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IPC-A-610E-2010® Acceptability of Electronic Assemblies Developed by the IPC-A-610 development team including Task Group (7-31b), Task Group Asia (7-31bCN) and Task Group Nordic (7-31bND) of the Product Assurance Committees (7-30 and 7-30CN) of IPC Supersedes: IPC-A-610D - February 2005 IPC-A-610C - January 2000 IPC-A-610B - December 1994 IPC-A-610A - March 1990 IPC-A-610 - August 1983 Users of this publication are encouraged to participate in the development of future revisions. Contact: IPC 3000 Lakeside Drive, Suite 309S Bannockburn, Illinois 60015-1249 Tel 847 615.7100 Fax 847 615.7105 .........................7 1...............2 EOS/ESD Safe Workstation/EPA ..................................4...........................................................5 1...................................................4..... Heatsinks .. 1-5 1.......... Threaded Fasteners ....5......3.............1 1.......5...3... 3-11 Gloves and Finger Cots ..4..........................3 Classification .1 1....................1...............5 Acceptance Criteria ......... 2-2 1. Solder Destination Side ..3 1.............................3....... *Primary Side ...... Defect Condition ............1 1.. 3-12 Hardware .............. 1-3 2.....1................................ Disposition ..........................4................................1 1..............4 1...........1 4...........1 4.....................................4......5 1.........4..............5.................1.......6 1..........3 1............. 1-5 1........................................... 2-1 1..8 Verification of Dimensions .. Warning Labels ...................2 1............................................3.........................1 3..4 1...............1 Scope ......................1.......................1................................ 3-10 Contamination ...... Intrusive Solder ......................1...... 2-2 2.......................... 1-3 2.......1. 1-6 IPC-A-610E-2010 3 Handling Electronic Assemblies .... Protective Materials ..5.........................5...1........................................................................................................ 3-1 3................ 1-3 1-3 1-4 1-4 1-4 1-4 1-4 1-4 1-4 1-4 Terms & Definitions ...... Electrostatic Discharge (ESD) ... *Cold Solder Connection ...................... Electrical Clearance .............................1.....1....1 3.............3 EOS/ESD Association Documents .............6 4 4.............................5......3...........8 1..........................1................................12 Board Orientation ..3 3..........1 IPC Documents ............................................................1.6 1..........2 April 2010 Electrical Clearance .2 3.3....................1...1.................... Specialized Designs ..............2 4....... 2-1 1.............5... 4-2 4-3 4-3 4-3 4-5 4-6 4-8 4-9 Jackpost Mounting ..............................4....4 1.... Process Indicator Condition .......................1. 1-1 2 Applicable Documents ...............................3 Handling Considerations ....................................2 1... Interference ............................... 3-10 After Soldering ....1 1...... Process Indicator Methodologies .........4.1.................. 4-2 4.................................................................5.......................................................... Contact .2 1.............5............................. 1-4 1-5 1-5 1-5 1-5 1-5 1-5 1-5 1-5 1-5 1-5 1-5 1-5 1-5 1-5 1-5 1...................................3 1................9 Magnification Aids ........................3...... Torque ........................... *Leaching .............. High Voltage ... Combined Conditions .................5...........3 4... 1-4 1.................4 Definition of Requirements ............ Wire Overlap .................4.............. 3-3 3-4 3-5 3-6 3............ 3-10 Electronic Assemblies ................................. 1-6 1.......................4...............................3..... Solder Source Side .................1.......... 2-2 1.............5.......... 3-9 Physical Damage .........1.1 Guidelines ......................... 1-2 2........................1........5 International Electrotechnical Commission Documents ........................2 Purpose ............................6 Examples and Illustrations ....10 1......................................4 3. 2-2 2...... Acceptable Condition ............ Target Condition .4...................................1 EOS/ESD Prevention .....2 4.......... 4-1 Hardware Installation ....................5..4...........................5......4 Electronics Industries Alliance Documents ...................................7 Inspection Methodology .....................4............ 2-1 1.....7 1................................................5...5........ Insulators and Thermal Compounds .................1 4...1................................................4 4....... 3-7 3.............. Pin-in-Paste ...... 4-11 vii ..................9 1...................3.....................5 3......1.......................2 3......................3 3...............2 Joint Industry Documents ...............1....................5........11 1........1............................................. Meniscus (Component) ....................................................... 3-9 3....... 1-6 1........... 2-2 2.................. 1-3 2........... Wire Overwrap .....................1 1...........6 ASTM ................................................................................................. *Secondary Side ...7 Technical Publications .................................. Wire Diameter .... *Nonfunctional Land .1....10 Lighting .................. Wires ................................ 3-2 3.1......................2 4............Table of Contents 1 Foreword ..................4 Electrical Overstress (EOS) .......... Conditions Not Specified .................... ....... 5-16 Lead Free Fillet Lift ..................3.Table of Contents (cont...5 Terminals – Stress Relief ................................... 6-28 6................... 5-10 Bridging ..................2.....................8 5...................... 5-6 Reflow of Solder Paste ........1 General ...............2 6...............1 Damage ............................... 6-30 6.......... 5-9 Dewetting .............. Rolled Flange ...................................................1..................... 4-23 4..5.............................................................................1 Edge Connector Pins ...................2..................7 Terminals – Solder – General Requirements .................5......2.......... 4-19 4.............2 4....1 6............ Presolder ........2 6..................... 6-26 6.............. 6-10 6......................................2 Terminals – Lead/Wire Placement – General Requirements ...............10 6... 5-10 Solder Balls/Solder Fines ...1........... 5-19 6-20 6-21 6-22 6.....................3..2.............................3 Deformation ...................1................ 6-7 Solder ..............1 6....................... Strand Separation (Birdcaging) – Post-Solder ..........................4 Service Loops ............................9 Swaged Hardware .......... 6-24 6...........6 5....................................................... 5-12 Solder Webbing/Splashes ..5 5.................. Bend Radius .............................1......... 4-22 4..............................................2 6...........................................................................................................................2.......... 5-1 Soldering Acceptability Requirements ...............4................7.10...........12 5.10 5..........3..............3 6...................13 6 6-10 6-10 6-12 6-13 6-15 6-15 6-17 Conductor ....... Terminals – Bifurcated ........2......................................................................4 4...................3.................... Ties over Splices and Ferrules ..........5..................................2 6...... 4-12 4....2............ Solder ...... 4-24 4....... Strand Separation (Birdcaging) – Presolder .... 6-34 6................... 6-42 Lead/Wire Placement .......... Coaxial Cable ..4 5... 5-9 Excess Solder ...............................1...........................................1.....1 6....2...........................................1 Soldering ..... 6-31 Solder .............. 4-24 4-25 4-26 4-27 4-28 Flared Flange .................8.....10.......................................................1 5........2 5.....1 Lacing – Damage ....................2 viii 6-18 6-19 Soldering Anomalies ...... 6-25 6................................ 4-14 4.............. 5-8 Cold/Rosin Connection ...................... 6-18 6......... 5-15 Solder Projections .........7... 5-13 Disturbed Solder ..................... Placement .............8 Terminals – Turrets and Straight Pins ............ 5-7 Nonwetting ................................................................................................) 4.....1....... 5-18 Probe Marks and Other Similar Surface Conditions in Solder Joints ..2 6...1.........................................................1 6..................................2...................7.......1................................. 6-33 Terminals – Bifurcated ..5.............5 Routing ................ Unused Wire Termination ...... Flexible Sleeve ........ 6-6 Controlled Split .......................1 Exposed Basis Metal ...... 6-8 Insulation .......................... 6-2 6.........2..7 5................. Clearance ....1........ Tinning ...........3.......1 6.......................9...3 Connector Pins ...9.......................................2 6.............4 Wire Bundle Securing ......................2.....................2 5.................4 6.....3.................1 6.......3 4........1................2 4........3 6..............5......3 6.. Damage ....... 6-25 Lead/Wire Bend ...........3 6......................2...............1 6.............. Terminal Base – Pad Gap ..................... 6-42 Solder ................................................................. 5-4 Pin Holes/Blow Holes ..... 6-1 6.........1 6....................... Terminals – Turret ...................................... 5-3 6................5 5 Wire Crossover ..4 6-2 6-2 6-3 6-4 6-5 Lead/Wire Placement ...2......... 6-34 6-37 6-38 6-39 Terminals – Slotted .......2 Press Fit Pins ............3...........3 6......... 5-4 5.....6 Terminal Connections ... 4-19 4.......1 6.................... Lead/Wire Placement – Staked Wires ....................2................................................... Bundle ................ 4-12 4.....9...................2........3 5...........9...................1 6..........1 5.3 5....... Soldering ........... 5-17 Lead Free Hot Tear/Shrink Hole ........................5..................................................2 Lacing ...............2............2...........1... Post-Solder .....2 6..........5 6...2............................................................2.. 5-14 Fractured Solder .................................................................. 6...............3......................2...........9 5............2.11 5....3...2....1...3........2..................1 4..........4........4...... 6-31 6..2...2 Terminals ....8.....................2 April 2010 Lead/Wire Placement – Side Route Attachments ....2................................................5............................................... 6-43 IPC-A-610E-2010 ..........................................................5 5... Lead/Wire Placement – Bottom and Top Route Attachments ................ Strand Damage ............. 4-16 6.......4 5.............. ..1 7................... Axial Leaded – Vertical .............................. Axial Leads – Horizontal .......6 7.....................1 7...................3.........1 7.....6 7.............1...............13.. 7-25 7.............4..5........1.. Solder Conditions – Solder in Lead Bend ........ 7-18 Connectors .4 7-25 7-27 Wire Selection ..............12...........................2...9 Lead Cutting after Soldering ........... Wire/Lead Protrusion ..................2.2......... Wrapped Attachment ... Wire/Lead Clinches ........ 7-12 DIP/SIP Devices and Sockets ...................................................... 7-13 Radial Leads – Vertical ................5..........6.........................2 6........................3 7.........................................9 7........................1.........................................2 7......13.....2 7..........4...............8 7.............................4............. Adhesive Bonding ... Supported Holes ....5... 7...............2 Lead/Wire Placement .1..................1.................... Wire/Lead Protrusion .4 7......2....6 7.......................5...........................1.1............................................................2 7...................................2 7..... 7...........11.. 7-1 Component Mounting ................. 6-52 Terminals – AWG 30 and Smaller Diameter Wires ......... 7-10 Leads Crossing Conductors ..4 7... Secondary Side – Land Area Coverage (E) ........1...........................3.........5....5 7................5...........1....3............................ 7-21 Vertical Shrouded Pin Headers and Vertical Receptacle Connectors ...........5........... 7-22 High Power ...............1........................................................3.5 7-28 Supported Holes ......................3 Mounting Clips ......3.....1......6 April 2010 7-31 7-32 Unsupported Holes .........................5......................1 7.............5.2 6........ Secondary Side – Lead to Barrel (D) ............ 7-3 Vertical ...........3........2 7.........4.....................3.........................1...... 7-2 7..................................1 Through Hole Technology .. Solder ............... Solder ........ Lead Cutting after Soldering ...................................5......................3.............4.......12 Lead/Wire Placement ....................................................4................. 7-67 7-68 7-70 7-72 7-72 7-73 7-73 ix ..........1 7............. 7-6 Bends ..........13 Terminals – Solder Cups ...3....2.........3 7......................5 7.............14 Lead/Wire Placement ...................... 7-24 IPC-A-610E-2010 7...................2.1 Lead/Wire Placement .. Lead in Hole ........... 7-59 7........5 7.....2 7.4 7................2................................ 7-8 Damage .................................................. 6-44 6..............10 Orientation ............2.......5 7............................ 6-49 7......... 6-47 Solder ............3....................................... 6-54 6..........1 6...... Wire Routing ..............5. 7-15 Spacers .........11 Terminals – Pierced/Perforated ..........2.......... 7-23 Conductive Cases ............. 6-54 6..............8 Solder Conditions – Meniscus in Solder ......................... 7-19 Right Angle ........ 7-6 Stress Relief ...5...2... 7-67 7....................1................................................1.1 7............................ 7........1 7...10 Coated Wire Insulation in Solder ......1 7.....8..... Adhesive Bonding – Nonelevated Components .................................) 6..12...3............1.....................5..........1 7.................................... Wire Hold Down ..... 6-50 Solder ..........2 7.............................. 7-2 Horizontal . Solder Conditions – Touching Through-Hole Component Body ..3..........1......3 7...16 Terminals – Edge Clip – Position ................. Wire/Lead Clinches ....................................................................................... 6-44 Solder .........8. 6-50 6.............................5 7........... 7-11 Hole Obstruction ........................3 6............................Table of Contents (cont.......5.............1............ 7........5..................3..1 6.............14.................... Axial Leads – Vertical ...................1 6.1.... Primary Side – Land Area Coverage (C) .....................3......3 7.... 7-33 7............. 6-46 7.1 Terminals – Hook ..............4 7........1 7................... 6-55 6.1 7..........12 Board in Board ...11 Interfacial Connection without Lead – Vias ...7 7...2 Component Securing ........... 7..2 7........15 Terminals – Series Connected .5. Vertical fill (A) .........................................4................ Axial Leaded – Horizontal ......1........................................................... 6-56 7 7.11..................3 7.............3............5..................5..1... Lap Soldered ......... Adhesive Bonding – Elevated Components .............3 7...................2 7.......2 7.3.............. 7-33 7-35 7-37 7-38 7-40 7-43 7-45 7-47 7-48 7-49 7-50 7-51 7-52 7-53 7-54 7-55 7-56 7-59 7-60 7-61 7-62 7-64 7-66 Jumper Wires .....7 7..5................... 6-47 6........ Primary Side – Lead to Barrel (B) .......................... Wire Staking ........................... 7-5 Lead Forming . 7-16 Radial Leads – Horizontal ......3.........4 7.... .. 8-33 Side Overhang (A) ........................ Thickness (G) ............ Minimum Side Joint Height (Q) ...........7 8........Table of Contents (cont...............1 8.......2.. End Overhang (B) ......1.6.3... Minimum End Joint Width (C) ........ 8-14 Rectangular or Square End Chip Components – 1......................... Tombstoning ..... Maximum Fillet Height (E) ...3..............3.2.................. 8-3 Mechanical Strength ........ 8-13 Solder Thickness (G) ...............1 Staking Adhesive ................................................) 8 Surface Mount Assemblies ..7........3.............1....1 8....2 8..........3 8...2...2..................3 8....4...3 Damage ...........6 8............4 8. 8-11 Side Joint Length (D) .9 8...............9.......................... 8-12 Maximum Fillet Height (E) .......3... 8-3 8.................3.............3........ 8-7 SMT Connections ..... Coplanarity ........3........1 8...........6........3......1 8..........................................3 8..5...................................4 8..2 8.................4 8............3................6....6........ End Joint Width (C) ...............5.......... Minimum Side Joint Length (D) ..........................6 8............ 8-68 Side Overhang (A) .5 8.......... 8-9 End Overhang (B) .......3............... Maximum Fillet Height (E) ...............................................................3.................3....... Side Joint Length (D) ...............3........6..1 8..............2......2 x Side Overhang (A) . Coplanarity ....................................... End Joint Width (C) .1......................3.1 8...3..................1........................7 8......6 8.......... Side Joint Length (D) .......................6 8............................3....6 8....6 8......... Minimum Side Joint Length (D) .................... Coplanarity ..7 8........3..........3.. 3 Terminations ..... Solder Thickness (G) ...............3 8. 8-10 End Joint Width (C) .............3..2 8...8 8..4...........3.......3..2 Component Bonding ..7......4 8.....................5 8....3........2.......5..5 8................1..4..... Minimum Fillet Height (F) ......10 8... Termination Variations ...........8 8.......... 8-36 8-37 8-38 8-39 8-40 8-41 Castellated Terminations .................9....3....................................... 3 Terminations – Minimum Fillet Height .....3.. Solder Thickness (G) ............................ 8-42 Side Overhang (A) ...............6.......................3.... Minimum Fillet Height (F) ............. Stacking ...... Side Joint Length (D) ............. 3 or 5 Side Terminations .7............................. 8-14 End Overlap (J) ............ End Overlap (J) ...... 8-60 Side Overhang (A) ...........3..3..2......8 April 2010 End Joint Width (C) .........3 8............3............6 8.............3. Solder Thickness (G) .............................2.3....3....... 3 Terminations – Solder Width .....3......3.3.........1 8....3..................2 8......3......4 8.5...2 8..........3 8...1 Chip Components – Bottom Only Terminations ..... Solder Thickness (G) ............4 8.5........ Minimum Heel Fillet Height (F) .............. 8-8 8.......3...........3......... Minimum End Joint Width (C) ............3............................................5 8...3...............9 8....... 8-47 8-51 8-52 8-54 8-56 8-57 8-58 8-59 Round or Flattened (Coined) Gull Wing Leads .......... 8-43 8-44 8-44 8-45 8-45 8-46 8-46 Flat Gull Wing Leads . 8-16 8-18 8-19 8-21 8-22 8-23 8-24 8-25 8-26 8-26 8-28 8-29 8-30 8-31 8-31 8-32 Cylindrical End Cap Terminations ........................3.....3..3.........3...3....... Minimum Heel Fillet Height (F) ..4....... 8-15 8....3................4.3 8...1 8...... End Overlap (J) .. 8-1 8........3.............3.................................8 8................3..................3.............. Toe Overhang (B) ........3.......................10...5..1 8.... 8-7 8...2...............6........6..............7............4 8..........7 8..................5 8.............2...................................................... 8-4 SMT Leads .....................1 8...........2............................... Maximum Heel Fillet Height (E) ....5 8.7... Solder Thickness (G) ..3......................7.....3.................................. 8-47 Side Overhang (A) ............3.........9...2 8...3..............2 8.............1.....3.. Maximum Fillet Height (E) .....3...............3........................... 8-13 Minimum Fillet Height (F) .............2...............4 8.3................. 8-61 8-62 8-62 8-63 8-64 8-65 8-66 8-66 8-67 J Leads ... Maximum Heel Fillet Height (E) .............3.6 8.........................4..2.........1. Minimum Heel Fillet Height (F) ..........8 8........... Mounting on Side (Billboarding) ..... 8-7 Flattening ..3.7 8....1 8...... End Overhang (B) .....7................ Minimum End Joint Width (C) ...3........1......... 8-34 End Overhang (B) .3...............................7........3.............3......7 8.5........3.6..........2.............3....... 8-68 8-70 8-70 8-72 8-73 8-74 8-76 8-76 IPC-A-610E-2010 .............10.........2...3...4 8................. Minimum Fillet Height (F) .... Toe Overhang (B) ......5 8..... Mounting Upside Down ........3..3....3........... 8-35 8............7 8..... Toe Overhang (B) .....2 8....3................5.2.....................3.........2 8........... Minimum Side Joint Length (D) ...............2.............1................3...................3............4...................7 8....2.3 8................2 8.....................8 8...2 Side Overhang (A) .........5 8..............3 8.... Maximum Fillet Height (E) ..9.......3.............3.1.... 8-8 8...........................3............... ..3 Maximum Fillet Height ...3............. 8-83 8...............................8 Butt/I Connections ...................) 8.... 9-2 9.............. 9-1 9....3........3................................. Minimum End Joint Width (C) .....1 8. 8-99 8.3...........13 Bottom Termination Components (BTC) .15..............15........4 Specialized SMT Terminations .......3 Leaded/Leadless Devices ........................8........................ Voids ........3..1..................6..1..........12..............6 8........ 9-17 9.............1................................. Package on Package ..................8..5 8.................... Extractors......5 Surface Mount Connectors ..... 9-16 9................. 9-8 9.......... 9-13 9. Maximum Fillet Height (E) ..........9 Edge Connector Pins ..............10 Tall Profile Components Having Bottom Only Terminations .12........15.....3.8....3.......................................3.............. 8-94 8................ 9-13 9...... 8-85 8............................. Solder Ball Spacing ...............3.3...12 Heat Sink Hardware ...........................3.......5 8.................2 Chip Resistor Element ..4 Ceramic Chip Capacitors ...............................7 Transformer Core Damage . 8-97 8................5 9 Chip and Cylindrical End Cap Components ..3...... 9-12 April 2010 xi ...............12... 9-10 9.........1..........1 8....9 Maximum Side Overhang (A) .....3 8..... 9-14 9..12 Surface Mount Area Array .................... 8-77 8-78 8-78 8-79 8-79 8-80 8-80 Flat Lug Leads .... J Lead ... 8-81 8.......1 Maximum Termination Overhang – Square Solder Land . 8-96 8..........6..... Solder Connections .................................... Underfill/Staking ............3............................................8............................1 8........................3........8..10 Press Fit Pins ......15 Flattened Post Connections .1 Loss of Metallization ..2 8........ 8-101 8.......1 SMT ...... 8-86 8-86 8-87 8-89 8-89 8-90 8..................8... Minimum Side Joint Length (D) .................. 8-96 8..1.............6.............4 8.......... Maximum Toe Overhang (B) .................... 9-3 9............................................. Latches .3............4 8....12................................3...3........................Table of Contents (cont.............3.6..........3...............8.................................. Castellations ...................3................8 Connectors..... 8-77 8........2 Maximum Termination Overhang – Round Solder Land ..... 8-92 8.........3 8..... Solder Thickness (G) ...........................6.....2 8..................12.6 Alignment ..................2 8............... 8-100 8.12................................. Land ................. 8-101 8-102 8-103 8-103 8-104 Component Damage .......11 Inward Formed L-Shaped Ribbon Leads ..............................................................4 8..3 8.....................................................11 Backplane Connector Pins .........................................3.................3................... Handles... 8-97 8................. 8-98 IPC-A-610E-2010 8.6 Jumper Wires .......................... 9-4 9....................................14 Components with Bottom Thermal Plane Terminations ........6 Relays ..........6........... Minimum Fillet Height (F) .......... 9-15 9........ Gull Wing ............5 Connectors ........3....3....................... 8-82 8................................................7 8..... ..............................4 10....................... Readability .................... 10-14 10................................................................................................. 10-49 Coverage ........8 10...5...........9 10............................1............. Solder Wicking ........9 11................. 11-2 11................7 Measling and Crazing .....1............................1 10...1 10..10 11.....................6 10....6 10........................1...........4....2 10....2.......3 10.. 10-53 Flexible and Rigid-Flex Printed Circuitry ..................4 10................................5................................................2 10........5 10........................................2.....1 10....................................................... 10-20 10...3 10. 10-19 Damage .............................. 10-16 10......1.......... Laser ........... Discoloration ....5 10... Insulation Wrap .......................................................4........... 10........ 10-12 Bow and Twist ..........7. 10-28 10-30 10-31 10-32 10-34 10-34 10-34 10-35 10-35 10-36 Cleanliness ........................4 Wrinkling/Cracking .1.......................5 10.......................................8............................... 10-13 Depanelization ....4 10........1 10..............................................................5............ Attachment .........2 10.............................. 11-4 End Tails..........................2.............. Scratches ...........2 12 Number of Turns ........................1 11................................ 10-17 Mechanical Damage ..1..............................1 10..................5....1 Gold Surface Contact Area .4 10......... Position .1............... 10-42 Surface Appearance ........................................................ 10-37 Flux Residues .... 10-50 Thickness .... 11-3 Turn Spacing ........7..... 10-1 10..3 Reduction in Cross-Sectional Area ......... 11-1 Solderless Wrap ..7.................................................. 10-5 Blistering and Delamination .......................... 11-12 Damaged Insulation .....3 10................................................................ Adhesion and Damage ... 10-2 10...7........................................................................... 10-7 Weave Texture/Weave Exposure ................................................ 11-10 Wire Slack ........................8............6..5........2 11...... Voids........ Etched (Including Hand Printing) ........................................................3 Chlorides...............3 10.........2 Laminate Conditions ........1.....................................3..................................................................5........ 10-40 Flux Residues – No-Clean Process – Appearance .....................8 11........................6........7 Solder Mask Coating .......... 10-44 10....4 10.... 11-7 Connection Position ......6.......2......6..................... Blisters.........6 General . A-1 Index ..... Using Radio Frequency Identification (RFID) Tags .......................3 10.2.........1 10.......5......... 10-43 10........2 10.................................................................1 10.7 11....... 10-52 Encapsulation ..4.........5 10-45 10-47 10-48 10-49 Conformal Coating ..............................................2.3..............3 Conductors/Lands . Carbonates and White Residues .6 11.......... 10-9 Haloing and Edge Delamination ................ 11-11 Wire Plating .......5..................................................1....Table of Contents (cont........ 10-16 Lifted Pads/Lands ............5..... Delamination ....................4 10............. 10-26 10.................................2 10.............................5.1 10...........5............ 12-1 Appendix A Electrical Conductor Spacing . 10-39 11 11...) 10 Printed Circuit Boards and Assemblies ........5 11.4.. 11-8 Wire Dress .............................3.................. 11-15 High Voltage ............ 11-13 Damaged Conductors & Terminals ..... Breakdown ............5...2 10............................ Discoloration ....... Bar Coding .............8........................................................ 10-38 Particulate Matter .... 10-10 Burns ....... 11-5 Raised Turns Overlap . Labels .............................................. Screened ....5 10............................5...............3 10.3 11.......1...4 11........ Index-1 April 2010 IPC-A-610E-2010 .... 10-4 10.......................................... 11-14 Component Mounting – Connector Wire Dress Strain/Stress Relief .......5.........................2.................2 xii 10-20 10-22 10-23 10-24 10-25 Marking .2 10.6...... 10-49 10......4.......... Stamped ....1 Discrete Wiring ........................ 11 1.3 1.5 1.6 Examples and Illustrations 1.1.10 1.1 1.1.4 Definition of Requirements 1.7 Inspection Methodology 1.4.7 Acceptance Criteria Target Condition Acceptable Condition Defect Condition Disposition Process Indicator Condition Process Indicator Methodologies Combined Conditions Conditions Not Specified Specialized Designs 1.8 1.5.1.1.2 Purpose 1.1.2 1.4 1.5.4 1.4.5.5.6 1.10 Lighting IPC-A-610E-2010 April 2010 1-1 .5 1.3 1.6 1.12 *Secondary Side Solder Source Side Solder Destination Side *Cold Solder Connection Electrical Clearance High Voltage Intrusive Solder *Leaching Meniscus (Component) *Nonfunctional Land Pin-in-Paste Wire Diameter Wire Overwrap Wire Overlap 1.3.1.9 1.1 1.5.4.5.5.4 1.1.1.5.5.1 *Primary Side 1.4.4.7 1.1.2 1.1 1.1.1.8 Verification of Dimensions 1.1 Scope 1.4.3 Classification 1.1.5.4.4.5.2 1.1.1 Acceptability of Electronic Assemblies Foreword The following topics are addressed in this section: 1.4.1 Board Orientation 1.1 1.3 1.5.5 Terms & Definitions 1.5.5.4.5.9 Magnification Aids 1.5.4. mechanical and other workmanship requirements. Training Programs (Optional) Rework and Repair 1-2 Documented training requirements for teaching and learning process procedures and techniques for implementing acceptance requirements of either end item standards. For instance. the presence of criteria for adhesive bonding of components does not imply/authorize/require the use of adhesive bonding. End Item Documentation IPC-D-325 Documentation depicting bare board specific end product requirements designed by the customer or end item assembly requirements. and modification/repair of laminate material. Acceptability Standard IPC-A-610 Pictorial interpretive document indicating various characteristics of the board and/or assembly as appropriate relating to desirable conditions that exceed the minimum acceptable characteristics indicated by the end item performance standard and reflect various out-of-control (process indicator or defect) conditions to assist the shop process evaluators in judging need for corrective action. or requirements detailed on the customer documentation. The criteria in this standard are not intended to define processes to accomplish assembly operations nor is it intended to authorize repair/modification or change of the customer’s Table 1-1 Document Purpose Design Standard product. more process steps to produce the product. Summary of Related Documents Spec. B.1 Acceptability of Electronic Assemblies Foreword If a conflict occurs between the English and translated versions of this document. one may use this document in conjunction with IPC-HDBK-001. the organization should consider periodic review of personnel skills to determine visual acceptance criteria appropriately. greater densities. End Item Standards IPC J-STD-001 Requirements for soldered electrical and electronic assemblies depicting minimum end product acceptable characteristics as well as methods for evaluation (test methods). Objective evidence of the demonstration of this knowledge should be maintained. Users of this standard should be knowledgeable of the applicable requirements of the document and how to apply them. and the depiction of a lead wrapped clockwise around a terminal does not imply/authorize/require that all leads/wires be wrapped in the clockwise direction. and C) indicating finer geometries. Details may or may not reference industry specifications or workmanship standards as well as customer’s own preferences or internal standard requirements. 1. April 2010 IPC-A-610E-2010 . Where objective evidence is unavailable. IPC-A-610 has criteria outside the scope of IPC J-STD-001 defining handling. This document presents acceptance requirements for the manufacture of electrical and electronic assemblies. frequency of testing and applicable ability of process control requirements.1 Scope This standard is a collection of visual quality acceptability requirements for electronic assemblies. and IPC J-STD-001. Table 1-1 is a summary of related documents. IPC-AJ-820. conductors. the English version will take precedence.# IPC-2220 (Series) IPC-7351 IPC-CM-770 Definition Design requirements reflecting three levels of complexity (Levels A. For a more complete understanding of this document’s recommendations and requirements. electronic assembly standards contained a more comprehensive tutorial addressing principles and techniques. supporting information is provided to give a broader understanding of the process considerations that are related to performance but not commonly distinguishable through visual assessment methods. In addition. IPC-AJ-820 is a supporting document that provides information regarding the intent of this specification content and explains or amplifies the technical rationale for transition of limits through Target to Defect condition criteria. and plated-through holes. IPC-7711/7721 Documentation providing the procedures to accomplish conformal coating and component removal and replacement. solder resist repair. Component and Assembly Process Guidelines to assist in the design of the bare board and the assembly where the bare board processes concentrate on land patterns for surface mount and the assembly concentrates on surface mount and through-hole principles which are usually incorporated into the design process and the documentation. Historically. acceptability standards. the methods used shall produce completed solder connections conforming to the acceptability requirements described in this document. as well as answering questions regarding clarification in use and application for defined content of this specification. Criteria are given for each class in four levels of acceptance: Target Condition. such as IPC-7351. process indicator. IPC-A-610. specifications. however. All products shall meet the requirements of the assembly drawing(s)/ documentation and the requirements for the applicable product class specified herein. 1. April 2010 1-3 . such as life support or other critical systems.3 Classification Accept and/or reject decisions shall be based on applicable documentation such as contracts. the order of precedence shall be defined in the procurement documents. Contractual reference to IPC-A-610 does not additionally impose the content of IPC-AJ-820 unless specifically referenced in contractual documentation. standards and reference documents. When documents other than IPC-A-610 are cited. the following order of precedence applies: 1. IPC-2220 (Series). Procurement as agreed and documented between customer and supplier. and for which uninterrupted service is desired but not critical. In the case of a discrepancy. Typically the end-use environment would not cause failures. the description or written criteria always takes precedence over the illustrations. it is a desirable condition and not always achievable and may not be necessary to ensure reliability of the assembly in its service environment. This document provides acceptance criteria for completed electronic assemblies. and the equipment must function when required. Class 2 — Dedicated Service Electronic Products Includes products where continued performance and extended life is required.4. Acceptable Condition. the acceptance criteria shall be defined between the customer and supplier. The word ‘‘shall‘‘ in this document invokes a requirement for manufacturers of all classes or product. the requirements of IPC J-STD-001 ‘‘Requirements for Soldered Electrical and Electronic Assemblies’’ do not apply unless separately and specifically required. however. A brief description follows each illustration. Where a requirement is presented that cannot be defined by the acceptable. and failure to comply with the requirement is a noncompliance to this standard. processes associated with Process Indicators. In order for the user to apply and use the content of this document.) The explanations provided in IPC-AJ-820 should be useful in determining disposition of conditions identified as Defect. If the assembly does not comply with these or with equivalent requirements. harsh. The customer (user) has the ultimate responsibility for identifying the class to which the assembly is evaluated. Missing hardware or components are a Defect for all classes. drawings. which are as follows: Class 1 — General Electronic Products Includes products suitable for applications where the major requirement is function of the completed assembly. and defect conditions. the manufacturer may do so. Criteria defined in this document reflect three classes.1 Target Condition Class 3 — High Performance Electronic Products Includes products where continued high performance or performance-on-demand is critical. the assembly/product should comply with other existing IPC requirements. end-use environment may be uncommonly IPC-A-610E-2010 A condition that is close to perfect/preferred.4 Definition of Requirements 1. In the event of conflict. 3. 1.1 Acceptability of Electronic Assemblies Foreword (cont. Master drawing or master assembly drawing reflecting the customer’s detailed requirements.2 Purpose The visual standards in this document reflect the requirements of existing IPC and other applicable specifications. 2.4.1. and either Defect Condition or Process Indicator Condition.1 Acceptance Criteria When IPC-A-610 is cited or required by contract as a standalone document for inspection and/or acceptance. The illustrations in this document portray specific points noted in the title of each page. the word ‘‘shall‘‘ is used to identify the requirement. IPC6010 (Series) and IPC-A-600. It is not the intent of this document to exclude any acceptable procedure for component placement or for applying flux and solder used to make the electrical connection. If the user and manufacturer do not establish and document the acceptance class. 1. 1. equipment downtime cannot be tolerated. When invoked by the customer or per contractual agreement.
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