w. e.f Academic Year 2009-10 ‘E’ Scheme MAHARASHTRA STATE BOARD OF TECHNICAL EDUCATION, MUMBAI TEACHING AND EXAMINATION SCHEME FOR POST S.S.C. DIPLOMA COURSES COURSE NAME : DIPLOMA IN INDUSTRIAL ELECTRONICS COURSE CODE : IE DURATION OF COURSE : SIX SEMESTERS WITH EFFECT FROM 2009-10 SEMESTER : FIFTH DURATION : 16 WEEKS PATTERN : FULL TIME - SEMESTER SCHEME : E SR. NO. SUBJECT TITLE Abbrev iation SUB CODE TEACHING SCHEME TH TU PR PAPER HRS TH (01) Max Min EXAMINATION SCHEME PR (04) Max Min OR (08) Max Min TW (09) Max Min SW (16005) 1 2 3 4 5 6 7 8 Principles of Computer Architecture and Maintenance Microcontrollers Principles of Communication Systems Industrial Electronics & Applications Advance Industrial Electronics Maintenance of Electronic Equipment Professional Practices-V Industrial Project & Entrepreneurship Development PCA MIC PCS IEA AIE MEE PPR IPD 12186 12187 12194 12195 12196 12191 12192 12193 03 03 03 03 03 --01 -------01 02 02 02 02 02* 04 03 02 03 03 03 03 03 ---- 100 100 100 100 100 ---- 40 40 40 40 40 ---- -50# ---50@ --- -20 ---20 --- --25@ 25# 25# ---- --10 10 10 ---- 25@ 25@ -25@ 25@ -50@ 25@ 10 10 -10 10 -20 10 50 TOTAL 16 01 18 -- 500 -- 100 -- 75 -- 175 -- 50 Student Contact Hours Per Week: 35 Hrs. THEORY AND PRACTICAL PERIODS OF 60 MINUTES EACH. Total Marks : 900 @ Internal Assessment, # External Assessment, No Theory Examination, * Practical on Alternate Week. Abbreviations: TH-Theory, TU- Tutorial, PR-Practical, OR-Oral, TW- Termwork, SW- Sessional Work ¾ Conduct two class tests each of 25 marks for each theory subject. Sum of the total test marks of all subjects is to be converted out of 50 marks as sessional work (SW). ¾ Progressive evaluation is to be done by subject teacher as per the prevailing curriculum implementation and assessment norms. ¾ Code number for TH, PR, OR and TW are to be given as suffix 1, 4, 8, 9 respectively to the subject code. MSBTE – Final Copy Dt. 18/12/2010 1 IE5 w. e. f Academic Year 2009-10 ‘E’ Scheme COURSE NAME : DIPLOMA IN ELECTRONICS ENGINEERING GROUP COURSE CODE : ET/EN/EJ/EX/IE/IS/IC/DE/EV/MU/IU/ED/EI SEMESTER : FIFTH FOR ET/EJ/EN/EX/IS/IC/IE/DE/EV/MU AND SIXTH FOR IU/ED/EI SUBJECT TITLE : PRINCIPLES OF COMPUTER ARCHITECTURE AND MAINTENANCE SUBJECT CODE : 12186 Teaching and Examination Scheme: Teaching Scheme TH 03 NOTE: ¾ Two tests each of 25 marks to be conducted as per the schedule given by MSBTE. ¾ Total of tests marks for all theory subjects are to be converted out of 50 and to be entered in mark sheet under the head Sessional Work. (SW) Rationale: The aim of the subject is to teach the basic working of the computer motherboard, peripherals and add-on cards. The subject helps the students to do the maintenance of the Computer, peripherals and its add-on cards. The students will be able to select the proper peripheral as per their specification and requirement. This is the core subject. The pre-requisite of the subject is Microprocessor. The subject is practical oriented and will develop the debugging skills in the students. Objectives: The student will be able to: 1. Debug and repair the faults in system. 2. Assemble the system. 3. Load the operating system and device drivers in the system. TU -PR 02 PAPER HRS. 03 TH 100 Examination Scheme PR -OR -TW 25@ TOTAL 125 MSBTE – Final Copy Dt. 18/12/2010 2 12186 IE5 w. e. f Academic Year 2009-10 ‘E’ Scheme Learning Structure: Application Understand the architecture of PC, use different techniques to troubleshoot the PC problems using preventive measures and repairing. Procedure Learning architectural details - Write everything down - Do the easy stuff first - Check for operator error - Check the software - Check external signals - Run diagnostic programs. Repairing the different components of PC by using different methods Principle Logic of components Rules of troubleshooting Rules of repairing Concepts Motherboard, drive formatting, latency, landing zone, HDD, FDD, Active, Passive, modular motherboard. Error codes, memory package, styles and structures, memory signals, memory manager, disk manager, EZ-Drive, DMI, SCSI, Video adapter etc. Facts AT, ATX, motherboard, AGP, PCI Port etc Problems of system boards, display problems Tools for repairing the faults, types of tests MSBTE – Final Copy Dt. 18/12/2010 3 12186 IE5 w. e. f Academic Year 2009-10 ‘E’ Scheme Contents: Theory Chapter Name of the Topic Motherboard And Its Components 1.1 Different types of PC configurations and their comparison 1.2 Chipset basic, chipset Architecture : North/South Bridge architecture and Hub architecture 1.3 Architecture of Intel chipset 915 G& 945 G 1.4 Overview and features of ISA, PCI-X, PCI-Xpress, AGP, Processor Bus (no pin description) Comparison between PCI and PCI Express 1.5 Logical memory organization : Conventional memory, Extended memory, Expanded memory (No memory map) 1.6 Concept of cache memory : Internal cache, External cache (L1, L2, L3 cache) 1.7 Overview and features of SDRAM, DDR, SDRAM, DDR2, SDRAM, DDR3 1.8 BIOS Basics Storage Devices And Its Interfacing 2.1 Recording Technique : RM, MFM, RLL Perpendicular magnetic recording • Hard disk construction and working • Terms related to Hard Disk : Track, Sector cylinder, cluster, Head parking, MBR, Zone recording • Formatting, Low level formatting, High level formatting, partitioning 2.2 Hard disk drive interface : features of parallel AT attachment (PATA), Serial AT Attachment (SATA), External SATA (no pin discription) • CDROM drive : Construction, recording • DVD : Construction, Recording Display Devices & Interfacing 3.1 CRT colour monitor : Block diagram and function of each block 3.2 Characteristics of CRT monitor : Dot pitch, Resolution, Video bandwidth, Horizontal scanning frequency, Interlaced versus non interlaced monitor 3.3 Advantages of CRT display over LCD display 3.4 LCD monitor : functional block diagram of LCD monitor, working principal, advantages and disadvantages Types : Passive matrix and Active matrix, Important characteristics : Resolution, Refresh rate, Response time. 3.5 Basic block diagram of a video accelerator card Input & Output Devices Construction, working & Installation of : 4.1 Keyboard. 4.2 Mouse: Mechanical, Optomechanical, New optical 4.3 Scanner: Types, Flat bed, Block diagram and specifications. 4.3 Modem: Internal and External: Block diagram and specifications. 4.4 Printer: Dot matrix, Inkjet, Laser: Block diagram and 4 Hours Marks 01 08 16 02 08 20 03 05 12 04 08 16 MSBTE – Final Copy Dt. 18/12/2010 12186 IE5 w. e. f Academic Year 2009-10 ‘E’ Scheme 05 06 07 specifications Power Supplies 5.1 Block diagram and working of SMPS. 5.2 Signal description and pin diagram of AT and ATX connectors 5.3 Power supply characteristics: Rated wattage, Efficiency, Regulation, Ripple, Load regulation, line regulation 5.4 Power problems : Blackout, Brownout, surges and spikes 5.5 Symptoms of power problems 5.6 Protection devices : Surge suppressor : working 5.7 UPS : Block diagram, working, Types, Rating Interfaces 6.1 SCSI, SCSI cables and connectors, SCSI drive configuration. 6.2 USB features 6.3 RS232 : (Voltages & 9 pin Signal description) 6.4 Centronics (interface diagram, signals and timing waveform) 6.6 Firewire features Pc Diagnostic, Testing And Maintenance And Tools 7.1 Preventive Maintenance : Active Preventive maintenance, passive preventiv maintenance, periodic maintenance procedure 7.2 Preventive maintenance of peripherals of PCs. 7.3 Fault finding and troubleshooting of the above peripherals 7.4 ESD (Electrostatic discharge), RFI protection 7.5 Working of logic probe, logic purser, current Total 04 12 05 12 10 12 48 100 Practical: Skills to be developed: Intellectual Skills: 1. Sequencing of steps 2. Methods of Fault Finding Motor Skills: 1. Follow Proper Procedure. List of experiments: 1. Study of components of Pentium IV motherboard 2. Study of HDD, its installation and partitioning 3. Study of Display adapter 4. Study of Keyboard 5. Study of Mouse and its types 6. Study of Flat bed scanner 7. Study of printers (Any one type, preferably Laser printer) 8. Study of modems 9. Study of SMPS 10. Study of UPS 11. Study of preventive maintenance of peripherals of PC MSBTE – Final Copy Dt. 18/12/2010 5 12186 IE5 w. e. f Academic Year 2009-10 ‘E’ Scheme Learning Resources: Books: Sr. No. 01 02 03 04 05 Author Mike Meyers, Scott Jernigan Bigelow Mark Minasi D. Balasubramanian Scott Mueller Title Managing & Troubleshooting PCs Bigelow's Troubleshooting, Maintaining & Repairing PCs The Complete PC Upgrade & Maintenance Guide Computer Installation & Servicing Upgrading & Repairing PCs Publisher Tata McGraw Hill Tata McGraw Hill BPB Publication Tata McGraw Hill Pearson Education MSBTE – Final Copy Dt. 18/12/2010 6 12186 IE5 w. e. f Academic Year 2009-10 ‘E’ Scheme COURSE NAME COURSE CODE SEMESTER : DIPLOMA IN ELECTRONICS ENGINEERING GROUP : ET/EN/EX/EJ/IE/IS/IC/DE/EV/MU/IU/ED/EI : FIFTH FOR ET/EN/EX/EJ/IE/IS/IC/DE/EV/MU AND SIXTH FOR IU/ED/EI SUBJECT TITLE SUBJECT CODE : MICROCONTROLLERS : 12187 Teaching and Examination Scheme: Teaching Scheme TH 03 TU -PR 02 PAPER HRS 03 TH 100 Examination Scheme PR 50# OR -TW 25@ TOTAL 175 NOTE: ¾ Two tests each of 25 marks to be conducted as per the schedule given by MSBTE. ¾ Total of tests marks for all theory subjects are to be converted out of 50 and to be entered in mark sheet under the head Sessional Work. (SW) Rationale: This subject comes under the technology area. The prerequisite of this subject is the thorough knowledge of architecture of 8085 Microprocessor and its programming. The peripheral devices of 8085 microprocessor such as PIO 8155 and 8255 and data converters are covered in this subject The knowledge of interfacing of peripherals will help the students in acquiring the design skills and for applications like stepper motor control and temperature control systems. The technology of microprocessor has led to a single chip Microcontroller technology MCS51 family architecture, details of 8051 Microcontroller and its programming is covered in this subject use of assembler and stimulator for programming of Microcontroller will make the students equipped for the development of embedded systems. Objectives: The student will be able to: 1. Use data transfer techniques. 2. Describe architecture and operation of microcontroller 8051. 3. Develop assembly language programs using instruction set of 8051. 4. Design and develop microcontroller based systems. 5. Explain various applications of microcontrollers. MSBTE – Final Copy Dt. 18/12/2010 7 12187 IE5 w. e. f Academic Year 2009-10 ‘E’ Scheme Learning Structure: Application To develop and use microcontroller based systems Procedure Procedural steps for writing, assembling and executing assembly language programs for 8051 Procedural steps for design and development of 8051 microcontroller based systems Principle Principles of assembly language programming of 8051 Concept Functional Block Diagram, pin out, operating modes of ICs Functional block diagram, registers, control signals, timers, counters, I/O ports, interrupts in 8051 microcontroller Addressing modes and instructions of 8051 Facts IC 8155, 8255, 8355, 8755 Architecture of 8051 Electronic Components and circuitry MSBTE – Final Copy Dt. 18/12/2010 8 12187 IE5 w. e. f Academic Year 2009-10 ‘E’ Scheme Contents: Theory Chapter Name of the Topic Peripheral Devices 1.1 Need of peripheral 1.2 Data Transfer Techniques Serial and Parallel Hand shaking, Polling, Interrupt driven & device driven Microprocessor controlled with DMA (Only concept of DMA; no chip details) Synchronous and Asynchronous Simplex & Duplex Baud rate - Define Programmable I/O Devices 2.1 IC 8155 • Block Diagram, pin out, operating modes, Simple I/O programs and Interfacing with 8085 Microprocessor. • Minimum system configuration of 8085 Microprocessor. • IC 8255 Block Diagram, pin out, operating modes, Simple I/O programs and Interfacing with 8085 Microprocessor. • Comparison of 8155 & 8255 peripheral. Interfacing of A to D Converter with 8085 Microprocessor. 1) Using Handshaking 2) Using interrupts • Interfacing of D to A Converter with 8085 Microprocessor and pgm for different waveform generation using 8255. • Practical Applications using 8085 Microprocessor. - For Stepper Motor Control operation - For Temperature Control operation. Introduction to Microcontroller 3.1 Comparison of Microprocessor, Microcontroller. 3.2 Evaluation of Microcontroller 3.3 Terminology: - RISC, CISC, VLIW, Harvard and Von Neumann Architectures 3.4 Memory types:- EEPROM and FLASH 3.5 Specification & comparison of 8051, 8751 & 8951. 8051 Microcontroller 4.1 MCS-51 Architecture and details (from intel manual) 4.2 Pin configuration and pin function of 8051. 4.3 Function of Clock, Oscillator, Registers, Register bank mapping, DPTR, Flags, Stack, PC, Ports 4.4 Concept of Data Memory and Program Memory 4.5 Connections of External Memory and timing diagram. 4.6 8051 Boolean Processors MCS-51 Addressing Modes and Instructions 5.1 8051 Addressing modes 5.2 8051 Instruction Set 5.3 Simple Programming ( in assembly language) 9 Hours Marks 01 02 06 02 04 08 03 08 16 04 02 04 05 14 20 06 08 20 MSBTE – Final Copy Dt. 18/12/2010 12187 IE5 w. e. f Academic Year 2009-10 ‘E’ Scheme 07 08 Assembly language programming 6.1 Development systems tools Editor, Assembler, Linker 6.2 Creating various files to run the 8051 program (asm, obj, lst and hex files) 6.3 8051 Data Types and Directives (DB, ORG, EQU, END etc.) 6.4 Software Simulators of 8051 MCS-51 Timers/Counters, Interrupts and Serial Communication 7.1 Study of Timer SFR’s (TMOD, TCON, TLX, THX) 7.2 Timer modes of 8051 and programming of 8051 timers. 7.3 Generation of time delay. Power saving options of 8051 ( study of PCON) Total 02 06 08 20 48 100 Practical: Skills to be developed: Intellectual Skills: 1. Reading 2. Sourcing of Web sites Motor Skill: 1. Testing 2. Measurement List of Practical: 1) 8155 Interfacing :( I/O Mode, Generation of square and sine wave using Timer mode) 2) 8255 Interfacing: (I/O Mode and BSR Mode Operations) 3) Generation of square, triangular and sine wave using DAC 4) Any one application of A to D converter Interfacing. 5) Stepper Motor Control 6) Addition, Subtraction, Multiplication and Division operations 7) Packing and unpacking of 8 bit data 8) Finding seven segment code using look up table 9) Square wave generation using internal timer of 8051 Learning Resources: Books: Sr. No. 01 02 Author Deshmukh Predko Title Microcontrollers: Theory & Applications Programming & Customizing 8051 Microcontroller Publisher Tata McGraw-Hill Tata McGraw-Hill MSBTE – Final Copy Dt. 18/12/2010 10 12187 IE5 w. e. f Academic Year 2009-10 ‘E’ Scheme COURSE NAME COURSE CODE SEMESTER SUBJECT TITLE SUBJECT CODE : INDUSTRIAL ELECTRONICS/INSTRUMENTATION / INSTRUMENTATION & CONTROL : IE/IS/IC/IU : FIFTH FOR IE/IS/IC AND SIXTH FOR IU : PRINCIPLES OF COMMUNICATION SYSTEMS : 12194 Teaching and Examination Scheme:Teaching Scheme TH 03 NOTE: ¾ Two tests each of 25 marks to be conducted as per the schedule given by MSBTE. ¾ Total of tests marks for all theory subjects are to be converted out of 50 and to be entered in mark sheet under the head Sessional Work. (SW) Rational: This subject comes under core technology group. It intends to teach the students facts, concepts, procedures of communication systems as well as advanced communication system. The knowledge of the subject will help the students to handle and operate the different communication systems at their work place after completion of the subject. Objectives: Due to globalization and competition, industries are developing fast and incorporating automation in various sectors. The future trend indicates that, The students will be able to: 1) Describe various electronic systems. 2) Compare various types of modulation techniques. 3) Analyze different types of audio and video systems. 4) Use principles in operating different types of communication facilities such as satellite, telephone, mobile and data communication. TU -PR 02 PAPER HRS. 03 TH 100 Examination Scheme PR -OR 25@ TW -TOTAL 125 MSBTE – Final Copy Dt. 18/12/2010 11 12194 IE5 w. e. f Academic Year 2009-10 ‘E’ Scheme Learning Structure: Applications Apply Communication System in understanding Working of Audio and Video Systems Principles of AM, Principles FM, Pulse Modulation and Digital Carrier Modulation Principl es of Antenn a and Wave Propaga tion Principl es of Audio and Video System Principl es of Satellite and Cable TV Principles of Telephony System, Fiber Optics, FAX, Cellular Phone & Cable Principles of Data Communic ation 1) LAN, WAN, MAN 2) Internet Concepts Radio (Wireless) Communication Systems Wire Communication Facts Various Communication Sources MSBTE – Final Copy Dt. 18/12/2010 12 12194 IE5 w. e. f Academic Year 2009-10 ‘E’ Scheme Contents: Theory Chapter Name of the Topic ANALOG COMMUNICATION 1.1 Introduction to electronic communication system and modulation techniques. 1.1.1 Importance of communication system. 1.1.2 Types of electronic communication system, concept of:- Simplex, Duplex – half & full, analog systems, Digital systems, Modulation. 1.1.3 Electromagnetic spectrum 1.1.4 Concept of transmission bandwidth 1.2 Types of Modulation1.2.1 Amplitude of Modulation: - definition, Representation in frequency. & Time domain, bandwidth required for AM, modulation Index and total carrier power numerical (no derivation only using formulas). 1.2.2 Block diagram with explanation of super heterodyne AM receiver. 1.3 Frequency modulation 1.3.1 Frequency modulation: Definition, Representation in time domain, Deviation ratio, maximum deviation ratio, and bandwidth for FM. 1.3.2 Block diagram of Foster- Seeley discriminator type FM receiver with function of each block. 1.4 Application of AM & FM, comparison of AM & FM. DIGITAL COMMUNICATION 2.1 Pulse Modulation 2.1.1 Definition of Pulse Modulation 2.1.2 Sampling theorem & Nyquist Criteria (Only statements) 2.2 Different types of Pulse modulation system with, Definition, waveforms, application, advantages and disadvantages of each. 2.2.1 PAM (pulse amplitude modulation) 2.2.2 PWM (pulse width modulation) 2.2.3 PPM (pulse position modulation) 2.3 Pulse code modulation: - Definition of PCM, Quantization process, Quantization error, Quantization error 2.3.1 PCM: - advantages and disadvantages 2.4 Digital carrier modulation 2.4.1 Different types of pulse modulation with definition, waveforms and Application of: - Amplitude shift keying, Frequency shift keying, Phase shift keying and Quadrature amplitude modulation. Hours Marks 01 08 16 02 08 16 MSBTE – Final Copy Dt. 18/12/2010 13 12194 IE5 w. e. f Academic Year 2009-10 ‘E’ Scheme 03 04 05 Introduction to Television 3.1 Different TV standards as i) NTSC and ii) CCIR – B 3.2 Block diagram of monochrome Transmitter and receiver, function of each block 3.3 Compatibility 3.4 Colour composite video signal 3.5 Col. TV Standards (only PAL system) 3.5.1 Primary and secondary colours, Grass man’s law 3.5.2 Colour difference signals 3.5.3 Colour burst signal 3.6 Block diagram PAL – D receiver and function of each block. 3.7 Introduction to direct to home TV 4.1 Telephone system and it’s applications 4.1.1 Concept of FAX 4.1.2 Components of facsimile system: Diagram with explanation 4.1.3 Scanning mechanism 4.1.4 Data compression 4.1.5 Block diagram Of FAX Tran receiver 4.2 Telephony systems 4.2.1 Landline telephony – DTMF, 4.2.2 Different tones used in telephony, 4.2.3 Cordless phone. 4.3 Introduction to cellular phone system 4.4 Cellular concept 4.5 Concept of Hands – off technique 4.6 Concept of frequency reuse 4.7 Cellular Telephone Systems: 4.7.1 GSM – Group Special Mobile or Global System 4.7.2 CDMA - Code division multiple access. Data Communication 5.1 Modes of Data transmission serial, parallel, Synchronous, asynchronous communication. 5.2 Simplex & Duplex Communication. 5.3 Network architecture and the OSI reference model. 5.4 MODEM 5.5 Introduction to networks & network topologies LAN, WAN, MAN 5.6 9 pin RS – 232 standard for serial communication Total 07 12 07 12 10 24 08 20 48 100 Practical: Skills to be developed: Intellectual Skills: i) Locate faults in various electronic circuits ii) Interpret test results Motor Skills: i) Observation skill ii) Acquisition of data. MSBTE – Final Copy Dt. 18/12/2010 14 12194 IE5 w. e. f Academic Year 2009-10 ‘E’ Scheme List of Practical: 1. Measure modulation index of AM by varying amplitude and frequency 2. To observe the waveforms by changing carrier and modulating frequency and by changing shape of the modulating signal i.e. square wave 3. To observe the waveforms of FM by changing carrier and modulating frequency and by changing shape of the modulating signal i.e. Square wave. 4. To observe the wave form of PAM: Change shape and frequency of carrier and modulating signal 5. To observe the wave form of PWM: Change shape and frequency of carrier and modulating signal 6. To observe the wave form of PPM: Change shape and frequency of carrier and modulating signal 7. To observe the wave form of PCM: By using 4 bit / 6 bit 8. Observe colour composite signal on CRO of video and chroma section and draw it. 9. Waveform analysis of colour TV at different test points. 10. Fault finding in horizontal oscillator section of TV. 11. Fault finding in VERTICAL SECTION of TV. 12. Study of PWM using FOC 13. Analog link using FOC 14. Digital link using FOC 15. Arrange a visit to LAN network in your college, and draw layout for it. List the different components used in it. Write specifications for each. 16. Draw layout for 20 computers in LAN network. List the components required to design it. Make a market survey for that. 17. Search different sites TV manufacturing companies (any 3) and compare them on the basis of components used , their specifications, cost etc. Learning Resources: Books: Sr. No. 01 02 03 04 05 06 07 08 Author Kennedy Frenzel Anita Divakar R. G. Gupta William Lee R.G Gupta Gulati Manohar Lotia Name Electronic communication systems. Communication Electronics Electronic Communication System Audio & Video Engineering Satellite Communication Television Engg and Video System Principles Of Video Engineering CD Player Manual Publication TMH Publication TMH Publication TMH Publication TMH Publication -TMH Publication -BPB Publication MSBTE – Final Copy Dt. 18/12/2010 15 12194 IE5 w. e. f Academic Year 2009-10 ‘E’ Scheme COURSE NAME COURSE CODE SEMESTER SUBJECT TITLE SUBJECT CODE : DIPLOMA IN INDUSTRIAL ELECTRONICS : IE/IU : FIFTH FOR IE AND SIXTH FOR IU : INDUSTRIAL ELECTRONICS & APPLICATIONS : 12195 Teaching and Examination Scheme: Teaching Scheme TH 03 NOTE: ¾ Two tests each of 25 marks to be conducted as per the schedule given by MSBTE. ¾ Total of tests marks for all theory subjects are to be converted out of 50 and to be entered in mark sheet under the head Sessional Work. (SW) Rationale: Over the years the design and construction of electronic devices and circuits have changed dramatically. The needs of the technician and experimenter have also changed over the years. In order to construct industrial circuits, engineer has to have a firm grasp of the fundamentals of power electronics. The background required is familiarity with basic power electronic concepts. Industrial electronics aspect is introduced to cater specifically the needs of students of Industrial Electronics engineering. Power electronics play important role in electronics power generation and power transformation. The content of power electronics is beyond the scope of one semester and hence Industrial electronics subject is continuation of power electronics. This subject is important link between basic electricity and advanced electronic applications. This subject shall provide firm foundation for many industrial applications and processes. Industrial electronics shall play very important role for shop floor engineers in the field of industrial applications like conversion, inversion, and stabilization of ac & dc power control etc. Also it will help engineer in the field of power generation, transformation and distribution in ac power. At the same time in the field of dc power requirement in industries, laboratories. This subject is heart of many industrial processes like battery charging, UPS, welding, time controlled processes, temperature controller operation etc. Objectives: Student will be able to: 1. 2. 3. 4. Choose a device for a specific application Describe the operation of various converters, invertors, choppers, regulator List applications of converters, invertors, choppers, regulator Select proper device for a given application TU -PR 02 PAPER HRS. 03 TH 100 Examination Scheme PR -OR 25# TW 25@ TOTAL 150 MSBTE – Final Copy Dt. 18/12/2010 16 12195 IE5 w. e. f Academic Year 2009-10 ‘E’ Scheme Learning Structure: Power conditioners. Stabilizer, UPS, SMPS Industrial drives Electronic ballast, HVDC transmission, electric welding, battery charger Industrial applications Dc to dc converterSwitch mode converter (chopper) Dc to ac converters Inverters Static switch Power electronic semiconductor switches (power transistor, power MOSFET, IGBT) Small signal diode, BJT, FET, MOSFET, Power diode, Thyristor MSBTE – Final Copy Dt. 18/12/2010 17 12195 IE5 w. e. f Academic Year 2009-10 ‘E’ Scheme Contents: Theory Chapter Name of the Topic Non Latching Devices: a) Need for power transistor, power MOSFET & IGBT Constructional details, operating principle, characteristics. b) Study of above devices with reference to the parameters i] Voltage and current rating ii] Turn on and turn off time iii] leakage current iv] Conduction loss & switching loss v] Gate triggering requirements – drive , gate dissipation c) List of applications of above devices d) Introduction to SIT , MCT , FCT Dc to DC converter (chopper) Basic block diagram, operating principle. Classification of choppers on the basis of: a] output voltage – step up & step down b] Commutation method – series turn off & parallel turn Off c] Quadrant of operation – single quadrant , two quadrant , four quadrant, Jones chopper Circuit, operating principle, Applications of choppers. DC to AC converter ( Inverter ) a] Basic principle of inverter b] Classification on the basis of : 1. Energy source – voltage source & current source. 2. Commutation – series & parallel c] Voltage source inverters : i] Series inverter ii] Parallel inverter with R & RL load iii Bridge inverter : simple bridge inverter with R load bridge inverter with Mc Murray Bed Ford commutation, Bridge inverter with Mc Murray commutator. d] Resonant inverters – Zero voltage switching e] Output voltage & harmonics control using PWM control method. f] Listing of applications. g] Specifications. AC & DC voltage regulator a) Ac voltage regulator Need of ac voltage regulator (power line disturbances) Regulator types : Relay type , servo type , Resonant type, solid state type ( tap changing & phase control) Circuit diagram , operating principle , applications of above types, Specifications b) Switching regulator (SMPS) i] Need ii] Power supply requirements: Regulated output, isolation, multiple outputs, efficiency, size, weight iii] Review of linear regulator 18 Hours Marks 1 06 16 2 06 14 3 06 14 4 08 12 MSBTE – Final Copy Dt. 18/12/2010 12195 IE5 w. e. f Academic Year 2009-10 ‘E’ Scheme 5 6 7 iv] SMPS : Block diagram Explanation of: 1] Isolation transformer : it’s requirements & core properties 2] Converter circuits : Push-pull , half bridge & full bridge 3] PWM control 4] Specifications UPS a] Need of UPS b] Basic block diagram of UPS & operating principle, explanation of rectifier , battery , inverter , static transfer switch c] Types of UPS : Off line UPS, On line UPS, Line interactive UPS & their comparison d] UPS specifications – Input voltage range, dc voltage range, transient response, response time, total harmonic distortion, output frequency, output waveform, transient recovery, load power factor & types of protection. Applications a] Ac voltage controller b] HVDC & transmission c] Resistance welding – Basic block diagram, Types, Welding control -SCR Line contactor, Heat control, Welding timer. d] Electronic ballast e] Battery charging regulator , emergency light f] Temperature controller g] Ac flasher h] SCR , UJT time delay & ultra precise time delay circuit (Note: Points e, f, g, h are to be taught in laboratory). Protection circuits a] Need of protection circuits b] Snubber circuits: Their functions, operating principle of unpolarised RC, polarized RC & polarized LR snubbers. c] Over current protection & over voltage protection d] Isolation circuits : pulse transformer & optoisolator e] Crowbar protection, current fold back , spike suppressor f] Circuit breaker TOTAL 08 12 08 16 08 16 48 100 Practical: Intellectual Skills: 1. Reading 2. Searching on Web sites Motor Skill: 1. Testing 2. Measurement MSBTE – Final Copy Dt. 18/12/2010 19 12195 IE5 w. e. f Academic Year 2009-10 ‘E’ Scheme List of Practical: 1] Characteristics of power transistor. 2] Characteristics of IGBT. 3] Characteristics of MOSFET. 4] Study of snubber circuit. 5] Study of step-up chopper. 6] Study of step-down chopper. 7] Study of series inverter. 8] Study of parallel inverter. 9] Study of servo voltage stabilizer. 10] Study of UPS. 11] Study of SMPS. 12] Study of liquid level controller. 13] Study of resistance welding. Learning Resources: Books: Sr. No. 01 02 03 04 Author Singh Bhattacharya Zbar Petruzella Title Power Electronics Industrial Electronics & Control Industrial Electronics: A Text Lab Manual Industrial Electronics Publisher Tata McGraw-Hill Tata McGraw-Hill Tata McGraw-Hill McGraw-Hill International MSBTE – Final Copy Dt. 18/12/2010 20 12195 IE5 w. e. f Academic Year 2009-10 ‘E’ Scheme COURSE NAME COURSE CODE SEMESTER SUBJECT TITLE SUBJECT CODE : DIPLOMA IN INDUSTRIAL ELECTRONICS : IE/IU : FIFTH FOR IE AND SIXTH FOR IU : ADVANCE INDUSTRIAL ELECTRONICS : 12196 Teaching and Examination Scheme: Teaching Scheme TH 03 TU -PR 02* PAPER HRS. 03 TH 100 Examination Scheme PR -OR 25# TW 25@ TOTAL 150 * Practical on Alternate Week. NOTE: ¾ Two tests each of 25 marks to be conducted as per the schedule given by MSBTE. ¾ Total of tests marks for all theory subjects are to be converted out of 50 and to be entered in mark sheet under the head Sessional Work. (SW) Rationale: With advancement of technologies, industries had undergone revolution. To cope up with the modern industries diploma level students are to be exposed to the modern techniques. Advanced Industrial Electronics subject is classified under technology group. The subject enables the student to learn basic facts, concepts, principles & procedures and safety used in modern industries. The knowledge of Industrial electronics will help students to develop supervisory & testing skills. It will also help the students to develop planning, scheduling as well as personal Skills. Objectives: Students will be able to: 1. Prescribe non destructive tests for materials. 2. Operate Modern Machinery. 3. Use CNC machine techniques. 4. Follow safety procedures. MSBTE – Final Copy Dt. 18/12/2010 21 12196 IE5 w. e. f Academic Year 2009-10 ‘E’ Scheme Learning Structure Application To develop the skill of implementing & testing different industrial Electronics concepts, principles & application circuits in industries Procedure Demonstration of NDT techniques such as UT & MPT Demonstration of EDM technique & NC-CNC machining techniques Demonstration of surface hardening of steel Principles Principles of ultrasonic testing & magnetic particle testing Ultrasoni c flow detection Magnetic crack detection Principle of non-traditional machining EDM Electrodischar ge machini Principle of automatic machining technique Numerical control & computer numerical control Principle of controlled heating process Induction to heating Concept Dielectric Heating Non – Destructive testing techniques Modern Machining techniques Controlled RF heating techniques Concept of modern industry which utilizes different testing, machine & controlling systems Different industrial circuits studied in industrial electronics area Facts Testing , machining & controlling systems used in industrial applications such as UFD , MCD , EDM , NC/CNC, induction heating , dielectric heating MSBTE – Final Copy Dt. 18/12/2010 22 12196 IE5 w. e. f Academic Year 2009-10 ‘E’ Scheme Content: Details Chapter Name of the Topic Concept of modern industry & Safety Introduction of modern industry Information of modern industry Concept of modern industry, problems in traditional industries, use of electronics systems in industries. 1 Intrinsic safety – Area, Classification, Knowledge of authorizedregulatory bodies, intrinsic safety related standards, explosionpackage, alarm annunciators. Reliability of various electronic components and systems Non destructive testing methods: Ultrasonic flaw detection Introduction to non-destructive testing. Different NDT methods – Magnetic crack detection, Ultrasonic, Radiography, Liquid penetration, Eddy current. Basic concept of ultrasonic generation transducers, piezoelectric transducer, piezoelectric effect, and magnetostriction coil transducer, magnetostriction effect. Different generation methods of ultrasonic waves, mechanical methods, thermal method, modern method of ultrasonic generation (introduction level) electronics methods – piezoelectric oscillator & magnetostriction oscillator (transistorized circuits) :- circuit diagram, working, frequency range, equation, advantages, disadvantages & applications. Application of ultrasonic- Ultrasonic flaw detection,– 2 resonancemethod, through transmission method (introduction level) Pulse echo method – block diagram and explanation, Ultrasonic flow detection/meter, level detection(measurement of liquid & solid) different probes :- normal & angle probes materials for probes – quartz, ceramic, lithium sulphate, couplets. Ultrasonic cleaning, soldering, cold welding heating, Applications : block diagram and explanation Other application – thermal effects, thermo acoustic method &electronic acoustic methods. Advantages & limitations of ultrasonic applications in industry Magnetic Crack Detection Introduction to magnetic crack detection (magnetic particle testing) Materials used in MPT Base material (material under test) :ferromagnetic material, inspection media : ferromagnetic material powders – non – fluorescent, fluorescent, colour powders, liquids like kerosene, water, light petroleum distillate (wet method), black light or ultraviolet source (magnaglo method) Principle of MPT, orientation of magnetic field, Longitudinal magnetization (principle using bar magnet) Circular magnetization (principle using circular magnet) Method of magnetization of base material (job under test) 23 Hours Marks 02 08 12 20 3 06 16 MSBTE – Final Copy Dt. 18/12/2010 12196 IE5 w. e. f Academic Year 2009-10 ‘E’ Scheme 4 5 6 Longitudinal magnetization: Coil shot method, yoke method, torroidal method. Circular magnetization: Headshot method, central conductor method and prod magnetization method. Locallised magnetization: Torroidal method, prod magnetization method, horse – shoe magnet method. Types & amount of magnetizing current used for magnetization, equation of magnetizing current. Methods of crack detection Dry method Wet method – magnaflux method, magnaglo method, partical size, advantages, limitations of each method, demagnetization. Indications obtained & standards used in MPT Techniques of recording results :Transparent plastic tape Strippable lacquer film Photography Standards used in MPT Non Traditional Machining & mass production techniques. Electro Discharge machining Introduction to Non traditional machining techniques thermal & electro thermal, chemical & electrochemical, mechanical Introduction to thermal & electro thermal type NTM i.e. EDM. Principal of EDM, schematic diagram & explanation Basic set-up of EDM. Schematic representation of EDM process & explanation. Concept of subsystems used in EDM set-up such as servo motor, high pressure pump, filter, pressure gauge, vacuum pump, dielectric fluid, electrodes, D.C. supply. Applications of EDM: Drilling of micro holes, thread cutting using EDM, wire-cut EDM as special application. Application diagram & explanation. Advantages & disadvantages of EDM. NC/CNC machines Introduction to NC, CNC, DNC, CIM system, points considered in selection of components for NC and CNC machining. Basic components of NC and CNC explanation of each block, Different input media used in NC/CNC. Block diagram and explanation of NC and CNC machines. Classification, Construction, operation fo NC/CNC machines, features considered while designing, structure of NC/CNC machines Part programming of NC/CNC, steps involved, manual part programming, ISO, EIA codes of programming, G codes, M codes and programming using different formats. Use of subroutines, do loop scanned (fixed) cycles in programming. Computer aided part programming; High level languages used in part programming, introduction to APT language and small application programs. Controlling techniques High frequency heating Introduction to different heating techniquesInduction heating, Dielectric heating, IR heating, Microwave heating. Introduction to induction heating Principle of induction heating, 24 06 12 16 28 06 16 MSBTE – Final Copy Dt. 18/12/2010 12196 IE5 w. e. f Academic Year 2009-10 ‘E’ Scheme basic set-up of induction heating. Block diagram and explanation of induction heating, use of reset timer in the system. Oscillator circuit used in induction heating system, circuit diagram, working, frequency range, application area. Application of induction heating system. Surface hardening of steel, Annealing, brazing and other applications. Block diagrams and explanation. Advantages and disadvantages of induction heating. Introduction to dielectric heating. Principle of dielectric heating, Block diagram and explanation of dielectric heating. Applications of dielectric heating. Comparison of dielectric and induction heating, Advantages and disadvantages of dielectric heating. Total Practical: Skills to be developed: Intellectual Skills: 1. Reading 2. Sourcing of Web sites Motor Skill: 1. Testing 2. Measurement 48 100 List of Practical: 1. Visit to automation industry 2. Demonstration of ultrasonic flaw detection using pulse echo system with standard reference blocks. 3. Demonstration of different industrial techniques used of MPT for surface & subsurface crack detection. 4. Demonstration of EDM process. (Die cut & wire-cut EDM demonstration should be shown) 5. Demonstration of NC/CNC machines. 6. Demonstration of surface hardening of steel using induction heating system. 7. Demonstration of dielectric heating system. Learning Resources: Books: Sr. No. 1 2 3 4 5 Author V.N.Bindal Title Publisher Narosa Publishing House New age International (P) Ltd. Narosa Publishing House Tata mcgraw Hill Publishing company Ltd. Tata mcgraw Hill Publishing company Ltd. Transducers for Ultrasonic flow detection B.S.Pabla, M.Adithan CNC Machines Baldev Raj Practical Non-Destructive T.Jayakumar Testing M.Thavasimutha S.K.Bhattacharya Industrial Electronics & S.Chatterjee Control HMT Production Technology MSBTE – Final Copy Dt. 18/12/2010 25 12196 IE5 w. e. f Academic Year 2009-10 ‘E’ Scheme COURSE NAME: DIPLOMA IN ELECTRONICS ENGINEERING GROUP (EXCEPT EV) COURSE CODE : ET/EN/EJ/EX/IE/IS/IC/DE/MU/ED/EI/IU SEMESTER : FIFTH FOR ET/EN/EJ/EX/IE/IS/IC/DE/MU AND SIXTH FOR ED/EI/IU SUBJECT TITLE: MAINTENANCE OF ELECTRONIC EQUIPMENTS SUBJECT CODE: 12191 Teaching and Examination Scheme Teaching Scheme TH -TU -PR 04 PAPER HRS. -TH -Examination Scheme PR 50 @ OR -TW -TOTAL 50 Rationale: This subject will develop the basic skills of maintenance of electronic equipments also provides the necessary knowledge and competence in fault finding, systematic repair of electronic test equipment. Also give the knowledge of maintenance management of service dept/ service enterprises working in industry / as a profession. Objective: Students will be able to: 1. To develop tracing, testing, maintenance and trouble shooting knowledge. 2. To develop analysis of circuit working 3. To develops different fault finding technique like, visual inspection, Tracing voltage analysis , Signal analysis 4. Able to find the equivalent components with the help of data book. 5. Effective use of internet 6. Effective use of computer, operation manual, service manual. MSBTE – Final Copy Dt. 18/12/2010 26 12191 IE5 w. e. f Academic Year 2009-10 ‘E’ Scheme Contents: Chapter Name of the Topic Reliability aspects of electronic equipment Hours 01 Traditional bathtub reliability curve Generalized reliability curve Mean time to fail Failure rate Mean time between failure Mean time to repair Mean time to restore system Thermal acceleration Electrical acceleration Damp heat acceleration Practical reliability Quality standards Maintenance policy Preventive maintenance Corrective maintenance Qualitative Maintenance Maintenance policy Equipment service options Types of contract General contract provision Maintenance organization Training Maintenance Personal Planning of spare parts inventory Assessing spare parts requirement Essentials of a good equipment management programme Planning for new equipment Acquisition process Planning of utilities Incoming inspection Inventory control User training Technical training Management of service manual and reference library Maintenance Arrangement Calibration Check Preventive Maintenance ALERT Issue Quality Assurance Installation procedure Environmental considerations Humidity Altitude Shock and vibrations Protection from electro-magnetic interference Safety Service and maintenance laboratory 27 04 Maintenance Management 02 10 MSBTE – Final Copy Dt. 18/12/2010 12191 IE5 w. e. f Academic Year 2009-10 ‘E’ Scheme Work bench Power for work bench Lighting Storage Maintenance system overview Log book Performa for recording specifications Performa for preventive maintenance Performa for corrective maintenance Data Analysis Information Tags Personal Safty Reading of block diagram Reading of circuit diagram Reading of working diagram Di-assembly Re-assembly Trouble shooting process Fault establishment Fault correction Fault finding aids Service, Maintenance & Instruction manuals Test and measuring Tools Pre Trouble shooting technique Preliminary observation Functional area approach Split half method Divergent path Convergent path Feed back path Systematic troubleshooting checks Check control selting Checks associated equipments Visual check Calibration Isolates the troubling circuit Measurement Individual components 1. Visual inspection 2. Measure Voltage levels Presence of signal & the signal waveform 3. Component failure Out of circuit test In circuit Test 4. Signal Tracing 5. Functional analysis Fundamental Troubleshooting Procedure 03 14 Trouble shooting procedure 04 02 MSBTE – Final Copy Dt. 18/12/2010 28 12191 IE5 w. e. f Academic Year 2009-10 ‘E’ Scheme Trouble shooting aids 05 Tools Service manual Circuit diagram Circuit board location Voltage analysis Fault finding flow check Diagnostic software List of replace able parts 02 Data manuals Trouble shooting technique Voltage analysis Signal injection Signal tracing Total 32 Note: Theory is to be covered during Practical Period Practical: 1. Testing of resister, capacitor and inductance by using multimeter and LCR meter, CRO. 2. Testing of Transistor by using multimeter and transistor TESTER,CRO 3. Testing of IC using IC tester 4. Testing of variable resisters, connector, switches, by using multimeter. 5. Testing of diodes, zener diode, varactor diode, VDR, Photo diode, Tunnel diode, LDR, Thermister, 7 segment display, FET, MOSFET, SCR, Triac with help of multimeter (testing Zig) 6. LAY OUT OF Components in given power supply • Tracing of voltage regulation section in given power supply • Voltage analysis in given power supply • Fault finding in given power supply by voltage analysis method • Fault finding in power supply by voltage analysis method. 7. LAYOUT of components for given function generator Tracing of alternation section used in function generator Voltage analysis in given function generator Fault finding in function generator by voltage analysis method Fault finding in function generator by voltage analysis method Fault finding in function generator by voltage analysis method. 8. Layout of components for given CRO Tracing a vertical section used in CRO Voltage analysis in CRO Signal Tracing in CRO Fault finding in CRO by voltage analysis method Fault finding in CRO by voltage analysis method Fault finding in CRO by voltage analysis method Fault finding in CRO by signal Tracing method. 9. Visit web site to get information about manufactures, Specification and cost. Which will be filled in tabular form for following measurement and Testing equipment’s ( ANY 5) 1. logic analyzer MSBTE – Final Copy Dt. 18/12/2010 29 12191 IE5 w. e. f Academic Year 2009-10 ‘E’ Scheme 2. logic probe 3. logic pulser 4. logic chip 5. Waveform generator 6. Pattern generator 7. IC Tester 8. Curve Tracer 9. RF power meter 10. Field strength meter 11. Distortion factor meter 12. Accessories for SMD soldering and disordering 13. Soldering & disordering station 14. Digital storage oscilloscope 15. Spectrum analysis 10. Draw the layout with the help of computer 1. Performa for recording specification in log look 2. Performa for preventive maintenance 3. Performa for corrective maintenance 4. Performa for data analysis 5. Layout for service department 6. Layout for store department 7. Layout for servicing table 11. Find equivalent components by using data book/ Internet (at least five components in each type) 1. Transistors 2. Diodes 3. FET/MOSFET 4. IC TTL 5. IC CMOS 12. Prepare fault finding flow chart using computer (at least for two faults in each equipments) Power supply Function generator CRO 13. Collect the catlog from market/ Internet and write down the information about specification manufacture, cost for the following (at least five from each group) (A) Resister Capacitor Inductors Transformer Diode Darlington Tr FET MOSFET IGBT Photo devices TTL IC CMOS IC Thyristors MSBTE – Final Copy Dt. 18/12/2010 LCD Display LED Display Microprocessor Micro controller Switches Fuses IC Sockets Solder materials Soldering station Desolder (widing pump) heak sink 30 12191 IE5 w. e. f Academic Year 2009-10 ‘E’ Scheme (B) Pliers Cutters Spanners (Wrenches) Screw drivers Jewelers screw drivers Hack jaw Hand drill & drills Files Hand held power tools & whole complement of drilling, grinding, polishing, soldering and cutting attachment (C) Brushes Blades Sponge Inspection mirror Magnifying glass Thread Sleeves (D) Contact cleaners Control cleaners Lubricants (WD40, LPSI) Flux remover Tunner cleaner Adicheives Solvent release Silicon rubber Industrial Visit: 1. Any service dept. in electronic factor 2. Any service enterprises in your city related with electronic goods. Learning Resources: Books: Sr. Author No. 01 02 03 R.G. Gupta R.S. Khandpar G.C. Loveday Title Electronic Instruments & System Trouble Shooting Electronic Equipment Electronic Testing & Fault Diagonis Publication Tata MacGraw Hill Tata MacGraw Hill Longman scientific and technical MSBTE – Final Copy Dt. 18/12/2010 31 12191 IE5 w. e. f Academic Year 2009-10 ‘E’ Scheme COURSE NAME COURSE CODE SEMESTER : DIPLOMA IN ELECTRONICS ENGINEERING GROUP : ET/EJ/EN/EX/DE/IE/IC/IS/EV/MU/ED/EI/IU : FIFTH FOR ET/EJ/EN/EX/DE/IE/IC/IS/EV/MU AND SIXTH FOR ED/EI/IU SUBJECT TITLE SUBJECT CODE : PROFESSIONAL PRACTICES-V : 12192 Teaching and Examination Scheme: Teaching Scheme TH -TU -PR 03 PAPER HRS -TH -Examination Scheme PR -OR -TW 50@ TOTAL 50 Rationale: Most of the diploma holders join industries. Due to globalization and competition in the industrial and service sectors the selection for the job is based on campus interviews or competitive tests. While selecting candidates a normal practice adopted is to see general confidence, attitude and ability to communicate and attitude, in addition to basic technological concepts. The purpose of introducing professional practices is to provide opportunity to students to undergo activities which will enable them to develop confidence. Industrial visits, expert lectures, seminars on technical topics and group discussion are planned in a semester so that there will be increased participation of students in learning process. Objectives: The student will be able to: 1. Acquire information from different sources. 2. Prepare notes for given topic. 3. Present given topic in a seminar. 4. Interact with peers to share thoughts. 5. Prepare a report on industrial visit, expert lecture. MSBTE – Final Copy Dt. 18/12/2010 32 12192 IE5 w. e. f Academic Year 2009-10 ‘E’ Scheme Sr. No. Learning Structure: Activity Application Use systems approach for writing report on Industrial visits and make a summary of expert lectures Procedure Method of presenting report on industrial visit Technique of effective listening and preparing a summary Concept Concept of observation Principles of listening Facts Industry Visit Expert Lectures MSBTE – Final Copy Dt. 18/12/2010 33 12192 IE5 w. e. f Academic Year 2009-10 ‘E’ Scheme 01 02 03 04 05 Structured industrial visits shall be arranged and report of the same should be submitted by the individual student, to form a part of the term work. Following are the suggested type of Industries/ Fields –(Any three visits) i) Data Acquisition System ii) Sugar Mill, Paper Mill, Cement Industry iii) Satellite Earth Station iv) Railway Station Control Room v) Digital RPM Meter Manufacturing Unit vi) Industry where Digital Drives are used vii) Digital Counters The Guest Lecture/s from field/industry experts, professionals to be arranged (2 Hrs), minimum 2 nos. from the following or alike topics. Students should submit a brief report on the guest lecture as part of Term Work a) Emerging Technology b) Peripheral Devices c) Blue Tooth Technology d) Energy Crisis and Alternative Energy Sources e) Digital Invertors f) Total Quality Management g) Six Sigma Information Search ,data collection and writing a report on the topic a) CDMA b) GPS c) Manufacturing process of ICs d) WLL Technology Group Discussion: The students should discuss in group of six to eight students and write a brief report on the same as a part of term work. The topic of group discussions may be selected by the faculty members. Some of the suggested topics are Seminar: Seminar topic should be related to the subjects of fifth semester Each student shall submit a report of 5 to10 pages and deliver a seminar (Presentation time – 10 minutes) MSBTE – Final Copy Dt. 18/12/2010 34 12192 IE5 w. e. f Academic Year 2009-10 ‘E’ Scheme COURSE NAME COURSE CODE SEMESTER : DIPLOMA IN ELECTRONICS ENGINEERING GROUP : ET/EJ/EN/EX/IE/IC/IS/EV/DE/MU/ED/EI/IU : FIFTH FOR ET/EJ/EN/EX/IE/IC/IS/EV/DE/MU AND SIXTH FOR ED/EI/IU SUBJECT TITLE : INDUSTRIAL PROJECT AND ENTREPRENEURSHIP DEVELOPMENT SUBJECT CODE : 12193 Teaching and Examination Scheme: Teaching Scheme TH 01 Notes: 1. One theory and one tutorial hour are for Entrepreneurship Development (EDP). Twenty five marks for term work are for report prepared under EDP 2. Two practical hours are for industrial project Content: Part A) Industrial Project Following activities related to project are required to be dealt with, during this semester. 1. Form project batches & allot project guide to each batch. (Max. 4 students per batch) 2. Each project batch should select topic / problem / work by consulting the guide & / or industry. Topic / Problem / work should be approved by Head of department. 3. Each project batch should prepare action plan of project activities & submit the same to respective Guide 4. At the end of semester, each project batch should submit the action plan and abstract of the project along with list of materials required if project involves fabrication or other facilities required in other kinds of project. 5. Action Plan should be part of the project report. TU 01 PR 02 PAPER HRS -TH -Examination Scheme PR -OR -TW 25@ TOTAL 25 MSBTE – Final Copy Dt. 18/12/2010 35 12193 IE5 w. e. f Academic Year 2009-10 ‘E’ Scheme Part B: Entrepreneurship Development Rationale: Globalization, liberalization & privatization along with revolution in Information Technology, have thrown up new opportunities that are transforming lives of the masses. Talented and enterprising personalities are exploring such opportunities & translating opportunities into business ventures such as- BPO, Contract Manufacturing, Trading, Service sectors etc. The student community also needs to explore the emerging opportunities. It is therefore necessary to inculcate the entrepreneurial values during their educational tenure. This will help the younger generation in changing their attitude and take the challenging growth oriented tasks instead of waiting for whitecollar jobs. The educational institutions should also demonstrate their uniqueness in the creation of enterprising personalities in their colleges. This subject will help in developing the awareness and interest in entrepreneurship and create employment for others. Objectives: Students will be able to 1) Identify entrepreneurship opportunity. 2) Acquire entrepreneurial values and attitude. 3) Use the information to prepare project report for business venture. 4) Develop awareness about enterprise management. MSBTE – Final Copy Dt. 18/12/2010 36 12193 IE5 w. e. f Academic Year 2009-10 ‘E’ Scheme Learning Structure: Application A) Use basic concepts, principles & procedures related to entrepreneurship B) To expose students to real problems faced by entrepreneur – preferably with the help of case study Procedure - Information gathering for opportunity - Product / Service Finalization as Business Opportunity - Project report preparation & Project execution - Planning - Resources, Enterprise, Budgeting - Study modern trends in business Concepts and Principles - Entrepreneurial Process Information Gathering Opportunity Identification Formulation of Business Plan - Running Enterprise successfully - Financial Statements, Budget - Financial Resources Facts - Different Organization Structures of SSI - Product Specifications, Product Cycle, Business Opportunities, Project Implementation MSBTE – Final Copy Dt. 18/12/2010 37 12193 IE5 w. e. f Academic Year 2009-10 ‘E’ Scheme Contents: Theory Chapter Name of the Topic Entrepreneurship, Creativity & Opportunities 1.1) Concept, Classification & Characteristics of Entrepreneur 1.2) Creativity and Risk taking. 1.2.1) Concept of Creativity & Qualities of Creative person. 1.2.2) Risk Situation, Types of risk & risk takers. 1.3) Business Reforms. 1.3.1) Process of Liberalization. 01 1.3.2) Reform Policies. 1.3.3) Impact of Liberalization. 1.3.4) Emerging high growth areas. 1.4) Business Idea Methods and techniques to generate business idea. 1.5) Transforming Ideas in to opportunities transformation involves Assessment of idea &Feasibility of opportunity SWOT Analysis Information And Support Systems 2.1) Information Needed and Their Sources. Information related to project, Information related to support system, Information related to procedures and formalities 02 2.2) Support Systems 2.2.1 Small Scale Business Planning, Requirements. 2.2.2 Govt. & Institutional Agencies, Formalities 2.2.3 Statutory Requirements and Agencies. Market Assesment 3.1) Marketing -Concept and Importance 3.2) Market Identification, Survey Key components 3.3) Market Assessment Business Finance & Accounts Business Finance 4.1) Cost of Project • Sources of Finance • Assessment of working capital • Product costing • Profitability • Break Even Analysis • Financial Ratios and Significance Business Account 4.2) Accounting Principles, Methodology 1) Book Keeping 2) Financial Statements 3) Concept of Audit, Hours 03 03 03 02 04 03 MSBTE – Final Copy Dt. 18/12/2010 38 12193 IE5 w. e. f Academic Year 2009-10 ‘E’ Scheme 05 Business Plan & Project Report 5.1) Business plan steps involved from concept to commissioningActivity Recourses, Time, Cost 5.2) Project Report 1) Meaning and Importance 2) Components of project report/profile (Give list) 5.3) Project Apprisial 1) Meaning and definition 2) Technical, Economic feasibility 3) Cost benefit Analysis Enterprise Management And Modern Trends 6.1) Enterprise Management: 1) Essential roles of Entrepreneur in managing enterprise 2) Product Cycle: Concept And Importance 3) Probable Causes Of Sickness 4) Quality Assurance : Importance of Quality, Importance of testing 6.2) E-Commerce Concept and process 6.3) Global Entrepreneur Total 03 06 02 16 Sr. No 1 2 Assignments Assess yourself-are you entrepreneur? Prepare project report and study its feasibility Learning Resources: 1) Books: Sr. No 1 2 3 4 5 Author J.S. Saini B.S.Rathore E. Gorden K.Natrajan Preferred by Colombo Plan Staff College for Technician Education. J.B.Patel D.G.Allampally J.B.Patel S.S.Modi S.B.Sareen H. Anil Kumar Name Of Book Entrepreneurship Theory and Practice Entrepreneurship Development Entrepreneurship Development A Manual on How to Prepare a Project Report A Manual on Business Opportunity Identification & Selection National Derectory of Entrepreneur Motivator & Resource Persons. 39 Publisher Wheeler Publisher Himalaya Publishing. Tata Mc Graw Hill EDI STUDY MATERIAL Ahmadabad (Near Village Bhat , Via Ahmadabad Airport & Indira Bridge), P.O. Bhat 382428 , Gujrat,India 6 MSBTE – Final Copy Dt. 18/12/2010 12193 IE5 w. e. f Academic Year 2009-10 ‘E’ Scheme 7 8 9 10 Gautam Jain Debmuni Gupta P.C.Jain D.N.Awasthi , Jose Sebeastian V.G.Patel New Initiatives in Entrepreneurship Education & Training A Handbook of New Enterpreneurs Evaluation of Enterpreneurship Development Programmes The Seven Business Crisis & How to Beat Them. P.H. (079) 3969163, 3969153 E-mail :
[email protected]/olp
[email protected] Website : http://www.ediindia.org 2) Video Cassettes NO 1 2 3 4 5 SUBJECT Five success Stories of First Generation Entrepreneurs Assessing Entrepreneurial Competencies Business Opportunity Selection and Guidance Planning for completion & Growth Problem solving-An Entrepreneur Skill SOURCE EDI STUDY MATERIAL Ahmadabad (Near Village Bhat , Via Ahmadabad Airport & Indira Bridge), P.O. Bhat 382428 , Gujrat,India P.H. (079) 3969163, 3969153 E-mail :
[email protected]/
[email protected] Website : http://www.ediindia.org Glossary: Industrial Terms: Terms related to finance, materials, purchase, sales and taxes. Components of Project Report: 1. Project Summary (One page summary of entire project ) 2. Introduction (Promoters, Market Scope / requirement) 3. Project Concept & Product (Details of product) 4. Promoters (Details of all Promoters- Qualifications, Experience, Financial strength) 5. Manufacturing Process & Technology 6. Plant & Machinery Required 7. Location & Infrastructure required 8. Manpower (Skilled, unskilled ) 9. Raw materials, Consumables & Utilities 10. Working Capital Requirement (Assumptions, requirements) 11. Market ( Survey, Demand & Supply ) 12. Cost of Project, Source of Finance 13. Projected Profitability & Break Even Analysis 14. Conclusion. MSBTE – Final Copy Dt. 18/12/2010 40 12193 IE5