged using the TriStation™ 1131 Developer’s Workbench. • TriStation 1131 and Modbus communication from the Main Processors. What are Typical UserCreated Applications? Each day Tri-GP systems supply increased safety, reliability, and availability to a worldwide installed base. The following sections describe typical applications. For details on the value Tri-GP can bring to your applications, ask your sales representative for additional documentation and customer references. Emergency Safety Shutdown (ESD) Tri-GP controllers provide continuous protection for safety-critical units in refineries, petrochemical and chemical plants, and other industrial processes. For example, in reactor and compressor units, plant trip signals—for pressure, product feed rates, expander pressure equalization and temperature—are monitored and shutdown actions taken if an upset condition occurs. Traditional shutdown systems implemented with mechanical or electronic relays may provide shutdown protection, but can also cause dangerous nuisance trips. Boiler Flame Safety Process steam boilers are a critical component in most refinery applications. Protection of the boiler from upset conditions, safety interlock for normal startup and shutdown, and flame-safety applications are combined in one integrated Tri-GP system. In traditional applications, these functions are provided by separate, nonintegrated components. With the faulttolerant, fail-safe Tri-GP controller, the boiler operations staff can use a critical resource more productively while maintaining safety at or above the level of electromechanical protection systems. What is TriStation 1131 Developer's Workbench? The TriStation 1131 Developer's Workbench is an integrated tool for developing, testing, and documenting applications for the Tri-GP controller. The programming methodology, user interface, and self-documentation capabilities make TriStation 1131 software superior to traditional and competing engineering tools. TriStation 1131 software complies with Part 3 of the IEC 61131 International Standard for Programmable Controllers and follows the Microsoft® Windows® guidelines for graphical user interfaces. What about Communication Capabilities? The Tri-GP controller provides communication capabilities through ports on the Main Processor and Communication Modules. Ports on the MP support Modbus slave and TriStation 1131 protocols. Ports on the CM support: • Modbus slave (ASCII or RTU) • Modbus master (RTU) • Modbus master or slave (TCP) • TriStation 1131 software • TCP/IP • TSAA (UDP/IP) • TSAA with IP multicast (UDP/IP) • Triconex Time Synchronization (DLC, UDP/IP, or SNTP) • Triconex Peer-to-Peer (DLC or UDP/IP) • HP JetDirect® (DLC/LLC) The Communication Baseplate can contain one or two CM Modules. For more information, see page 43. 2 The Tri‐GP controller is designed with a fully triplicated architecture throughout, from the input modules through the Main Processors to the output modules. System Overview Fault tolerance in the Tri-GP controller is achieved through the Triple Modular Redundant (TMR) architecture. The Tri-GP provides error-free, uninterrupted control in the event of hard failures of components or transient faults from internal or external sources. The Tri-GP is designed with a fully triplicated architecture throughout, from the input modules through the Main Processors (MPs) to the output modules. Each module houses the circuitry for three independent channels. Each channel on an input module reads the process data and passes it to the corresponding MP. The three MPs communicate with each other using a proprietary, high-speed bus called the TriBus. Once per scan, the MPs synchronize and communicate with their neighbors over the TriBus. The TriBus sends copies of all analog and digital input data to each MP, then compares output data from each MP. The MPs vote the input data, execute the application, and send outputs generated by the application to the output modules. In addition, the Tri-GP controller votes the output data on the output modules as close to the field as possible. This allows the Tri-GP to detect and compensate for any errors that could occur between the TriBus voting and the final output driven to the field. Each I/O Baseplate supports two modules in one logical slot which means both the active and hot-spare module receive the same information from the field termination wiring. The Main Processors switch control between the two healthy I/O modules approximately every hour, so that each module undergoes complete diagnostics on a regular basis. If a fault is detected on the active module, Tri-GP automatically switches control to the hot-spare module, allowing the system to continuously work in triplicated control. The faulty module can then be removed and replaced. For details, see “Online Module Repair” on page 11. Main Processor Module Every Tri-GP system contains three Main Processors. Each MP controls a separate channel and operates in parallel with the other two MPs. A dedicated I/O control processor on each MP manages the data exchanged between the MP and the I/O modules. A triplicated I/O bus, located on the baseplates, extends from one column of I/O modules to the next column using I/O bus cables. The I/O control processor polls the input modules and transmits the new input data to the MPs. The MPs then assemble the input data into tables which are stored in memory for use in Simplified Tri-GP Architecture 3 The TriBus uses a programmable device with direct memory access to synchronize. the I/O control processor generates a smaller table for each output module and transmits these tables to the appropriate channels of the output modules over the I/O bus. This port can also be used to download Tri-GP firmware to the Flash ROM. If the controller loses power. and compare data among the three Main Processors. Main Processor A transmits a table to Channel A of each output module over I/O Bus A. transmit. Ports on the Main Processors enable the Tri-GP to communicate with TriStation 1131 software and with external devices by means of Modbus and Ethernet protocol. voting takes place. diagnostics.6 V Battery and Monitor Dual-Power Regulators Debug (RJ-12) I/O Bus Diagnostic Bus Channels (to other MPs) Debug (RJ-12) Modbus (DB-9) Reserved (DB-9) Ethernet Network (RJ-45) System Alarm Program Alarm data. Using the table of output values. Each MP provides 16 megabytes of DRAM for the user-written application. all critical retentive data is stored in NVRAM (NonVolatile Random Access Memory). the signal value found in two out of three tables prevails. The MPs maintain data about necessary corrections in local memory. After this transfer. The Main Processors receive power from redundant 24-volt DC power sources. and communication buffers. Each MP provides: • One Ethernet (IEEE 802.3 V +5 V 3. If a disagreement occurs. sequence-of-events (SOE) and I/O 4 . and the MPs correct the third table accordingly. Built-in fault analyzer routines flag any disparity and use it at the end of each scan to determine whether a fault exists on a particular module. • One Modbus RS-232 or RS-485 serial port which acts as a slave while an external device is the master. The transmittal of output data has priority over the routine scanning of all I/O modules. The Main Processors send the corrected data to the application. Typically. A failure of one power source does not affect controller performance. The 32-bit MP executes the application in parallel with the neighboring MP and generates a table of output values that is based on the table of input values according to user-defined rules. The I/O control processor on each MP manages the transmission of output data to the output modules by means of the I/O bus. a distributed control system (DCS) monitors— and optionally updates—the Tri-GP controller data directly through an MP. For example. The input table in each MP is transferred to its neighboring MP by the TriBus. MPC860A Clock/NVRAM 8 KB MPC860A 36-Bit Bus Shared Memory 128 K 36-Bit Bus Flash 6 MB TriBus FPGA DRAM 16 MB DRAM 16 MB Up Stream Tribus (to other MPS) Up Stream Down Stream Down Stream Main Processor Architecture the voting process.3) TriStation 1131 port for downloading the application to the Tri-GP controller and uploading diagnostic information. The application is stored in flash EPROM and loaded in DRAM for execution. In the event of an external power failure.System Overview Program Processor I/O Processor Dual 24 V Power Inputs Alarm 1 Alarm 2 Redundant Alarm Relays +3. One-time differences which result from sample timing variations are distinguished from a pattern of differing data. the application and all critical data are retained indefinitely. I/O Extender Modules and I/O Bus Cables. consists of three independent. The MPs synchronize at the beginning of every scan. Either position can hold the active I/O module while the other position holds the hotspare I/O module. Each I/O column draws power from both power rails through redundant DC-DC power converters. both the active module and the hot-spare module receive the same information from the field termination wiring. serial links operating at 25 megabits per second. Next. Each channel is powered independently by these redundant power sources. Each column is typically limited to eight baseplates due to vertical space restrictions. MP I/O Power Bus I/O Power Supply #1 Power Supply #2 I/O Bus Channel A Channel B Channel C ~ ~~ EM CM Communication Bus Interconnect Assembly I/O (25 I/O Baseplates Maximum) (8 I/O Baseplates Maximum per Column) I/O Bus I/O I/O Bus Power Bus EM EM I/O Bus and Logic Power Distribution A triplicated I/O bus between the I/O modules and the MPs transfers data at 2 megabits per second.Bus and Power Distribution The triplicated I/O bus and redundant logic power (shown in the figure to the right) are carried from baseplate to baseplate by user-installed Interconnect Assemblies. the TriBus takes these actions: • Transfers input. This ensures that the same data is received by the upstream processor and the downstream processor. Field signal distribution is local to each I/O baseplate. Isolation is provided between field and logic power on all I/O modules. Each field connection on the baseplate extends to both active and hot-spare I/O modules. then each MP sends its data to its upstream and downstream neighbors. diagnostic and communication data • Compares data and identifies disagreements with the output data and application memory of the previous scan An important feature of the Tri-GP architecture is the use of a single transmitter to send data to both the upstream and downstream MPs. Consequently. The two I/O module slots on the baseplate tie together as one logical slot. Logic power for the modules in each I/O column is distributed using two independent power rails. Each column of modules must have a separate logic power connection. The I/O bus is contained within an I/O column and can be extended to another I/O column using a set of three I/O bus cables (one for each TMR channel). Each I/O module transfers signals to or from the field through its associated baseplate assembly. 5 . The TriBus. which is local to the MP Baseplate. In TMR mode. Analog Input/Digital Input Module The Analog Input/Digital Input Module has 16 digital input points (points 1–16) and 16 analog input points (points 17– 32). The AI/DI Module has three isolated sets of electronics. Periodic manual calibration is not required. and transmits it to the MPs on demand. Each input table is passed to its associated MP over the corresponding I/O bus. an ASIC on each channel scans each input point. Each AI Module is guaranteed to remain in calibration for the life of the controller. AI Modules continuously execute Forced Value Diagnostics (FVD) which is a self-test diagnostic that detects and signals an alarm for all stuck-at and accuracy fault conditions typically in less than 500 milliseconds. compiles data. each channel receives variable voltage signals from each point.System Overview Analog Input Module On an Analog Input (AI) Module each channel measures the input signals asynchronously and places the results into a table of values. the mid-value data is used by the application. which independently process field data input to the module. This safety feature allows unrestricted operation under a variety of multiple-fault scenarios. the average is used. called channels. The input table in each MP is transferred to its neighbors over the TriBus. and transmits the values to the three MPs on demand. For digital input points. in dual mode. converts them to digital values. Sensing of each input point is performed in a manner that prevents a single failure on one channel from affecting another channel. 6 Individual Point Field Terminations Analog Input Module T ypical P oint (1 of 32) T riplicated I/O Bus Isolated Bus Transceiver ADC ASIC A Isolation Filtering DAC oint Individual P erminations Field T ADC ASIC Isolated Bus Transceiver B DAC ADC ASIC Isolated Bus Transceiver C DAC Analog Input Module Schematic Analog Input/Digital Input Module Typical Point (1 of 32) Triplicated I/O Bus Isolated Bus Transceiver ADC ASIC A Isolation Filtering * DAC ADC ASIC Isolated Bus Transceiver B * DAC ADC ASIC Isolated Bus Transceiver C * DAC *On DI points only Analog Input/Digital Input Module Schematic . For analog input points. the Fault indicator turns on and activates the system alarm. The shunt output circuitry provides multiple redundancy for all critical signal paths. This safety feature allows unrestricted operation under a variety of multiplefault scenarios. AO Modules use special shunt circuitry to vote on the individual output signals before they are applied to the load. each channel includes a proprietary ASIC that receives its output table from the I/O communication processor on its corresponding main processor. In dual mode. B. AO Modules continuously execute Forced Switch Diagnostics (FSD) on each point. high reliability and safe operation is ensured.For all points. ongoing diagnostics for each channel. T riplicated I/O Bus I/O Controller(s) Field Circuitry T ypical Point (4) A Isolated Bus T ransceiver µProc A Selector Logic DAC V oltage Loopback Current Loopback B Isolated Bus T ransceiver µProc B Selector Logic DAC V oltage Loopback Current Loopback Output T ermination C Isolated Bus T ransceiver µProc C Selector Logic DAC V oltage Loopback Current Loopback Analog Output Modules Schematic 7 . The AI/DI Module is mechanically keyed to prevent improper installation in a configured baseplate. If the diagnostics detect a failure on any channel. AI/DI Modules include the hot-spare feature which allows online replacement of a faulty module. Analog Output Module On an Analog Output (AO) Module. Each AO Module is guaranteed to remain in calibration for the life of the controller. Voter circuitry ensures only one output channel (A. Periodic manual calibration is not required. The Fault indicator identifies a channel fault. AI/DI Modules sustain complete. By carefully forcing error conditions and observing proper behavior of the voting circuitry. the MPs vote the data before passing it to the control program. the data passed is the average. AI/DI Modules are guaranteed to operate properly in the presence of a single fault and may continue to operate properly with multiple faults. guaranteeing safety and maximum availability. the data passed is mid-value. not a complete module failure. In TMR mode. or C) is driving the field load. or B and C. B and C respectively. The output signal transition is guaranteed to be less than 2 milliseconds (500 microseconds is typical) and is transparent to most field devices. Each channel includes a proprietary ASIC which handles communication with its corresponding MP. The Quad Voter circuitry has multiple redundancy on all critical signal paths. and supports run-time diagnostics. the commanded state of each point is momentarily reversed on one of the output drivers. Each input table is interrogated at regular intervals over the I/O bus by the I/O communication processor located on the corresponding MP. A fault on one channel cannot pass to another. Although the channels reside on the same module. MP A interrogates Input Table A over I/O Bus A. they are completely isolated from each other and operate independently. Digital Output Module On the Digital Output (DO) Module. For example. each channel includes a proprietary ASIC which receives its output table from the I/O communication processor on the corresponding MP. DI Modules continuously execute Forced Value Diagnostics (FVD) which is a self-test diagnostic that detects and signals an alarm for all stuck-at fault conditions typically in less than 500 milliseconds. The diagnostics ensure complete fault coverage of each input circuit even if the actual state of the input points never changes. guaranteeing safety and maximum availability. or A and C) command them to close. and places the values into input tables A. one after another.System Overview Digital Input Module A Digital Input (DI) Module contains the circuitry for three identical channels (A. determines the respective states of the input signals. Digital Output Modules use the patented Quad Voter circuitry to vote on the individual 8 Digital Input Module Schematic output signals just before they are applied to the load. This safety feature allows unrestricted operation under a variety of multiple-fault scenarios. Loop-back circuitry on the module allows each ASIC to read the output value for the point to determine whether a latent fault exists within the output circuit. This voter circuitry is based on parallelseries paths which pass power if two out of three channels (A and B. Each input channel on the DI Module measures the input signals from each point on the baseplate asynchronously. B and C). For devices that cannot tolerate a signal Digital Output Module Schematic . DI Module diagnostics are specifically designed to monitor devices which hold points in one state for long periods of time. Each channel conditions signals independently. During Output Voter Diagnostic (OVD) execution. high-frequency inputs can be individually configured for non-amplified and amplified magnetic speed sensors common on rotating equipment. DO Module diagnostics are specifically designed to monitor outputs which remain in one state for long periods of time. six sensitive. Each input channel receives pulse input voltages from each point. and transmits the values to the MPs on demand. Sensing of each input point is designed to prevent a single failure on one channel from affecting another channel. converts the values to frequency (RPM) data. The resulting count and time are used to generate a frequency (revolutions per minute). PI Module T ypical Point (1 of 6) T riplicated I/O Bus + Isolation Filtering ASIC Isolated Bus T ransceiver A – Isolation Filtering Individual Point Field T erminations Isolation Filtering ASIC Isolated Bus T ransceiver B Isolation Filtering Isolation Filtering ASIC Isolated Bus T ransceiver C Isolation Filtering Pulse Input Module Schematic 9 . which is transmitted to the Main Processors. The PI Module senses voltage transitions from the speed sensors. PI Modules have three independent input channels. To ensure correct data for each scan. one value is selected using a mid-value selection algorithm. Pulse Input Module On a Pulse Input (PI) Module. such as turbines or compressors.transition of any length. OVD can be disabled on a per-point basis from TriStation 1131 software. Every input transition is sampled and time is measured for an optimized number of input gear pulses. The OVD diagnostics ensure complete fault coverage of each output circuit even if the actual state of the output points never changes. HART Communication Highway Addressable Remote Transducer protocol (HART™) is a bi-directional industrial field communication protocol used to communicate between intelligent field instruments and host systems over 4–20 mA instrumentation wiring. System Status Indicators . The front panel of every I/O module includes light-emitting diode (LED) indicators that display the status of the module or the external systems to which it is connected. see the TriStation 1131 Developer’s Guide. For more information on reporting. Any I/O module can activate the system integrity alarm. A lighted Fault indicator shows that the module has detected a fault and must be replaced. Each output has a loopback circuit which verifies the operation of each relay switch independently of the presence of a load. watch-dog timers. Invensys offers these components to enable HART communication between HART devices in the field and Configuration and Asset Management Software running on a PC. Other indicators are modulespecific. • 2354S2 Analog Input HART Baseplate • 2354AS2 Analog Input HART Hazardous Location Baseplate • 2483S2 Analog Output HART Baseplate • 2483AS2 Analog Output HART Hazardous Location Baseplate • Triconex 4850 HART multiplexer System Diagnostics and Status Indicators The Tri-GP controller uses online diagnostics and specialized fault-monitoring circuitry to detect and alarm all single-fault and most multiple-fault conditions. and other proprietary diagnostic mechanisms. Normal service of a Tri-GP system consists of replacing plug-in modules. solid-state output switches. The three sets of signals are voted and the voted data is used to drive the 32 individual relays. activates the alarm to summon plant maintenance personnel. which consists of redundant normally closed (NC) relay contacts on each MP.System Overview Solid-State Relay Module On a Solid-State Relay (SRO) Module. Using the alarm information. Reporting is done through a local or remote PC running TriStation 1131 software or host computer. The SRO Module is a non-triplicated module for use on non-critical points which are not compatible with highside. for example. loss-ofpower sensors. Ongoing diagnostics test the operational status of the SRO Module. output signals are received from the MPs on each of three channels. Pass. Any failure condition. Fault and Active indicators are common to all I/O modules. you can tailor the response of the system to the specific fault sequence and operating priorities of the application. The circuitry includes I/O 10 T riplicated I/O Bus Intelligent I/O Controller(s) Field Circuitry T ypical P oint (2 of 32) C1 A Isolated Bus T ransceiver ASIC B Isolated Bus T ransceiver ASIC ASIC Com C Isolated Bus T ransceiver ASIC C2 Solid-State Relay Module Schematic loop-back. All internal diagnostic and alarm data is available for remote logging and report generation. including loss or brown-out of system power. interfacing with annunciator panels. the other acts as a hot-spare module— powered. Tri-GP switches control between the two healthy I/O modules approximately every hour. Tri-GP switches control to the second I/O module and returns to triplicated control. For example. a faulted module can be repaired online without interrupting the control process. When a replacement module is inserted and passes the diagnostic test. This method demonstrates the Tri-GP’s ability to automatically transition from triplicated to dual control and back again without process interruption. In the case where there are two identical I/O modules in the slot. the Fault indicator turns on. If a fault is detected on the active module. so that each module undergoes complete diagnostics on a regular basis. the Tri-GP system automatically switches control to the hot-spare module. a second I/O module can be inserted in the slot. allowing the system to continuously work in triplicated control. the hot-spare module is tested regularly and can be used for online replacement of any DI Module in the system. The faulty module can then be removed and replaced. but inactive.Online Module Repair Because the logical slot for Tri-GP modules can contain two identical I/O modules. After the replacement module becomes active. if a Tri-GP system normally operates with four DI Modules. at least one hot-spare DI Module should be installed at all times. 11 . it becomes the active module. In the case where there is only one I/O module in the slot and a fault occurs. Tri-GP periodically switches control between each module. Ideally. With this arrangement. When one module is active. After the replacement module passes a diagnostic test. If a fault occurs on a system that does not have a hot-spare module. the faulty module can be removed and sent to Invensys for repair. but the module remains active in dual control. at least one hot-spare module should be installed for every type of I/O module used in the system. Notes . or any combination that does not exceed 416 total AI or AI/DI points) • 20 AO points maximum (5 baseplates) • 640 DI points maximum (20 DI baseplates. 25 AI/DI baseplates. • Analog Input/Digital Input (AI/DI) • Analog Output (AO) • Digital Input (DI) • Digital Output (DO) • Pulse Input (PI) • Solid-State Relay Output (SRO) Tri-GP systems can include 25 total I/O baseplates (requires TriStation 1131 v4.A typical Tri‐GP system is configured into one or more vertical I/O columns guided by DIN rails and mounted on a sheet‐metal panel. A Tri-GP system must include three Main Processors and the MP Baseplate. Setting up a Tri‐GP System A Tri-GP system consists of: • Main Processors and I/O modules • Optional communication modules • The baseplates on which the modules are mounted • Field wiring connections • A programming workstation running TriStation 1131 software A typical Tri-GP system is configured into one or more vertical I/O columns guided by DIN rails and mounted on a sheet-metal panel. based on the requirements described in this section.or wall-mounted enclosure such as a Rittal® cabinet or a Hoffman® box. 13 AI/DI baseplates. . The system also can include any combination of these module types and baseplates: • Communication Module (CM) • Analog Input (AI) Typical System Configuration Please contact Invensys Global Customer Support (GCS) for help with configuring large systems. Tri-GP systems support: • 25 I/O baseplates maximum • 416 AI points maximum (13 AI baseplates. see “Product Specifications” on page 17. its configuration must be planned. as shown in the figure at the right. modules. The completed panel is installed in a floor. and accessories. 13 Planning a System Configuration Before a Tri-GP system can be physically installed.8 software or later). For more information on available baseplates. Multiple I/O columns are connected by means of extender modules and I/O bus cables. or any combination that does not exceed 640 total DI points) • 320 DO points maximum (20 baseplates) • 30 PI points maximum (5 baseplates) • 640 SRO points maximum (20 baseplates) Performance and other considerations may limit the maximum number of I/O points in some applications. For compatible units and supported distances. In TriStation 1131 software. logic power. the numbers are also used for the configuration setup.Setting up a Tri‐GP System Interconnection of Baseplates Baseplates are connected by Interconnect Assemblies that carry I/O messages. and corrosive atmospheres. the average ambient temperature of a Tri-GP system should be below 120° F (50° C).) The I/O modules also have Address Plugs which are used to identify field point connections and are the equivalent of traditional Rack-Slot addresses. the bus should be terminated. Terminal covers protect terminal baseplates. Adequate convection or forced-air cooling should be provided. and the I/O Interconnects are connected to other I/O Baseplates. Required Accessories End caps. Two I/O Extender Modules are linked by I/O Bus Cables. b. Power and Cooling Considerations Before operating a Tri-GP system. terminal covers. For maximum reliability. contact your regional customer center.To convert watts to British thermal units: BTU = watts x 3. using the table on this page. Modules mounted in two columns must be connected together by an Interconnect Assembly. They are available for both MP Baseplates and I/O Baseplates. fiber-optic transceivers are commercially available.414. at the bottom of the enclosure and exit at the top. The Address Plug is the node number for the system. the I/O bus can be operated without termination. I/O Bus Length If the total length of the I/O bus is less than 20 feet (6 meters). In TriStation 1131 software. and system power across baseplates. In vented applications. Extending the I/O Bus I/O Extender Modules (EM) and I/O Bus Cables carry I/O messages from one I/O column to another and to supply logic power connections for each I/O column. The MP Interconnect is connected to an I/O Baseplate. (Node numbers can be from 1 to 63. The heat load dissipated by the system is calculated by adding the logic power and field power for all of the modules. liquids. If the I/O bus length is greater than 20 feet. the logic power consumption and cooling requirements should be determined. End caps protect the top and bottom of each end-of-column baseplate. . as shown in the figure on page 13. The maximum I/O bus length is 650 feet (200 meters) which includes the following: • Length of all baseplates • Length of I/O Extender Modules • Length of I/O bus extension cables Note: For distances greater than 650 feet or for applications requiring isolation. air should flow into vents 14 Module Model Number Maximum Logic Power (Watts)a 8 8 3 3 3 3 3 3 3 3 3 3 Maximum Field Powerb Primary Main Processor Communication Analog Input Analog Input/ Digital Input Analog Output Analog Output Digital Input Digital Input Digital Output Digital Output Pulse Input Solid-State Relay Output 3101S2 3201S2 3351S2 3361S2 3481S2 3482S2 3301S2 3311S2 3401S2 3411S2 3382S2 3451S2 Not applicable Not applicable 4 4 3 7 7 7 4 4 Negligible 4 Spare Not applicable Not applicable Negligible Negligible Negligible Negligible Negligible Negligible Negligible Negligible Negligible Negligible a. the number is used for the configuration setup. I/O slot covers protect unused I/O slots. and slot covers are used to minimize the exposure of Tri-GP components to dust.Field power is the percentage of field circuit power that is dissipated within the baseplate. Addressing of System Components The Main Processor and Communication Module (if used) are identified by the Address Plug located at the bottomleft part of the MP Baseplate. Invensys recommends installing DIN rails to act as guides prior to mounting the baseplates. The panels should be made of 12-gauge or heavier steel and the DIN rails should be compatible with the DIN 50022 standard.Mechanical Installation A Tri-GP system is physically set up by installing the following components on a user-supplied sheet-metal panel: • One Main Processor Baseplate with three MP Modules • One Communication Baseplate with one or two Communication Modules • I/O Baseplates with one or two I/O modules each • Interconnect Assemblies for connecting baseplates • I/O bus extenders and cables for connecting I/O columns • End caps for the top and bottom of each I/O column Panel Mounting of Baseplates and Modules The sheet-metal panels on which baseplates are mounted and the DIN rails used for guidance are user-supplied. Mounting Components on a Sheet-Metal Panel Placing an I/O Module on a Baseplate 15 . the entire system is placed in a user-supplied metal enclosure with a sealed bottom and a closed door. Connecting Field Devices Field devices are wired to the termination strips mounted on either the baseplate or the external termination panel. Logic Power Logic power is distributed down each column.Setting up a Tri‐GP System The basic steps for installing Tri-GP components include: • Installing DIN rails • Fastening the baseplates onto the panels • Joining the baseplates together with interconnect assemblies • Connecting multiple columns of baseplates with extender modules and I/O bus cables • Installing the MP. This configuration provides you with a wide range of possibilities for field power distribution. If a single power source is used. If not wired. Each baseplate is isolated from all other baseplates. and connective devices are securely mounted on a panel. it must be jumpered to the redundant termination points. see the Communication Guide for Tri-GP v2 Systems. The PC running TriStation 1131 software requires the installation of the following: • A Network Interface (NIC) card • Ethernet or Data Link Control (DLC) protocol • A connection between an MP port or CM port For more information. a system alarm is generated. 16 Connecting to a PC Running TriStation 1131 Software The Tri-GP controller communicates with the PC running TriStation 1131 software using Ethernet (TCP/IP) protocol or DLC protocol. . This distribution is redundant and both must be wired. and I/O modules onto the baseplates Typical Enclosures When all baseplates. CM. Either of the following can be used: • A floor-mounted enclosure such as a Rittal cabinet for one I/O column • A wall-mounted enclosure such as a Hoffman box for two or more I/O columns Connecting Logic Power and Field Power The Tri-GP controller offers a flexible power-handling system. Field Power Field power is also redundant and both wiring points must be wired. modules. see page 41. see page 35. a HART AO baseplate and a hazardous location HART AO baseplate are available. For details. terminal covers. see page 41. Each channel transmits the data to the MP associated with the channel. see page 32. Analog Input Module and Baseplates Each Analog Input (AI) Module has three isolated channels which independently process analog inputs from field devices. For details. Two CMs can provide redundant communication connections or independent communication ports. In addition to the standard AO baseplate. see page 32. see page 36. Digital Output Modules and Baseplates Each Digital Output (DO) Module has three isolated channels which independently accept data from the MP associated with each channel. Communication Module and Baseplate The Communication Module (CM) is a three-to-one interface to the MPs that enables use of industry-standard communication protocols. see page 39. Analog Output Modules and Baseplates Each Analog Output (AO) Module has three isolated channels which independently accept data from the MPs. The channels provide input to a voter circuit which uses the voted value to drive the coil of the relay. see page 40. For details. For details. and corrosive atmospheres. For details. For details. Solid-State Relay Output Module and Baseplate Each Solid-State Relay Output (SRO) Module has three isolated channels which independently accept data from the MP associated with each channel. Voter circuitry selects a single channel to drive the output and shunts output from the other channels. Each MP Module acts as one channel of the triplicated Tri-GP system. The MPs vote the data before passing it to the application. a HART AI baseplate and a hazardous location HART AI baseplate are available. Interconnect Assemblies Tri-GP baseplates within a single I/O column are connected by Interconnect Assemblies that carry I/O messages and logic power across the baseplates. I/O Extender Modules I/O Extender Module Kits are used to carry I/O messages from one I/O column to another and to provide logic power terminals for each I/O column. Each channel transmits the data to the MP associated with the channel. see page 18. This section provides detailed specifications for each product in the Tri-GP family. Analog Input/Digital Input Module and Baseplates Each Analog Input/Digital Input (AI/DI) Module has three isolated channels which independently process analog and digital inputs from field devices. Required Accessories Accessories such as end caps. A single Tri-GP controller can support up to two CMs on one CM Baseplate with each CM operating independently. In addition to the standard AI baseplate. Each channel transmits the data to the MP associated with the channel. Also included are: • International approvals (page 23) • Environmental specifications (page 25) • Dimensions and clearances (page 25) Main Processor Modules and Baseplates Every Tri-GP system is controlled by three Main Processor (MP) Modules that reside on a single baseplate. For details. For details.The Tri‐GP controller supports a complete range of modules for applications with low point counts and distributed I/O. liquids. see page 25. For details. For details. For details. see page 34. For details. Pulse Input Modules and Baseplate Each Pulse Input (PI) Module has three isolated channels which independently receive voltage transitions from each point and converts the transitions to frequency (RPM) data. For details. see page 27. see page 37. as well as by individual parts. 17 . Components for the Tri-GP system are offered in TriPaks and kits. Digital Input Modules and Baseplates Each Digital Input (DI) Module has three isolated channels which independently process digital input from field devices. Product Specifications The Tri-GP controller supports a range of modules for applications with low point counts and distributed I/O. and slot covers are required to protect Tri-GP components from dust. The MPs vote the data before passing it to the application. Product Specifications Standard Tri-GP Products Model 5101S2 5201S2 5351S2 5361S2 5352S2 5354S2 Product Name Main Processor TriPak Communication Module TriPak Analog Input TriPak Analog Input/Digital Input TriPak Analog Input Tripak. Enhanced. High Current Digital Output TriPak. High Resolution Digital Input Baseplate Kit. HART Qty 3 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Description Main Processor Module Main Processor Baseplate Kit Communication Module Communication Module Baseplate Kit Analog Input Module Analog Input Baseplate Kit Analog Input/Digital Input Module Analog Input/Digital Input Baseplate Kit Analog Input Module Analog Input Baseplate. Hazardous Location Triconex 4850 HART Multiplexer Analog Output Module AO Module Baseplate Kit High-Current Analog Output Module AO Module Baseplate Kit Digital Input Module Digital Input Baseplate Kit Digital Input Module. Enhanced Pulse Input TriPak. HART Triconex 4850 HART Multiplexer Consists of 3101S2 2101S2 3201S2 2201S2 3351S2 2351S2 3361S2 2361S2 3351S2 2352S2 3351S2 2354S2 1600106-001 3351S2 2354AS2 1600106-001 3481S2 2481S2 3482S2 2481S2 3301S2 2301S2 3311S2 2301S2 3311S2 2302S2 3301S2 2302S2 3401S2 2401S2 3401S2 2401LS2 3411S2 2401HS2 3401S2 2402S2 3451S2 2451S2 3382S2 2381S2 3382S2 2381AS2 3481S2 2483S2 1600106-001 5354AS2 Analog Input TriPak. High Current Digital Output Module Digital Output Baseplate Kit. High Voltage Digital Output Module Digital Output Baseplate Kit Digital Output Module Digital Output Baseplate Kit. HART 5481-1S2 5482-1S2 5301S2 5311S2 5312S2 5302S2 5401S2 5401LS2 5411HS2 5402S2 5451S2 5382-1S2 5382AS2 5483S2 18 . HART. Triconex 4850 HART Multiplexer Analog Input Module Analog Input Baseplate Kit. HART. Hazardous Location Analog Output TriPak. RTD/TC/4-20 mA Analog Input Module Analog Input Baseplate Kit. Supervised. Hazardous Location Analog Output Module Analog Output Baseplate Kit. Supervised Digital Output Baseplate Kit. HighCurrent Digital Input TriPak Digital Input TriPak. High Resolution Digital Input TriPak. High Resolution. High Voltage Digital Input Module Digital Input Baseplate Kit. High Voltage Digital Output TriPak Digital Output TriPak. HART. Hazardous Location Analog Output TriPak Analog Output Tripak. Low Current Digital Output TriPak. High Voltage Digital Input TriPak. Enhanced Pulse Input Baseplate Kit Pulse Input Module. High Voltage Solid-State Relay Output TriPak Pulse Input TriPak. Enhanced Pulse Input Baseplate Kit. Low Current Digital Output Module. High Resolution Digital Input Baseplate Kit Digital Input Module. RTD/TC/420 mA Analog Input TriPak. High Voltage Solid-State Relay Output Module Solid-State Relay Output Baseplate Kit Pulse Input Module. Hazardous Location 1 1 1 1 1 1 1 1 1 1 1 1 I/O External Termination Baseplate External Termination Panel Kit I/O Interconnect Assembly Slot Cover Terminal Cover I/O External Termination Baseplate I/O Interconnect Assembly Slot Cover I/O External Termination Baseplate I/O Interconnect Assembly Slot Cover AI/DI ETP Kit. I/O Baseplate I/O Bus Termination Kit. Hazard. 10 ft SSR Input Modules for use with SSR Input ETP 100 to 240 VAC (ordered separately) 2302AS2 Digital Input Baseplate Kit. MP Baseplate Digital Input Baseplate Kit 2292 2301S2 2302S2 Digital Input Baseplate Kit. External Termination Analog Input/Digital Input Baseplate Kit. Hazardous Location Consists of 3481S2 2483AS2 1600106-001 3000671-110 2920 8910-4S2 8401 2910 2912 2911 2913 3000678-100 4000212-002 2921 2910 2911 3000678-100 2921 3900064-003 3000678-100 2920 3900064-003 3000673-030 2921 2900 2901 3000721-310 3000762-110 2921 2900 9105-310F 1300447-001 3000989-315 9573-610F 2921 2900 2901 3000721-140 2921 2900 3000989-145 2921 2900 9793-610F 2101S2 2281 I/O Bus Extender Module Kit 2291 I/O Bus Termination Kit. Hazardous Location Main Processor Baseplate Kit Qty 1 1 1 1 1 1 1 1 1 1 1 2 3 1 1 1 1 1 1 1 1 1 1 1 1 1 1 2 1 1 2 Description Analog Output Module Analog Output Baseplate Kit. HART.Standard Tri-GP Products (Continued) Model 5483AS2 Product Name Analog Output TriPak. Hazardous Location 2342AS2 19 . HART. I/O Bus Cables I/O Interconnect Assembly Top End Cap – I/O Bottom End Cap – I/O I/O Extender Module I/O Interconnect Assembly I/O Bus Terminator Kit (Set of 3) I/O Extender Module MP Interconnect Assembly I/O Bus Terminator Kit (Set of 3) I/O Baseplate I/O Interconnect Assembly Slot Cover Terminal Cover I/O External Termination Baseplate External Termination Panel (Solid State Relay Input) I/O Interconnect Assembly Slot Cover Interface Cable. High Voltage 2342S2 Analog Input/Digital Input Baseplate Kit. Location Triconex 4850 HART Multiplexer MP Baseplate MP Interconnect Assembly Tri-GP User Documentation (hardcopy) Accessories Kit Top End Cap – I/O Top End Cap – MP Bottom End Cap – I/O Bottom End Cap – MP I/O Extender Module 2-ft. Hazardous Location 2401S2 Digital Output Baseplate Kit 2401HS2 Digital Output Baseplate Kit. Low Current 20 . HART.Product Specifications Standard Tri-GP Products (Continued) Model 2351S2 Product Name Analog Input Baseplate Kit Qty 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Description I/O Baseplate I/O Interconnect Assembly Slot Cover Terminal Cover I/O External Termination Baseplate I/O Interconnect Assembly Slot Cover I/O External Termination Baseplate External Termination Panel Kit I/O Interconnect Assembly Slot Cover I/O HART Baseplate MP Interconnect Assembly Slot Cover Terminal Cover I/O HART Baseplate MP Interconnect Assembly Slot Cover Terminal Cover I/O Baseplate I/O Interconnect Assembly Slot Cover Terminal Cover I/O Baseplate I/O Interconnect Assembly Slot Cover Terminal Cover I/O Hazardous Location Baseplate I/O Interconnect Assembly Slot Cover Terminal Cover I/O Baseplate I/O Interconnect Assembly Slot Cover Terminal Cover I/O Baseplate I/O Interconnect Assembly Slot Cover Terminal Cover I/O Baseplate I/O Interconnect Assembly Slot Cover Terminal Cover Consists of 3000675-030 2921 2900 2901 3000721-110 2921 2900 3000989-115 9792-310F 2921 2900 3000851-020 2920 2900 2901 3000851-120 2920 2900 2901 3000675-040 2921 2900 2901 3000719-110 2921 2900 2901 3000719-210 2921 2900 2901 3000674-040 2921 2900 2901 3000975-040 2921 2900 2901 3000715-040 2921 2900 2901 2352S2 Analog Input Baseplate Kit for TC. High Current 2401LS2 Digital Output Baseplate Kit. and 4-20mA (requires 2 of part number 9764-510F) Analog Input Baseplate Kit. RTD. Hazardous Location 2352AS2 2354S2 Analog Input Baseplate Kit. Hazardous Location 2361S2 Analog Input/Digital Input Baseplate Kit 2381S2 Pulse Input Baseplate Kit 2381AS2 Pulse Input Baseplate Kit. HART 2354AS2 Analog Input Baseplate Kit. 440 VAC max. 2 A at 75 to 264 VAC SSR. 1. HART. HART 2483AS2 Analog Output Baseplate Kit.5 A at 40 to 200 VDC Power (Dry Contact) Relay. Hazardous Location (for use with Model 2402AS2) 9671-610F 21 . 10 ft. DI External Termination Panel. DO Interface Cable. Hazardous Location 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 4 1 2 1 1 1 1 1 2 2 1 1 I/O External Termination Baseplate External Termination Panel Kit I/O Interconnect Assembly Slot Cover I/O Baseplate I/O Interconnect Assembly Slot Cover Terminal Cover I/O External Termination Baseplate External Termination Panel Kit I/O Interconnect Assembly Slot Cover I/O Baseplate I/O Interconnect Assembly Slot Cover Terminal Cover I/O HART Baseplate MP Interconnect Assembly Slot Cover Terminal Cover I/O HART Baseplate MP Interconnect Assembly Slot Cover Terminal Cover MTL4546 Intrinsic Safety Barrier—Isolator Set of Spare Fuses Set of Address Plugs (1 through 10) Set of Address Plugs (11 through 20) Set of Address Plugs (21 through 32) Set of Address Plugs (33 through 43) Set of Address Plugs (44 through 54) Set of Address Plugs (55 through 63) External Termination Panel. 10 ft Relay Output Modules for use with Relay Output ETP (ordered separately) SSR. DI Interface Cable. High Voltage Qty 1 1 1 1 1 Description I/O Baseplate External Termination Panel (Relay Output ETP) I/O Interconnect Assembly Slot Cover Interface Cable. Hazardous Location 8401 Trident/Tri-GP Accessory Kit 9573-610F Digital Input Termination Panel Kit. 2 A at 4 to 60 VDC SSR. Hazardous Location (for use with Model 2302AS2) Digital Output Termination Panel Kit. Hazardous Location 2481S2 Analog Output Baseplate Kit 2483S2 Analog Output Baseplate Kit.Standard Tri-GP Products (Continued) Model 2402S2 Product Name Digital Output Baseplate Kit. 125 VDC max 2402AS2 Digital Output Baseplate Kit. 10 ft. DO Consists of 3000764-310 3000763-110 2921 2900 9106-310F 1300462-001 1300471-001 1300472-001 1300463-001 3000764-310 9671-610 2921 2900 3000676-320 2921 2900 2901 3000764-510 9863-610F 2921 2900 3000674-020 2921 2900 2901 3000852-030 2920 2900 2901 3000852-130 2920 2900 2901 1600107-001 3000698-010 3000698-020 3000698-030 3000698-040 3000698-050 3000698-060 3000771-880 4000195-310 3000769-390 4000196-310 2451S2 Solid-State Relay Output Baseplate Kit 2480AS2 Analog Output Baseplate Kit. 5. 10 ft. 10 ft.0 Documentation Set (hardcopy) CD containing SOE Recorder software and doc. AI External Termination Panel. Type E TC Shorting Plug 9792-310F Analog Input Termination Panel Kit. RTD 32F to 1112F (0C to 600C). AO Triconex 4850 HART Multiplexer CD containing: Developer’s Workbench (software) TriStation 1131 Help Documentation (online) TriStation 1131 v4. AI External Termination Panel.3. DDE Server.8. SOE Recorder.0 SOE Recorder v4.8. RTD 32F to 1400F (0C to 760C).0 Documentation Set (hardcopy) CD containing Enhanced Diagnostic Monitor software Enhanced Diagnostic Monitor. AI Interface Cable.3.0 Documentation Set CD containing: Developer’s Workbench (software) TriStation 1131 Help Documentation (online) TriStation 1131 v4. Type J TC 32F to 2372F (0C to 1300C). Type T TC 32F to 1652F (0C to 900C).8. 10 ft. DI Interface Cable.8.3. v4. RTD/TC/AI Interface Cable.5. DI External Termination Panel. Hazardous Location (for use with Model 2352AS2) Analog Input/Digital Input Termination Panels Kit. AO Interface Cable.0 User Documentation (hardcopy) 1 1 8910-4S2 8747-11 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 External Termination Panel. Hazardous Location (for use with Model 2342AS2) Analog Output Termination Panel Kit. Hazardous Location (for use with Model 2480AS2) Triconex 4850 HART Multiplexer TriStation 1131 Developer’s Workbench v4.0 with CEMPLE for Tri-GP Triconex General Purpose User Documentation (hardcopy) TriStation 1131 v4. v4.0 Documentation Set (hardcopy) CD containing documentation in PDF format Consists of 3000712-100 4000189-510 1600048-220 1600048-030 1600048-040 1600048-110 1600048-120 1600048-130 1600048-140 1600048-300 3000771-710 4000197-510 3000771-710 3000771-880 4000197-510 4000195-310 3000770-960 4000198-510 1600106-001 3000755-829 3000760-930 3000755-828 3000760-930 9700122-001 9700123-001 9700100-011 9700098-010 9700112-003 9700124-001 9700096-002 9700097-007 3000723-303 9700108-004 3000708-430 9700081-008 3000796-009 9700107-008 9793-610F 9863-610F Triconex 4850 7254-13S2 7523-4 7521-6 7260-7 Triconex DDE Server v4. 10 ft Signal Conditioning Modules for use with 9764-510F (ordered separately) 4–20 mA 32F to 392F (0C to 200C).3. 10 ft.0 for Tri-GP 1 1 1 1 1 1 1 1 1 1 1 7255-13S2 TriStation 1131 Developer’s Workbench v4. AI Interface Cable.8. Type K TC 32F to 752F (0C to 400C). v2.0 Triconex Documentation Set Contact Invensys for current model number 22 .0 Documentation Set Planning and Installation Guide for Tri-GP v2 Systems Communication Guide for Tri-GP v2 Systems TriStation 1131 Developer’s Guide TriStation 1131 Libraries Reference Safety Considerations Guide for Trident v2 Safety Considerations Guide for Tri-GP v2 Safety Considerations Guide for Trident v1 Safety Considerations Guide for Tricon CD containing DDE Server software and doc.0 Enhanced Diagnostic Monitor v2.Product Specifications Standard Tri-GP Products (Continued) Model 9764-510F Product Name RTD/TC/AI Termination Panel Kit (for use with Model 2352S2) Qty 1 1 Description External Termination Panel. Part 1: Framework.2 No. 72/23/EEC. Overvoltage Category II is assumed.2 No 1010. Requirements for application design and installation Electronic equipment for use in power installations National Fire Alarm Code Boiler and Combustion Systems Hazards Code.01-2004 (IEC 61511-1 Mod) EN50156-1:2004 EN 50178:1998 NFPA 72:2007 NFPA 85:2007 EN 54-2:1997/A1:2006a a. and Laboratory Use. Overvoltage Category II is assumed.0. and it must be installed in an area with an access level greater than 2.4-M1982 CAN/CSA C22. 2000 IEC 61511:2004 IEC 61131-2:2007 IEC 61326-3-1:2008 ANSI/ISA-84. the Tri-GP system must be installed in a metal enclosure with a sealed bottom and a closed door. Part 1: General Requirements Process Control Equipment Programmable Controllers Part 2: Equipment Requirements and Test. Electrical equipment for measurement. Definitions. Measuring and Process Control Equipment Electrical Equipment for Use in Hazardous (Classified) Locations-General Requirements Functional safety of electrical/electronic/programmable electronic safety-related systems Functional safety . European Union CE Mark Factory Mutual IEC 61131-2 3611 3810 3600 TÜV Rheinland IEC 61508.Part 3-1: Immunity requirements for safety-related systems and for equipment intended to perform safety-related functions (functional safety) General industrial applications Functional Safety: Safety Instrumented Systems for the Process Industry Sector . 23 . Test reports from the various certification agencies are available upon request. Electrical Equipment for use in Class I-Division 2. and Class III-Divisions 1 and 2. Canadian Standards Association CSA has certified that the Tri-GP v2.Safety instrumented systems for the process industry sector Programmable Controllers Part 2: Equipment Requirements and Test. Invensys has certified the Tri-GP v2. Certifying Agency Canadian Standards Association Standard Number CAN/CSA-C22.00. control and laboratory use . European Union CE Mark Based upon the independent TÜV evaluation and test results. See Certificate of Compliance for details. the Tri-GP and associated wiring must be installed following the guidelines outlined in the Planning and Installation Guide. 2007 Edition Fire detection and fire alarm systems.EMC requirements .0-M91 CSA Std C22. To ensure maximum reliability and trouble-free operation.International Approvals The Tri-GP controller has been certified as complying with multiple internationally recognized standards by the following internationally recognized certification agencies. Control and indicating equipment. Hazardous Locations Electrical and Electronic Test. Control. connected to Safety Ground.1-92 UL 3121-1 1998-07-14 Title General Requirements—Canadian Electrical Code. Parts 1-7. 89/336/EEC and Low Voltage Equipment Directive No. Class II-Division 2.To comply with the requirements of EN 54-2:1997/A1:2006. Part II Bonding and Grounding of Electrical Equipment (Protective Grounding) Safety Requirements for Electrical Equipment for Measurement.x controller suitable to use in the European Union and all other jurisdictions requiring compliance with the European Union EMC Directive No.x controller is in full compliance with the following internationally recognized electrical safety standards and is qualified for general use in North American and other jurisdictions requiring compliance with these standards. Hardware and Software Requirements Electrical equipment for furnaces and ancillary equipment.2 No. these certifications have qualified the Tri-GP controller for use around the world in safety critical applications. System. RFI. b. connected to Safety Ground. and EU directives. 0. half-sine. or equivalent. IEC 61000-4-29.15-80 MHz. 2. 73-79db when installed per the guidelines of the P & I Guide. test Fc 15 g. Additionally. 1 kV CM2 I/O. per IEC 60068-2-14. 0. Class A.5 kV CM shielded. For hazardous location applications. To comply with standards related to conducted disturbance.S. In North America. 3 axis.5 mm displacement @ 5 to 8. 2.4 to 150 Hz (continuous) 3. For European Union CE Mark and conducted susceptibility compliance. CISPR 11.7 GHz: 1 V/m CISPR 16. Division 2 Temperature T4. 1 ms battery. test Ab. 1 kV CM/0. • Field power supplies must be approved for use in safety extra-lowvoltage (SELV) circuits according to the requirements of IEC 61010-1. 80–1000 MHz: 10 V/m.5 g acceleration @ 8. To comply with the requirements of EN 54-2:1998.2 No. test Db 5% to 95%. test Ea IEC 61000-4-2. Groups A. C. but they all actually meet the more stringent FT6 rating. 10 ms DC power supply Interface cables (connect external termination panels to baseplates): FT4 Vertical Flame Test-Cables in Cable Trays per C. 30-1000 MHz @ 10m. Also. 0. and IEC 60068-2-30. tests Na and Nb -40° F to +185° F (-40° C to +85° C) per IEC 60068-2-2. 11 ms. any signal going to or through a hazardous atmosphere must use hazardous location protection. 0. redundant power sources must be used for system power. connected to Safety Ground. Conducted emissions Radiated emissionsa Power interruptions Cable flame test ratingb Feature Operating temperature Specification -4° F to +158° F (-20° C to +70° C) ambient (which is the air temperature measured at the bottom of the baseplate). 24 . non-condensing Class G3 Level as defined in ISA Standard S71. 2009. the Tri-GP system must be mounted in a metal enclosure with a sealed bottom and a closed door. 1.Applies to cables shipped after April 1. Groups C and D.x is in full compliance with the internationally recognized standards listed on page 23.2 No. shielded and communication. TÜV Rheinland TÜV has certified that the Tri-GP v2. Factory Mutual FM has certified the Tri-GP v2. 10 V IEC 61000-4-18.S. per IEC 60068-2-27. Damped Oscillatory Wave.Cables will be marked with FT4 or CMG rating. Surge Withstand.4 Hz (continuous) 0.4 to 150 Hz (occasional) All tests per IEC 60068-2-6.4c I/O bus cables (connect columns of baseplates): FT6 Horizontal Flame & Smoke Test-per C. the system must be located in an area with an access level greater than 2.11.0 GHz: 3 V/m. d.4–2.x controller is in full compliance with the international recognized standards listed on page 23 and is qualified for use in Class I. 2 kV CM2/1 kV DM2 AC power and I/O.3-92 Appendix Bd Storage temperature Relative humidity Corrosive environment Sinusoidal vibrations per axis Shock Electrostatic discharge Conducted susceptibility Radiated susceptibility a. must be installed between power supplies and baseplates. C22. the field signals used with ATEXcompliant external termination panels are certified for use in Class 1.5 kV CM/1 kV DM unshielded AC I/O & power.A. 0.75 mm displacement @ 5 to 8. 2 kV power & unshielded AC I/O. but they all actually meet the more stringent FT4 rating. 4 kV contact. Class A. IEC 60068-2-1. Class III 1. Division 2.5 kV CM2/0. c.A. C22.0 g acceleration @ 8. B. such as an IS Barrier. 8kV air IEC 61000-4-4. these guidelines must be followed: • The entire Tri-GP system must be installed in a metal enclosure with a sealed bottom and a closed door. Fast Transient/Burst. the system must be located in an area with an access level greater than 2 to comply with the requirements of EN 54-2:1998.04.15-30MHz. and D hazardous indoor locations.Cables will be marked with FT6 or CMP rating.3-92 Para 4.Product Specifications To comply with the CE Mark requirement for emissions and conducted susceptibility. 4-47 db when installed per the guidelines of P & I Guide. test Bb.5 kV DM I/O IEC 61000-4-3.4 Hz (occasional) 1. Radio Frequency Electromagnetic Fields.5 kV DM2 DC power IEC 61000-4-6. based on exposure testing according to EIA Standard 364-65A. a Schaffner® FN 2410 line filter. 0. 1 kV signal and communication lines IEC 61000-4-5.0–2. 3) port for connection to the TriStation 1131 programming workstation • A lock lever that indicates whether the module is properly locked on the baseplate MODE REMOTE RUN PROGRAM HALT ALARMS FIELD POWER LOGIC POWER SYSTEM ALARM PROGRAM ALARM OVER TEMPERATURE LOCK 9. Please contact Invensys to obtain the specifications for particular items. 249 mm 8.79 inches (249 millimeters) long • I/O Baseplates other than AI and AO HART are 7. and AO HART Baseplates are 9 inches (229 millimeters) wide by 9. The following alarm indicators are on the front panel of each MP: • The Field Power alarm indicates loss of field power or faulty field power supply • The Logic Power alarm indicates a missing or faulty system power supply • The System Alarm indicates problems with the application or system integrity • The Program Alarm indicates problems that are defined by the user-written application • The Over Temperature alarm indicates when the module is over 183° F (84° C) Dimensions and Clearances The dimensions given on the figure to the left are predicated on the vertical mounting of Tri-GP baseplates on a panel. 217 mm COMMUNICATIONS IO BUS TX RX TX RX TX RX LINK TRISTATION TX RX COMM BUS SERIAL 1.25 in. 32 mm 7. The DIN rails and baseplate assemblies should be arranged on the panel to allow for the installation of wiring channels (such as Panduit) along the left side of vertical columns.79 in. the Tri-GP performs predictably in a hostile industrial environment.75 inches (44 mm) • Depth = 6. and HART AO Baseplates) need for any other modules • A 10BaseT Ethernet (IEEE 802. 229 mm without the (MP.00 in. not all of the listed specifications apply to every item. However.00 in.65 inches (220 mm) • Width = 1. The specifications listed on the table to the right confirm this built-in reliability. CM. 178 mm (I/O Baseplates) MP3101S2 25 . there should be at least 5 inches (15 centimeters) of clearance between active modules and the walls of the enclosure. HART AI.55 in.Environmental Specifications Designed for critical applications. AI HART Baseplates. Alarm Indicators The Tri-GP fault-monitoring circuitry is able to detect and signal an alarm for all single faults and most multiple faults.65 inches (169 mm) Clearance should always allow adequate air flow around Tri-GP modules.79 inches (249 millimeters) long Main Processor Module Every Tri-GP system is controlled by three Main Processor (MP) Modules that reside on a single baseplate.0 inches (178 millimeters) wide by 9. Each MP Module acts as one channel of the triplicated Tri-GP system and provides the following features: PASS FAULT ACTIVE • An RS-232 or RS-485 Modbus port for direct TMR connection to a DCS (or other external host) 9. The dimensions include the following: • The MP Baseplate. All Tri-GP I/O modules have the same dimensions. which are: • Height = 8. due to the number of diverse items that make up a Tri-GP system. For typical applications. so that no other logic power supplies are needed for the column.Product Specifications System Status Indicators The system status indicators identify the processing state of the module. • The Fault indicator identifies when the processor has an internal fault. Program. a high-speed. In addition to the TriStation 1131 and Modbus ports and alarm connectors. the MP Baseplate provides redundant. and communication buffers. The three MPs compare their respective data during every scan using the TriBus. Logic power supplied here can operate the MPs and carry to the I/O Baseplates as well. and Halt) identify the operating state of the entire Tri-GP system. The status indicators include the following: • The Pass indicator identifies when the module is operating normally. The MPs communicate with the I/O modules over a TMR HDLC I/O bus that operates at 2 megabits per second. fault-tolerant inter-processor bus. sequence-of-events (SOE) and I/O data. • The Active indicator blinks once per scan when executing an application. Run. Logic Power Fuses ñ + DSP1 DSP2 DSP3 FUSE Logic Power and Alarm Terminal Blocks Fuses and Blown Fuse Indicators DSP4 FUSE Modbus Ports for Direct DCS Connections TriStation Connectors Debug Connectors 1 Node Address MP Baseplate MP Baseplate Connectors 26 . • Communication indicators that identify the type of communication occurring Physical Description Each MP provides 16 megabytes of DRAM for the user-written application. 24-volt fused logic power connectors. Other Indicators Other indicators on the MP include the following: • Mode indicators (Remote. diagnostics. Communication Module The Communication Module (CM) is a one-to-one interface to the MPs. Two CMs can provide redundant communication connections or additional independent communications ports. The Tri-GP v2 CM enables communication with: • External host computers • Distributed control systems (DCS) • Open networks • Network printers • Other Tri-GP v2 systems • Tricon™ version 9–10 systems A single Tri-GP controller can support up to two CMs on one CM Baseplate. Each CM operates independently and supports three RS-232 or RS-485 serial ports and two Ethernet ports per CM. PASS FAULT ACTIVE LOCK COMMUNICATIONS SERIAL TX RX TX RX TX RX SERIAL SERIAL LINK NET 1 TX RX LINK NET 2 TX RX CM 3201S2 CM Baseplate CM Front Panel 27 . 28 . Network Ports Each CM provides two network ports which are configured as follows: One 10-megabit Ethernet port. Transmission rates up to 115 kilobits per second per port can be selected. Each CM Net1 network port supports Triconex Time Synchronization via DLC. with the following connectors: • 10BaseT • Attachment unit interface (AUI) for a 10-megabit media adapter unit (MAU) One 100-megabit Ethernet port. with the following connectors: • 100BaseTX • Media independent interface (MII) for a 100-megabit MAU Media adapter units may be used in place of the 10/100 BaseT RJ-45 twisted-pair connections to convert the CM network ports to other Ethernet media types or to extend network distances. Supported Protocols Each CM serial port supports these protocols: • Modbus master (RTU) • Modbus slave (ASCII or RTU) CM Baseplate Connectors Each CM network port supports these protocols: • TSAA (UDP/IP) • TSAA with IP Multicast (UDP/IP) • TriStation 1131 • Peer-to-Peer (UDP/IP) • Peer-to-Peer (DLC) • Modbus Master or Slave (TCP) • Triconex Time Synchronization via UDP/IP • SNTP Triconex Time Synchronization • JetDirect Network Printer Server DLC/LLC NOTE The Tri-GP CM supports a maximum of four Modbus TCP ports.Product Specifications Communication Capabilities Each CM provides the following communication capabilities: • Serial ports • Network ports • Multiple protocol support Serial Ports Each CM provides three optically isolated RS-232 or RS-485 serial ports which are user-configurable for Modbus point-to-point or multi-point (network) connections. current limited 5 V ± 5%. 6 W maximum. current limited Protective earth to functional earth isolation 500 VDC 29 .75 W maximum additional per MAU 33 VDC –0.Logic Power for CM Logic power is supplied by the MP Baseplate.4 A maximum 0 V.2 to 30 VDC) 8 W maximum 6 W maximum additional per MAU 3. Logic Power Feature Nominal input voltage Specified operational voltage range Logic power (without MAUs) 10 Mb AUI type MAU 100 Mb MII type MAU Absolute maximum input voltage Absolute maximum reverse input voltage Input power interruption time from nominal value Repetition rate Reverse current isolation input to input Inrush current per input Short circuit current limit per input Functional earth to logic ground isolation +12 V AUI output power +5 V MII output power Specification 24 VDC 24 VDC –15% or +20% + 5% AC ripple (19.4 A maximum.75 W maximum.2 A for 50 ms 2. no isolation 12 V ± 10%.6 VDC 1 ms maximum 1 sec minimum 500 A maximum 2. typically 1. 3. The left module occupies the slot below the “L” label on the baseplate and the right module occupies the slot below the “R” label. The maximum operating temperature for all types of I/O modules is 158° F (70° C) ambient.2 mm2 to 3. For most types of I/O baseplates. Each I/O Baseplate includes one I/O Interconnect Assembly. and one Terminal Cover.Product Specifications Common Features for I/O Modules and Baseplates The Digital Input (DI) Module and Baseplate shown below serve as examples for all of the Tri-GP I/O modules and baseplates whose appearance is similar. The following pages provide detailed specifications for all of the I/O modules and baseplates. Each module is mechanically keyed to prevent improper installation in a configured baseplate. one Slot Cover. PASS FAULT ACTIVE FIELD PWR 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 LOCK 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 DI 3301S2 24v DI Baseplate DI Front Panel 30 . the status of either the left or right module can be active or hot-spare depending on which module is in control. the wiring for field devices is connected directly to terminals on the baseplate. At any time.3 mm2) AWG wiring. Each I/O module occupies one of two slots on the baseplate that constitute an I/O set. All types of I/O modules support a hotspare module. which are compression terminals that are compatible with 24 to 12 (0. 31 . minimum 800 VDC. Logic Power Feature Nominal input voltage Voltage range Logic power Absolute maximum input voltage Absolute maximum reverse input voltage Input power interruption time from nominal Power interruption interval Reverse current isolation input to input Inrush current per input Short circuit current limit per input Functional earth to logic ground isolation Protective earth to functional earth isolation Specification 24 VDC 24 VDC –15% or +20% +5% AC ripple (+19.Common Specifications for All I/O Modules The following tables identify the logic and field power specifications for all I/O modules.2 to +30 VDC)a See module specifications 33 VDC – 0.6 VDC 1 ms maximum 1 sec minimum 500 A maximum 2.4 A maximum 0 V.2 to +30 VDC) <3 W 33 VDC – 0.For the PI Module. no isolation 500 VDC. the voltage range is configurable in TriStation 1131 software.6 VDC Not applicable Not applicable 500 A maximum 500 VDC. minimum a. minimum Field Power Feature Nominal field voltage Specified operational voltage range Power Absolute maximum input voltage Absolute maximum reverse input voltage Input power interruption time from nominal Power interruption interval Reverse current isolation Functional earth to protective earth isolation Functional earth to functional earth (logic ground) isolation Specification 24 VDC 24 VDC –15% or +20% +5% AC ripple (+19.4 A maximum 2. which is used in typical 4-20 mA applications. on request. Model 3351S2 Analog Input Module Specifications Feature Points Nominal input current Specified operational current range Absolute maximum field voltage Absolute maximum reverse field voltage Absolute maximum input current Input bandwidth (3dB) Source impedance Input impedance (with baseplate) I to V resistor Resolution Absolute error Diagnostic Scan time Functional earth to protective earth isolation Functional earth to functional earth (logic) isolation Specification 32. minimum 32 . The Model 3351S2 AI Module can be used with these baseplates: • Model 23512351S2. AI Modules support a hot-spare module. which independently process field data input to the module.6 VDC 50 mA DC 16 Hz 180 250 100 0. If the diagnostics detect a failure on any channel. Each channel places the processed data in an array and transmits this array.15% of full scale (20 mA) Force-to-value diagnostic (FVD) < 1 ms for all 32 points 500 VDC. not a complete module failure. Each AI Module is mechanically keyed to prevent improper installation in a configured baseplate. AI Modules are guaranteed to operate properly in the presence of a single fault and may continue to operate properly with multiple faults. commoned 4–20 mA DC 2–22 mA DC 33 VDC – 0. In TMR mode.Product Specifications Analog Input Module Each TMR Analog Input Module has three isolated sets of electronics. • Model 2354S2. minimum 800 VDC. AI Modules include complete. The MPs vote the data before passing it to the application. which is used in 420 mA applications in hazardous locations and enables communication between HART field devices and Configuration and Asset Management Software running on a PC.01% 12 bits 0. • Model 2354AS2. ongoing diagnostics for each channel. to the MP associated with that channel. which is used in 420 mA applications and enables communication between HART field devices and Configuration and Asset Management Software running on a PC. called channels. In dual mode. the Fault indicator turns on and activates the system alarm. the data passed is mid-value. • AI External Termination Baseplate. the data passed is the average. The Fault indicator identifies a channel fault. which is used with the Model 9764510F RTD/TC/AI External Termination Panel or the Model 9792-310F AI Hazardous Location External Termination Panel. 5 W/pt. On to Off. 100 k < 1 ms for all DI points . In TMR mode. 16 AI. The Fault indicator identifies a channel fault.01% 12 bits 0. In dual mode.2 W/pt. Sensing of each input point is performed in a manner that prevents a single failure on one channel from affecting another channel. The AI/DI Module has three isolated sets of electronics. For analog input points. points 17–32) 500 VDC. an ASIC on each channel scans each input point. For all points. 33 Functional earth to protective earth isolation Functional earth to functional earth (logic) isolation Features of AI Points Nominal input current Specified operational current range Absolute maximum field voltage Absolute maximum reverse field voltage Absolute maximum input current Input bandwidth (3dB) Source impedance Input impedance (with baseplate) I to V resistor Resolution Absolute error Diagnostic Scan time Features of DI Points Nominal input voltage Operational voltage range Absolute maximum input voltage Absolute maximum reverse input voltage Input Delay Input impedance Input power Input threshold Diagnostic (loss of view) Maximum input toggle rate to maintain diagnostic fault coverage FVD Off state glitch Duration Magnitude Output impedance ADC scan time < 2 ms 36% test voltage 0–5 VDC. each channel receives variable voltage signals from each point. If the diagnostics detect a failure on any channel. not a complete module failure. Analog Input/Digital Input Modules include the hot-spare feature which allows online replacement of a faulty module. @ 24 VDC 0. called channels. The AI/DI Module is mechanically keyed to prevent improper installation in a configured baseplate. and transmits the values to the three MPs on demand. minimum Specification 4–20 mA DC 2–22 mA DC 33 VDC – 0. the MPs vote the data before passing it to the control program. Off to On > 100 kwithout baseplate ~ 3 kwith baseplate 0. The Model 3361S2 AI/DI Module is compatible with the Model 2361S2 AI/DI Baseplate and the AI/DI External Termination Baseplate. which independently process field data input to the module. compiles data. the data passed is midvalue.15% of full scale (20 mA) Force-to-value diagnostic (FVD) < 1 ms for all 32 points Specification 0–24 VDC 15–30 VDC 33 VDC – 0. minimum 800 VDC.Model 3361S2 Analog Input/Digital Input Module Specifications Features Common to all Points Points Specification 32. converts them to digital values. @ 33 VDC 0–5 VDC = Off region 6–14 VDC = transition region 15–30 VDC = On region Force-to-value diagnostic (FVD). commoned (16 DI. and transmits it to the MPs upon demand. ongoing diagnostics for each channel. For digital input points.6 VDC 50 mA DC 16 Hz 180 250 100 0.6 VDC < 10 ms. points 1–16. the Fault indicator turns on and activates the system alarm. the data passed is the average. AI/DI Modules are guaranteed to operate properly in the presence of a single fault and may continue to operate properly with multiple faults. AI/DI Modules sustain complete. < 2 ms/test < 20/sec Analog Input/Digital Input Module The Analog Input/Digital Input Module has 16 digital input points (1–16) and 16 analog input points (17–32). which is used with the Model 9863-610F External Termination Panel in hazardous locations. nominal 300 @ >16 VDC (1 A minimum) 500 @ >20 VDC (1 A minimum) 700 @ >24 VDC (1 A minimum) 800 @ >28 VDC (1 A minimum) 36 VDC. commoned-return. continuous 1 ms. maximum 24 VDC. AO Modules support a hot-spare module. continuous 0 VDC.25% (in range of 4–20 mA) of FSR (0–22 mA). The Model 3482S2 High-Current AO Module is compatible with only the Model 2481S2 Analog Output Baseplate. controlled 0–22 mA over-range 0 mA output capability (step function < 2 mA) <0. The Model 3481S2 AO Module can be used with these baseplates: • Model 2481S2.Product Specifications Analog Output Modules Each TMR Analog Output Module has three isolated sets of electronics. • Model 2483AS2. not a complete module failure. maximum 3482S2 4. DC-coupled None 4–40 mA output. If the diagnostics detect a failure on any channel.25% (in range of 4–40 mA) of FSR (0–44 mA). continuous 0 VDC. Each AO Module is mechanically keyed to prevent improper installation in a configured baseplate. typical 3 ms. ongoing diagnostics for each channel. the Fault indicator turns on and activates the system alarm. AO Modules are guaranteed to operate properly in the presence of a single fault and may continue to operate properly with multiple faults. called channels. Special circuitry is used to ensure that the channels that are not driving the output are shunted so they cannot affect the output. which is used in typical applications. AO Modules include complete. which enables communication between HART field devices and Configuration and Asset Management Software running on a PC. which independently accept data from the MP associated with each channel. nominal 125 @ >16 VDC (1 A minimum) 210 @ >20 VDC (1 A minimum) 295 @ >24 VDC (1 A minimum) 340 @ >28 VDC (1 A minimum) 36 VDC. from 32° F to 158° F (0° C to 70° C) TMR 12 bits Forced-switch diagnostic (FSD) 32 VDC. DC-coupled None 4–20 mA output. • AO External Termination Baseplate. Analog Output Module Specifications Model Number Points Isolated points Output current range 3481S2 4. which is used in hazardous locations and enables communication between HART field devices and Configuration and Asset Management Software running on a PC. continuous 1 ms. The channels provide input to voter circuitry to select a single channel to drive the output. typical 3 ms. controlled 0–44 mA over-range 0 mA output capability (step function <4 mA) < 0. from 32° F to 122° F (0° C to 50° C) TMR 12 bits Forced-switch diagnostic (FSD) 32 VDC. • Model 2483S2. maximum 24 VDC. The Fault indicator identifies a channel fault. commoned-return. maximum Output accuracy Type Resolution Diagnostic External loop power (reverse voltage-protected) Output loop power requirements for specified load Over-range protection Switch time on leg failure 34 . 2–30 VDC 33 VDC – 0.6 VDC ON to OFF or OFF to ON Time constant = 2. @ 33 VDC 0–5 VDC = Off region 6–14 VDC = transition region 15–30 VDC = On region Force-to-value diagnostic (FVD). minimum 800 VDC. called channels.3dB @ 1. the Fault indicator turns on and activates the system alarm. .2 W/pt. If the diagnostics detect a failure on any channel. Each channel places the processed data in an array and transmits this array. The Model 3311S2 DI Module reports Sequence of Events (SOE) with a reso- lution of one millisecond or less and with an accuracy of one millisecond or less. which is used with typical applications.13 msec. not a complete module failure. The Digital Input Module Specifications Model Number Points Nominal input voltage Operational voltage range Absolute maximum input voltage Absolute maximum reverse input voltage Input delay Input impedance Input power Input threshold Fault indicator identifies a channel fault. 100 k <1 ms for all 32 points 500 VDC. <2 ms/test <20/sec Diagnostic (loss of view) Maximum input toggle rate to maintain diagnostic fault coverage FVD Off state glitch Duration Magnitude Output Impedance ADC scan time Functional earth to protective earth isolation Functional earth to functional earth (logic ground) isolation <20/sec <2 ms 36% test voltage 0–5 VDC. The DI Module continuously verifies the ability of the system to detect transitions to the opposite state. which is used with the Solid State Relay Input External Termination Panel in high-voltage applications.5 W/pt. on request. @ 24 VDC 0.86 msec. with baseplate 0. minimum <2 ms 36% test voltage 0–5 VDC. DI Modules support a hot-spare module. Each DI Module is mechanically keyed to prevent improper installation in a configured baseplate. minimum 35 . ongoing diagnostics for each channel. without baseplate 3 k. The MPs vote on the data before passing it to the application. .Digital Input Modules Each TMR Digital Input Module has three isolated sets of electronics. <2 ms/test 3311S2 32. commoned 24 VDC 19. minimum 800 VDC. <2 ms/test Force-to-trigger diagnostic (FTD).3dB @ 55 hz >30 k.2–30 VDC 33 VDC – 0. with baseplate 0. @ 24 VDC 0. DI Modules are guaranteed to operate properly in the presence of a single fault and may continue to operate properly with multiple faults. • DI External Termination Baseplate.2 Khz >30 k.6 VDC ON to OFF or OFF to ON Time constant = 0. without baseplate 3 k. or the Model 9573-610F DI 3301S2 32. The Model 3301S2 and 3311S2 DI Modules can be used with these baseplates: • Model 2301S2. which independently process field data to the module. @ 33 VDC 0–5 VDC = Off region 6–14 VDC = transition region 15–30 VDC = On region Force-to-value diagnostic (FVD). commoned 24 VDC 19.5 W/pt. DI Modules include complete. to the MP associated with that channel. 100 k <1 ms for all 32 points 500 VDC.2 W/pt. ongoing diagnostics for each channel. The channels use the patented Quad Voter circuitry to vote on individual output signals as they are applied to the load. guaranteeing safety and maximum availability. self limiting 3411S2 16. typical >20 ms Not applicable <1.0 VDC @ 1. OVD detects and alarms these types of faults: • Points—all stuck-on and stuck-offs are detected. called channels.0 ms for all 16 points 500 VDC. typical >20 ms Not applicable <1. The Quad Voter circuitry has multiple redundancy on all critical signal paths. commoned 24 VDC 19 to 30 VDC 33 VDC – 0. minimum Field alarms Loop-back thresholds Loss of field power. typical 700 mA maximum.6 VDC 30 mA <4.6 VDC @ 1. This voter circuitry is based on parallelseries paths which pass power if two out of three switches (channels A and B. self limiting (See the Tri-GP Planning and Installation Guide for extended carry current limits and conditions.0 ms for all 16 points 500 VDC. or channels A and C) command them to close. Digital Output Module Specifications Model Number Points Nominal output voltage Specified operational voltage range Absolute maximum output voltage Absolute maximum reverse input voltage Minimum required field load Output current Switching Carry 3401S2 16. the Fault indicator turns on Digital Output Modules Each TMR Digital Output Module has three isolated sets of electronics. If the diagnostics detect a failure on any channel. • Switches—all stuck-on or stuck-off switches or their associated drive circuitry are detected.) Loss of field power. For each point.6 A <8.0 A.Product Specifications Hazardous Location External Termination Panel.8 A.0 A. minimum 800 VDC. or channels B and C. typical 700 mA maximum.5 A <1.8 A. To allow unrestricted safe operation under a variety of multiple-fault scenarios. the DO Module periodically executes the Output Voter Diagnostic (OVD) routine. self-limiting 3. commoned 24 VDC 19 to 30 VDC 45 VDC – 0.6 VDC n/a <4. minimum 800 VDC. maximum 500 s. minimum Leakage to load (Off state) Diagnostic glitch duration Diagnostic fault coverage Maximum toggle rate Minimum toggle rate On state voltage drop Loop-back scan time Functional earth to protective earth isolation Functional earth to functional earth (logic) isolation 36 . self-limiting 3. output point shorted On or Off 0–5 VDC = Off region 6–14 VDC = transition region 15–30 VDC = On region <1 mA <2 ms. maximum 500 s. output point shorted On or Off 0–5 VDC = Off region 6–14 VDC = transition region 15–30 VDC = On region <1 mA <2 ms. DO Modules include complete. which independently accept data from the MP associated with each channel. which is used with the Relay Output External Termination Panel in highvoltage applications. The resulting count and time are used to generate a frequency (revolutions per minute). which is used with the Relay Output External Termination Panel in highvoltage applications. To ensure correct data for each scan. Although the circuitry is designed for high-frequency operation with debounced edge detection. or the Model 9671-610 DO Hazardous Location External Termination Panel. one value is selected using a mid-value selection algorithm. If the diagnostics detect a failure on any channel. which independently receive voltage transitions from each point and converts the transitions to frequency (RPM) data. which is used with low-current applications where integral current limiting is required. such as turbines or compressors. The output frequency is proportional to the rotational speed of the shaft and the number of teeth. called channels. PI Modules support a hot-spare module. The Model 3382S2 PI Module is compatible with the Model 2381S2 PI Baseplate and the Model 2381AS2 PI Hazardous Location Baseplate. The MPs vote the data before passing it to the application. the resulting change in the magnetic field causes a sinusoidal signal to be induced in the sensor. The six sensitive. Each channel places the processed data in an array and transmits the array. on request. which is used with typical applications. not a complete module failure. to the MP associated with that channel. or the Model 9671-610 DO Hazardous Location External Termination Panel. The PI Module senses voltage transitions from the speed sensors. Each output is provided with a 180 ohm series resistor. The Fault indicator identifies a channel fault. 37 . ringing on the input signal can result in many additional transitions being counted. As the teeth move past the sensor. Pulse Input Modules Each TMR Pulse Input Module has three isolated sets of electronics. ongoing diagnostics for each channel. The Fault indicator identifies a channel fault. PI Modules include complete. which is transmitted to the Main Processors. DO Modules are guaranteed to operate properly in the presence of a single fault and may continue to operate properly with certain multiple faults. the Fault indicator turns on and activates the system alarm. PI Modules are guaranteed to operate properly in the presence of a single fault and may continue to operate properly with multiple faults. • Model 2401LS2. it is sensitive to any type of waveform distortion that could result in erroneous measurements. samples every input transition. not a complete module failure. These baseplates can be used with the Model 3401S2 DO Module: • Model 2401S2. and measures time to optimize the number of input gear pulses. • DO External Termination Baseplate. which is recommended for use with highcurrent power loads. The module is capable of counting over 32. The type of speed sensor typically used with the PI Module consists of an inductive coil and rotating teeth. Sensing of each input point is designed to prevent a single failure on one channel from affecting another channel. DO Modules support a hot-spare module. The Model 3382S2 PI Module enables the controller to provide better control response by providing the control program with an accurate measurement of angular acceleration. Each DO Module is mechanically keyed to prevent improper installation in a configured baseplate. • DO External Termination Baseplate. This can reduce the response time of the controller to one or two scan times. Consequently. Each PI Module is mechanically keyed to prevent improper installation in a configured baseplate.and activates the system alarm.000 transitions per second. The sensor is physically close to the teeth of a gear on the rotating shaft. These baseplates can be used with the Model 3411S2 DO Module: • Model 2401HS2. high-frequency inputs can be individually configured for non-amplified and amplified magnetic speed sensors which are common on rotating equipment. 01 times the numeric value of the input frequency when the frequency range is 3kHz–32 kHz 500.000 Hz/sec2 < 2. 2 Hz to 32.000 Hz 1 V P-P. minimum a. or 10 s minimum pulse width (positive and negative) n/a Number of gear teeth per point (programmable) 1–255a Baseplate configurable Baseplate configurable n/a 0. 0.5 times the numeric value of the input frequency when the frequency range is 3 kHz–32 kHz Gear multiple tracking Precision frequency reference test 20 ms 500 VDC. may exceed the specified values if the number of gear teeth per point “G” is not within the range of 255 > n*G >= 240. b.000 Hz 0. 2.Absolute error of speed. where n is an integer. and jerk.5 Hz to 2 Hz 1 V P-P. does not include error introduced by the field device. 0.000 Hz 2 V P-P.Absolute error of speed. acceleration.1%. and jerk. 0.000 to 32.5 Hz to 32 kHz 20% to 80%. minimum 800 VDC.01%.5 Hz to 2 Hz n/a 0. acceleration. The reporting of speed acceleration and jerk is susceptible to noise and inaccuracies in the gear manufacturing (tooth-tooth spacing) 38 . 2 Hz to 32.000 Hz n/a 4.Product Specifications Pulse Input Module Specifications Model Points Input type Sensor compatibility Maximum operating voltage Minimum operating voltage Differential Single-ended Speed range Input frequency range Duty cycle Maximum continuous slew rate Maximum continuous RPM slew rate Termination resistor Pull-up resistor Resolution Absolute error of input frequency Absolute error Maximum acceleration rate Absolute error of acceleration (Hz/sec)b Maximum jerk rate Absolute error of jerk (Hz/sec2)b Measurement algorithm Diagnostic Minimum scan update rate Functional-to-protective-earth isolation Functional-to -functional-earth (logic) isolation b 3382S2 6 Differential: channel-isolated Single-ended: commoned ground Magnetic.000 Hz/sec < 0.5 to 2. open collector ±33 VDC 500 mV P-P. active. commoned in pairs ±24 V ±30 V ±33 V peak 15 W resistive <100 A 0. minimum 800 VDC. The Fault indicator identifies a channel fault. The three sets of signals are voted and the voted data is used to drive the 32 individual relays. mounted on baseplate Functional earth to protective earth isolation Functional earth to functional earth (logic) isolation Specification 32. not a complete module failure. Ongoing diagnostics test the operational status of the SRO Module. SRO Modules include complete. which independently accept data from the MP associated with each channel.5 A 1 per output. the Fault indicator turns on and activates the system alarm. fast-acting 500 VDC. Model 3451S2 Solid-State Relay Output Module Specifications Feature Points Nominal input voltage Operational voltage range Maximum switching voltage Maximum switching power Maximum off-state leakage Maximum nominal current Maximum over current Voltage drop at baseplate Fuses. interfacing with annunciator panels. solid-state output switches. The SRO Module is a non-triplicated module for use on non-critical points which are not compatible with highside. The Model 3451S2 SRO Module is compatible with the Model 2451S2 SRO Baseplate.75 A.7 A per channel <0.Solid-State Relay Output Module Each Solid-State Relay Output Module has three isolated sets of electronics. SRO Modules support a hot-spare module. for example. 0. Each output has a loop-back circuit which verifies the operation of each relay switch independently of the presence of a load. called channels. Each SRO Module is mechanically keyed to prevent improper installation in a configured baseplate. If the diagnostics detect a failure on any channel. The SRO Module receives output signals from the MPs on each of three channels. The channels provide input to a voter circuit which uses the voted value to drive the coil of the relay. SRO Modules are guaranteed to operate properly in the presence of a single fault and may continue to operate properly with multiple faults. ongoing diagnostics for each channel. The output portion of this module is Simplex.5 A per channel 0. minimum 39 .25 V @ 0. the bus should be terminated by adding an I/O Bus Terminator Kit to both open ends of the system. To extend a system beyond eight baseplates or to distribute the baseplates into multiple I/O columns. each with fuse and blown-fuse indicators • A protective earth (safety ground) terminal • Three DB-9-pin I/O bus connectors. The maximum allowable I/O bus length is 650 feet (200 meters). Various cable lengths are available. I/O Bus Cables An I/O bus cable is required for each TMR channel and is terminated at each end by a male DB-9-pin connector. Logic Power Terminals I/O Extender Module Connectors for I/O Bus Cables Two I/O Extender Modules Linked by I/O Bus Cables 40 . one per channel In a typical Tri-GP system.Product Specifications I/O Extender Module Kits I/O Extender Module Kits are used to: • Carry I/O messages from one I/O column to another • Provide logic power terminals for each I/O column You must connect 24 volt logic power sources to every I/O column by using an I/O Extender Module or an MP Baseplate. Each I/O Extender Module Kit includes: • Two I/O Extender Modules • Three two-foot I/O Bus Cables • One I/O or MP Interconnect Assembly The main components on an I/O Extender Module are: • Two 24-volt logic power input terminal blocks. If the I/O bus is longer than 20 feet (6 meters). a maximum of eight baseplates may be connected end-to-end in an I/O column. as shown on the figure at the right. I/O Extender Modules and I/O Bus Cables are used. They are available for both MP Baseplates and I/O Baseplates. an MP Interconnect Assembly consists of a small passive PCB in a molded plastic housing with two DIN-C 96-pin male connectors. The MP Interconnect is connected to an I/O baseplate.Interconnect Assemblies Tri-GP baseplates within a single I/O column are connected by Interconnect Assemblies that carry I/O messages and logic power across the baseplates. Top End Cap Bottom End Cap End Caps for I/O Baseplate/I/O Extender Module Required Accessories Top End Cap Bottom End Cap End Caps for MP Baseplate The following accessories are required to protect Tri-GP components from dust. an I/O Interconnect Assembly consists of a small passive PCB in a molded plastic housing with two DIN-C 96-pin male connectors. and the I/O Interconnects are connected to other I/O Baseplates. I/O Interconnect Assembly Physically. 41 . Slot covers protect unused baseplate slots. Slot Cover Terminal Cover Terminal covers protect any terminals on a baseplate that are not connected to field wiring. The MP Interconnect Assembly also is used on AI and AO HART Baseplates because they are the same size as MP Baseplates. liquids and corrosive atmospheres: • End caps • Terminal covers • Slot covers End caps protect the top and bottom of each end-of-column baseplate and serve as a card guide. I/O Interconnect Assembly MP Interconnect Assembly MP Interconnect Assembly Physically. The assembly is attached to the top or bottom of an I/O baseplate in order to connect other I/O Baseplates. The assembly is attached to the top or bottom of an MP Baseplate in order to connect adjacent I/O Baseplates. Notes . JetDirect printing. OPC clients which conform to OPC version 2. MP Only 3 serial ports not available not available not available not available 3 Ethernet ports not available One CM 3 serial ports 3 serial ports 3 serial ports 2 Ethernet ports 1 serial portb 2 Ethernet ports 2 Ethernet ports Two CMs 6 serial ports 6 serial ports 6 serial ports 4 Ethernet ports 2 serial portsb 4 Ethernet ports 4 Ethernet ports not available 2 Ethernet ports 4 Ethernet ports not available not available 1 Ethernet portd 2 Ethernet ports 2 Ethernet portsd 4 Ethernet ports not available 2 Ethernet ports 4 Ethernet ports using TSAA protocol to access point data in the Tri-GP controller. Time Synchronization. c. Peer-to-Peer. a client/server workstation connects to a DCS client develop client/server programs. and memory variables. and TriStation 1131 protocols. Honeywell. TSAA client/server (DDE Server and OPC Server). d. Two client/server programs. Ports on the MP support TriStation 1131 and Modbus slave protocol. OPC Server allows read and write access to Tri-GP input. OPC Server for Triconex OPC Server for Triconex is an OPCcompliant product available from Matrikon. ABB. Typically. Bailey.Maximum of four Modbus TCP ports.0 for Alarms and Events Handler can communicate with a Tri-GP through the OPC Server. Communication Capabilities The Tri-GP controller provides stateof-the-art communication capabilities through communication ports on the Main Processors and Communication Modules. Depending on application requirements. and Modbus master/slave protocols. Fisher-Rosemount and Yokogawa • A PC running TriStation 1131 software through the TriStation 1131 (Ethernet) protocol • Other Tri-GP. b. OPC stands for OLE for Process Control which is a standard set of non-proprietary interfaces used to TSAA Client/Server Protocol Triconex System Access Application is a master/slave protocol that allows an external device acting as a master to communicate with one or more Tri-GP controllers. the Tri-GP controller can communicate with the following: • OPC Server for Triconex • Any Modbus master. and system attributes. Peer‐to‐Peer.0 for Data Access and version 1. but not both at the same time. output.The Tri‐GP’s Main Processor and Communication Module support Modbus. including DCS from Foxboro®.NET1 only. Trident™. 43 .Serial 3 only. DDE Server and OPC Server.NET1 or NET2 can be configured for Peer-to-Peer using UDP/IP. Ethernet. use TSAA. and Tricon controllers through the Triconex Peer-to-Peer protocol • External devices using TSAA which is a Triconex master/slave protocol used by devices on an Ethernet network Tri-GP Communication Capabilities Type of Connection Tri-GP as Modbus Slave Tri-GP as Modbus Master Tri-GP as Modbus Master/Slave Tri-GP as Modbus Master or Slave using TCPa TriStation 1131 communication using serial connection TriStation 1131 communication using TCP/IP protocol TSAA Client/Server or TSAA Client/Server with IP Multicast communication Peer-to-Peer communication— for one network of Triconex controllers only—using UDP/IPc or DLC Triconex Time Synchronization via DLC Triconex Time Synchronization using UDP/IP or SNTP Triconex Time Synchronization HP JetDirect Printing a. Ports on the CM support TriStation 1131. see the Matrikon Web site at www. Serial Port Specifications Mode RTU ASCII RS-232 RS-485 Master Slave Point-to-Point Multi-drop MP CM Modbus Communication Modbus is an industry-standard master/slave protocol that is traditionally used for energy management.3) Attachment unit interface (AUI) for MAU Media independent interface (MII) for MAU Debug port MP CM 44 . and system attributes. see the Product Release Notice for TriStation v4. and serial ports and network ports on the CM. Trident. A DCS typically acts as the master while the Tri-GP controller acts as the slave. The master can also be an operator workstation or any general-purpose computer programmed to support Modbus devices. A client can read input.x. or both.com. Peer-to-Peer protocol supports a maximum of 31 Triconex controllers. operate. Serial ports on the MP. The TriStation 1131 software must be installed on a PC that is running Windows and is connected to a CM or MP port on the Tri-GP controller. TriStation 1131 Communication TriStation 1131 protocol uses TCP/IP for CM ports and DLC for MP ports to enable communication between a PC running TriStation 1131 software and a Tri-GP controller. to write data to a Triconex control program. A Tri-GP controller can operate as a Modbus master. Peer-to-Peer Triconex Peer-to-Peer protocol allows Tri-GP. pipeline monitoring. Triconex DDE Server communicates with one or more Triconex controllers through TSAA protocol. Any Windows application that supports DDE protocol—such as Microsoft® Excel®—can use Triconex DDE Server. For detailed Windows version compatibility information. To return data to clients. Client applications use DDE (Dynamic Data Exchange) protocol to communicate with a DDE Server.3) Ethernet Port (10BaseT/100BaseTX Auto-negotiable IEEE 802. Communication Interfaces Interface Modbus Serial Port (RS-232/RS-485) Ethernet Port (10BaseT IEEE 802.Communication Capabilities For more information on OPC Server for Triconex and OPC client applications. and Tricon controllers in a closed network to exchange a limited amount of process control data. the DDE Server uses DDE protocol. download.matrikon. The controllers in a Peer-to-Peer network can be time-synchronized with the master node (the controller with the lowest node number). available on the Invensys Global Customer Support (GCS) website. TriStation 1131 software is compliant with the IEC 61131 International Standard for Programmable Controllers. support Modbus communication. and memory variables. slave. transfer line control. if allowed. Upgrades to Flash ROM The CM firmware stored in the Flash ROM can be upgraded by connecting an Ethernet port to a PC which is running the Triconex Firmware Manager. output. and other industrial processes. and monitor projects for the Tri-GP controller. TriStation 1131 Developer’s Workbench is used to develop. DDE Server for Triconex Triconex DDE Server is a Windows (2000 or XP) application that enables DDE-compliant clients to read and. The TriStation 1131 v4.0 software supports the following Windows operating systems: Windows XP. Windows 7 (32-bit and 64-bit). and documenting safety and critical-process control applications for the Tri-GP controller.x • Function Block Diagram • Ladder Diagram • Structured Text An optional Triconex programming language. TriStation 1131 Software 4.1.x.0 Software These are new features in TriStation 1131 v4. Windows Server 2003.0 software: Support for Triconex General Purpose (Tri-GP) v2. test and document process‐control applications for the Tri‐GP Controller TriStation 1131 Developer’s Workbench TriStation 1131 Developer's Workbench is an integrated tool for developing. CEMPLE (Cause and Effect Matrix Programming Language Editor) supports the widely used Cause and Effect Matrix (CEM) methodology. testing.8.8. see the Product Release Notice for TriStation v4. Functional Overview TriStation 1131 software provides three editors which support these IEC 611313 languages: Example of TriStation 1131 v4. and Windows Server 2008 R2 (32-bit and 64-bit). functions. and function blocks • Define the controller configuration • Declare tagnames • Test applications in an emulator • Download and monitor applications Features in TriStation 1131 v4.1.8. For detailed version compatibility information. available on the Invensys Global Customer Support (GCS) website. user interface and self-documentation capabilities make the system superior to traditional and competing engineering tools. TriStation 1131 software allows you to: • Create programs.x controllers TriStation 1131 software is compliant with Part 3 of the IEC 61131 International Standard for Programmable Controllers with defines programming languages. The programming methodology.x Software Interface 45 .Easy‐to‐use developerʹs workbench allow you to develop.8. This table identifies the compatibility of Tri-GP and TriStation 1131 software versions.0 Tri-GP System 2. Functions do not have to be instanced. For more information on the Enhanced Diagnostic Monitor. An optional language. Libraries TriStation 1131 software includes libraries of pre-defined functions. an 46 Sample Logic in FBD. Programs A program is the highest-level executable logic element in a TriStation 1131 project. the data associated with a function is not retained from one evaluation of the function to the next. Some of these elements are automatically included in every project by TriStation 1131. Programming Languages TriStation 1131 software includes these programming languages: Function Block Diagram. and Ladder Diagram. Each instance is identified by a user-defined instance name. Elements of a TriStation 1131 Project A TriStation 1131 project contains all of the elements required to implement a safety or control application in a Triconex controller. and data variables) that work together to allow a programmable control system to achieve control of a machine or a process. Function Blocks A function block is a logic element which yields one or more results. Unlike a function block. analog (DINT).TriStation 1131 Developer’s Workbench Enhanced Diagnostic Monitor The Enhanced Diagnostic Monitor is an application which monitors the hardware health of Triconex controllers and allows users to effectively troubleshoot the safety system during maintenance. function or function block. can be purchased separately. functions. and real (REAL). Function Block Diagram (FBD) Function Block Diagram is a graphical language that corresponds to circuit . CEMPLE. you can also develop your own libraries of project elements. while others are user-created. These libraries can include programs. and data types which can be imported to other TriStation 1131 projects. All of the data associated with a specific instance of a function block is retained from one evaluation of the function block to the next. To use a function block in a program. function blocks. Structured Text. and data types that can be used in a project. Functions A function is a logic element which yields exactly one result. function blocks. Data types used by TriStation 1131 software include discrete (BOOL). TriStation 1131 software includes these libraries: • IEC 61131-3 Standard Library – a set of functions and function blocks defined by the IEC 61131-3 Standard • Triconex Library – a set of Triconex functions and function blocks that can be used with any Triconex programmable controller • Tricon Library – a set of functions and function blocks that are specifically for use with the Tricon controller In addition to the pre-defined libraries. Each program is uniquely identified by a user-defined type name. function blocks. A TriStation 1131 project can include hundreds of programs. It is an assembly of programming language elements (functions. Data Types A data type defines the size and characteristics of variables declared in a program. see the online Help or printed guide included with the Enhanced Diagnostic Monitor. ST and LD Languages instance of the function block type must first be declared. Emulator Panel The Emulator Panel allows you to connect to an emulator. Links are different from the wires in FBD in that they transfer only binary data between the elements. the controller configuration identifies the modules in the system. and tagnames in the control program. memory allocation for tagnames.diagrams. CASE statement. For Loop and Exit statements. The problem is referred to as the cause and the action as the effect. these structures were added: arrays. variables. Sample CEM from a TriStation Project Cause and Effect Matrix Programming Language Editor (CEMPLE) CEMPLE is a high-level graphical language that provides a two-dimensional matrix in which you can associate a problem in a process with one or more corrective actions. structures. download the control program. and test and debug the control program. You can specify commands to 47 Declaring Tagnames in a Program . and programming structures such as conditional (IF…THEN…ELSE) statements. enumerated data types. Testing can be done by dragging variables and tagnames from the list to the monitor panel and changing the values as desired. var-external. The matrix associates a cause with an effect in the intersection of the cause row and the effect column. The basic elements are coils and contacts which are connected by links. Functions and function blocks can be invoked in Structured Text. Structured Text (ST) Structure Text is a high-level. and operating parameters. Controller Configuration In TriStation 1131 software. The wires transfer binary and other types of data between elements.0 software. textual programming language that is similar to PASCAL. a methodology that is commonly used throughout the process-control industry and readily understood by a broad range of plant personnel. The panel lists the programs. These configuration settings are included in the application that is downloaded to the controller. Ladder Diagram (LD) Ladder Diagram is a graphical language that uses a standard set of symbols for representing relay logic. CEMPLE is the first automated implementation of CEM. thereby eliminating the risks associated with manual translation from handdrawn CEMs. In TriStation 1131 v4. FBD elements appear as blocks that are wired together to form circuits. CEM diagrams are automatically translated into IEC 61131-3 compliant Function Block Diagrams. Structured Text allows Boolean and arithmetic expressions. and var-temp variables. communication settings. TriStation 1131 Developer’s Workbench You can also display the value of a variable during program execution. and function blocks to add information about the operations. functions. or to halt the execution. and variables An annotation can be used to display descriptive text. Emulator Panel run the control program without intervention. you can specify the drawing colors used in the programming editors. Reports and Documentation TriStation 1131 software includes multiple methods of sorting data and documenting project elements. Password Security TriStation 1131 software provides a security system that defines users and their privileges with regard to editing. tagnames. both during and after project development. Project History An audit trail function is provided to document the history of a project and its program version changes. including information specified in system and user-modifiable macros. and editor options such as double-spacing between function block terminals. state changes and other operations. You can also create customized reports with Crystal Reports™. Comments Comments can be added to programs. Help Documentation TriStation 1131 software features an online Help system which provides detailed information about the software. Printouts of user-developed function blocks and programs can be obtained on a variety of user-selected engineering drawing templates. For example. Annotations Annotations can be added to constants. . TriStation 1131 Interface Options TriStation 1131 software allows you to specify options to be used in the interface. library changes. Controller Panel The Controller Panel allows connection to the controller for real-time execution of the application. This detailed log keeps track of user actions and comments by automatically timestamping critical events within a session and manually logging user comments on demand. You can also specify the directory location for files. 48 Standard reports are available to document the project configuration data. to run in single-step. CEM Programming Language Editor Cause and Effect Matrix (CEM) is a methodology that is commonly used in the process control industry to define alarms. intersection. effects. It can also be used to specify properties and to invert values for variables.CEMPLE is the Triconex automated implementation of the traditional CEM methodology that has been used by process control engineers for decades. The Matrix can also include functions or function blocks related to causes. and effects • Multiple levels of undo and redo editing Matrix As the major component of the CEM Editor. Invensys has automated the CEM process with the Cause and Effect Matrix Programming Language Editor. and effect states • Automatic conversion of matrix to Function Block Diagram language Variable Detail Table FBD Network CEM Editor Components 49 . 99 effects. • Customized view monitoring of active causes. intersections. intersection. and 1. or effect that is selected in the matrix.000 intersections • Ability to invoke functions and function blocks to evaluate cause. the Matrix identifies the parts of associated with causes. and intersections. Automated CEM Called CEMPLE The traditional CEM method is timeconsuming and subject to errors caused by misinterpretation of the matrix or inaccurate coding. CEMPLE enables a cause and effect matrix to be used as the basis for a TriStation program. referred to as CEMPLE. and mitigation actions. CEM Editor The CEM Editor includes the following components as shown in the figure below: • Matrix • FBD Network • Variable Detail Table FBD Network The FBD Network displays the Function Block Diagram (FBD) related to the cause. process control engineers have used manual methods such as graph paper and spreadsheet programs to identify problem conditions and corrective actions. Matrix rows and columns CEMPLE Features CEMPLE includes the following features: • Ability to specify up to 99 causes. emergency shutdown strategies. effects. For decades. and intersections. the state of the effect is based on how the matrix is evaluated. and intersection. In a basic matrix. and effects can be viewed in a choice of colors. Using Functions and Function Blocks For more complex processes. User-created functions and function blocks. toolbar. In an instance view of a matrix. Variable Detail Table The Variable Detail Table displays the inputs and outputs of the FBD Network that are generated when a cause. and pop-up menu. and intersections. requires. CEMPLE enables functions and function blocks to be added to causes. As with other types of executable elements. a logical OR is typically used for energize to trip systems. Variables can be added or renamed by making changes in the Variable Detail Table. The effect state can be determined in either of two ways: by a logical AND operation or by a logical OR operation on the intersection. effect. must be created and enabled for use before they can be included in a matrix. For more information. or intersection is selected. values and variables can be set for use during emulation and realtime execution. causes are identified as true or false inputs related to one or more effects through the intersections between them. Where appropriate. drop-down lists provide variable names or function and function block names to be selected. evaluation of process input to determine the cause state. Commands can be selected from a main menu. effect. a matrix can be tested and debugged offline using the Emulator Control Panel. After the project is downloaded. calculating one or more process variable values based on the state of an effect. active causes. The state of a cause (true or false) determines the state of the related effect. Instance View of a Matrix The FBD network uses internal boolean variables to save and move results to associated cells so that causes and effects can be evaluated. CEMPLE Tools A matrix can be developed and edited using a variety of graphical interface methods. and using time delays. effects. an internal variable is automatically created to store and move results between cells. see the TriStation 1131 Developer’s Guide. intersections. If more than one cause is related to an effect. Testing and Monitoring Like all TriStation 1131 programs. A logical AND is typically used for de-energize to trip systems.CEM Programming Language Editor many purposes. such as. the Control Panel can be used to monitor the values of variables during realtime execution. This feature can be used for Developing a Matrix A matrix created in CEMPLE can be as basic or complex as the situation 50 . For each cause. The variable type and data type can also be specified from the Variable Detail Table. it obtains the tagname. event variables and SOE blocks are identified in the TriStation 1131 project. Sequence of Events (SOE) Capability Triconex systems support the ability to report. This capability. is only for use with the Triconex SOE Recorder program. the Main Processors examine selected discrete variables for state changes known as events. MP MP MP Preparing Your System for Event Collection To enable the controller to detect events. events that are significant in your application. Configuring SOE Blocks An SOE block is a data structure that resides in the memory of a controller’s Main Processors. by exception. alias. includes the following parts: • Defining the discrete data items to be monitored through the TriStation 1131 application • Monitoring and collecting events by the Triconex controller • Retrieving the events from the Triconex controller using a host system The following host systems can be used to retrieve event data: • Triconex SOE Recorder. and other information about the event variable from the SOE definition file.During each scan of the TriStation 1131 project. When the SOE Recorder collects an event from the controller. which is output from TriStation 1131 software. After an SOE-enabled project is downloaded to the controller.0 With SOE Recorder you can: • Collect and analyze event data • Export event data to dBASE IV files • Print reports with event data The SOE data file. The following tasks are completed in the TriStation 1131 software: • Defining SOE blocks • Assigning event variables to the SOE blocks • Adding SOE function blocks to the program logic Types of Event Variables The types of discrete variables that can be designated as event variables include BOOL input and BOOL aliased memory variables. the project must include an SOE function block that starts the event collection. state name. a Windows-based application • An OPC client application which has implemented the Alarm and Events Handler as specified in the OPC standard version 1. TriStation 1131 software creates an SOE definition file that contains the SOE block definitions. called Sequence of Events (SOE). This file is read by the SOE Recorder program and adds descriptive information which is associated with the tagname in the Configuration file in a TriStation 1131 project. In addition. When SOE blocks are Triconex Controller CM Triconex Controller CM Triconex Controller CM NET2 NET1 NET1 To DCS PC Running TriStation 1131 Software PC Running SOE Software Tri-GP Network with SOE Recorder 51 . based on TriStation 1131 settings. When a block is collecting events. Trip Processing A trip is a shutdown of the controlled process. It queries all the controllers on the network to determine which downloaded TriStation 1131 projects include SOE blocks.000 events for all blocks. The following function blocks are available: • SOESTRT starts event collection • SOESTOP stops event collection • SOESTAT checks status of SOE blocks • SOECLR clears status of SOE blocks The SOESTRT function block must be added to the TriStation 1131 program to identify the SOE blocks from which events are to be collected. A report engine and standard report are included. . SOE Recorder allows you to: • Find events and copy them to Windows-based applications • Filter and sort saved event data • Specify the display of point properties for event data • View the properties of individual events SOE Recorder also allows event data to be exported to dBASEIV or ASCII text files. Each day. Because the scans of the various controllers on the network are not synchronized. with 60. SOE Function Blocks SOE function blocks control and verify event collection for SOE blocks. or a portion of the controlled process. The worst-case difference is the longer scan time plus 25 milliseconds. SOE Recorder SOE Recorder can simultaneously collect event data from as many as 31 networked controllers. either manually or automatically.000 events. For more information about SOE Recorder. the Main Processors write an event entry which includes the values of event variables that changed during the current scan and a time stamp. Snapshots of events that cover specific periods of time before or after trips have occurred 52 SOE Events File can also be saved. SOE Recorder compares its clock with the clock of each controller from which event data is being collected. these variables must be evaluated in combination to determine the final state of the trip variable. Time Synchronization and Time Stamps In a typical Peer-to-Peer network. a message is displayed in the SOE message bar. If a project requires several variables related to trip conditions. The maximum individual block size is 20. the same event can be logged by two controllers with different time stamps. When a trip event occurs. SOE Recorder can automatically create a trip snapshot. While the TriStation 1131 project is running. see the SOE Recorder User’s Guide. the event variables to be detected by the controller are specified for each block. The block size is the amount of memory that the Main Processors reserve for recording of events. whose state change initiates the shutdown activities.Sequence of Events (SOE) Capability configured. If a controller’s clock is out of sync by more than five minutes. The other SOE function blocks are optional. A TriStation 1131 project used for safety shutdown typically includes one trip variable. If a project includes one or more SOE blocks. SOE Recorder can be used to analyze events online as it collects them from the controllers. A controller recognizes events on a scan basis and time-stamps each event at the beginning of the scan. then SOE Recorder opens the appropriate SOE definition file and begins collecting events from the associated controller. This snapshot is a file of events that occurred x minutes before a trip and y minutes after a trip. the controllers synchronize their time with the master node (the controller with the lowest node number) within ±25 milliseconds. CEM Stands for Cause and Effect Matrix which is a twodimensional matrix for the development of safety applications.Glossary The symbol which represents ohm. availability The probability that the control system is operational at some instant of time. configuration In TriStation 1131 software. Invensys offers communication modules with Ethernet and serial protocol. communication and I/O modules. machinery or other equipment by producing appropriate instructions in response to input signals. and memory and module settings. 53 . card See module. a cause is a problem to be solved by the matrix. A Abbreviation for amp. communication modules Modules that enable the Triconex controllers to communicate with host computers. based on Class and Type combinations. The symbol which represents micro. control program In TriStation 1131 software. ASIC Stands for Application Specific Integrated Circuit. communication and I/O modules. which is one of a number of approach directives developed by the European Union and covers all equipment and protective systems intended for use in potentially explosive atmospheres bin An address range of aliased variables in Triconex controllers. the modules and settings used in a Triconex controller. causes are represented by rows and effects are represented by columns. board See module. Alias is a convention of Modbus which is a communication protocol available with Triconex communication modules. a control program is the compiled code (built from program elements and configuration information) that is downloaded to and runs in a Triconex controller. alias A five-digit number which identifies the data type and hardware address of a point in the Triconex controller. cause In CEM methodology. field termination panels. control system The system which governs the operation of plant. In this type of matrix. controller A Triconex controller includes Main Processors. CEMPLE A language editor in the TriStation 1131 Developer's Workbench that allows you to develop CEMs for safety shutdown applications. ATEX Stands for “Atomsphères Explosibles” and refers to the European Union Directive 94/9/EC. CE Mark A type of certification by the European Union which ensures the electro-magnetic compatibility of Triconex controllers with other pieces of electrical and electronic equipment. including Main Processors. and field termination devices. effect In CEM methodology. IEC 61131-3 The part of the IEC 61131 standard for programmable controllers that specifies the syntax and semantics of a unified suite of programming languages for programmable controllers. Applications running under Windows can use DDE to send and receive data and instructions to and from each other.Glossary DCS Stands for distributed control system. and verifying. based on state changes of discrete variables in the user-written application. An event occurs when a variable changes from the normal state to another state. compiling. event variable A discrete memory variable or discrete input point that has been assigned to an SOE block. Input polling is asynchronous and overlaps execution of the user-written application. including its replacement or repair to return the PLC to operational status. In an instance view. loading. event logger A utility that logs. you can change the values of variables during emulation or real-time execution. a cell in a matrix where a cause row intersects an effect column. or 2) the identification and isolation of a faulty physical component. FBD Stands for Function Block Diagram which is a graphical programming language that corresponds to circuit diagrams. debugging. fault tolerance The ability to identify and compensate for failed control system elements and allow repair while continuing an assigned task without process interruption. Used for connective programming. instance view In TriStation 1131 software. intermittent fault A fault or error that is only occasionally present due to unstable hardware or varying software states. FBD programs are structured by groups of interconnected elements (networks). HART Highway Addressable Remote Transducer protocol is a bi-directional industrial field communication protocol used to communicate between intelligent field instruments and host systems over 4–20 mA instrumentation wiring. intersection In CEMPLE. allowing the integration of function and function blocks. an effect is an action that must be taken to solve a cause (problem). which is a system that controls a process and provides status information to an operator. event A state change of a discrete aliased variable which has been designated for event logging. Fault tolerance is achieved by incorporating redundancy and fault masking. DDE Stands for Dynamic Data Exchange (DDE) which is an interprocess communication mechanism provided by Microsoft Windows. Proper use of an event logger warns users about dangerous conditions and printouts of events can help identify the sequence of events that led to a trip. displays and prints critical events in real time. hot-spare A unique feature of Triconex controllers which allows spare I/O modules to be installed with automatic switch to the spare in case the primary module fails. debug The act of locating and correcting faults: 1) one of the normal operations in software development such as editing. 54 . input poll time The time required by the Triconex controller to collect input data from the controlled process. IEEE Stands for the Institute of Electrical and Electronics Engineers (IEEE) which is a professional society for engineers. host See external host. the Emulator Control Panel and Triconex Control Panel displays the values of annotated variables while a TriStation 1131 project is running. program 1. node number The physical address of a node. MTTR Stands for Mean Time To Repair which is the expected time to repair a failed system or subsystem. commands. Usually expressed in hours. The set of instructions. failure events. logical slot A logical slot includes two physical slots. including the time taken to repair the system. which can house a primary module and a hot spare module. Markov model A generalized modeling technique which can be used to represent a system with an arbitrary number of modules. node usually means a Triconex controller. MTTF Stands for Mean Time To Failure which is the expected average time to a system failure in a population of identical systems. Scan time is composed of three elements: • Input poll time (asynchronous with execution of the user-written application) 55 . a function or function block that can be selected from a list in the Intersection cell of a cause row and an effect row. A Markov model can be mathematically solved to produce a resultant probability. A traditional methodology for ESD applications which associates a problem (cause) in a process with one or more actions (effects) that must be taken to correct the problem. Modules are defined by their connection to a left and right power rail. Peer-to-Peer A protocol that allow multiple Triconex controllers on a proprietary network to exchange limited amounts of process and safety information. ISO Stands for the International Organization for Standardization (ISO) which is a worldwide federation of national standards bodies (ISO member bodies) that promulgates standards affecting international commerce and communications. In this document.Glossary intersection function In CEMPLE. module An active field-replaceable unit consisting of an electronic circuit assembly housed in a metal spine. Usually expressed in hours. 2. MTBF Stands for Mean Time Between Failure which is the expected average time between failures of a system. Usually expressed in hours. reliability The probability that no failure of the system will have occurred in a given period of time. output poll time The time required by the Triconex controller to implement the outputs generated by the user-written application in response to inputs from the controlled process. node Any of the machines on a network. and/or directions that define the Triconex controller’s output signals in terms of input signals. The act of creating such a set of instructions using the relay ladder language of the TriStation 1131 programming system. A CEM program 2. Also called board or card. matrix 1. LD Stands for Ladder Diagram. scan time The period of the Triconex controller’s cycle of required control functions. open network A network to which an external host can be connected. m Abbreviation for milli. protocol A set of rules describing the format used for data exchange between two entities. which is a graphical programming language that uses a set of symbols to represent relay logic. and repair events. TriStation 1131 A Windows-based application for developing and downloading user-written applications and for performing maintenance and diagnostics. trip A safety-related shutdown of the controlled process or a portion of the controlled process. plants and equipment. which is a high-level programming language used for complex arithmetic calculations and procedures that are not easily expressed in graphical languages. Tri-GP. UDP/IP Stands for User Datagram Protocol/Internet Protocol (UDP/IP) which are protocols for the Transport and Network layers of the OSI network model. or with an OPC client/server application. 56 . The complete system is triplicated. Time Synchronization A Triconex protocol used to establish and maintain a synchronized. TÜV Rheinland is an authorized technical inspection agency for a wide variety of products. TÜV Rheinland TÜV stands for Technischer Überwachungs-Verein which translates to Technical Supervisory Association. processes. voting A mechanism whereby each leg of a TMR system compares and corrects the data in each leg using a twoout-of-three majority voting scheme. with a distributed control system (DCS). each of the three identical systems is called a leg. TMR Stands for Triple-Modular Redundant architecture. which allows Triconex controllers to achieve fault tolerance. transient fault A fault or error resulting from a temporary environmental condition. sequenced data delivery. or Trident controllers.Glossary • The time required to execute the user-written application • Output poll time ST Stands for Structured Text. network-wide time basis. system Consists of a set of components which interact under the control of a design. TCP/IP Stands for Transmission Control Protocol/Internet Protocol (TCP/IP) which are protocols for the Transport and Network layers of the OSI network model. Each leg independently executes the user-written application in parallel with the other legs. UDP/IP provides best-effort datagram delivery. TriStation protocol A master/slave protocol used by a TriStation 1131 application for communication with the Triconex controllers. In Germany. TCP/IP provides reliable. Time can be synchronized with the master node in a network of Tricon. installations.