System-Level ESD_EMI Protection Guide

System-Level ESD/EMI Protection Guidewww.ti.com/esd 2010 System-Level ESD/EMI Protection Guide ➔ Table of Contents/Introduction Introduction System-level electrostatic discharge (ESD) protection has become very important in today’s world as devices become portable, contain multiple interface connectors, have touch- screens, and are continually exposed to the external world . It only takes one ESD strike to permanently damage a product, making ESD protection a critical component of system design . Electromagnetic interference (EMI) is another challenge often faced in system design . EMI is a radio frequency (RF) (800 MHz to 2 GHz) disturbance that affects an electrical circuit due to electromagnetic conduction from an external source . EMI can be avoided by using EMI filters that eliminate RF noise and maintain signal integrity . Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Why External ESD? . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 ESD Protection for USB Charger Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 ESD Protection for High-Speed USB 2 .0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 ESD Protection for Super-Speed USB 3 .0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 ESD Protection for VGA and DVI-I Ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 ESD Protection for HDMI/DVI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 ESD Protection for Portable HDMI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 ESD Protection for High-Speed Video and Data Interface . . . . . . . . . . . . . . . . . . 11 ESD Protection for 1394 Ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 ESD Protection for Keypads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 EMI Filters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Resources Packaging Solutions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 ESD/EMI Protection Device List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 TI Worldwide Technical Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 ESD/EMI Protection Solutions TI produces ESD/EMI devices with solutions that protect the majority of external connections to the outside world . Learn more about our ESD/EMI product portfolio . Applications • USB 2 .0/3 .0* • HDMI* • DVI* • DisplayPort • eSATA • 1394* • LVDS • Gigabit Ethernet* • Audio headphones • Microphone ports • Speaker ports • SDIO • SIM www.ti.com/esd *Featured section within this guide. System-Level ESD/EMI Protection Guide 2 Texas Instruments 2010 Silicon die areas for system-level ESD (IEC 8-KV contact). and compromise signal integrity at high data rates . 100 ns Pad Silicon die areas for devicelevel ESD (I2 KV HBM). discrete solutions consume board space. In order to protect against this excess energy. 48 A Legend Charge Device Model (CDM) Human Body Model (HBM) System Level IEC Standard Model 24 A 50 ns ESD models. This is illustrated below . The silicon area required to design system-level ESD protection is much larger than is required for HBM or CDM . complicate layout. Texas Instruments ESD solutions with flow-through packaging allow designers to add ESD components in the final stages of a design without any change in the board layout . Texas Instruments stand-alone ESD devices provide space-saving. Often ESD protection is considered at the last phase of system design . Device-level ESD specifications are not sufficient to protect devices in a system . a more robust design is required . However. This difference in silicon area translates to additional cost . System-level ESD protection can be implemented using discrete diodes or capacitors . System-Level ESD/EMI Protection Guide 3 Texas Instruments 2010 . VCC CH N CH N-1 CH6 CH4 CH2 CH1 CH3 CH5 Pad GND Typical circuit diagram for N number of channels. it becomes more difficult and costly to integrate robust system-level ESD protection with microcontroller or core chipsets . cost-effective solutions to protect system interconnects from external ESD strikes while maintaining signal integrity . The energy associated with a system- level ESD strike is much higher than a device-level ESD strike . Designers need flexibility to select an ESD component that does not compromise the PCB layout or consume additional board space . As technology nodes become smaller. in many applications.System-Level ESD/EMI Protection Guide ➔ Why External ESD? Semiconductor devices based off of advanced processes only offer device-level ESD specifications like the charge device model (CDM) and the human body model (HBM) shown below . Many after-market chargers generate more than 5 V at the USB VBUS pin .0 A2 GND ID VBUS 2 5 B1 0.6 TPD4S012 DRY Package (Top View) D+ D– ID 1 6 TPD4S012 YFP Package 1. Snap-back technology allows high-voltage tolerance during normal operation while reducing the clamp voltage during system-level ESD stress . D– and ID pins and a 20-V clamp for the VBUS pin . datasheets and evaluation modules at www.8 1. GND 1. It supports data rates in excess of 480 Mbps . D–.com/sc/device/TPD4S012 Key Features • Integrated ESD clamps for D+.ti. A common industry solution is to use a high-voltage clamp for the VBUS line . VBUS and ID pins to provide single-chip ESD protection • IEC 61000-4-2 (level 4) system-level ESD compliance measured at the D+. VBUS = 20 V USB Charger/Controller VBUS IO IO IO D+ DGND TPD4S012 in a USB charger application. This simplifies PCB design and allows for flexible design with a small form factor .2 Current (A) VBUS N. Core PMU Chip/USB Controller GND ID D+ VBUS D- System-Level ESD/EMI Protection Guide 4 Texas Instruments 2010 .System-Level ESD/EMI Protection Guide ➔ ESD Protection for USB Charger Interface 4-Channel USB ESD Solution with Power Clamp TPD4S012 Get samples.8-pF line capacitance Tolerates 6-V signal • VBUS line (VBUS) 11-pF line capacitance Tolerates 20-V signal Applications • Cellular phones • Digital cameras • Global positioning systems (GPS) • Portable digital assistants (PDAs) The TPD4S012 is a single-chip ESD protection solution for the USB charger interface .8 B2 C1 0. ID) 0 . The TPD4S012 allows single-layer flow-through PCB layout .2 0 0 5 10 15 Voltage (V) 20 25 30 VBUS clamp voltage under ESD event.C. The TPD4S012 offers a combination of two separate clamps: a 6-V clamp for the D+. D– and ID Pins ±10-kV contact discharge ±10-kV air-gap discharge • 3 amps peak pulse current (8/20-µs pulse) • USB signal pins (D+. GND D+ D– VBUS A1 1.4 0.6 C2 3 4 0.4 (Top View) 1. D–. 0 Low-Capacitance.ti. Ethernet LAN. three-. GND IO1 IO2 1 2 3 4 Vcc IO2 TPD6E001 RSE Package (Top View) TX+ 10 9 8 7 6 5 N.0 • Ethernet • FireWireTM (IEEE 1394) • Video • Cell phones • SVGA connections • Blood glucose meters The TPD2E001. 4- and 6-channel ESD solutions • IEC 61000-4-2 (level 4) ESD protection ±8-kV contact discharge ±15-kV air-gap discharge ±15-kV human body model • Low 1 .0. Each channel RVBUS consists of a pair of diodes that steers ESD current pulses to VCC or GND . TPD3E001. datasheets and evaluation modules at www.5-pF capacitance per channel.5-pF input capacitance • Low 1-nA supply and leakage currents • 0 . GND VBUS . 3-. a ±8-kV contact discharge and a ±15-kV air-gap discharge . TPD4E001.0 (480-Mbps) applications protecting two ESD. TPD2E001 The TPDxE001 is a low-capacitance ESD protection diode array designed to . with a ±15-kV HBM.C.1µF TX- TPD4E001 DRL Package (Top View) IO1 IO2 GND 1 2 3 6 5 4 IO3 N.C. This device has a typical 1 . TPD4E001 and TPD6E001 are designed to protect I/O lines bearing the sensitive capacitive loads of USB 2 . System-Level ESD/EMI Protection Guide 5 Texas Instruments 2010 . Multiple-Channel ESD Protection Arrays for High-Speed Interfaces TPD2E001. RJ 45 TPD2E001 DRY Package (Top View) Vcc N. making it GND ideal for use in high-speed data I/O interfaces .1µF protect sensitive electronics attached to communication lines . TPD3E001.C GND IO4 Vcc IO4 IO3 GND RX+ RX- TPD4E001 Ethernet ESD protection.5 V supply voltage range Applications • USB 2 . USB RT Controller ±8-kV contact discharge. IO6 IO5 IO4 Ethernet Transceiver TPD4E001 IO1 IO2 VCC IO3 +V CC . They are compliant with IEC 61000-4-2. FireWireTM and video VGA interfaces with rail-to-rail diodes . and ±15-kV air-gap discharge. IO1 1 2 3 6 5 4 N.System-Level ESD/EMI Protection Guide ➔ ESD Protection for High-Speed USB 2. four- or six-channel solutions making it ideal for Ethernet and FireWireTM applications .1µF TPD4E001 Vcc D+ DGND USB Controller/ µProcessor IO4 IO1 Vcc IO3 IO2 VBUS D+ GND DGND TPD4E001 in USB 2. as specified in IEC DIO2 61000-4-2 . The IO1 D+ TPDxE001 protects against ESD pulses up to ±15-kV human-body model (HBM).9 V to 5 . TPD6E001 Get samples. The TPDxE001 comes in two-.com/sc/device/PARTnumber Key Features • 2-.C. Tight matching of the line capacitance and series resistors ensure that the differential signal distortion due to the added ESD clamp remains minimal.ti. including clamp capacitance and series resistor matching between the differential signal pairs .0 2-Channel ESD Solution with Series-Resistor Isolation TPD2S017 Get samples. This architecture allows the device to generate very low clamp voltage during system-level ESD strikes and provides a controlled filter roll-off for spurious EMI suppression and signal integrity .02 pF (typ) differential channel input capacitance • ±1% deviation of series resistors (±8 mΩ) Applications • High-speed USB • IEEE 1394 • LVDS • Mobile Digital Display Interface (MDDI)/Mobile Industry Processor Interface (MIPI) The TPD2S017 is a two-channel ESD solution with series resistor isolation to provide two-stage ESD protection for ultra-ESD-sensitive IOs . -3-dB data = 2.com/sc/device/TPD2S017 Key Features • Ultra-low clamp voltage ensures the protection of low voltage core chipsets during ESD events • Exceeds IEC61000-4-2 (level 4) ESD Protection ±11-kV contact discharge ±15-kV human body model • 0 .System-Level ESD/EMI Protection Guide ➔ ESD Protection for High-Speed USB 2.000E+06 1.000E+08 1. datasheets and evaluation modules at www. while also allowing the part to operate at high-speed differential data rates (in excess of 1 . 6-DBV (Top View) Ch1_Out Ch2_Out 0 -1 -2 -3 -4 -5 -6 -7 -8 -9 1. This device offers flow-through pin mapping for ease of board layout . The monolithic silicon technology allows matching component values.74G Hz GND Ch1_In Vcc Ch2_In System-Level ESD/EMI Protection Guide 6 Texas Instruments 2010 .000E+10 Frequency (Hz) TPD2S017DBVR insertion loss data (S21).000E+09 1. TPD2S017 1 Vcc VBUS D+ USB Controller 1 D- GND Usage model for TPD2S017.000E+07 1.5 Gbps) . This device also offers 5-A (8/20-µs) peak pulse current ratings per IEC 61000-4-5 (lightning) specification . This device has 0 .0 Host/ Controller DGND D+ RX+ GND RX- 8 mm D2+ N. eSATA. eSATA or LVDS interface . TX+ VRUS D+ 1 3 D2 GND 1.C. This device has been designed to protect sensitive components that are connected to ultra high-speed data and transmission lines .0.System-Level ESD/EMI Protection Guide ➔ ESD Protection for Super-Speed USB 3.C.C. The TPDxEUSB30 offers protection from stress caused by ESD .05-pF matching capacitance between differential lines and pin capacitance less than 0 .0 2. One TPD4EUSB30 and one TPD2EUSB30 to protect USB 3. D– lines • 0 .ti. These features enable the TPDxEUSB30 to support data rates in excess of 6 Gbps supporting applications such as USB 3 .0 Interface TPDxEUSB30 Get samples. GND GND 2.or 4-Channel ESD Solution for Super-Speed USB 3. VRUS TX- D1- N. datasheets and evaluation modules at: www.5 mm USB 3. 1 mm TPD4EUSB30 package.0 Class A connector (two-layer routing).0 Host/ Controller TXDGND D+ RX+ GND RX- 8 mm 1.com/sc/device/PARTnumber Key Features • Single-pair differential lines to protect the differential data and clock lines of the USB 3 .05-pF matching capacitance between the differential signal pair • Supports data rates in excess of 6 Gbps Applications • USB 3 .05 mm USB 3.05 mm Three TPD2EUSB30 to protect USB 3. or LVD interface • ESD protection meets or exceeds IEC 61000-4-2 (level 4) ±8-kV contact discharge ±8-kV air-gap discharge • 5-A peak pulse current (8/20-µs pulse) for D+.7 pF .0.0 Class A connector (requires only one layer of routing).C. The TPDxEUSB30 conforms to IEC61000-4-2 (level 4) ESD protection . TX+ D1+ N.0 high-speed • eSATA • HDMI • LVDS The TPDxEUSB30 provides two ESD clamp circuits with flow-through pin mapping for ease of board layout . D2- N. System-Level ESD/EMI Protection Guide 7 Texas Instruments 2010 . System-Level ESD/EMI Protection Guide ➔ ESD Protection for VGA and DVI-I Ports Integrated 7-Channel ESD Solution for the VGA Port TPD7S019 Get samples. buffering and sync impedance • Exceeds IEC61000-4-2 (level 4) ESD protection ±8-kV contact discharge ±15-kV human body model • 4-pF loading cap on video lines Level • Buffer and impedance matching Shifting resistor option for SYNC signals 15 Ω EDS 65 Ω Protection 55 Ω Applications • VGA and DVI-I ports in: PCs Graphics cards Set top boxes TVs Impedance Matching The TPD7S019 is TI’s first integrated ESD solution for the VGA port . The device incorporates all of the necessary items for VGA lines: level shifting.com/sc/device/TPD7S019 Key Features • Integrated 7-channel ESD solution with level shifting. buffering and impedance matching . eliminating the need for additional ICs to complete the same functions that the TPD7S019 performs . Level Shifting ESD Protection TPD7S019 Impedance Matching Signal Buffering Signal Buffering Preview: TPD7S019-15 RSV Package (Top View) SYNC_Out2 VCC_VIDEO VCC_SYNC 16 15 14 13 12 11 10 9 SYNC_IN2 VCC_VIDEO VIDEO1 VIDEO2 VIDEO3 GND 1 2 3 4 5 6 7 SYNC_Out1 SYNC_IN1 DDC_Out2 DDC_IN2 VIDEO1 VIDEO2 VIDEO3 GND BYP VCC_DDC DDC_IN1 DDC_Out1 SYNC_IN1 SYNC_Out1 VBYNC 8 DDC_IN1 VCC_SYNC VCC_VIDEO VIDEO1 VIDEO2 VIDEO3 GND VCC_DDC BYP 1 2 3 4 5 6 7 8 DDC_Out1 VCC_DDC BYP 16 15 14 13 12 11 10 9 SYNC_Out2 SYNC_IN2 SYNC_Out1 SYNC_IN1 DDC_Out2 DDC_IN2 DDC_IN1 DDC_Out1 DDC_IN2 DDC_Out2 SYNC_IN2 SYNC_Out2 System-Level ESD/EMI Protection Guide 8 Texas Instruments 2010 . datasheets and evaluation modules at www. ESD protection.ti. All of this combined gives the designer a single-chip device for the VGA port. offers on-chip regulator with 55-mA current limit feature • Meets IEC61000-4-2 (Level 4) ESD protection ±8-kV contact discharge • Integrated level shifting for control pins with additional LV supply • Supports HDMI 1 . ESD_BYP 5-V_SUPPLY TMDS_D2+ TMDS_GND TMDS_D1+ TMDS_GND TMDS_D1– TMDS_D0+ TMDS_GND TMDS_D0– TMDS_CK+ TMDS_GND TMDS_CK– Ioff TMDS_D2– LV Supply DDC_DAT_IN LV Supply 1 38 CE_REMOTE_IN D2+ GND D2– D1+ GND D1– D0+ GND D0– CLK+ GND CLK– CE_R NC D_CK D_DT GND 5OUT HTDT HDMI Connector CE_REMOTE_OUT DDC_DAT_OUT LV Supply LV Supply TPD12S520 HDMI Core Chip DDC_CLK_IN DDC_CLK_OUT HOTPLUG_DET_IN HOTPLUG_DET_OUT TPD12S520/1 electrical schematic. This current enables HDMI receiver detection even when the receiver device is powered off . such as the IEC61000-4-2 (level 4) ESD. These devices also support Ioff (backdrive) protection for current in-rush events . In many cases. While providing ESD protection. In these cases. eliminating the need for an external diode. may not have robust ESD cells to sustain system-level ESD strikes . Connector and Cable HDMI (Active) HDMI Power Down I (Backdrive) Power On Ioff (backdrive protection) is very important for any data-cable connection where one side may be in power-on mode while the other is in power-down mode. This prevents the current backflows to the power-down circuit from any damage.3 data rate • 0 .8-pF ultra-low cap for I/O • 0 . the TPD12S520 and TPD12S521 provide the desired system-level ESD protection. The TPD12S521 for transmitter ports provides an on-chip regulator with current output ratings of 55 mA for pin 38 .com/sc/device/PARTnumber Key Features • TPD12S520: single-chip ESD solution for HDMI reveiver ports • TPD12S521: single-chip ESD solution for HDMI transmitter ports. System-Level ESD/EMI Protection Guide 9 Texas Instruments 2010 . datasheets and evaluation modules at www. the core ICs.05-pF matching cap between TMDS • Backdrive protection Applications • PCs • Consumer electronics • Set-top boxes • DVDRW players • HDTVs The TPD12S520 and TPD12S521 are single-chip ESD solutions for HDMI receiver and transmitter ports . such as the scalar chipset.System-Level ESD/EMI Protection Guide ➔ ESD Protection for HDMI/DVI HDMI Receiver/Transmitter Port Protection and Interface Devices TPD12S520/1 Get samples. This enables the TPD12S521 to provide ESD protection and line-drive capabilities on a single-chip solution . Both of these devices offer a pin layout that is mapped to an HDMI connector.ti. these devices add little to no glitch in the highspeed differential signals due to the low I/O capacitance . by absorbing the energy associated with the ESD strike . VCC Off VCC = 0 VCC 19 20 Board layout example for TPD12S520. eliminating routing and reducing board layout complexity and cost . com/sc/device/TPD12S015 Key Features • Integration of DC/DC charge pump. The TPD12S015 allows HDMI 1 .System-Level ESD/EMI Protection Guide ➔ ESD Protection for Portable HDMI HDMI Companion Chip with Step-Up Converter. The integrated ESD clamps and resistors provide good matching between each differential signal pair to provide an advantage over discrete ESD clamp solutions. The SCL and SDA pins meet the I2C specification and drive up to 750-pF loads . The CEC_B pin has an internal 27 kΩ pullup to an internal 3 .ti. On the B side. • Pin layout matches HDMI type C/D connector which allows for singleboard layout design • The DDC and CEC control lines can drive a 750-pF load.3 V (internal) VBAT CT_CP_HPD* GND DC/DC Converter +5-V Power 10 Texas Instruments 2010 .5-V source to drive the HDMI 5V_Out pin .05 pF Applications • Smart phones • Multimedia phones • Digital camcorders • Digital still cameras • Portable game consoles YFF Package (Top View) 1 A B C D E F G 2 3 4 The TPD12S015 integrates a unique combination of eight low-capacitance ESD clamps. Each has a common power rail (VCCA) on the A side from 1 . I2C Level Shifter and High-Speed ESD Clamps TPD12S015 Get samples.3 to 5 .75 k SCL_A SCL_B CEC_A 3.3 data rates and provides IEC61000-4-2 (level 4) ESD protection . +5-V Power CLK- CLK+ D2- D2+ D1- D1+ D0- D0+ YFF Package Pin Mapping 1 A B C D E F G LS_OE SCL_A SDA_A CT_CP_HPD FB 5VOUT PGND 2 VCCA CEC_A HPD_A GND GND SW VBAT 3 D2+ GND GND CEC_B SCL_B SDA_B HPD_B 4 D2– D1+ D1– D0+ D0– CLK+ CLK– TPD12S015 internal boost converter circuit. This eliminates the need for an external DC/DC converter for portable applications . where variations between ESD clamps degrade the differential signal quality . datasheets and evaluation modules at www.1 V to 3 . There are three non-inverting bidirectional translation circuits for the SDA.5 V (internal) ERC 26 k ±15% CEC_B 5V ERC 1. The TPD12S015 also has a directionless level shifter with integrated pull-up resistors and one-shot circuits . and a power-saving DC/DC converter.6 V .75 k SDA_A SDA_B TPD12S015 directionless level shifter with integrated pull-ups and one-shot circuits. the SCL_B and SDA_B each have an internal 1 . saving system designers almost three times the board space and significantly reducing overall system cost . voltage translation level shifter and ESD protection reduces 76% board space and 30% cost compared to discrete solutions . This DC/DC converter generates a steady 5-V output from a 2 . SCL and CEC lines .75 kΩ pullup connected to the regulated 5-V rail (5VOUT) . System-Level ESD/EMI Protection Guide HPD_A 10 k LS_OE* LDO VCCA 5-V HPD_B 3.3 V . The TPD12S015 has an internal boost converter circuit . resulting in longer cable lengths • Meets IEC 61000-4-2 (level 4) system-level ESD protection ±8-kV contact discharge • 1-pF I/O capacitance for 8-channel ESD protection • Differential matching capacitance of . 5V ERC 1. I2C level shifters. D1+ GND D2+ 1 2 3 6 5 4 D1– VCC D2– TPD4S009 (DGS) D1+ D1– GND D2+ D2– 1 2 3 4 5 10 9 8 7 6 N. These interfaces provide ESD protection with ultra-low.8-pF Capacitance for High-Speed Differential Interface Applications TPD8S009.C. These devices are ideal for any high-speed application up to 6 Gbps . N. 0.C.C.ti. All of these devices except for the TPD4S010 support Ioff (backdrive) protection circuits with an additional diode on the VCC line . 0 . datasheets and evaluation modules at: www.3 and DisplayPort data rate • System-level IEC-61000-4-2 (level 4) ESD protection ±8-kV contact discharge • Differential matching of less than 0 . TPD8S009 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 TPD4S010 Core Scalar/ Switch TPD8S009 and TPD4S010 in DisplayPort application.C. TPD4S009 and TPD4S010 provide ESD protection for high-speed differential bus interfaces .C. System-Level ESD/EMI Protection Guide 11 Texas Instruments 2010 .System-Level ESD/EMI Protection Guide ➔ ESD Protection for High-Speed Video and Data Interface Ultra-Low. They also provide ultra-low matching capacitance to help improve the signal quality .C.8 pF • Ioff feature for TPD8S009 and TPD4S009 Applications • LVDS • HDMI/DVI • DisplayPort • eSATA interface • Serial link • Ethernet • PCI Express® The TPD8S009.05 pF • Pin capacitance less than 0 . N. TPD4S009 (DRY) TPD8S009 (DSM) TPD4S010 (DQA) Package options. N. TPD4S009.C. TPD4S009 (PGV or DCK) 14 N.com/sc/device/PARTnumber Key Features • Complies with the HDMI 1 .C. GND N. D0+ GND D0– D1+ GND D1– D2+ GND D2– D3+ GND D3– 1 2 3 4 5 6 7 8 9 10 11 12 13 VCC D1+ GND 15 VCC D2+ 1 2 3 6 5 4 D1– VCC D2– D1+ D1– GND D2+ D2– 1 2 3 4 5 10 9 8 7 6 N. TPD4S010 Get samples. N.C.8-pF capacitance for less distortion during data transfer . VCC N. D2+ and D2– . Additionally. if there is a floating GND or a high-level signal at the D+. datasheets and evaluation modules at www. ESD-sensitive core chipset .System-Level ESD/EMI Protection Guide ➔ ESD Protection for 1394 Ports Firewire ESD Clamp with Live-Insertion Detection Circuit TPD4S1394 Get samples. The optimized line capacitance allows it to protect the data lines with data rates in excess of 1 .6 GHz without degrading signal integrity . The TPD4S1394 is characterized for operation over ambient air temperatures of –40°C to 85°C . single-in-line pin mapping Applications • IEEE 1394 live insertion protection • LVDS The TPD4S1394 provides a robust system-level ESD solution for the IEEE 1394 port along with a live insertion detection mechanism for high-speed lines interfacing a low-voltage.com/sc/device/TPD4S1394 Key Features • Integrated late Vg detection mechanism generates FWPWR_EN flag • System-level IEC 61000-4-2 ESD protection for high-speed applications Passes 8 KV in 1394 system interface ±15-kV human body model • Low I/O capacitance 1 . Vcc D1+ D1– TPD4S1394 1394 Controller GND VCLMP FWPWR_EN D2+ D2– 1394 Connector. It conforms to the IEC61000-4-2 (level 4) ESD protection and ±15-kV HBM ESD protection . The TPD4S1394 incorporates a live insertion circuit whose output state changes when improper voltage levels are present on the input data lines .5 pF pin capacitance • On-chip 600-ms timer delay mechanism • Flow-through. The FWPWR_EN signal controls an external FireWireTM port power switch . D– pins. D1–. This device protects and monitors up to two differential input pairs . the internal comparator will detect the changes and pull the FWPWR_EN signal to low state . it performs ESD protection on the four input pins: D1+. During the live insertion event. there is an internal delay mechanism preventing it from being driven to the high state regardless of the inputs to the comparator .ti. When FWPWR_EN is driven low. System-Level ESD/EMI Protection Guide 12 Texas Instruments 2010 . System-Level ESD/EMI Protection Guide ➔ ESD Protection for Keypads 8-Channel ESD Clamp Array TPD8E003 Get samples. The TPD8E003 is specified for –40°C to 85°C operation .5-A peak pulse current (8/20 µsec) • Low breakdown voltage of 6 V Applications • Keypad • Touch-screen interface • Memory interface • Docking connector interface The TPD8E003 is an array of eight ESD clamps in a space-saving SON (DQD) package . cell phones. System-Level ESD/EMI Protection Guide 13 Texas Instruments 2010 . datasheets and evaluation modules at www. communication keypad systems and other applications . Its integrated design offers superior matching between multiple lines over discrete ESD clamp solutions . It is intended for use in space-constrained equipment such as portable computers. A B C DQD Package (Top View) IO1 IO2 IO3 IO4 1 2 3 4 GND 8 7 6 5 Through via (6 mils) GND via (6 mils) Top layer trace (4 mils wide) D E IO8 IO7 IO6 IO5 Bottom layer trace (4 mils wide) F Keypad Controller G I K M N O P H J D2+ D2– L Y Z TPD8E003DQDR at keypad interface. This integrated transient voltage suppressor device is designed for applications requiring system-level ESD robustness . The TPD8E003 includes ESD protection circuitry that prevents damage to the application when subjected to ESD stress exceeding IEC 61000-4-2 (level 4) .ti.com/sc/device/TPD8E003 Key Features • Eight-channel ESD clamp array to enhance system-level ESD protection • Exceeds IEC61000-4-2 (level 4) ESD protection ± 12-kV contact discharge ± 15-kV air-gap discharge • 3 . 9 mm -5.00E+05 3dB drop/bias of 0.5V -3dB = 1. dB for TPD2F702.0 -15. With the integration of a 5000-pF capacitor in a space-saving low-noise WCSP package.00E+08 1.0 TPD2F702 YFK Package (Top View) 0. datasheets and evaluation modules at www.28 MHz Legend (DC Bias @ 0.00E+06 1.0V) (DC Bias @ 2. The TPD2F702 exceeds ±30-kV ratings per IEC61000-4-2 contact and air-gap specifications .ti.18 MHz 3dB drop/bias of 2. CTOTAL = 5000 pF) • Low 10-nA leakage current • WCSP packages and flow-through pinout Applications • Mobile phones • Headsets • PDAs • Portable gaming The TPD2F702 is a two-channel EMI filter for audio interface applications .0 -45.3 mm 0.00E+09 Frequency vs.0 -40.9 mm 1.0 -35.0 -25.System-Level ESD/EMI Protection Guide ➔ EMI Filters 2-Channel EMI Filter for Audio Headphones TPD2F702 Get samples. The TPD2F702 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interferences .com/sc/device/TPD2F702 Key Features • 2-channel EMI filtering for audio ports AVIF connector.5V) 1.0 Insertion Loss (dB) -20. The device is optimized for AVIF connector or speaker port interfaces .0 -30. This filter includes ESD protection circuitry. headphone • Exceeds level 4 ESD protection on connector ±30-kV contact discharge ±30-kV air-gap discharge • Pi-style (C-R-C) filter configuration with -3-dB bandwidth at 1 . 0. which prevents damage to the application when subjected to ESD surges far exceeding IEC 61000-4-2 (level 4) . System-Level ESD/EMI Protection Guide 14 Texas Instruments 2010 .0V -3dB = 1.625 mm 0. TPD2F702 Out R Audio Amp/ Audio Codec Out L SGND 5000 pf 5000 pf Sample TPD2F702 application.0 1.2 MHz (R=15 Ω.0 -10. This low-pass filter array also provides system level ESD protection to eliminate the need for external ESD clamps .0 -50.00E+07 Frequency (Hz) 1. the TPD2F702 offers superior EMI noise suppression (2 MHz to 6 GHz) compared to discrete implementation . 4-mm pitch DQD packages .75 mm (0. these filters are ideal for EMI filtering and protecting data lines from ESD at the LCD display. 3. and eight-channel EMI filters in space-saving 0 . In particular. such as mobile handsets.35 mm x 0.75mm (0.ti. PDAs. or 8-channel EMI filter with greater than 25-dB attenuation at 1 GHz • System-level IEC 61000-4-2 ESD protection ± 12-kV contact discharge ± 20-kV air-gap discharge ± 15-kV human body model • Pi-style C-R-C topology with -3-db bandwidth at 200 MHz (R = 100 Ω. etc .35mm x 0. The low-pass filter arrays reduce EMI emissions and provide system-level ESD protection . six-.com/sc/device/PARTnumber Key Features • 4-. datasheets and evaluation modules at www.5 V • Low 10-nA leakage current Applications • LCD display interface • Keypad • Memory interface • Cell phones • SVGA video connections • PDAs The TPD4F003.3 mm x 1.4 mm pitch) Functional TPDxF003 board. Because of its small package and easy-to-use pin assignments.4mm pitch) 2.75 mm (0.4 mm pitch) System-Level ESD/EMI Protection Guide 15 Texas Instruments 2010 . 26 Pin SD Card MicroSD Card 32 mm 11 mm 15 mm 34 mm ExpressCard | 34 75 mm 24 mm Memory Controller GND Memory Connector TPDxF003 typical use circuit. TPDxF003 filters are suitable for a wide array of applications. keypad and memory interfaces . TPD4F003 (DQD) Ch1_In Ch2_In Ch3_In Ch4_In 1 2 3 4 GND 8 7 6 5 Ch1_Out Ch2_Out Ch3_Out Ch4_Out Ch1_In Ch2_In Ch3_In Ch4_In Ch5_In Ch6_In TPD6F003 (DQD) 1 2 3 4 5 6 GND 12 11 10 9 8 7 Ch1_Out Ch2_Out Ch3_Out Ch4_Out Ch5_Out Ch6_Out Ch1_In Ch2_In Ch3_In Ch4_In Ch5_In Ch6_In Ch7_In Ch8_In TPD8F003 (DQD) 1 2 3 4 GND 5 6 7 8 16 15 14 13 12 11 10 9 Ch1_Out Ch2_Out Ch3_Out Ch4_Out Ch5_Out Ch6_Out Ch7_Out Ch8_Out 1.5 mm x 1. TPD6F003 and TPD8F003 are four-.7mm x 1. notebook computers. CTOTAL = 17 pF) • Flow-through package layout • Operating I/O voltage range up to 5 .35 mm x 0.System-Level ESD/EMI Protection Guide ➔ EMI Filters Space-Saving EMI Filters TPDxF003 Get samples. video consoles. 6-. TPD4F202 YFU Packaging (Top View) 1 A B C D E F 2 3 Pin No.06 mm x 1 .57 mm x 0 .and 6-Channel EMI Filters for LCD Display TPDxF202 Get samples. The pi-style (C-R-C) filter provides at least 30-dB attenuation in the carrier frequency range (800 to 2700 MHz) .com/sc/device/PARTnumber Key Features • Low 10-nA leakage current • Ultra-thin YFU package 1 . The TPDxF202 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interferences . CTOTAL = 15 pF) • Cut-off frequency at 108 MHz Applications • LCD interface • Cell phones • SVGA video connections • PDAs The TPDxF202 is a four- and six-channel EMI filter in space-saving SON packages . The TPDxF202 is specified for –40°C to 85°C operation . A1 A3 B2 C1 C3 D1 D3 E2 F1 F3 G1 G3 H2 J1 J3 Name Ch1_In Ch1_Out GND Ch2_In Ch2_Out Ch3_In Ch3_Out GND Ch4_In Ch4_Out Ch5_In Ch5_Out GND Ch6_In Ch6_Out Display Controller LCD Top view of TPD6F202 usage example. System-Level ESD/EMI Protection Guide 16 Texas Instruments 2010 . datasheets and evaluation modules at www. It is used on mobile-phone LCD or memory interfaces .ti. This filter includes an ESD protection circuitry that prevents damage to the application when subjected to ESD strikes up to IEC 61000-4-2 (level 4) . This low-pass filter array reduces EMI emissions and provides system-level ESD protection .3 mm • Exceeds IEC 61000-4-2 system- level ESD protection ± 25-kV contact discharge ± 25-kV air-gap discharge • Pi-style (C-R-C) filter configuration with greater than -32 dB attenuation at 1 GHz (R = 100 Ω. A1 A3 B2 C1 C3 D1 D3 E2 F1 F3 Pin Mapping Name Ch1_In Ch1_Out GND Ch2_In Ch2_Out Ch3_In Ch3_Out GND Ch4_In Ch4_Out TPD6F202 YFU Packaging (Top View) 1 A B C D E F G H I 2 3 Pin Mapping Pin No.System-Level ESD/EMI Protection Guide ➔ EMI Filters 4. 8 mm x 0.Resources ➔ Packaging Solutions TI offers the most robust packaging solutions for ESD/EMI devices . Normal top layer mounting 1 mm <0. The ultra-thin package.18 mm2 PicoStarTM packages to 62 mm2 TSSOP. we have packaging solutions that can fit into any design . With over eight package types ranging from 0 . or placed under some discrete components .053 mm x 2. thinner end equipment .5 mm) (2.5 mm x 2. From the PicoStarTM package that can be embedded into the PCB to 38-pin TSSOP designed for easy board layout (see page 9). about as thin as a human hair. The PicoStarTM package is thin enough to be embedded inside the PCB. PicoStar Package Solutions: Portable consumer electronics designers can save board space with intergrated circuits (ICs) in the PicoStarTM package from Texas Instruments . Devices in this form factor are 50 percent thinner than similar chips in traditional packages and enable smaller.5 mm x 1.35 mm) (1. there are options for every design .13 mm (height) PicoStarTM package under ceramic inductor.6 mm x 0.3 mm) Bit Width TI packages for ESD/EMI solutions.15 mm PCB Metal Layers PicoStarTM Package PicoStarTM package embedded in PCB board.45 mm x 1 mm) (1 mm x 1 mm) (1 mm x 1 mm) (0. The images here show the space-saving capabilities of this package for board TM layout . System-Level ESD/EMI Protection Guide 17 Texas Instruments 2Q 2010 . mounted under a connector.35 mm) A1 A2 B2 C1 C2 (1.8 mm) (0. 0. 0. is the first to give system designers the option to embed silicon components inside the printed circuit board (PCB) to maximize board space . 1 2 3 4 12 11 10 9 8 7 Package Size 5 6 1 2 3 6 5 4 (6.3 mm (height) YFU package under the Zif connector. Height of the total PCB board is 1 mm. Preview products are listed in bold blue. 6-SON GND VCC TPD6E001 Yes IO 1 IO 2 IO 3 IO 4 IO 5 IO 6 6 0.5 5-SOT. 6-SON.5 11 1.9 to 5.5 11 1. of Channels Supply Voltage (Vdd) VBR (min) (V) I/O Cap (pF) Packages IO *TPD1E14A4 Yes 1 n/a -8 to +15 4 2-0201 (YFW) GND VCC TPD2E001 Yes IO 1 IO 2 2 0.5 10-/12-QFN GND *Subject to change. 6-SON GND VCC TPD4E001 Yes IO 1 IO 2 IO 3 IO 4 4 0. System-Level ESD/EMI Protection Guide 18 Texas Instruments 2010 .5 11 1. 6-SON GND VCC TPD3E001 Yes IO 1 IO 2 IO 3 3 0. Call Product Information Center.5 5-SOT.8 3-SOT.Resources ➔ ESD/EMI Protection Device List General-Purpose ESD Protection IEC61000-4-2 Device Level 4 Protection Diagram No.9 to 5.3 to 6 9 0. 4-SOP GND IO 1 TPD2E009 Yes IO 2 2 –0.5 11 1. See page 24 for contact information.9 to 5.5 6-SOT.9 to 5. Resources ➔ ESD/EMI Protection Device List General-Purpose ESD Protection (continued) IEC61000-4-2 Device Level 4 Protection Diagram No.9 to 5.6 6-SOT.9 10-QFN GND IO1 IO2 4-DSLGA (YFM) 3-SC70 (3-DCK) TPD2E007 Yes 2 n/a ±14 10 GND System-Level ESD/EMI Protection Guide 19 Texas Instruments 2010 .5 9 0. 6-SON GND D2+ D1+ D1– TPD4S010 Yes D2– 4 0. 6-SC70.5 6 1.5 6 1.9 6-SOT. of Channels Supply Voltage (Vdd) VBR (min) (V) I/O Cap (pF) Packages VCC TPD4E004 Yes IO 1 IO 2 IO 3 IO 4 6 0. 6-SON GND VCC TPD6E004 Yes IO 1 IO 2 IO 3 IO 4 IO 5 IO 6 6 0.5 9 0.6 8-QFN GND VCC TPD4S009 Yes D2+ D2– D1+ D1– 4 0.9 to 5.9 to 5.9 to 5. Call Product Information Center.5 2.8 6-SON GND *Subject to change. Preview products are listed in bold blue.5 6-PicoStarTM Package GND VBUS D+ TPD4S012 Yes DID 4 –0. of Channels Supply Voltage (Vdd) VBR (min) (V) I/O Cap (pF) Packages D- D+ TPD2EUSB30 Yes GND 2 n/a 9 0.Resources ➔ ESD/EMI Protection Device List General-Purpose ESD Protection (continued) IEC61000-4-2 Device Level 4 Protection Diagram No. See page 24 for contact information. System-Level ESD/EMI Protection Guide 20 Texas Instruments 2010 . ID =6 VBUS = 20 0.7 3-SOT Vcc (Optional) Ch1_In Ch1_Out TPD2S017 Yes Ch2_In Ch2_Out 2 0 to 5 11 1 6-SOT-23 GND IO1 IO2 IO3 IO4 TPD4E002 Yes 4 n/a 6 11 5-SOT IO1 IO4 IO3 *TPD4E281 Yes IO2 4 n/a 4. D-.3 to 20 D+. of Channels Supply Voltage (Vdd) VBR (min) (V) I/O Cap (pF) Packages -3-dB Bandwidth Ch_In 15 30 pF 5000 pF Ch_Out TPD2F702 ±8 IEC 6100-4-2 (Level 1) ESD IEC 6100-4-2 (Level 4) ESD 2 ±14 15 5.Resources ➔ ESD/EMI Protection Device List General-Purpose ESD Protection (continued) IEC61000-4-2 Device Level 4 Protection Diagram No.000 5-WCSP 1.6 4.3 to 6 9 0.5 8-SON Vcc GND TPD8S009 Yes D3D3+ D2D2+ D1D1+ D0D0+ 8 –0.5 pF Ch_Out 4 6 100 17 8-WSON 200 MHz GND System-Level ESD/EMI Protection Guide 21 Texas Instruments 2010 .2 MHz GND Ch_In TPD4F003 ±8 100 8.5 pF 8.8 15-SON GND General-Purpose EMI Protection IEC61000-4-2 Device Contact (kV) Diagram No.2 1. of Channels Supply Voltage (Vdd) VBR (min) (V) I/O Cap (pF) Packages D2+ VCMLP D2D1+ D1- VCC FWPER_EN TPD4S1394 Yes GND 4 0 to 4. 9 to 5. 6-SOT (DRL) 5-SOT (DLR) Application Audio. eSATA USB 2. Ethernet.DRY) 6-SON (DRS).1 I/O Capacitance (pF) 4 1. 3-SC70 (3-DCK) 3-SOP (DBZ).5 n/a VBR (min) (V) -8 to +15 11 ±14 7 7 11 11 11 6.5 pF 6 100 17 16-WSON 200 MHz GND ESD Protection Device List Device *TPD1E14A4 TPD2E001 TPD2E007 TPD2E009 TPD2EUSB30 TPD2S017 TPD3E001 TPD4E001 TPD4E002 IEC61000-4-2 Contact (kV) ±15 ±8 ±8 ±8 ±8 ±11 ±8 ±8 ±15 IEC610004-2 Level 4 Yes Yes Yes Yes Yes Yes Yes Yes Yes No. industrial.0 High Speed USB OTG USB 2. cell phones USB 2. of Channels Supply Voltage (Vdd) VBR (min) (V) I/O Cap (pF) Packages -3-dB Bandwidth Ch_In TPD6F002 ±20 100 C1 = 17 pF C2 = 17 pF Ch_Out 6 6 100 34 12-SON 100 MHz GND Ch_In TPD6F003 ±8 100 8. audio port FirewireTM.0. Call Product Information Center.0 Full Speed Preview products are listed in bold blue.9 to 5.5 10 0. FireWireTM RS-232/RS-485. System-Level ESD/EMI Protection Guide 22 Texas Instruments 2010 .5 n/a n/a n/a 0 to 5 0.9 to 5. Of Channels   1 2 2 2 2 2 3 4 4 Supply Voltage n/a 0.5 pF Ch_Out 6 6 100 17 12-WSON 200 MHz GND Ch_In TPD8F003 ±8 100 8.0 USB 2. FireWireTM.7 0. Ethernet.DRY) 4-DSLGA (YFM). LVDS signaling USB 3.5 0.5 11 Pin/Package   2-0201 (YFW) 4-SOP (DZD) 5-SOT (DRL) 6-SON (DRS.5 1. eSATA.7 1 1. See page 24 for contact information. 3-SOT (DRT) 3-SOT (DRT) 6-SOT-23 (DBV) 5-SOT (DRL) 6-SON (DRS.Resources ➔ ESD/EMI Protection Device List General-Purpose EMI Protection (continued) IEC61000-4-2 Device Contact (kV) Diagram No.5 pF 8. portable computer.0. *Subject to change.5 pF Ch_Out 8 8. 5 1. LCD display. HDMI USB 2.6 2. Of Channels   4 4 4 4 4 4 6 6 7 8 8 12 12 12 Supply Voltage 0. LCD display. LCD display.5 n/a 0 to 20 0 to 4.5 0 to 5. eSATA VGA DisplayPort Keypad. SDIO.5 0.5 n/a 0 to 55 2.8 1. DisplayPort. System-Level ESD/EMI Protection Guide 23 Texas Instruments 2010 . LCD display.9 to 5. Ethernet.8 0. LVDS signaling HDMI Class C/D connector HDMI receiver port HDMI transmit port Preview products are listed in bold blue. **Passes 8 KV in 1394 system interface. LCD display. *Subject to change. FireWireTM.5 7 0. LVDS signaling.2 MHz 200 MHz 108 MHz 100 MHz 200 MHz 108 MHz 200 MHz 300 MHz 300 MHz Application Audio Memory.0 High Speed. Call Product Information Center.3 0. eSATA Memory. LCD display.8 Pin/Package   6-SON (DRY) 6-PicoStarTM Package (YFM) 10-MSOP (DGS)  6-SC-70 (DCK). FireWireTM.Resources ➔ ESD/EMI Protection Device List ESD Protection Device List (continued) Device TPD4E004 *TPD4E281 TPD4S009 TPD4S010 TPD4S012 TPD4S1394 TPD6E001 TPD6E004 TPD7S019 TPD8E003 TPD8S009 TPD12S015 TPD12S520 TPD12S521 IEC61000-4-2 Contact (kV) ±8 ±8 ±8 ±8 ±10 **±8 ±8 ±8 ±8 ±12 ±8 ±8 ±8 ±8 IEC610004-2 Level 4 Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes Yes No.5 0 to 5. HDMI eSATA. USB 2.8 1. ID = 6 VBUS = 20 4. Ethernet.5 n/a 0 to 5.0 High Speed eSATA. FireWireTM. keypad Memory. 6-SON (DRY).0 High Speed (charging applications) 1394/FireWireTM USB 2.6 2. of Channels 2 4 4 6 6 6 8 3 6 VBR (min) (V) ±14 6 6 6 6 6 6 6 6 Rline (typ) (Ohms)   15 100 100 100 100 100 100 47 45 Ctotal (typ) (pF)   5.9 to 5. 12-WQFN (RSF) 8-UQFN (RSE) 16-SSOP (DBQ).8 0. touch-screen interface. SIM card HDMI. Ethernet. keypad Memory. D-. keypad Memory. Memory. eSATA USB 2.0. 6-SOT-23 (DBV) 6-SON (DQA) 6-SON (DRY) 8-X2SON (DQL) 10-UQFN (RSE). EMI Protection Device List Device TPD2F702 TPD4F003 TPD4F202 TPD6F002 TPD6F003 TPD6F202 TPD8F003 TPD3F303 TPD6F301 Air-Gap (kV) ±30 ±20 ±25 ±30 ±20 ±25 ±20 ±15 ±15 Contact (kV) ±30 ±12 ±25 ±20 ±12 ±25 ±12 ±8 ±8 No.5 1. keypad SIM interface SDIO interface Preview products are listed in bold blue. keypad Memory.5 9 9 D+.030 17 30 34 17 30 17 20 12 Pin/Package 5-WCSP (YFK) WSON (8-DQD) DSBGA (10-YFU) SON (12-DSV) WSON (12-DQD) DSBGA (15-YFU) WSON (16-DQD) SON (8-DQD) SON (16-DQD) -3-dB Bandwidth 1.0.9 to 5. 16-UQFN (RSE) 8-WSON (DQD) 15-SON (DSM) 28-DSBGA (YFP) 38-TSSOP (DBT) 38-TSSOP (DBT) Application USB 2.8 0.5 VBR (min) (V) 6 4.3 to 5.5 0.6 0.2 11 6 9 6 9 9 9 9 I/O Capacitance (pF) 1. keypad Memory. See page 24 for contact information. 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