Technical Data SheetRe-issued September 2006 HELOXY™ Modifier 505 Product Description HELOXY™ Modifier 505 is a low viscosity polyepoxide resin that imparts flexibility, impact resistance and thermal shock resistance when incorporated in a wide variety of epoxy formulations. Application Areas/Suggested Uses q q q q Stress relieved concrete patching and surfacing compounds Thermal shock resistant potting and dip coating compounds High impact resistant tooling compounds High peel strength adhesives Benefits q q q q Compatible with conventional epoxy resins Non-volatile and low odor Excellent water resistance Imparts high flexibility and impact resistance to epoxy systems Sales Specification Property Weight per Epoxide Viscosity at 25°C Color Units g/eq cP Gardner Value 500 – 650 250 – 500 6 max. Test Method/Standard ASTM D1652 ASTM D445 ASTM D1544 Typical Properties Property Density at 25°C Units lb/gal Value 8.5 Test Method/Standard ASTM D1475 Processing/How to use In blends with unmodified liquid epoxy resins, HELOXY Modifier 505 is generally substituted at HCD-2635 (Rev. 10/12/2011 9:41:37 AM) Page 1 of 5 HELOXY Modifier 505 concentrations up to 60 percent by weight to provide varying degrees of flexibility. Figure 1 plots the viscosity of such blends as a function of HELOXY Modifier 505 concentrations. The pot life of formulations modified with HELOXY Modifier 505 is normally slightly longer than that of the corresponding base resin. the same cure schedules can be maintained as the unmodified epoxy resins. anhydrides. aromatic amines. Although the combining ratio of the curing agents must be adjusted to compensate for the lower epoxide content (higher WPE) of HELOXY Modifier 505. polybasic acids and Lewis acids. Table 1 / Properties of Epoxy Systems Containing HELOXY Modifier 505 HCD-2635 (Rev. Compared to polyglycol based flexibilizers. Figure 1 / Viscosity reduction with reactive diluents HELOXY Modifier 505 is a useful flexibilizer for systems cured with aliphatic amines. HELOXY Modifier 505 imparts superior electrical properties and water resistance at levels providing equivalent flexibility. Table 1 illustrates the effect of HELOXY Modifier 505 modification on properties of an EPON™ Resin 828/EPIKURE™ 3072 Curing Agent system for ambient temperature use and an EPON 828 anhydride system for elevated temperature cure. 10/12/2011 9:41:37 AM) Page 2 of 5 . 71 Glass Bow Shrinkage 3 (inches divergence from plane surface) 3 Linear Shrinkage 4 inch >0.6 Compressive Strength (yield) 2 Izod Impact.66 --- 0. 24 hrs Weight Loss.000 480 0.83 0.•lb.030 --- --- --- inch/inch 0.600 48 216 102 1. @ 25°C. 100 g mass Cure Schedule cP minutes °F °C 4.750 61 --- Flexural Strength (ultimate) Flexural Modulus (initial) Flexural Deflection psi ksi inches 16.5 Handling Properties Viscosity @ 25°C Gel Time.460 ------- 400 ------- 320 ------- 2 weeks at 25°C 2 hrs at 93°C followed by 2 hrs at 204°C Cured State Properties 1 Tensile Strength (ultimate) Tensile Elongation Tensile Modulus psi % ksi 8.400 0. 24 hrs at 150°C % % 0.900 3 --5.100 0.8 63 Water Absorption.5 60 40 --58 1.33 --- 0. notch Hardness psi ft.40 90 10.200 67 202 94 1.060 70 >0.29 9.HELOXY Modifier 505 Units Composition EPON Resin 828 HELOXY Modifier 505 EPIKURE Curing Agent 3072 Hexahydrophthalic Anhydride EPIKURE Curing Agent 3253 2 A B C D E F pbw pbw pbw pbw pbw 100 --35 ----- 75 25 30 ----- 60 40 36 ----- 100 ----80 1. 10/12/2011 9:41:37 AM) Page 3 of 5 .0038 0.0031 0.200 0.390 25 --11. 100 g mass Peak Exotherm.19 1.6 21.5 40 60 --47 1.83 82 <800 2.52 81 2.17 --- 0.065 0.100 10 --2.590 9 --2.530 250 >0.95 71 --0.460 -->0.200 490 0.6 1.4 --7.000 40 315 157 1./inch Shore D 13.900 0.40 86 8.41 13.14 0.0029 --- --- --- HCD-2635 (Rev.520 350 >0.600 6.6 3.10 0.10 0.400 0. This product will slowly advance in viscosity and epoxide equivalent weight (EEW) over time. Mold Size 1 (195 ml).3(1011) 2.9(1012) 2.0(1015) 9.HELOXY Modifier 505 Electrical Properties Dielectric Constant 5 Dissipation Factor Volume Resistivity at 25°C at 66°C at 93°C at 130°C at 150°C at 180°C at 200°C ohm•cm ohm•cm ohm•cm ohm•cm ohm•cm ohm•cm ohm•cm 3.52 0.4(1015) 1.42 (1010) 3. 3 Corps of Engineers test method measuring the curing stress of a 1/8” thick resin layer bonded to a sheet 1 2 of picture-glass.024 1.1(1015) 2.1(1012) 7. Refrigerated storage will enhance product stability and thus.1(1011) 5.013 3.4(1010) 1.015 4.97 0.52 (1011) 4.72 0.012 >1016 >1016 9. extend the product shelf life expectancy. HELOXY Modifier 505 should be stored in tightly sealed containers.033 3. stored. 4 ERF-12-64. and adherence to proper handling procedures. if feasible. 5 Measured at 1 megacycle and 25 °C. use of appropriate engineering controls and proper personal protective clothing and equipment. None of these materials should be used. The tendency to do so is affected by storage conditions. or transported until the handling precautions and recommendations as stated in the Material Safety Data Sheet (MSDS) for these and all other products being used are understood by all persons who will work with HCD-2635 (Rev. and other factors. 1” height. composition.9(109) <109 ----<109 ----- Determined on 1/8” thick test specimens Test specimen dimensions –1/2” right cylinder.2(109) 2. 10/12/2011 9:41:37 AM) Page 4 of 5 .5(1013) 9. Storage & Handling Please refer to the MSDS for the most current Safety and Handling information. Safety.10 (1013) 1.021 3. through the observance of proper precautions. Please refer to the Momentive web site for Shelf Life and recommended Storage information.12 (1014) 1.12 0.8(1011) 7. Should crystallization occur. especially when stored above the recommended maximum storage temperature.34 (1015) 7.3(1010) 4. Some materials can crystallize during storage.80 0. Exposure to these materials should be minimized and avoided.4(109) <109 <109 <109 --------------------- 5. it may be converted to liquid by opening the drum bung and gently warming to temperatures not to exceed 50 °C (122 °F). in a dry location at normal room temperatures.59 0.3(1014) 1.2(1015) 1. All products supplied by Momentive are subject to Momentive’s terms and conditions of sale. Nothing contained herein constitutes an offer for the sale of any product. Contact Information For product prices. ("Momentive") products should be directed to your Momentive sales representative. PDS-2635. or order placement. availability.(Rev.com ® and ™ Licensed trademarks of Momentive Specialty Chemicals Inc. Packaging Available in bulk and drum quantities. (“Momentive”) to be accurate at the time of preparation or prepared from sources believed to be reliable. except that the product shall conform to Momentive’s specifications. Questions and requests for information on Momentive Specialty Chemicals.them. visit our website at: www. or the nearest Momentive sales office. CONCERNING THE PRODUCT OR THE MERCHANTABILITY OR FITNESS THEREOF FOR ANY PURPOSE OR CONCERNING THE ACCURACY OF ANY INFORMATION PROVIDED BY MOMENTIVE. DISCLAIMER The information provided herein was believed by Momentive Specialty Chemicals Inc.momentive. Information and MSDSs on non-Momentive products should be obtained from the respective manufacturer. but it is the responsibility of the user to investigate and understand other pertinent sources of information. Inc. to comply with all laws and procedures applicable to the safe handling and use of the product and to determine the suitability of the product for its intended use. call our toll-free customer service number at: 1-877-859-2800 For literature and technical assistance.10/12/2011 9:41:36 AM) . MOMENTIVE MAKES NO WARRANTY. EXPRESS OR IMPLIED.