Mpx10 Sensor de Presion Motorola

Distributed by: www.Jameco.com ✦ 1-800-831-4242 The content and copyrights of the attached material are the property of its owner. Uncompensated Pressure Sensor Schematic VOLTAGE OUTPUT versus APPLIED DIFFERENTIAL PRESSURE The output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure side (P1) relative to the vacuum side (P2). Inc. Compensation techniques are simplified because of the predictability of Motorola’s single element strain gauge design. REV 10 Motorola Sensor Device Data © Motorola. Features • Low Cost • Patented Silicon Shear Stress Strain Gauge Design • Ratiometric to Supply Voltage • Easy to Use Chip Carrier Package Options • Differential and Gauge Options • Durable Epoxy Unibody Element or Thermoplastic (PPS) Surface Mount Package Application Examples • Air Movement Control • Environmental Control Systems • Level Indicators • Leak Detection • Medical Instrumentation • Industrial Controls • Pneumatic Control Systems • Robotics 3 + VS 2 SENSING ELEMENT + Vout 1 2 3 4 .MOTOROLA SEMICONDUCTOR TECHNICAL DATA Order this document by MPX10/D 10 kPa Uncompensated Silicon Pressure Sensors The MPX10 and MPXV10GC series devices are silicon piezoresistive pressure sensors providing a very accurate and linear voltage output — directly proportional to the applied pressure. uncompensated sensors permit manufacturers to design and add their own external temperature compensation and signal conditioning networks. low cost.45 psi) 35 mV FULL SCALE SPAN (TYPICAL) UNIBODY PACKAGE MPX10D CASE 344 PIN NUMBER Gnd +Vout Vs –Vout 5 6 7 8 N/C N/C N/C N/C 1 2 MPX10DP CASE 344C 4 PIN NUMBER Gnd +Vout 3 4 VS –Vout 1 GND NOTE: Pin 1 is noted by the notch in the lead. These standard. NOTE: Pin 1 is noted by the notch in the lead. Similarly. output voltage increases as increasing vacuum is applied to the vacuum side (P2) relative to the pressure side (P1). 2001 1 .Vout MPXV10GC7U CASE 482C MPXV10GC6U CASE 482A SMALL OUTLINE PACKAGE MPX10 MPXV10GC SERIES 0 to 10 kPa (0–1. Figure 1. Figure 1 shows a schematic of the internal circuitry on the stand–alone pressure sensor chip. 1. relative to 25°C.0 Vdc. TA = 25°C unless otherwise noted. using end point method. • Temperature Hysteresis: Output deviation at any temperature within the operating temperature range.0 — 50 35 — 1.22 — 0. at 25°C. • TcSpan: Output deviation at full rated pressure over the temperature range of 0 to 85°C.34 550 1250 — — — Unit kPa Vdc mAdc mV mV mV/kPa %VFSS %VFSS %VFSS %VFSS/°C µV/°C %Zin/°C Ω Ω ms ms %VFSS NOTES: 1. 3. when this pressure is cycled to and from the minimum or maximum rated pressure. • TcOffset: Output deviation with minimum rated pressure applied.0 6. • TCR: Zin deviation with minimum rated pressure applied. • Pressure Hysteresis: Output deviation at any pressure within the specified range.0 — — –ā0.0 kPa (kiloPascal) equals 0.MPX10 MPXV10GC SERIES MAXIMUM RATINGS(NOTE) Rating Maximum Pressure (P1 > P2) Burst Pressure (P1 > P2) Storage Temperature Operating Temperature Symbol Pmax Pburst Tstg TA Value 75 100 –40 to +125 –40 to +125 Unit kPa kPa °C °C NOTE: Exposure beyond the specified limits may cause permanent damage or degradation to the device.5 — ± 0.28 400 750 — — — Typ — 3. 7. 2.0 35 20 3. relative to 25°C. with zero differential pressure applied.5 — ±15 — — — 1. relative to 25°C. 2 Motorola Sensor Device Data . OPERATING CHARACTERISTICS (VS = 3. Device is ratiometric within this specified excitation range. Warm–up Time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized.16 — 0. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. Accuracy (error budget) consists of the following: • Linearity: Output deviation from a straight line relationship with pressure. 8. over the temperature range of 0 to 85°C. P1 > P2) Characteristic Differential Pressure Range(1) Supply Voltage(2) Supply Current Full Scale Span(3) Offset(4) Sensitivity Linearity(5) Pressure Hysteresis(5) (0 to 10 kPa) Temperature Hysteresis(5) (–40°C to +125°C) Temperature Coefficient of Full Scale Span(5) Temperature Coefficient of Offset(5) Temperature Coefficient of Resistance(5) Input Impedance Output Impedance Response Time(6) (10% to 90%) Warm–Up Time(7) Offset Stability(8) Symbol POP VS Io VFSS Voff ∆V/∆P — — — TCVFSS TCVoff TCR Zin Zout tR — — Min 0 — — 20 0 — –1.5 Max 10 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. Temperature Cycling with Bias Test. after the temperature is cycled to and from the minimum or maximum operating temperature points. over the specified pressure range. Offset Stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure.0 — — –0. over the temperature range of –ā40°C to +125°C.145 psi. 5. 6. Offset (Voff) is defined as the output voltage at the minimum rated pressure.0 20 ±0.1 ± 0. Operating the device above the specified excitation range may induce additional error due to device self–heating. 4. MPX10 MPXV10GC SERIES TEMPERATURE COMPENSATION Figure 2 shows the typical output characteristics of the MPX10 and MPXV10GC series over temperature. While a least squares fit gives the “best case” linearity error (lower numerical value).0 6. Motorola Sensor Device Data 3 . There are two basic methods for calculating nonlinearity: (1) end point straight line fit or (2) a least squares best line fit. However.3 2. the calculations required are burdensome. there are no temperature effects due to differences in the thermal expansion of the strain gauge and the diaphragm. while allowing the pressure signal to be transmitted to the silicon diaphragm. Motorola’s specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure. Several approaches to external temperature compensa80 70 OUTPUT (mVdc) 60 50 40 30 20 10 0 PSI 0 kPa 0. Unibody Package — Cross–Sectional Diagram (not to scale) Figure 4 illustrates the differential or gauge configuration in the basic chip carrier (Case 344). 70 60 LINEARITY OUTPUT (mVdc) +ā125°C SPAN RANGE (TYP) 50 40 30 20 10 0 0 PRESSURE (kPA) THEORETICAL OFFSET (VOFF) MAX POP ACTUAL SPAN (VFSS) 4. requiring that the device be temperature compensated if it is to be used over an extensive temperature range.0 0.5 10 VS = 3 Vdc P1 > P2 +ā25°C -ā40°C tion over both –40 to +125°C and 0 to +80°C ranges are presented in Motorola Applications Note AN840. Output versus Pressure Differential Figure 3. Linearity Specification Comparison WIRE BOND LEAD FRAME ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉÉÉÉ DIE P1 P2 SILICONE DIE COAT STAINLESS STEEL METAL COVER EPOXY CASE RTV DIE BOND Figure 4.0 8. Because this strain gauge is an integral part of the silicon diaphragm. The MPX10 and MPXV10GC series pressure sensor operating characteristics and internal reliability and qualification tests are based on use of dry air as the pressure media. an end point fit will give the “worst case” error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. or by designing your system using the MPX2010D series sensor. Contact the factory for information regarding media compatibility in your application. Media other than dry air may have adverse effects on sensor performance and long term reliability.6 0.0 PRESSURE DIFFERENTIAL Figure 2. LINEARITY Linearity refers to how well a transducer’s output follows the equation: Vout = Voff + sensitivity x P over the operating pressure range (Figure 3).2 OFFSET (TYP) 1. A silicone gel isolates the die surface and wire bonds from the environment. the properties of the strain gauge itself are temperature dependent. Conversely. as are often encountered in bonded strain gauge pressure sensors. Temperature compensation and offset calibration can be achieved rather simply with additional resistive components.9 1. Devices are available in the basic element package or with pressure port fittings which provide printed circuit board mounting ease and barbed hose pressure connections. The Pressure (P1) side is the side containing silicone gel which isolates the die from the environment. The Motorola presPart Number MPX10D MPX10DP MPX10GP MPX10GS MPXV10GC6U MPXV10GC7U Case Type 344 344C 344B 344E 482A 482C sure sensor is designed to operate with positive differential pressure applied.MPX10 MPXV10GC SERIES PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Motorola designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. MPX Series Device Type Basic Element Ported o ed Elements e e s Options Differential Differential Gauge Gauge Case Type Case 344 Case 344C Case 344B Case 344E Order Number MPX10D MPX10DP MPX10GP MPX10GS Device Marking MPX10D MPX10DP MPX10GP MPX10D ORDERING INFORMATION — SMALL OUTLINE PACKAGE (MPXV10GC SERIES) Device Type/Order No No. P1 > P2. MPXV10GC6U MPXV10GC6T1 MPXV10GC7U Packing Options Rails Tape and Reel Rails Case Type Case 482A Case 482A Case 482C Device Marking MPXV10G MPXV10G MPXV10G 4 Motorola Sensor Device Data . The Pressure (P1) side may be identified by using the table below: Pressure (P1) Side Identifier Stainless Steel Cap Side with Part Marking Side with Port Attached Side with Port Attached Side with Part Marking Side with Part Marking ORDERING INFORMATION — UNIBODY PACKAGE MPX10 series pressure sensors are available in differential and gauge configurations. 36 0.016 0.35 5.10 23. 3.194 0.54 BSC 0.56 5.020 0.200 0.016 0.048 0. 4. 2. 4.016 0.IS INCLUSIVE OF THE MOLD STOP RING.016 0. INCHES MIN MAX 0. MOLD STOP RING NOT TO EXCEED 16.04 3.048 0.59 6.5.685 0.052 0.51 1. 2.93 0.75 8. 3.22 1.305 0.65 18.26 0.514 0.136 (0. 1994.89 4.18 3.695 0.41 0.85 17.37 7.68 3.220 0.005) M T A M DAMBAR TRIM ZONE: THIS IS INCLUDED WITHIN DIM.06 13.100 BSC 0. 2.22 1.04 5.106 0.420 0.230 0.62 4.159 0.32 2.41 0.910 BSC MILLIMETERS MIN MAX 29.42 7.07 12.16 7.89 4.450 0.67 11.695 0.153 0.325 0.42 30 _ NOM 12.22 1.100 BSC 0.13 (0. DIMENSIONING AND TOLERANCING PER ANSI Y14.00 13.715 0.08 5. DIMENSION -A.220 0. GROUND + OUTPUT + SUPPLY . VCC .25 (0.014 0.59 0.08 29.84 6.11 BSC –Q– B PIN 1 1 2 3 4 K S F G D 4 PL 0.048 0.064 0. DIMENSIONING AND TOLERANCING PER ASME Y14.630).63 2.064 0.41 17.430 0. DIM A B C D F G H J K L N P Q R S U INCHES MIN MAX 1.495 0.005) –P– 0.118 MILLIMETERS MIN MAX 15.153 0. 2.5M.MPX10 MPXV10GC SERIES UNIBODY PACKAGE DIMENSIONS C R M 1 B –A– N PIN 1 1 2 3 4 2 3 4 Z NOTES: 1.145 1.020 0.36 0.159 0. 1982.290 0.240 0.SUPPLY + SUPPLY GROUND STYLE 3: PIN 1. 2. 4. 3. 3. CONTROLLING DIMENSION: INCH.250 0.725 0.54 BSC 4. “F” 8 PL DIM A B C D F G J L M N R Y Z STYLE 1: PIN 1.40 17.11 16. 4.440 0.630 0.475 0. GROUND + OUTPUT + SUPPLY . GND -VOUT VS +VOUT CASE 344–15 ISSUE Z SEATING PLANE –T– R H N PORT #1 POSITIVE PRESSURE (P1) –A– U L NOTES: 1.534 0.57 10.014 0.OUTPUT Motorola Sensor Device Data 5 .300 0. 3.63 2.43 1. CONTROLLING DIMENSION: INCH.92 11.65 18.00 (0.010) J C M T Q S M T S S Q S CASE 344B–01 ISSUE B STYLE 1: PIN 1. 2.OUTPUT STYLE 2: PIN 1.00 L –T– J SEATING PLANE G F 4 PL F Y D 0.182 0.595 0.725 30 _ NOM 0.175 0.62 10.40 18.51 1. 63 2.153 0.67 11.100 BSC 0.60 2.014 0.63 2.51 1.30 7.37 7.25 (0.89 4.083 0. 3.780 0.52 4.59 6.405 0. 2.020 0. GROUND + OUTPUT + SUPPLY .064 0.MPX10 MPXV10GC SERIES UNIBODY PACKAGE DIMENSIONS — CONTINUED V R PORT #2 PORT #1 –A– U W H PORT #2 VACUUM (P2) L PORT #1 POSITIVE PRESSURE (P1) NOTES: 1.345 0.59 6.53 7.064 0.87 8.04 1. 2.186 0.100 BSC 0.048 0.278 0.440 0.020 0.375 0. CONTROLLING DIMENSION: INCH.182 0.53 18.159 0. 3.063 0.290 0.245 0.41 8.22 6.725 0.240 0.22 1.06 7.10 4.41 0.182 0.65 18.194 STYLE 1: PIN 1.11 5.72 5. DIM A B C D F G J K N R S V INCHES MIN MAX 0.005) M N –T– T B M GROUND + OUTPUT + SUPPLY .38 N –Q– SEATING PLANE B SEATING PLANE PIN 1 1 2 3 4 –P– –T– J C 0. 1982.04 3. CONTROLLING DIMENSION: INCH.18 3.016 0.690 0.5M.715 0.910 BSC 0.220 0.13 (0. DIM A B C D F G H J K L N P Q R S U V W INCHES MIN MAX 1.435 0.89 4.175 0.36 0.720 0. DIMENSIONING AND TOLERANCING PER ANSI Y14.016 0.51 1.014 0.36 0.62 7.820 0.42 7.420 0.93 0.016 0. 4.54 BSC 0.08 29.330 MILLIMETERS MIN MAX 29.310 0.76 9.005) M K S –T– 0.11 BSC 6.93 –B– V 4 3 2 1 PIN 1 K J R SEATING PLANE S G F D 4 PL 0.OUTPUT PORT #1 POSITIVE PRESSURE (P1) C BACK SIDE VACUUM (P2) A NOTES: 1.OUTPUT CASE 344E–01 ISSUE B 6 Motorola Sensor Device Data .220 0.310 0.194 0.48 19.300 0.62 10.695 0.145 1.05 0. 1982.87 4.16 10.010) M T Q S G D 4 PL F T S S Q S CASE 344C–01 ISSUE B STYLE 1: PIN 1.048 0.248 0.10 23.5M. 4.13 (0.255 0.41 17.29 11.62 4.240 0.685 0. 2. 2.41 0.40 18.300 0.85 17. DIMENSIONING AND TOLERANCING PER ANSI Y14.82 0.81 20.28 6.153 0.22 1. MILLIMETERS MIN MAX 17.016 0.159 0.54 BSC 4.62 4.178 0. MAXIMUM MOLD PROTRUSION 0. 2.709 0. 5. DIMENSIONING AND TOLERANCING PER ANSI Y14.25 (0. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION.026 0.415 0.07 2.125 MILLIMETERS MIN MAX 10.28 1.011 0.444 0.425 0. 3.92 3.245 0.54 3.125 MILLIMETERS MIN MAX 10.415 0.415 0. 1982.415 0.009 0.010 0.010) M T B S A S N –B– 8 G 1 NOTES: 1.448 0.41 6.115 0. 2.120 0_ 15 _ 0.448 0.500 0.034 0.25 (0.17 DETAIL X S W V C PIN 1 IDENTIFIER –T– K M J DETAIL X CASE 482C–03 ISSUE B Motorola Sensor Device Data 7 .54 10. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT. CONTROLLING DIMENSION: INCH.002 0.540 0.100 0.725 0.05 0. DIM A B C D G H J K M N S V W INCHES MIN MAX 0.22 6.115 0.255 0.255 0.79 10.17 S W V C H J K M PIN 1 IDENTIFIER –T– SEATING PLANE CASE 482A–01 ISSUE A –A– 5 4 N –B– 8 G 1 0. MAXIMUM MOLD PROTRUSION 0.54 10.25 0.042 0.92 3.061 0.54 10.15 (0.245 0.23 0.011 0. 3.54 BSC 0. DIMENSION S TO CENTER OF LEAD WHEN FORMED PARALLEL.70 13.55 1.5M.MPX10 MPXV10GC SERIES SMALL OUTLINE PACKAGE DIMENSIONS –A– 5 4 D 8 PL 0.864 2. 4.21 0.006).520 0.79 12. 4. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION.66 0. 5.48 2.071 0_ 7_ 0.425 0.48 2.444 0.54 BSC 0. S DIM A B C D G J K M N S V W SEATING PLANE INCHES MIN MAX 0.425 0.15 (0. 6.009 0.38 18.038 0.54 10.21 0.425 0.100 BSC 0.38 13.79 12.70 13.560 0.100 BSC 0.80 0_ 7_ 11.22 6.01 18.05 0_ 15 _ 11.72 14.22 6. CONTROLLING DIMENSION: INCH.79 10.010) M T B D 8 PL S A NOTES: 1.520 0.006).28 11.28 11. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT.500 0.28 2. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M.23 0.96 1. 1982. com/semiconductors/ 8 ◊ Motorola Sensor Device Data MPX10/D . and expenses. All operating parameters. nor does Motorola assume any liability arising out of the application or use of any product or circuit. Ltd. even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part.. Silicon Harbour Centre. Tokyo 106–8573 Japan. Motorola makes no warranty. Tai Po..K. intended. Inc. 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