HP ProLiant DL980 G7 Server - Maintenance and Service Guide 2013-05 v8
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HP ProLiant DL980 G7 Server Maintenanceand Service Guide Abstract This document describes service procedures for the HP ProLiant DL980 G7 Server. This document is intended for experienced service technicians. HP assumes that you are qualified in the servicing of computer equipment, are trained in recognizing hazards in products with hazardous energy levels, and are familiar with weight and stability precautions for rack installations. HP Part Number: AM426-9001H Published: May 2013 Edition: 8 © Copyright 2010, 2013 Hewlett-Packard Development Company, L.P. Notices The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein. Windows® and Windows Server® are U.S. registered trademarks of Microsoft Corporation. Intel® and Xeon® are trademarks of Intel Corporation in the United States and other countries. Contents 1 Illustrated parts catalog...............................................................................5 Mechanical Components...........................................................................................................5 System components...................................................................................................................9 2 Removal and replacement procedures.........................................................21 Required tools........................................................................................................................21 Safety considerations..............................................................................................................21 Preventing electrostatic discharge.........................................................................................21 Server warnings and cautions..............................................................................................21 Power off the server.................................................................................................................22 SAS hard drive blank..............................................................................................................22 SAS/SATA hard drive..............................................................................................................22 DVD-ROM drive......................................................................................................................23 Power supply blank.................................................................................................................23 Hot-plug power supply............................................................................................................24 Fans.....................................................................................................................................25 Upper fans........................................................................................................................25 Lower fan module..............................................................................................................25 Remove the upper or lower processor memory drawer or processor memory drawer blank...............26 Remove a processor memory drawer cover................................................................................27 Memory cartridge...................................................................................................................27 DIMMs..................................................................................................................................30 Memory options................................................................................................................32 DIMM support...................................................................................................................34 Single-, dual-, and quad-rank DIMMs...................................................................................34 DIMM identification...........................................................................................................35 DIMM installation guidelines...............................................................................................35 Memory cartridge population guidelines...............................................................................36 Memory subsystem architecture............................................................................................36 Hemisphere mode..............................................................................................................37 Memory performance optimization.......................................................................................38 Memory RAS.....................................................................................................................38 Advanced ECC memory population guidelines......................................................................39 Online Spare memory population guidelines.........................................................................39 Mirrored Memory population guidelines...............................................................................40 Heatsink................................................................................................................................42 Processor...............................................................................................................................44 Expansion slot cover...............................................................................................................49 Low profile I/O expander........................................................................................................50 Non-hot-plug expansion board.................................................................................................52 Battery-backed write cache procedures......................................................................................53 Removing the BBWC cache module......................................................................................53 Removing the BBWC battery pack........................................................................................54 BBWC low profile I/O expander location.............................................................................55 Recovering data from the battery-backed write cache..............................................................55 Remove the SPI board.............................................................................................................56 Systems Insight Display assembly..............................................................................................57 Front bezel.............................................................................................................................58 Solid state drive......................................................................................................................59 Battery..................................................................................................................................60 I/O expansion board..............................................................................................................61 Expansion board options....................................................................................................63 Contents 3 ....................................................................................................................................................91 Fan location...............92 System board components..................................70 Power backplane..........................................................................................................................76 Flashing firmware using Smart Components....................................96 Expansion board components..................................87 Hard drive LED combinations..............................................................................85 Processor and memory board configuration / logical (physical) location................................................................................................................................................................................................................................................................................................................................................................................................................................94 System maintenance switch..............................................................................................................................................................................................................83 Front panel components.....................................................................................104 Environmental Specifications..............................................................................74 4 Flashing firmware.............................................................................................................................77 Procedure for Windows and Linux operating systems...........................87 Rear panel components.......................................................96 DIMM slot locations................................................................................................................................................67 XNC module......................................................................................................................................................75 Flashing firmware using Offline Update...........109 Index.............................................................................................87 Hard drive LEDs........................105 8 Acronyms and abbreviations........................................................................................................................72 3 Upgrading a 4s configuration to an 8s configuration...................70 HP Trusted Platform Module...........88 Rear panel LEDs..............................................................................................................................................................83 Front panel LEDs................................................................102 DVD-ROM drive cabling....................75 Flashing firmware requirements..............................................................99 6 Cabling............................................104 Server Specifications............................................................................................107 9 Documentation feedback..........................................................................................................................................................................................................................................103 7 Specifications.....................................................................................77 Procedure for Solaris and VMware operating systems....................................................................................................................................................................................99 Battery pack LEDs.........................................................................................................................................................................SAS backplane.......................................67 System board...................82 5 Component identification....................84 System Insight Display LEDs......................................................................................102 XNC cabling..........................................................................................................................................................................90 Power supply LED..................................................................................................................110 4 Contents ..........................98 Device numbers.....................95 SPI board components.........................................................................................................................................................................................................68 Re-entering the server serial number and product ID..................................... hard drive 392613-001 Mandatory1 4 Bezel assembly. Check the HP Partsurfer website (http://partsurfer.Frontal section of processor-memory drawer AM426-69021 Mandatory1 6 Processor memory drawer bottom AM426-69018 Mandatory1 Not shown Blank.Upper processor-memory drawer. Item Description Spare part number Customer self repair 1 Access panel AM426-69016 Mandatory1 2 Processor memory drawer top AM426-69002 Mandatory1 — Bezel . lower processor memory drawer AM426-69008 Mandatory1 Mechanical Components 5 .aspx). power. to ensure you have the latest part numbers associated with this product.com/search.hp.1 Illustrated parts catalog Mechanical Components NOTE: The list of part numbers is current and correct as of the publication of the document. Part numbers change often. SID 591209-001 Mandatory1 5 Bezel . frontal access AM426-69019 Mandatory1 3 Blank. PCI end retainer. Si tratta comunque di componenti progettati per questo scopo. If. Toutefois. frontal access AM426-69020 Mandatory1 7 Tool. 2 Optional: Opzionali—Parti la cui riparazione da parte del cliente è facoltativa. PCI retainer. 6 Illustrated parts catalog . PCI top retainer.Item Description Spare part number Customer self repair — Bezel . power supply 496058-001 Mandatory1 Not shown Plastics Kit AM426-69014 Mandatory1 Not shown Hardware kit . low-profile expansion slot cover. deve sostenere le spese di spedizione e di manodopera per il servizio. depending on the type of warranty service designated for your product. there may or may not be additional charges. These parts are identified as "No" in the Illustrated Parts Catalog. Se tuttavia il cliente ne richiede la sostituzione ad HP. Ces pièces sont identifiées par la mention “Non” dans le Catalogue illustré. 2 Optional: Facultatif—Pièces pour lesquelles la réparation par le client est facultative. — 1 Mandatory: Obligatoire—Pièces pour lesquelles la réparation par le client est obligatoire. les coûts de déplacement et main d'oeuvre du service vous seront facturés. Si vous demandez à HP de remplacer ces pièces. l'intervention peut ou non vous être facturée. Se il cliente ne affida la riparazione ad HP. Ces pièces sont également conçues pour permettre au client d'effectuer lui-même la réparation. T-15 Torx screwdriver 199630-001 Mandatory1 8 Blank.Lower processor-memory drawer. HP requires that an authorized service provider replace the part. fan blank. In order to satisfy the customer warranty. full-length expansion slot cover. optical device blank.contains a 496058-001 heatsink blank. These parts are also designed for customer self repair. — 1 Mandatory: Obbligatorie—Parti che devono essere necessariamente riparate dal cliente. If you request HP to replace these parts. you require that HP replace them for you. 2 Optional—Parts for which customer self repair is optional.Miscellaneous parts included AM426-69022 Mandatory1 Not shown 3-8 U Slide rail kit AM426-2104A Mandatory1 1 Mandatory—Parts for which customer self repair is mandatory. however. you will be charged for the travel and labor costs of this service. Pour que la garantie puisse s'appliquer. HP exige que le remplacement de la pièce soit effectué par un Mainteneur Agréé. 3 No—Some HP parts are not designed for customer self repair. 3 No: Non—Certaines pièces HP ne sont pas conçues pour permettre au client d'effectuer lui-même la réparation. si vous demandez à HP de remplacer ces pièces. selon le type de garantie applicable à votre produit. and PCI removable retainer Mandatory1 Not shown Bezel kit . potrebbe dover sostenere spese addizionali a seconda del tipo di garanzia previsto per il prodotto. für die das Customer Self Repair-Verfahren optional ist. tendrá que hacerse cargo de los gastos de desplazamiento y de mano de obra de dicho servicio. — 1 Mandatory: Verplicht—Onderdelen waarvoor Customer Self Repair verplicht is. A fim de cumprir a garantia do cliente. HP richiede che queste parti siano sostituite da un centro di assistenza autorizzato. afhankelijk van het type garantieservice voor het product. 3 No: Nenhuma—Algumas peças da HP não são projetadas para o reparo feito pelo cliente. Dichos componentes se identifican con la palabra “No” en el catálogo ilustrado de componentes. 2 Optional: Opcional—Peças cujo reparo feito pelo cliente é opcional. Per rispettare la garanzia. — 1 Mandatory: Zwingend—Teile. HP pone como condición que un proveedor de servicios autorizado realice la sustitución de estos componentes. Wenn Sie jedoch den Austausch dieser Teile von HP vornehmen lassen möchten. Tali parti sono identificate da un “No” nel Catalogo illustrato dei componenti. Als u echter HP verzoekt deze onderdelen voor u te vervangen. Essas peças também são projetadas para o reparo feito pelo cliente. 3 No: Kein—Einige Teile sind nicht für Customer Self Repair ausgelegt. No entanto. Sin embargo. dependiendo del tipo de servicio de garantía correspondiente al producto. Deze onderdelen worden in de geïllustreerde onderdelencatalogus aangemerkt met "Nee". 2 Optional: Optioneel—Onderdelen waarvoor reparatie door de klant optioneel is. Se desejar que a HP substitua essas peças. pode haver ou não a cobrança de taxa adicional. no catálogo de peças ilustrado. Als u HP verzoekt deze onderdelen te vervangen. können bei diesem Service je nach den für Ihr Produkt vorgesehenen Garantiebedingungen zusätzliche Kosten anfallen. muss das Teil von einem HP Servicepartner ersetzt werden. Diese Teile sind auch für Customer Self Repair ausgelegt. se desejar que a HP as substitua. In verband met de garantievoorwaarden moet het onderdeel door een geautoriseerde Service Partner worden vervangen. dependendo do tipo de serviço de garantia destinado ao produto. Im illustrierten Teilekatalog sind diese Teile mit „No“ bzw. Wenn Sie diese Teile von HP ersetzen lassen. 2 Optional: Optional—Teile. Ook deze onderdelen zijn ontworpen voor reparatie door de klant. 2 Optional: Opcional— componentes para los que la reparación por parte del usuario es opcional. die im Rahmen des Customer Self Repair Programms ersetzt werden müssen. werden Ihnen die Versand. Mechanical Components 7 . Essas peças estão identificadas com a marca “No” (Não). serão cobradas as despesas de transporte e mão-de-obra do serviço. — 1 Mandatory: Obligatorio—componentes para los que la reparación por parte del usuario es obligatoria. 3 No: No—Algunos componentes no están diseñados para que puedan ser reparados por el usuario. — 1 Mandatory: Obrigatória—Peças cujo reparo feito pelo cliente é obrigatório.3 No: Non CSR—Alcuni componenti HP non sono progettati per la riparazione da parte del cliente. Um den Garantieanspruch des Kunden zu erfüllen. si precisa que HP realice su sustitución.und Arbeitskosten für diesen Service berechnet. a HP exige que um técnico autorizado substitua a peça. Para que el usuario haga valer su garantía. Estos componentes también están diseñados para que puedan ser reparados por el usuario. komen de reiskosten en het arbeidsloon voor uw rekening. puede o no conllevar costes adicionales. 3 No: Nee—Sommige HP onderdelen zijn niet ontwikkeld voor reparatie door de klant. kunnen daarvoor extra kosten in rekening worden gebracht. Si solicita a HP que realice la sustitución de estos componentes. „Nein“ gekennzeichnet. 8 Illustrated parts catalog . Part numbers change often. to ensure you have the latest part numbers associated with this product. Check the HP Partsurfer website (http://partsurfer.com/search.System components NOTE: The list of part numbers is current and correct as of the publication of the document.aspx). Item Description Spare part number Customer self repair 1 PCI-X/PCI Express I/O expansion board 591204-001 Mandatory1 PCI Express I/O expansion board 591205-001 3 System board AM426-69015 Optional2 4 SPI board — — — HP ProLiant DL980 NC375i AM426-69017 SPI Board Mandatory1 — HP ProLiant DL980 331i SPI Board AM451-69002 Mandatory1 5 Memory module 591198-001 Optional2 6 Heatsink assembly 591207-001 Optional2 7 Memory — — 2 588139-B21 Mandatory1 588137-B21 System components 9 .hp. LGA 1567 socket.0 processor kit Mandatory1 — Intel Xeon E7-2830 4-processor kit. LGA 1567 socket. PC3L-10600.5 GB Level-2 cache (256 KB per core). 501538-001 PC3-8500R memory module (512 MBx4) Mandatory1 — 16GB (1x16GB) memory DIMM . 2. PC3-10600R. DDR3-1333. LGA 1567 socket. DDR3-1333. 2. 1.13GHz Mandatory1 Illustrated parts catalog — 650017-001 .10 Item Description Spare part number Customer self repair — 2 GB (128 MBx8). DDR3 DIMM memory module 501533-001 Mandatory1 — 4 GB (256MBx4). Registered CAS-9 LP 632204-001 Mandatory1 — 32GB memory DIMM 32GB 632205-001 4RX4 PC3L-8500R-9A Mandatory1 8 Processors — — Intel Xeon e7520 4 core 597821-001 processor. 133 501534-001 MHz. 95 W TDP] Mandatory1 — Intel Xeon E6540 6 core 594899-001 processor. PC3-10600R. 105 W TDP] Mandatory1 — Intel Xeon X6550 8 core 594896-001 processor.27 GHz [2 GB Level-2 cache (256 KB per core). DDR3 DIMM memory module1Rx4 Mandatory1 — 4 GB. 133 PC3-10600R.86 GHz [1 GB Level-2 cache (256 KB per core).00 GHz [2 GB Level-2 cache (256 KB per core). single-rank memory module 595424-001 Mandatory1 — 4 GB PC3L 10600R 606426-001 DDR3-1333 memory module Mandatory1 — 8 GB PC3-10600R-DDR3-133 MHz RDIMM 501536-001 Mandatory1 — 8GB PC3L 10600R 606427-001 DDR3-1333 memory module Mandatory1 — 16 GB DDR3-106. LGA 1567 socket.Dual rank x4.00 GHz [1.86 processor kit 653055-001 Mandatory1 — HP DL980 10 Core E7-2850 650016-001 2. 2. 130W TDP] Mandatory1 — HP DL980 6 Core E7-4807 1. 130 W TDP] Mandatory1 — Intel Xeon X7500 8 core 594893-001 processor. 2. 000-rpm 6. 6G SAS. 10.35-cm: DL980 (2.5 in) 581286-B21 Mandatory1 — f) 900 GB. 6G SAS.5-in) 512743-001B21 Mandatory1 — b) 146-GB.000-rpm. 6.40GT/s) — HP DL980 10 Core E7-2860 650015-001 2. 6.000-rpm.35 cm (2.5 in) 581284-B21 Mandatory1 — e) 600 GB.5-in) 507284-001 Mandatory1 — d) 450 GB.4 processor kit Mandatory1 Not shown Thermal grease kit 395532-001 Optional2 9 Power backplane AM426-69001 No3 11 Memory cartridge — — — Memory cartridge for Intel Xeon 7500/6500 Series processor 591198-001 Optional2 — Memory cartridge for Intel Xeon E7 Family processor: HP DL980 647058-001 Optional2 13 SAS backplane 591203-001 Optional2 14 Systems Insight Display assembly AM426-69003 Optional2 15 SFF hot-plug drives (not shown) — — — a) 72-GB. 6G SAS.) dual port enterprise hard drive Mandatory1 Not shown Solid state drives — — System components 11 .) dual port enterprise hard drive Mandatory1 — HP 146 GB SAS 15K SFF 512547-B21 (2.35 cm (2. 15.000 619291-B21 rpm 6. 6. 10. 6G SAS. 6G SAS.) dual port enterprise hard drive Mandatory1 — HP 72 GB SAS 15K SFF 512545-B21 (2. 10.5 in.5 in.Item Description Spare part number Customer self repair (24MB Level-2 cache.26 processor kit Mandatory1 — HP DL980 10 Core E7-4870 653050-001 2.5 in. 15.5-in) 512744-001 Mandatory1 — c) 300 GB.000 rpm 6.35-cm (2. 6G SAS.35 cm (2. 10.35-cm (2.5 in) Mandatory1 — HP 300 GB SAS 10K SFF 507127-B21 (2.000 rpm 6. 35 cm (2. PCIe. high-efficiency Mandatory1 Not shown HP 1200W CS Platinum Power Supply Kit 578322-B21 Mandatory1 Not shown I/O — — — SCSI U320e host bus adapter (HBA). 3G SATA.IB 4x 593412-001 quad data rate (QDR) CX-2 PCIe dual port host channel adapter Mandatory1 — HP SC08Ge HBA 488765-B21 Mandatory1 — HP NC112T PCIe Gigabit Server Adapter 503746-B21 Mandatory1 — HP NC360T PCIe Dual Port 1Gb Server Adapter 412648-B21 Mandatory1 — HP NC365T 4-port Ethernet 593722-B21 Server Adapter Mandatory1 — HP NC373F PCIe Mfn 1GbE 394793-B21 Server Adapter Mandatory1 — HP NC373T PCIe Mfn 1GbE 394791-B21 Server Adapter Mandatory1 — HP NC375T PCIe 4Prt Gigabit Server Adapter Mandatory1 Illustrated parts catalog 538696-B21 . 579229-001 12V. SAS. SAS. dual channel. 6. MDL SSD 572071-B21 Mandatory1 — b) 120 GB.5 in) SSD SLC drive 632494-B21 Mandatory1 Not shown Media drives — — — a) SATA DVD-ROM drive 481428-001 Mandatory1 481041-B21 — b) SATA DVD RW drive 481429-001 Mandatory1 481043-B21 12 16 Fan.5 in). redundant.1200W.5 in) SSD SLC drive 632492-B21 Mandatory1 — e) 400 GB. with low voltage differential (LVD) 593120-001 Mandatory1 — Host channel adapter . 6. 6.Item Description Spare part number Customer self repair — a) 60 GB 3G SATA.35 cm (2. hot-pluggable.35 572073-B21 cm (2. 6. lower module AM426-69013 Mandatory1 17 Small form factor PCI Express I/O expansion module AM426-69012 Mandatory1 18 XNC module AM426-69009 Mandatory1 19 Power supply PHB .35 cm (2. 1U form factor.5 in) MDL SSD Mandatory1 — c) 200 GB. PCIe RAID controller with eight internal Serial Attached SCSI ports in a low-profile form factor. 1 Gb. SAS.Item Description Spare part number Customer self repair — HP NC382T PCIe Dual-Port Multifunction Gb Server Adapter 458492-B21 Mandatory1 — HP NC523SFP 10Gb 2P Adapter 593717-B21 Mandatory1 — HP NC524SFP Dual Port 10GbE Module 489892-B21 Mandatory1 — HP NC550SFP 2 -port PCIe 581201-B21 x8 Ethernet Adapter Mandatory1 — HP NC382T PCIe Dual Port 458491-001 Multifunction Gigabit Server Adapter Mandatory1 — SAS controller board. 16-ports external. for use 462594-001 in the Smart Array P212 controller Mandatory1 — HP P212/256 Smart Array controller 462834-B21 Mandatory1 — HP P411/256 Smart Array controller 462830-B21 Mandatory1 — SAS controller board. PCIe x8 487204-B21 Mandatory1 — HP SC08e 6 Gb SAS HBA 614988-B21 Mandatory1 — HP Smart Array P812 controller. for Smart Array P411 controller with 256 MB memory module 462918-001 Mandatory1 — HP Smart Array P411 controller w/1GB FBWC controller 572531-B21 Mandatory1 — HP Smart Array P411 controller w/512MB FBWC controller 578229-B21 Mandatory1 — HP Smart Array P812/1 controller Gb flash. 24 ports. PCIe. 8-ports internal. supports up to 108 hard drives 587224-001 Mandatory1 — HP Smart Array E500/256 external controller 435129-B21 Mandatory1 — HP Smart Array P400/256 405132-B21 SAS controller. supports up to 512MB BBWC and RAID Level-6 (ADG) Mandatory1 — HP Smart Array P400/512 rmkt controller Mandatory1 411064-B21 System components 13 . For Smart Array P400 controller only Mandatory1 — HP Smart Array P800 controller Mandatory1 — HP P410/Zero Memory FIO 462860-B21 Smart Array controller Mandatory1 — HP Smart Array P410/256 controller 462862-B21 Mandatory1 — HP Smart Array P400/512 rmkt controller 462864-B21 Mandatory1 — HP Smart Array P410/256 MB BBWC controller 491195-B21 Mandatory1 — HP Smart Array P410 with 1GB FBWC controller 572532-B21 Mandatory1 — HP P410 with 512MB FBWC controller 578230-B21 Mandatory1 — HP SAS Expander Card 468406-B21 Mandatory1 — HP StorageWorks 81Q PCI-e FC HBA AK344A Mandatory1 — HP StorageWorks FC 1242SR 4Gb PCIe dual channel HBA AE312A Mandatory1 — HP StorageWorks FC 2242SR 4Gb PCIe dual channel HBA A8003A Mandatory1 — HP StorageWorks FC 1142SR 4Gb PCIe HBA AE311A Mandatory1 — HP StorageWorks FC 2142SR 4Gb PCIe HBA A8002A Mandatory1 — HP StorageWorks 82E 8Gb AJ763A Dual-port PCIe FC HBA Mandatory1 — HP StorageWorks 82Q 8Gb AJ764A Dual Port PCI-e FC HBA Mandatory1 — HP StorageWorks 81E 8Gb SP PCI-e FC HBA AJ762A Mandatory1 — HP StorageWorks 8 Gb short wave FC SFF transceiver 468508-001 Mandatory1 — HP StorageWorks 42B PCIe AP768A 4Gb Dual Port Mandatory1 — HP StorageWorks 41B PCIe 4Gb Single Port AP767A Mandatory1 — HP StorageWorks 82B PCIe AP770A 8Gb Dual Port Mandatory1 — HP StorageWorks 81B PCIe 8Gb Single Port Mandatory1 Illustrated parts catalog Spare part number 381513-B21 AP769A Customer self repair .14 Item Description — HP Smart Array cache 383280-B21 battery kit . 1-GB 505908-001 Mandatory1 System components 15 . cache module.28TB MLC PCIe ioDrive Duo 641027-B21 Mandatory1 Not shown USB/video assembly 591201-001 Optional2 Not shown 256 BBWC memory module 462974-001 . 512 MB 405835-001 Optional2 Not shown b) Smart Array cache module.includes controller.40B wide .Item Description Spare part number Customer self repair — PCIe one-port FC 81q HBA board 489190-001 Optional2 — HP StorageWorks CN1000E Dual Port Converged Network Adapter AW520A Mandatory1 — HP StorageWorks CN1000Q Dual Port Converged Network Adapter BS668A Mandatory1 — HP StorageWorks CN1100E Dual Port Converged Network Adapter BK835A Mandatory1 — HP SC11Xe HBA 412911-B21 Mandatory1 — HP StorageWorks PCIe U320e SCSI HBA AH627A Mandatory1 — HP IB 4X DDR CX-2 PCI-e G2 Dual Port HCA 592521-B21 Mandatory1 — HP IB 4X QDR CX-2 PCI-e G2 Dual Port HCA 592520-B21 Mandatory1 — HP IB 4X DDR Conn-X PCI-e 448397-B21 G2 Dual Port HCA Mandatory1 — HP IB 4X DDR PCI-e G2 Dual 409376-B21 Port HCA Mandatory1 — HP 160Gb SLC PCIe ioDrive 600278-B21 accelerator card Mandatory1 — HP 320Gb MLC PCIe ioDrive accelerator card 600279-B21 Mandatory1 — HP 320Gb SLC PCIe ioDrive 600281-B21 Duo accelerator card Mandatory1 — HP 640Gb MLC PCIe 600282-B21 ioDrive Duo accelerator card Mandatory1 — HP 1. 256 MB 405836-001 Optional2 Not shown Smart Array BBWC battery pack 398648-001 Mandatory1 Not shown FBWC. does not include batteries Mandatory1 Not shown Smart Array cache module — — Not shown a) Smart Array cache module. automatic speed negotiation.PCIe dual-port FC 489193-001 82e HBA board Mandatory1 — 4Gb PCIe to FC HBA StorageWorks FC142SR single-channel 397739-001 Mandatory1 — 4Gb PCIe to FC HBA StorageWorks FC2242SR dual-port 397740-001 Mandatory1 — 4 GB PCIe to FC HBA 407620-001 (QLogic) Features one 4Gbps FC port with SFF multimode optic with LC-style connector. with LVD 445009-001 Mandatory1 Illustrated parts catalog 587225-001 . automatic speed negotiation.407621-001 4GB. 1000base-T fiber connector (FC) Mandatory1 — 8-port external SAS HBA board 489103-001 Mandatory1 — PCIe dual-port FC 82q HBA 489191-001 board Mandatory1 — PC board . MPIO basic Mandatory1 — Intel NC360T PCIe 2-port Gb (1000 Base-T) server NIC adapter .includes a standard-height bracket attached 412651-001 Mandatory1 — HP NC522SFP Dual-Port 10GbE Gigabit Server Adapter 468332-B21 Mandatory1 — 4Gb PCIe-to-FC HBA StorageWorks FC2242SR dual-channel 397740-001 Mandatory1 — 4Gb PCIe-to-FC HBA StorageWorks FC2242SR dual-channel 397740-001 Mandatory1 — SCSI U320e (HBA) . 512 MB 578882-001 Mandatory1 Not shown FBWC capacitor pack 587324-001 Mandatory1 Not shown NC524SFP dual-port 10GBE 490712-001 module Optional2 Not shown Super capacitor module Optional2 — PCIe mezzanine NIC card . optical LC type connector. PCIe. and MPIO Mandatory1 — PCIe dual FC HBA (QLogic).16 Item Description Spare part number Customer self repair Not shown HP 512 MB FBWC module 534915-B21 Mandatory1 Not shown HP 1 GB FBWC module 534562-B21 Mandatory1 Not shown FBWC module.PCIe single -port 489192-001 FC 81e HBA board Mandatory1 — PC board .dual channel.436431-001 4-port. 320GB. PCIe 466515-001 Mandatory1 — SPS-BD. logical NAND flash. 123. access latency (512 byte) twenty-nine microseconds.ioDrive 600477-001 accelerator card. access latency (512 Byte) twenty-nine microseconds. SLC. 1. Mandatory1 600478-001 Customer self repair System components 17 . logical NAND flash. 160 GB.000 Interface Operating Procedures (IOPS) 75/25 R/W Mandatory1 — PC board . bandwidth (64kB) 1.Item Description Spare part number — Dual-channel Ultra320 PCIE 445009-002 HBA Mandatory1 — PC board .5GBs reads. access latency (512 Byte) twenty-six microseconds.0GBs writes.PCIe gigabit ADP 503827-001 Mandatory1 — SPS-BD NIC PXIE 4P 10/100/1000 539931-001 Mandatory1 — HP NC550SFP 10Gb 2-port 581201-B21 PCIe x8 Ethernet Adapter Mandatory1 — NC550SFP dual-port 10GbE 586444-001 server adapter Mandatory1 — SPS-BD mezzanine 4X DDR IB CX G2 dual-port 593413-001 Mandatory1 — Quad port NC365T adapter 593743-001 . logical NAND flash.SE 468349-001 Mandatory1 — PCIe one-port FC 81q HBA board 489190-001 Mandatory1 — SPS-BD. 81Q.ioDrive accelerator card. MLC. logical Not And (NAND) flash. 735M/s reads. 770MBs reads. bandwidth (64kB) 750MBs writes. Single Level Cell (SLC). 238. 320GB. bandwidth (64kB) 1.ioDrive accelerator card.NC112T. bandwidth (64kB) 510MBs writes. MLC.1 gigabit Ethernet (GbE) Mandatory1 — PC board .000 IOPS 75/25 R/W mix Mandatory1 — PC board . FC.HBA.5GBs writes 1. access latency (512 Byte) twenty-six microseconds.5GBs reads.ioDrive 600474-001 accelerator card.NC522SFP+ 10 gigabit. 67000 IOPS (75/25 R/W) 600475-001 Mandatory1 — PC board . 640GB. 35. XNC JLink.Item Description Spare part number Customer self repair 138.Serial ATA (SATA). SATA power/data 501025-001 Optional2 Not shown Cable assembly.8 cm (33-in) 498426-001 Mandatory1 Not shown Cable . video — Mandatory1 Not shown b) Cable assembly. depending on the type of warranty service designated for your product. 000 IOPS 75/25 R/W mix Not shown SPS-PCA Mini-DIMM 512MB 581135-001 Mandatory1 Not shown Battery. fan. These parts are identified as "No" in the Illustrated Parts Catalog. Lithium 153099-001 Mandatory1 Not shown Cable kit for DL980G7 AM426-69011 Mandatory1 Not shown a) Cable assembly. SSD — Mandatory1 Not shown f) Cable assembly. 3 No—Some HP parts are not designed for customer self repair. backplane/SPI — Mandatory1 Not shown g) Cable assembly. If. power. USB. there may or may not be additional charges. UID — Mandatory1 Not shown c) Cable assembly. 3V. power / data 531997-001 Mandatory1 Not shown Cable. — 18 Illustrated parts catalog . 5A BBWC 409124-001 battery Mandatory1 Not shown Cable assembly. mini-SAS. Mini — SAS (SPI to SAS backplane) Mandatory1 Not shown SATA DVD power cable 496071-001 Mandatory1 Not shown Cable assembly. SATA DVD — Mandatory1 Not shown e) Cable assembly. SAS power — Mandatory1 Not shown d) Cable.56 cm AM426-69023 (14 in) Mandatory1 Not shown Trusted Platform Module (TPM) kit 488069-B21 No3 Not shown Trusted Platform Module (TPM) 505836-001 No3 1 Mandatory—Parts for which customer self repair is mandatory. you require that HP replace them for you. HP requires that an authorized service provider replace the part. If you request HP to replace these parts. These parts are also designed for customer self repair. however. you will be charged for the travel and labor costs of this service. 2 Optional—Parts for which customer self repair is optional. thermal sensor — Mandatory1 Not shown g) Cable assembly. 83. power. In order to satisfy the customer warranty. 2 Optional: Optional—Teile. Pour que la garantie puisse s'appliquer. „Nein“ gekennzeichnet. Ces pièces sont également conçues pour permettre au client d'effectuer lui-même la réparation. — 1 Mandatory: Verplicht—Onderdelen waarvoor Customer Self Repair verplicht is. potrebbe dover sostenere spese addizionali a seconda del tipo di garanzia previsto per il prodotto. Als u HP verzoekt deze onderdelen te vervangen. puede o no conllevar costes adicionales. werden Ihnen die Versand. Per rispettare la garanzia. muss das Teil von einem HP Servicepartner ersetzt werden. Si tratta comunque di componenti progettati per questo scopo. Um den Garantieanspruch des Kunden zu erfüllen.und Arbeitskosten für diesen Service berechnet. dependiendo del tipo de servicio de garantía correspondiente al producto. deve sostenere le spese di spedizione e di manodopera per il servizio. System components 19 . die im Rahmen des Customer Self Repair Programms ersetzt werden müssen. — 1 Mandatory: Zwingend—Teile. l'intervention peut ou non vous être facturée. 2 Optional: Opcional— componentes para los que la reparación por parte del usuario es opcional. 2 Optional: Opzionali—Parti la cui riparazione da parte del cliente è facoltativa. si precisa que HP realice su sustitución. HP exige que le remplacement de la pièce soit effectué par un Mainteneur Agréé. können bei diesem Service je nach den für Ihr Produkt vorgesehenen Garantiebedingungen zusätzliche Kosten anfallen. 3 No: Kein—Einige Teile sind nicht für Customer Self Repair ausgelegt. HP pone como condición que un proveedor de servicios autorizado realice la sustitución de estos componentes. Se il cliente ne affida la riparazione ad HP. selon le type de garantie applicable à votre produit. Tali parti sono identificate da un “No” nel Catalogo illustrato dei componenti. HP richiede che queste parti siano sostituite da un centro di assistenza autorizzato. 3 No: Non—Certaines pièces HP ne sont pas conçues pour permettre au client d'effectuer lui-même la réparation. si vous demandez à HP de remplacer ces pièces. Ces pièces sont identifiées par la mention “Non” dans le Catalogue illustré. — 1 Mandatory: Obligatorio—componentes para los que la reparación por parte del usuario es obligatoria. 3 No: Non CSR—Alcuni componenti HP non sono progettati per la riparazione da parte del cliente.1 Mandatory: Obligatoire—Pièces pour lesquelles la réparation par le client est obligatoire. komen de reiskosten en het arbeidsloon voor uw rekening. für die das Customer Self Repair-Verfahren optional ist. tendrá que hacerse cargo de los gastos de desplazamiento y de mano de obra de dicho servicio. les coûts de déplacement et main d'oeuvre du service vous seront facturés. Diese Teile sind auch für Customer Self Repair ausgelegt. Dichos componentes se identifican con la palabra “No” en el catálogo ilustrado de componentes. Wenn Sie jedoch den Austausch dieser Teile von HP vornehmen lassen möchten. Estos componentes también están diseñados para que puedan ser reparados por el usuario. Wenn Sie diese Teile von HP ersetzen lassen. Si solicita a HP que realice la sustitución de estos componentes. Toutefois. Si vous demandez à HP de remplacer ces pièces. Se tuttavia il cliente ne richiede la sostituzione ad HP. — 1 Mandatory: Obbligatorie—Parti che devono essere necessariamente riparate dal cliente. 2 Optional: Facultatif—Pièces pour lesquelles la réparation par le client est facultative. Im illustrierten Teilekatalog sind diese Teile mit „No“ bzw. Sin embargo. Para que el usuario haga valer su garantía. 3 No: No—Algunos componentes no están diseñados para que puedan ser reparados por el usuario. a HP exige que um técnico autorizado substitua a peça. 3 No: Nenhuma—Algumas peças da HP não são projetadas para o reparo feito pelo cliente. — 1 Mandatory: Obrigatória—Peças cujo reparo feito pelo cliente é obrigatório. se desejar que a HP as substitua. Deze onderdelen worden in de geïllustreerde onderdelencatalogus aangemerkt met "Nee". kunnen daarvoor extra kosten in rekening worden gebracht. serão cobradas as despesas de transporte e mão-de-obra do serviço. Als u echter HP verzoekt deze onderdelen voor u te vervangen. In verband met de garantievoorwaarden moet het onderdeel door een geautoriseerde Service Partner worden vervangen. 20 Illustrated parts catalog . A fim de cumprir a garantia do cliente. 2 Optional: Opcional—Peças cujo reparo feito pelo cliente é opcional. afhankelijk van het type garantieservice voor het product. Essas peças estão identificadas com a marca “No” (Não). No entanto. Essas peças também são projetadas para o reparo feito pelo cliente. no catálogo de peças ilustrado. pode haver ou não a cobrança de taxa adicional. Ook deze onderdelen zijn ontworpen voor reparatie door de klant. Se desejar que a HP substitua essas peças.2 Optional: Optioneel—Onderdelen waarvoor reparatie door de klant optioneel is. dependendo do tipo de serviço de garantia destinado ao produto. 3 No: Nee—Sommige HP onderdelen zijn niet ontwikkeld voor reparatie door de klant. • Always be properly grounded when touching a static-sensitive component or assembly. • Place parts on a grounded surface before removing them from their containers. Operating the server in this manner results in improper airflow and improper cooling that can lead to thermal damage. • Unplug the power cord from the power supply to disconnect power to the equipment. electrical outlet. • Do not route the power cord where it can be walked on or pinched by items placed against it. To prevent electrostatic damage: • Avoid hand contact by transporting and storing products in static-safe containers. be sure that you understand the following warnings and cautions. CAUTION: Do not operate the server for long periods with the access panel open or removed. review all the safety information. WARNING! To reduce the risk of electric shock or damage to the equipment: • Do not disable the power cord grounding plug.2 Removal and replacement procedures Required tools You need the following items for some procedures: • Torx T-15 screwdriver (provided with the server) • Phillips screwdriver • Flathead screwdriver • Diagnostics Utility Safety considerations Before performing service procedures. Pay particular attention to the plug. leads. WARNING! To reduce the risk of personal injury from hot surfaces. Server warnings and cautions Before installing a server. Preventing electrostatic discharge To prevent damaging the system. allow the drives and the internal system components to cool before touching them. • Keep electrostatic-sensitive parts in their containers until they arrive at static-free workstations. Required tools 21 . be aware of the precautions you need to follow when setting up the system or handling parts. • Plug the power cord into a grounded (earthed) electrical outlet that is easily accessible at all times. The grounding plug is an important safety feature. and the point where the cord extends from the server. A discharge of static electricity from a finger or other conductor may damage system boards or other static-sensitive devices. or circuitry. This type of damage may reduce the life expectancy of the device. • Avoid touching pins. SAS hard drive blank CAUTION: For proper cooling. If the server is installed in a rack. When the server activates standby power mode. Remove the component as indicated. 3. 4. 5. do not operate the server without the access panel. To remove the component: 1. The system is now without power. The front panel Power On/Standby button does not completely shut off system power. Remove the hard drive. 6. Blue LEDs illuminate on the front and rear panels of the server. To replace the blank. electric shock. slide the blank into the bay until it locks into place. locate the server by identifying the illuminated rear UID LED button. Back up the server data. do not operate the server unless all bays are populated with either a component or a blank. Back up all server data on the hard drive. Determine the status of the drive from the hot-plug SAS hard drive LED combinations (“Hard drive LED combinations” (page 87)). Press the Power On/Standby button to place the server in standby mode. or blanks installed. or damage to the equipment. the system power LED changes to amber.Power off the server WARNING! To reduce the risk of personal injury. 22 Removal and replacement procedures . If the server supports hot-plug components. NOTE: 1. Shut down the operating system as directed by the operating system documentation. Disconnect the power cords. it is not necessary to power down the server. If installing a hot-plug device. If the server is installed in a rack. baffles. expansion slot covers. 3. press the UID LED button on the front panel. SAS/SATA hard drive CAUTION: To prevent improper cooling and thermal damage. 2. minimize the amount of time the access panel is open. 2. disconnect the power cord to remove power from the server. Portions of the power supply and some internal circuitry remain active until the power cord is disconnected. Remove the DVD-ROM drive. Extend the server from the rack. DVD-ROM drive To remove the component: 1. Remove the access panel. DVD-ROM drive 23 . 3. reverse the removal procedure. reverse the removal procedure. 2. Power supply blank Remove the component as indicated. To replace the component. 4. Disconnect the cable from the rear of the DVD-ROM drive.To replace the component. 5. Power down the server. HP recommends installing redundant hot-plug power supplies in pairs. and the point where the cord extends from the server. see the HP power advisor at the HP website (http://www. Hot-plug power supply The server supports up to eight hot-plug power supplies. Disconnect the power cord from the failed power supply. reverse the removal procedure. • Do not route the power cord where it can be walked on or pinched by items placed against it. Install all power supplies to provide full redundancy. 24 Removal and replacement procedures . Pay particular attention to the plug. To confirm the redundancy of your configuration. • Unplug the power cord from the power supply to disconnect power to the equipment. 2. WARNING! To reduce the risk of electric shock or damage to the equipment: • Do not disable the power cord grounding plug.com/go/hppoweradvisor). • Plug the power cord into a grounded (earthed) electrical outlet that is easily accessible at all times. The grounding plug is an important safety feature. To remove the component: 1.To replace the component.hp. Remove the failed power supply. electrical outlet. Upper fans To remove the component: 1. so iLO 3 does not detect that the shutdown should be canceled when the fans are hot-swapped. Shut down the server and remove the power cord. perform the following instead of hot-swapping the fans: 1. reverse the removal procedure. 2. however. 2. Fans 25 . Lower fan module To remove the component: 1. they may be flagged as "Failed" and then "OK" in a random order. This issue occurs because HP Integrated Lights-Out 3 (iLO 3) Firmware Version 1. however.10 detects that when two fans are failed and repaired in quick succession. Extend the server from the rack. the fan sensor state returns to "OK" (Green). reverse the removal procedure. and the system continues with its graceful shutdown. Remove the fan module. A future version of iLO 3 firmware will prevent the graceful shutdown from continuing if the fans are immediately replaced. 2.To replace the component. Extend the server from the rack. 3. the 60-second shutdown is not always aborted as it should be. if the hot-plug fans are immediately replaced. There is no workaround to prevent the possible shutdown. Remove the access panel. 3. Fans NOTE: If two fan fail or if a dual-rotor fan is removed and the "Shutdown" operating system pop-up alert appears. Power the server back on. if the fans fail and need to be replaced. Remove the fan. To replace the component. Replace any dual rotor fans (or two individual fans). 3. Lower the handle. 26 Removal and replacement procedures . Remove the upper or lower processor memory drawer or processor memory drawer blank 1. and the processor memory drawer blank. press the release buttons and then remove the drawer from the server. Release the latches on the release lever. CAUTION: XNC cabling (“XNC cabling” (page 102)) is required for eight processor systems. 2. reverse the removal procedure. Power off the server (“Power off the server” (page 22)).To replace the component. Firmly holding the processor memory drawer. and then extend the processor memory drawer from the server until the release latches catch. Failure to cable the XNC will result in the lower processor memory drawer not being recognized by the server. 4. The procedure is the same for the upper and lower processor memory drawers. 3. Memory cartridge NOTE: Be sure you are using the correct spare part number when replacing the memory cartridge. Remove the processor memory drawer cover (“Remove a processor memory drawer cover” (page 27)). 3. The procedure is the same for the upper and lower processor memory drawers. and the processor memory drawer blank. 2. Remove the failed memory cartridge. Power off the server (“Power off the server” (page 22)).Remove a processor memory drawer cover 1. 4. CAUTION: XNC cabling (“XNC cabling” (page 102)) is required for eight processor systems. Remove the processor memory drawer. 2. Power off the server (“Power off the server” (page 22)). (“Remove the upper or lower processor memory drawer or processor memory drawer blank” (page 26)) Remove the processor memory drawer cover. Remove the processor memory drawer (“Remove the upper or lower processor memory drawer or processor memory drawer blank” (page 26)). which are not interchangeable. The server ships with one of two different memory cartridges. Remove a processor memory drawer cover 27 . To remove the component: 1. Failure to cable the XNC will result in the lower processor memory drawer not being recognized by the server. 6. b. Remove the DIMM. Removal and replacement procedures . Remove the DIMMs from the failed memory cartridge: a. Open the memory cartridge cover. Open the DIMM slot latches.28 5. Install the DIMM. Install the DIMMs in the replacement memory cartridge: a. Close the memory cartridge cover. 3. Open the DIMM slot latches. Memory cartridge 29 . 2.To replace the component: 1. Install the memory cartridge. b. 2. 30 Open the memory cartridge cover. 6. 3. 4. Removal and replacement procedures . Power down the server. Remove the memory cartridge. DIMMs To remove the component: 1. Power up the server. 5. Install the processor memory drawer. 5.4. Remove the processor memory drawer cover (“Remove a processor memory drawer cover” (page 27)). Remove the processor memory drawer (“Remove the upper or lower processor memory drawer or processor memory drawer blank” (page 26)). Install the processor memory drawer cover. b. Remove the DIMM. Open the DIMM slot latches.6. b. Remove the failed DIMM from the memory cartridge: a. Install the DIMM. DIMMs 31 . Install the replacement DIMM in the memory cartridge: a. Open the DIMM slot latches. To replace the component: 1. 2. 3. for a total of 128 DIMMs. Install the processor memory drawer cover.and dual-rank PC3-10600 (DDR-1333) DIMMs operating at 1066 MHz • Quad-rank PC3-8500 (DDR-1066) DIMMs operating at 1066 MHz Removal and replacement procedures . 4. The server supports the following DIMM speeds: 32 • Single. Each memory cartridge can contain eight DIMMs. Memory options This server contains eight memory cartridge connectors in each processor memory drawer. for a maximum memory configuration of 4 TB. Close the memory cartridge cover. Install the processor memory drawer. Install the memory cartridge. 6. 5. Power up the server. If the operating system will not boot. Reboot the server and verify that no warning messages appear during POST. the Step 1 procedure below may be attempted. d. 2. WARNING! There is not enough available PCI memory to allocate to all devices installed in the system. Select Advanced Options. c. If the warning message continues to appear. perform one or more of the following potential workarounds to allow the remaining PCI devices to receive their requested memory allocations:If the server operating system documentation states that it requires 2GB (or more) of memory below the 4GB address boundary. and then perform Step 2 below: 1. ensure that all slotted PCI devices are using updated firmware and drivers and reboot the server. It can occur when the I/O configuration of the server demands resources beyond those which the platform architecture allows. leaving insufficient memory for PCI devices that have not yet been configured. Change the default selection of 2GB of Memory Mapped I/O to either 3GB of Memory Mapped I/O or Automatically configure Memory Mapped I/O. Select Advanced System ROM Options. It can occur when the I/O configuration of the server demands resources beyond those which the platform architecture allows. a. e. do not perform Step 1 below because it may result in operating system boot failure. If the warning message continues to appear. Boot the server. if performing Step 1 results in operating system boot failure. determine which adapter is least critical for the operating environment and remove or disable that adapter. g.The above message is an indication that the HP ProLiant DL980 G7 server has encountered this MMIO limitation and does not indicate an issue with the server. Change the MMIO Settings in the ROM-Based Setup Utility (RBSU).Depending on the processor model. Repeat this step until the server completes POST without displaying this error message. 3.This message is an indication that the HP ProLiant DL980 G7 server has encountered this MMIO limitation and does not indicate an issue with the server. Press the F9 key during POST (when the F9 prompt appears). after the System ROM has allocated most of the available memory for some PCI devices.If some PCI devices are not allocated memory and the warning message appears during POST. However.If the operating system documentation does not specify its memory requirements below the 4GB boundary. Devices which were not allocated requested resources may not operate properly. Select Memory Mapped I/O Options.This occurs during the I/O configuration phase of POST. DIMMs 33 . perform Step 1 again and change Memory Mapped I/O Options to the default value of 2GB of Memory Mapped I/O . perform Step 1 again and reset Memory Mapped I/O Options to the default value of 2GB of Memory Mapped I/O . f. b. the memory clock speed might be reduced to 1066 or 800 MHz. In addition. To prevent this issue from occurring. It does not affect the operation or functionality of the server or of ECC. with only one rank accessible at a time. Any ProLiant DL980 G7 server configured with a P66 System ROM dated 07/07/2010. if current DRAM technology supports 2-GB single-rank DIMMs. The server memory control subsystem selects the proper rank within the DIMM when writing to or reading from the DIMM. and the server is running any version of the System ROM detailed in the Scope section below. The DIMM does actually support "Correctable Error Threshold Count. or to correct it after it has already occurred. dual-. This is only a reporting issue and can be safely ignored. an understanding of single-. this is incorrect. A dual-rank DIMM is similar to having two single-rank DIMMs on the same module. 34 Removal and replacement procedures . DIMM support The server supports the following DIMMs: • Single. • Quad-rank PC3-8500 (DDR3-1066) DIMMs operating at 1066 MT/s Single-. Some DIMM configuration requirements are based on these classifications. It only affects the reporting of ECC capabilities in the DIMM SPD and does not impact any other system operation. dual-.and dual-rank PC3-10600 (DDR3-1333) DIMMs operating at 1066 MT/s While single-rank DIMMs are supported. HP recommends dual-rank and quad-rank DIMMs since they provide significant memory throughput and better memory protection (Online Spare memory mode) over single-rank DIMMs. optimized command and address pipelining via various interleaving schemes enables the Intel® Xeon™ 7500-series processor architecture to benefit from dual-rank and quad-rank DIMMs. this issue does not affect the operation or functionality of the server or of ECC. A single-rank DIMM has one set of memory chips that is accessed while writing to or reading from the memory. Although only one data rank is accessed at any given time for each DIMM. update the System ROM to a version dated 03/24/2011 (or later). For example. or 01/27/2011 and using the Survey Tool in SmartStart (any version) may see this issue. a dual-rank DIMM would be 4-GB and a quad-rank DIMM would be 8-GB.NOTE: ProLiant DL980 G7 servers may be unable to provide MMIO (Memory Mapped I/O) memory to all slotted PCI devices during Power-On Self-Test (POST) in large I/O configurations. the Survey Utility in HP SmartStart will report the "Correctable Error Threshold Count" for the DIMM as "Feature Not Supported. A quad-rank DIMM is effectively two dual-rank DIMMs on the same module. It only affects the reporting of ECC capabilities in the DIMM SPD and does not impact any other system operation. A dual-rank DIMM performs significantly better than its single-rank counterpart. and quad-rank DIMMs To understand and configure memory protection modes properly. A quad-rank DIMM provides further performance improvement even at the same DIMM capacity." This issue is only observed when using the Survey Tool in HP SmartStart. resulting in the following warning message: NOTE: When an HP ProLiant DL980 G7 server is configured with a DIMM that has an uninitialized SPD area.and quad-rank DIMMs provide the greatest capacity with the existing memory technology. Only one rank is accessible at a time. 07/27/2010. and quad-rank DIMMs is helpful." However. Dual. 6B in both cartridges). DIMMs 35 . This guarantees proper electrical signaling on the DDR3 channel since DIMMs with higher rank counts present larger electrical loading on the DDR3 channel and must be populated at the end point of the channel. Eight memory cartridges provide a total of 128 DIMMs per system. 44-bit addressing mode must be used (40-bit versus 44-bit addressing is configured in the RBSU). • DIMM quads must be populated in sequence by letter designation. Item Description Definition 1 Size — 2 Rank 1R = Single-rank2R = Dual-rank4R = Quad-rank 3 Data width x4 = 4-bitx8 = 8-bit 4 Memory speed 10600 = 1333-MHz8500 = 1066-MHz 5 DIMM type R = RDIMM (registered) For the latest supported memory information. 7C in both cartridges) and DIMM quad (4D. CAUTION: Failure to follow these guidelines may result in the inability to recognize memory. see the QuickSpecs on the HP website (http:// www. 5D in both cartridges). Not all supported operating systems support 44-bit addressing mode. such DIMM pairs offer larger memory protection to provide increased memory fault resiliency. memory errors. DIMMs with the highest number of ranks must be installed in the white DIMM connector locations. and D-pair. followed by the B-pair. balance DIMM quads by letter groupings across all memory cartridges so that the (1A. HP recommends using DIMMs with identical part numbers throughout the system. NOTE: To utilize more than 128GB per processor socket. observe the following minimum guidelines: • The minimum configuration is two DIMMs per cartridge.DIMM identification To determine DIMM characteristics. Each memory cartridge can support up to eight DIMMs. for configuration simplicity. • When installing mixed rank DIMMs in any cartridge. When installing DIMMs in the memory cartridge. • To achieve maximum performance. When possible. In 40-bit mode. For more information. DIMM quad (2C. use the label attached to the DIMM and the following illustration and table. 8A) pair is installed in all memory cartridges first. and systems with 8 installed processors are limited to a maximum of 1TB of addressable memory. Install DIMM quad (1A. see the illustration below.com). 8A in both cartridges) first.hp. DIMM installation guidelines This server supports two memory cartridges per processor. Running in Lockstep mode. • DIMMs must be installed in quads with identical characteristics. refer to the desired operating system documentation to ensure 44-bit addressing is supported. systems with 4 installed processors are limited to a maximum of 512GB. or reduced memory performance. C-pair. followed by DIMM quad (3B. Do not install memory cartridges in cartridge slots without the corresponding processor installed. Upper processor memory board is shown on the left.• AMP modes Advanced ECC. Each Intel Xeon 7500 processor contains two memory controllers as shown in the illustration below. which are not interchangeable. distribute the total memory capacity evenly across all processors. • Memory is only accessible to the system if the associated processor is installed. Each memory controller has two SMI buses operating in Lockstep mode. Each SMI bus connects to a memory buffer. Online Spare. For additional memory configuration requirements. with a pair of DIMMs in each memory cartridge for a corresponding processor. • To maximize performance in multi-processor configurations. see the corresponding AMP sections: ◦ Advanced ECC memory population guidelines (“Advanced ECC memory population guidelines” (page 39)) ◦ Online Spare memory population guidelines (“Online Spare memory population guidelines” (page 39)) ◦ Mirrored Memory population guidelines (“Mirrored Memory population guidelines” (page 40)) Memory cartridge population guidelines This server contains eight memory cartridge slots in each processor memory drawer. NOTE: Be sure you are using the correct spare part number when replacing the memory cartridge. • Two DIMM populated memory cartridges are required per processor. Lower processor memory board is shown on the right. Observe the following guidelines: • Memory must be loaded in quads. The buffer converts SMI to DDR3 and expands the memory capacity of the 36 Removal and replacement procedures . Memory subsystem architecture The Intel® Xeon™ 7500 processor memory architecture is designed to take advantage of multiple stages of memory interleaving to reduce latency and increase bandwidth. The server ships with one of two different memory cartridges. and Mirrored Memory have further requirements beyond the ones listed here. ◦ Processors with a QPI speed of 5. all populated memory cartridges are populated the same way. the extra memory on that SMI channel pair does not benefit from the interleaving mechanism across memory controllers.6 GT/s run memory at 978 MT/s. a high-performance interleaving technology. DIMMs. • Memory speed is not affected by number of DIMMs or ranks. ◦ Processors with a QPI speed of 4. and is enabled in RBSU when processors in the system have identical DIMM population behind both of their memory controllers. Hemisphere mode The Intel® Xeon™ 7500-series processor architecture incorporates Hemisphere mode. Hemisphere mode combines the tracking resources of both memory controllers within each processor for a more aggressive cache line pipelining. • Hemisphere mode should produce the best overall performance for a variety of applications. Hemisphere mode is the only supported configuration. To take advantage of this feature.4 GT/s run memory at 1066 MT/s. and DIMM ranks for better performance. • Greater performance is obtained when all cartridges are populated with either four or eight dual. Successive cache lines are interleaved between the DIMMs and the Lockstep SMI channels of the two memory controllers in the processor such that adjacent cache lines reside on different memory controllers. All DIMMs run at the highest possible speed for a given processor. That is to say.system. • To enable each processor to enter Hemisphere mode. Each buffer has two DDR3 channels and can support up to four DIMMs for a total of eight DIMMs per cartridge.or quad-rank DIMMs. both memory cartridges must be installed and populated with equal memory capacities based on the DIMM installation guidelines (“DIMM installation guidelines” (page 35)). SMIs. If an SMI channel pair has more DIMMs than others.8 GT/s run memory at 800 MT/s. • DDR3 memory speed is a function of the QPI bus speed supported by the processor: • ◦ Processors with a QPI speed of 6. DIMMs 37 . DIMMs should be populated evenly between all SMI channels. • The server supports Mirrored Memory mode while Hemisphere mode is enabled. • The best performance is obtained when all installed processors are enabled for Hemisphere mode. • The maximum system memory capability is achieved with an initial memory target of 1024 GB with 32 x 32-GB DIMMs and 2 TB with 64 x 32-GB DIMMs. the same example applies. and a 4 TB maximum with 128 x 32 GB DIMMs. • For 4-GB DIMMs.Memory performance optimization The server supports 128 DIMMS across eight Multi-core processors (64 DIMMs across four multi-core processors. populate a four-processor system with eight cartridges of four 2-GB DIMMs each for a total of 32 DIMMs. see "Advanced ECC memory population guidelines (“Advanced ECC memory population guidelines” (page 39)). the initial memory target is 128-GB using 32 DIMMs. taking into account that 64. Memory RAS The server supports the following AMP modes: 38 • Advanced ECC memory mode provides the greatest memory capacity for a given DIMM size and provides x4 and x8 SDDC. observe the following guidelines: • The largest contributor to maximum memory bandwidth performance is to use both memory controllers inside the processor. the initial memory target is 256-GB using 32 DIMMs. • The next largest contributor to performance is the number of ranks per DIMM. To achieve maximum memory bandwidth performance. The maximum expansion target is 512 GB with 64 DIMMs. Quad-rank DIMMs offer a further performance boost. the minimum DIMM count per cartridge is four DIMMs installed in DIMM pair locations A and B. Dual-rank DIMMs perform significantly better than single-rank DIMMs. The maximum expansion target is 256 GB with 64 DIMMs. This mode is the default option for this server. • For 8-GB DIMMs. optimal performance is achieved when populated DIMMs can take advantage of the Intel® Xeon™ 7500-series processor architecture. • The second largest contributor to performance is to populate each DDR3 channel in each memory cartridge. To achieve this. To achieve the best performance for a given memory processor configuration. Plan the memory configurations using identical DIMMs to achieve the memory size target. This configuration is required for this server." • Online Spare memory mode provides protection against persistent DRAM failure. For more information. Using a four-processor configuration as an example. resulting a doubling of the memory capacity. but must be done for both processor memory drawers. do the following: • If the initial memory target is 64 GB. in each processor memory drawer). Hemisphere mode is required for this server. Rank-sparing is more efficient than DIMM-sparing since only a portion of a DIMM is set aside for memory Removal and replacement procedures . Hemisphere mode is optimum when four or eight DIMMs are installed per cartridge.and 128-DIMM count configurations result in the highest performance. • Maximum throughput is achieved when all memory cartridges are fully populated with the maximum number of eight quad-rank DIMMs per cartridge. populate both memory cartridges for each installed processor. While there are many DIMM population configurations that can support any total memory size. Hemisphere mode can be achieved with two or six DIMMs per cartridge (2 cartridges per processor). For an eight-processor configuration. but this configuration is not optimal for Hemisphere mode. For more information. the server notifies the user and shuts down the operating system. Log into the installed VMWare Server using the vSphere Client or vCenter Client application. For more information. At the boot menu. Uncorrectable errors in the DIMMs of one memory cartridge are corrected by the DIMMs in the mirrored cartridge. see "Mirrored Memory population guidelines (“Mirrored Memory population guidelines” (page 40)). the sockets are paired so that the even socket of each pair is considered primary and the odd socket is the mirror. When implementing memory mirroring on the ProLiant DL980 G7 server. the server boots in Advanced ECC mode. Log into the newly installed VMWare Server with vSphere Client or vCenter Client. The two memory controllers of each processor form a mirrored pair using two memory cartridges. NOTE: When attempting to install or boot VMware ESX 4.hp. Advanced ECC can correct single-bit and multi-bit memory errors on a single x8 or two adjacent x4 DRAM devices. Navigate to Configuration Panel -> Software Advanced Settings -> VMKernel. the system will reboot." • Mirrored Memory mode provides the maximum protection against failed DIMMs.protection.The BIOS will report that NUMA node 1 has no memory. see the QuickSpecs on the HP website (http:// www. Navigate to: Configuration Panel -> Software Advanced Settings -> VMKernel 5. Perform the following: 1." AMP modes are configured in RBSU. 4. 2. see "Online Spare memory population guidelines (“Online Spare memory population guidelines” (page 39)). Up to 2-TB of active memory using 16-GB DIMMs is supported in this AMP mode. 3. The server provides notification when correctable error events have exceeded a pre-defined threshold rate. Boot to VMware ESX 4. It monitors DIMMs for excessive correctable errors and copies the content of an unhealthy rank to an available spare rank in advance of multi-bit or persistent single-bit failures that may result in uncorrectable faults.1 on a ProLiant DL980 G7 server with Advanced Memory Protection (Memory Mirroring) enabled. 7.1. see "HP ROM-Based Setup Utility.Boot. If the requested AMP mode is not supported by the installed DIMM configuration. If Memory Mirroring will be enabled after VMware is installed. DIMMs 39 . For more information.useNUMAInfo" to disable NUMA prior to enabling memory mirroring. 8. the system reports that the cores on the odd sockets do not have any local memory. then immediately after BIOS POST and when the VMware installation begins. Uncheck "VMkernel.If Memory Mirroring is enabled prior to VMware installation. Online Spare memory population guidelines Online spare memory provides protection against persistent DRAM failure.Boot. press F2 and add the following line to the boot options:useNUMAInfo=falseAfter installation. perform the following: 6.useNUMAInfo" to disable NUMA." For the latest memory configuration information. However. Rank-sparing is more efficient than DIMM-sparing since only a portion of a DIMM is set aside for memory protection. Uncheck "VMkernel. When uncorrectable errors are detected using Advanced ECC. the following error message will be displayed: The system has found a problem on your machine and cannot continue.com/go/ProLiant). press "a" to modify the kernel argument and add "useNUMAInfo=false" to the end of the "grub append>" line. Advanced ECC memory population guidelines Advanced ECC memory is the default memory protection mode for the server. Therefore. are set aside as the sparing ranks. Further memory reads and writes will only occur on the mirrored DIMM pairs. the rank size of a dual-rank 2-GB DIMM is 1 GB and the rank size of a dual-rank 4-GB DIMM is 2 GB. each Lockstep DIMM pair of a memory controller (of a memory cartridge connected to a processor) has a mirrored DIMM pair on the other memory cartridge of the sibling processor in the same QPI island. and interleaving cannot be enabled simultaneously. Mirrored Memory population guidelines Errors that are not corrected by ECC or SDDC cannot be corrected by Online Spare memory. For example. • Mirrored Memory mode. the 2-GB rank size of the 4-GB DIMMs in the 1A/8A pair is equal to or greater than the rank size of the other installed DIMMs. • If installing mixed rank DIMMs in a cartridge. divide the total DIMM size by the number of ranks. By providing added redundancy in the memory sub-system. • Rank sparing requires that the spare ranks of the DIMM pair 1A/8A be at least as large as any other DIMM rank on the DDR3 channels of the cartridge. the processor avoids a system crash by reading the mirrored DIMM pairs from the other memory cartridge. SDDC. Hemisphere mode. or D would be larger (2 GB) than the spare rank size of the 2-GB DIMM pair in 1A/8A (1 GB). Mirrored Memory provides the greatest protection against memory failure beyond ECC. In Mirrored Memory mode.When Online Spare memory is enabled. In this case. In this case. and Online Spare memory. The following population rules apply to each memory cartridge. since the rank size of a 4-GB DIMM in pairs B. 1A/8A. then the contents of the failing DIMM ranks are copied to the spare DIMM ranks. However. • The available memory bandwidth is reduced by up to 50% in this mode. Removal and replacement procedures . The exceptions to Mirrored Memory mode are the following: 40 • In Mirrored Memory mode. No performance penalty occurs for rank-sparing. the system management routine disables the failed DIMM. Upon detecting an uncorrectable memory error from a DIMM pair of a memory cartridge. half of the memory is allocated to memory protection. the server cannot support DIMM sparing in this example if the 2-GB DIMMs are populated in the 1A/8A pair locations and the 4-GB DIMMs are populated in any of the remaining DIMM pair locations. This is because it violates the rule requiring that the spare rank size of DIMM pair 1A/8A (1 GB) be equal to or larger than the single rank size of the other DIMM pair locations. To determine the size of a single rank in a DIMM. Once the copy is complete. Therefore. the first ranks of DIMM pair. Online Spare mode. all memory accesses to the previous failing DIMM ranks go to the spare DIMM ranks. Begin with the DIMM installation guidelines (“DIMM installation guidelines” (page 35)) with these additional constraints: • All installed processors must contain a valid sparing configuration. other than the time it takes to copy the data from the failing rank to the spare rank upon an error condition. If a DIMM rank on either of the SMI buses exceeds its correctable ECC threshold. the available memory is reduced by the size of the first ranks of DIMM pair 1A/8A. it is possible to support rank sparing with mixed DIMM pair sizes in the cartridge if the 1A/8A pair is populated with the 4-GB DIMMs and the other pairs are populated with either the identical 4-GB or 2-GB DIMMs (pairs C and D are not required to be populated). follow the mixed rank installation rules of the DIMM installation guidelines (“DIMM installation guidelines” (page 35)). C. observe these additional constraints: • For the server to support Mirrored Memory. • The minimum allowable configuration is two memory cartridges per processor. When implementing memory mirroring on the ProLiant DL980 G7 server. then immediately after BIOS POST and when the VMware installation begins. it may also occur under Red Hat Enterprise Linux 4 and SUSE Linux Enterprise Server 10.1. Navigate to: Configuration Panel -> Software Advanced Settings -> VMKernel 5.1 on a ProLiant DL980 G7 server with Advanced Memory Protection (Memory Mirroring) enabled. perform the following: 6.The BIOS will report that NUMA node 1 has no memory.Boot. NOTE: When attempting to install or boot VMware ESX 4.If Memory Mirroring is enabled prior to VMware installation. the following error message will be displayed: The system has found a problem on your machine and cannot continue. If Memory Mirroring will be enabled after VMware is installed. • Both memory cartridges for each processor must be populated with the same DIMM configurations. Uncheck "VMkernel. Log into the installed VMWare Server using the vSphere Client or vCenter Client application. • Both of the CPU sockets on the same QPI island must be loaded with identical memory. or SUSE Linux Enterprise Server 10. press F2 and add the following line to the boot options:useNUMAInfo=falseAfter installation. utilize the DIMM installation guidelines (“DIMM installation guidelines” (page 35)) for the ProLiant DL980 G7server: DIMMs 41 . This contention is exacerbated when running processes with high memory resource requirements. Although this has been observed under Red Hat Enterprise Linux 5. Any server using the Non-Uniform Memory Access (NUMA) multiprocessing architecture when all memory is configured for a single CPU may be affected. Red Hat Enterprise Linux 5. However. an error message similar to the following may appear when the server is operating under a heavy workload.To configure memory for Mirrored Memory mode. prior to the server becoming unresponsive: soft lockup . press "a" to modify the kernel argument and add "useNUMAInfo=false" to the end of the "grub append>" line. 2. 3.Boot. Uncheck "VMkernel. the system reports that the cores on the odd sockets do not have any local memory.Recent Linux kernels (for example. Navigate to Configuration Panel -> Software Advanced Settings -> VMKernel. Boot to VMware ESX 4.CPU#21 stuck for 10s!This occurs because configuring all server memory for a single CPU results in contention of all other CPUs for communication to the single node configured with memory. 8. Perform the following: 1. To avoid this issue when running Red Hat Enterprise Linux 4. NOTE: If all installed memory is configured for a single CPU on a ProLiant DL980 G7 server running Red Hat Enterprise Linux 5.x and SUSE Linux Enterprise Server 11) have improved methods for dealing with memory and should not experience this issue. all processors must have a valid mirroring configuration. Log into the newly installed VMWare Server with vSphere Client or vCenter Client. the system will reboot.This issue is not specific to the HP ProLiant DL980 G7 server. 7. the sockets are paired so that the even socket of each pair is considered primary and the odd socket is the mirror. kernels in Red Hat Enterprise Linux 6.useNUMAInfo" to disable NUMA prior to enabling memory mirroring.useNUMAInfo" to disable NUMA. 4. At the boot menu. Power off the server (“Power off the server” (page 22)). 2.Heatsink To remove the component: 1. 42 Remove the heatsink. 4. 3. 5. Open the processor retaining bracket. Remove the processor memory drawer cover (“Remove a processor memory drawer cover” (page 27)). Remove the processor memory drawer (“Remove the upper or lower processor memory drawer or processor memory drawer blank” (page 26)). Removal and replacement procedures . 3. 4. Heatsink 43 . Close and lock the processor retaining bracket. Install the heatsink. Allow the alcohol to evaporate before continuing. Remove the heatsink protective cover. 2. Clean the old thermal grease from the top of the processor with the alcohol swab.To replace the component: 1. Failure to cable the XNC will result in the lower processor memory drawer not being recognized by the server. CAUTION: Use care when handling components to avoid damaging connector pins. 3. 6. To replace the component. Power up the server. do not install the processor without using the processor installation tool.5. CAUTION: To help avoid damage to the processor and system board. CAUTION: XNC cabling (“XNC cabling” (page 102)) is required for eight processor systems. be sure the handle of the processor memory drawer is fully open before removing the cover. The processor memory module is very heavy when fully populated. multiprocessor configurations must contain processors with the same part number. 44 Remove the processor memory drawer cover (“Remove a processor memory drawer cover” (page 27)). Power off the server (“Power off the server” (page 22)). reverse the removal procedure. 7. 2. CAUTION: To prevent damage to the processor memory drawer cover. Install the processor memory drawer cover. CAUTION: To prevent possible server malfunction and damage to the equipment. Removal and replacement procedures . Processor WARNING! Use caution when installing the processor memory module or removing the processor memory module. Install the processor memory drawer. Remove the processor memory drawer (“Remove the upper or lower processor memory drawer or processor memory drawer blank” (page 26)). To remove the component: 1. 4. 7. ensuring the locking lever graphic on the tool is oriented correctly. Open the processor locking lever and the processor socket retaining bracket. and then push in and release the tabs to secure the processor in the tool. 6. Line up the processor tool. c. b. 5. remove the processor from the system board: a. Using the processor tool. Release the tabs. and then place the tool on the processor. Remove the heatsink (“Heatsink” (page 42)). Processor 45 . Press in on the plastic tabs. and then carefully lift the processor and tool straight up. Carefully rotate the tool. 46 Be sure the tool is oriented correctly. Removal and replacement procedures . and then install the processor. Handle the processor by the edges only. To replace the component: 1. Carefully insert the processor into the processor installation tool. especially the contact area.CAUTION: To avoid damage to the processor. THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. do not touch the bottom of the processor. and do not touch the bottom of the processor. Align the processor installation tool with the socket. 2. especially the contact area. CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. To avoid damage to the system board: 3. • Never install or remove a processor without using the processor installation tool. • Do not touch the processor socket contacts. • Do not tilt or slide the processor when lowering the processor into the socket. Press and hold the tabs on the processor installation tool to separate it from the processor, and then remove the tool. Processor 47 4. Close the processor socket retaining bracket and the processor locking lever. CAUTION: Be sure to close the processor socket retaining bracket before closing the processor locking lever. The lever should close without resistance. Forcing the lever closed can damage the processor and socket, requiring system board replacement. 5. 6. 48 Clean the old thermal grease from the heatsink with the alcohol swab. Allow the alcohol to evaporate before continuing. Apply all the grease to the top of the processor in the following pattern to ensure even distribution. Removal and replacement procedures 7. 8. Install the heatsink. Close and lock the processor retaining bracket. 9. Install the processor memory drawer cover. 10. Install the processor memory drawer. 11. Power up the server. Expansion slot cover CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all expansion slots have either an expansion slot cover or an expansion board installed. 1. 2. 3. Power down the server. Extend or remove the server from the rack. Remove the access panel. Expansion slot cover 49 Check for the shipping screw. Place a hand under the component to support it as you remove it from the server. Open the latch. 2. Low profile I/O expander 1. 50 Power off the server (“Power off the server” (page 22)). and remove the expansion slot cover. Slide the I/O expander out of the server. and open the lever. Removal and replacement procedures . reverse the removal procedure.4. and remove if present. To replace the component. Press the release button. 5. 3. 4. Press the side buttons to remove the component cover. 5. To open the I/O card lock. push the blue tab. Low profile I/O expander 51 . then open the hinge forward. flip it back. To replace the component. Power down the server. 2. To remove the component: 1. Non-hot-plug expansion board CAUTION: To prevent improper cooling and thermal damage. 52 Disconnect any cables attached to the expansion board. Remove expansion slot covers as necessary. Extend the server from the rack. Open the expansion slot latch. Removal and replacement procedures . 4. Remove the access panel.6. 3. 5. reverse the removal procedure. do not operate the server unless all expansion slots have either an expansion slot cover or an expansion board installed. 7. The cache module is backing up data. do not remove the cable from the cache module. Battery-backed write cache procedures 53 .6. and data is lost if the cable is detached. Remove the retaining screw. Extend the server from the rack. reverse the removal procedure. Remove the access panel. wait 15 seconds and then check the amber LED before unplugging the cable from the cache module. Detaching the cable causes any unsaved data in the cache module to be lost. To remove the component: 1. To replace the component. Removing the BBWC cache module CAUTION: After the server is powered down. Battery-backed write cache procedures Two types of procedures are provided for the BBWC option: • • Removal and replacement of failed components: ◦ Removing the cache module (“Removing the BBWC cache module” (page 53)) ◦ Removing the battery pack (“Removing the BBWC battery pack” (page 54)) Recovery of cached data from a failed server (“Recovering data from the battery-backed write cache” (page 55)) CAUTION: Do not detach the cable that connects the battery pack to the cache module. if installed. CAUTION: Do not detach the cable that connects the battery pack to the cache module. If the amber LED blinks after 15 seconds. Power down the server. Detaching the cable causes any unsaved data in the cache module to be lost. 2. Remove the expansion board. 3. do not remove the cable from the cache module. • If the LED is not illuminated. Restore system power. If the existing cache is connected to a battery. CAUTION: Do not detach the cable that connects the battery pack to the cache module. Open the cache slot latches. Power down the server. 2. If the amber LED blinks after 15 seconds. reverse the removal procedure. Remove the access panel. • If the LED is not illuminated. 5. • If the LED is flashing every 2 seconds. Remove the cache module. and then repeat the previous steps. 3. 7. Remove the SPI board (“Remove the SPI board” (page 56)). Removing the BBWC battery pack CAUTION: After the server is powered down. 6. 5. and data is lost if the cable is detached. observe the BBWC Status LED (“Battery pack LEDs” (page 99)). Disconnect the cable. disconnect the battery cable from the cache. wait 15 seconds and then check the amber LED before unplugging the cable from the cache module. Disconnect the cable. 54 Removal and replacement procedures . 4. Restore system power. • If the LED is flashing every 2 seconds. 6. Remove the battery pack. observe the BBWC Status LED (“Battery pack LEDs” (page 99)). The SPI board is removed for clarity. data is still trapped in the cache. data is still trapped in the cache. disconnect the battery cable from the cache.4. Extend the server from the rack. Detaching the cable causes any unsaved data in the cache module to be lost. 8. If the existing cache is connected to a battery. To replace the component. and then repeat the previous steps. The cache module is backing up data. To remove the component: 1. CAUTION: Before starting this procedure. reverse the removal procedure. Recovering data from the battery-backed write cache If the server fails. read the information about protecting against electrostatic discharge (“Preventing electrostatic discharge” (page 21)). Battery-backed write cache procedures 55 . BBWC low profile I/O expander location BBWC procedures are the same for a BBWC located in the low profile I/O expander.To replace the component. you can recover any data temporarily trapped in the BBWC by using the following procedure. 4. Removal and replacement procedures . You can now transfer the drives (and controller. Power off the server (“Power off the server” (page 22)). 6. Power down the failed server. Perform one of the following: • Install the BBWC into an empty BBWC DIMM socket on the system board of the recovery server. an amber LED on the module blinks every 15 seconds. (This is the preferred option.1. NOTE: If replacing the SPI board or clearing NVRAM. A 1759 POST message is displayed. 3. 5. This data is now stored on the drives in the recovery server. Extend the server from the rack. 2. you must re-enter the server serial number through RBSU (“Re-entering the server serial number and product ID” (page 70)). Remove the SPI board To remove the component: 1. 4. 3. Detaching the cable causes any unsaved data in the cache module to be lost. • Install the BBWC into an empty BBWC DIMM socket on any Smart Array Controller in the recovery server. 56 Raise the levers. CAUTION: Do not detach the cable that connects the battery pack to the cache module. 2. and lift the SPI board from the server. If any data is trapped in the cache module. 5. Power up the recovery server. stating that valid data was flushed from the cache.) • Find a server that has enough empty drive bays to accommodate all the drives from the failed server and that meets all the other requirements for drive and array migration. Remove the access panel. Do not install any internal drives or BBWC in this server. Disconnect all cables from the SPI board. Remove the BBWC [cache module and battery pack (“Removing the BBWC battery pack” (page 54))] from the failed server. Transfer the hard drives from the failed server to the recovery server station. if one was used) to another server. Perform one of the following: • Set up a recovery server station using an identical server model. 4. 5.6. 6. Pull the bezel up and away from the server. Systems Insight Display assembly 57 . always be sure that the cables are not in a position where they can be pinched or crimped. Using a T-10 Torx screwdriver. Remove the access panel. Power off the server (“Power off the server” (page 22)). Systems Insight Display assembly CAUTION: When routing cables. Extend the server from the rack. To replace the component. To remove the component: 1. Remove all components from the failed SPI board. 8. reverse the removal procedure. Remove the Systems Insight Display assembly. Remove the retaining screw. 2. 7. 3. Disconnect the cable from the rear of the Systems Insight Display assembly. release the two locking latches on the top of the SID bezel. To replace the component. Remove the SID bezel (“Systems Insight Display assembly” (page 57)). Remove the seven screws from the right side of the chassis and eight screws from the left side of the chassis. Removal and replacement procedures . 58 1. Extend the server from the rack. Remove the access panel. 4. Power down the server. 5. Have a replacement bezel on hand for immediate replacement before removing the bezel. 6. From the left and right insertion tabs. Front bezel CAUTION: Removal of the bezel will most likely destroy the component. reverse the removal procedure. 3. 2. slide the upper part of the bezel forward. Extend the server from the rack.. 2. 5. To replace the component. Disconnect the cable from the solid state drive. Remove the solid state drive. and remove the bezel. inserting the left side tab as the bezel is placed into position.7. Disengage the three bezel catches between the processor memory drawers. Remove the access panel. Solid state drive To remove the component: 1. reverse the removal procedure. 3. the three catches on the lower part of the bezel. Solid state drive 59 . 4. Power down the server. To replace the component. Remove the SPI board (“Remove the SPI board” (page 56)). reverse the removal procedure. 3. puncture. a vanadium pentoxide. A risk of fire and burns exists if the battery pack is not properly handled. Battery If the server no longer automatically displays the correct date and time. • Do not expose the battery to temperatures higher than 60°C (140°F). short external contacts. or dispose of in fire or water. WARNING! The computer contains an internal lithium manganese dioxide. Extend the server from the rack. Remove the access panel. 2. 60 Removal and replacement procedures . or an alkaline battery pack. To remove the component: 1. Power down the server. 5. • Do not disassemble. To reduce the risk of personal injury: • Do not attempt to recharge the battery. 4. you may need to replace the battery that provides power to the real-time clock. • Replace only with the spare designated for this product. crush. Remove the battery. contact an authorized reseller or an authorized service provider. 3. reverse the removal procedure. Release the latches on the release lever. Remove the access panel. 1. NOTE: When either optional I/O expansion board in installed in a two-processor configuration. I/O expansion board 61 .To replace the component. 4. the second processor must be installed in socket 3. I/O expansion board CAUTION: To prevent improper cooling and thermal damage. Extend the server from the rack. do not operate the server unless all expansion slots have either an expansion slot cover or an expansion board installed. 2. Power off the server (“Power off the server” (page 22)). For more information about battery replacement or proper disposal. Lower the handle. Remove the I/O expansion board: 7. 6. and then extend the processor memory drawer from the server until the release latches catch.5. 62 • PCI-X/PCIe Express I/O expansion board • PCIe Express I/O expansion board Removal and replacement procedures . Remove any expansion boards from the failed I/O expansion board (“Non-hot-plug expansion board” (page 52)). reverse the removal procedure. Expansion board options In the main I/O tray the server supports up to 11 expansion slots. The server ships with 5 PCI Express expansion slots.To replace the component. I/O expansion board 63 . perform Step 1 again and reset Memory Mapped I/O Options to the default value of 2GB of Memory Mapped I/O . g. If the warning message continues to appear. Boot the server. It can occur when the I/O configuration of the server demands resources beyond those which the platform architecture allows.This occurs during the I/O configuration phase of POST.To support the optional expansion slots. Select Advanced Options. the Step 1 procedure below may be attempted. a. 2. perform one or more of the following potential workarounds to allow the remaining PCI devices to receive their requested memory allocations:If the server operating system documentation states that it requires 2GB (or more) of memory below the 4GB address boundary. 3. Select Memory Mapped I/O Options. Devices which were not allocated requested resources may not operate properly. Press the F9 key during POST (when the F9 prompt appears).The above message is an indication that the HP ProLiant DL980 G7 server has encountered this MMIO limitation and does not indicate an issue with the server. and then perform Step 2 below: 1. leaving insufficient memory for PCI devices that have not yet been configured. c. e. ensure that all slotted PCI devices are using updated firmware and drivers and reboot the server. It can occur when the I/O configuration of the server demands resources beyond those which the platform architecture allows. 64 If the warning message continues to appear. do not perform Step 1 below because it may result in operating system boot failure. after the System ROM has allocated most of the available memory for some PCI devices. if performing Step 1 results in operating system boot failure.If some PCI devices are not allocated memory and the warning message appears during POST. Select Advanced System ROM Options. Change the default selection of 2GB of Memory Mapped I/O to either 3GB of Memory Mapped I/O or Automatically configure Memory Mapped I/O. However. Change the MMIO Settings in the ROM-Based Setup Utility (RBSU). Repeat this step until the server completes POST without displaying this error message.This message is an indication that the HP ProLiant DL980 G7 server has encountered this MMIO limitation and does not indicate an issue with the server. determine which adapter is least critical for the operating environment and remove or disable that adapter. install one of the following options into the server: • PCI Express I/O Expansion Board—Adds six optional slots • PCI-X/PCI Express I/O Expansion Board—Adds five optional slots WARNING! There is not enough available PCI memory to allocate to all devices installed in the system.If the operating system documentation does not specify its memory requirements below the 4GB boundary. Removal and replacement procedures . perform Step 1 again and change Memory Mapped I/O Options to the default value of 2GB of Memory Mapped I/O . d. b. If the operating system will not boot. f. Reboot the server and verify that no warning messages appear during POST. and Smart Array P800 Controller. This issue may also occur when there is an HP CN1000E Converged Network Adapter in slot 9 and a HP CN1000E Converged Network Adapter in slot 10." NOTE: When multiple LAN-On-Motherboard (LOM) ports on an NC375i Network Adapter configured in a ProLiant DL980 G7 server are connected to a DHCP and a PXE server. 3.his issue only occurs when more than one LOM ports are connected AND Port 2 is used to boot from the PXE server. there are no Integrated Management Log (IML) events or other indications other than the boot sequence does not progress past "Inlet Ambient Temperature" as shown above.15 (or later) and I/O cards are installed in SubIO (I/O expansion board) slots or LPIO (Low Profile PCI-e I/O expansion board) slots. then "Run. From the command prompt. when there is an HP NC550SFP 10Gb 2-port PCIe x8 Ethernet Adapter in I/O slot 9 and an HP CN1000E Converged Network Adapter in I/O slot 10. Shut down the stress test and reboot the server. 4. the PXE boot will succeed.07. then the server Power-On-Boot process may stop responding at the point where "Inlet Ambient Temperature" is displayed. 2. On a ProLiant DL980 system. This occurs because the ServerEngines driver is not getting enough MSI messages at driver load time. If only Port 2 is connected. this may also potentially occur when any I/O card is installed in SubIO/LPIO slots with the BIOS/iLO 3 firmware combination described above.27 or a ProLiant DL580 G7 with System ROM 2010. issue occurs in the following scenario: Run a network stress test (netperf). booting from the PXE server may not succeed with the following error message: No filename or root path specified(There is no F12 key option available to boot from a PXE server.For any ProLiant DL980 G7 server running Windows Server 2008 that has either an NC550SFP in slot 9 and an HP CN1000E Converged Network Adapter in slot 10 or an HP CN1000E Converged Network Adapter in slot 9 and an HP CN1000E Converged Network Adapter in slot 10. The issue has been detected with a large range of I/O cards including the HP NC522SFP 10G NIC. Type "cmd. NOTE: cards: Any HP ProLiant DL980 server configured with any of the following HP IO Accelerator ◦ 160GB SLC PCIe ioDrive (part number 600278-B21) ◦ 320GB MLC PCIe ioDrive (part number 600279-B21) ◦ 320GB SLC PCIe ioDuo (part number 600281-B21) ◦ 640GB MLC PCIe ioDuo (part number 600282-B21) I/O expansion board 65 . type "bcdedit /set UsePhysicalDestination yes. the driver is not getting enough MSI-X interrupts." 2.NOTE: For ProLiant DL980 G7 servers. so the system is reverting to legacy interrupt mode.)This occurs due to the PXE implementation in the adapter firmware.08. Run netperf again.When this occurs." 3. the connection in the second port of the CN1000E may be dropped.27 (or later). during a network stress test (netperf). The connections to the clients will be made at a slow rate and then finally the connection to slot 9 and 10 will be dropped. perform the following to allow netperf to run in this configuration without connections dropping: 1. In addition. Go to the Start menu. This 1.To prevent the server from ceasing to respond during the Power-On-Boot process. upgrade the System ROM to HP ProLiant DL980 G7 System ROM 2011.01. Smart Array P212 Controller.28 is used with Integrated Lights-Out 3 (iLO 3) Firmware Version 1. which is not HP-specific. NOTE: If an HP ProLiant DL980 G7 with System ROM 2010. 2010 under both of the following conditions: ◦ An application has sustained high WRITE-bandwidth demands to the HP IO Accelerators. Misc 0x65000000'00000090)This is targeted to be resolved in a future version of the System ROM. causing the operating system to generate a machine check when attempting to access the devices. ◦ High ambient (data center) temperature (>25deg C). the system will display the following warnings: Thermal throttling activated (<junction temp in degC>)When the IO accelerator card stops thermal throttling. APIC ID 0x000000A0. To avoid the temperature messages. When this occurs. NOTE: When the HP ProLiant DL980 G7 server is configured with the Low-profile PCI Express I/O expansion kit (Option Part Number AM434A) and no additional I/O backplane options are installed. Status 0xFA000000'00160F0F. Bank 0x0000000B or 0x0000000C. 2011 (1/27/2011) or later.◦ 1. perform either of the following: ◦ Accept "reduced write bandwidth" when prompted by the server.3 (or later). (With reduced cooling. I/O devices installed in the Low Profile I/O backplane may not function. The server supports up to 5 low profile PCI Express expansion slots in the optional low profile PCI Express expansion module. Address 0x00000000'00000000. The expected WRITE bandwidth reduction is relatively small.2. the system will display the following warning: Thermal throttling deactivated (<junction temp in degC>)The above warning messages will be logged as follows: ◦ For Linux operating systems in: /var/log/messages ◦ For Windows operating systems in: the Windows system event log.27 (or later) and PCIe IO Accelerator Card firmware driver version 2.28TB MCL PCIe ioDuo (part number 641027-B21) may experience thermal throttling when the server is running a System ROM dated July 27. 66 Removal and replacement procedures . the IO Accelerator cards will reduce WRITE bandwidth to remain within temperature specifications. As a workaround. resulting in the following warning message: NOTE: Five or more PCIe IO Accelerator Cards are now supported when running DL980 G7 System ROM version 2011.) ◦ Upgrade the System ROM to a version dated January 27. Processor 5 or 6. the IO Accelerator cards will self manage the critical internal component temperature to stay within specifications.27) or July 7.07. a message similar to the following will be displayed in the Integrate Management Log (IML):Uncorrectable Machine Check Exception (Board 0. 2010 (2010. With no firmware change.01. When the IO accelerator card begins thermal throttling. perform either of the following: ◦ Remove the Low-profile PCI Express I/O expansion kit (Option Part Number AM434A) ◦ Order either of the following I/O backplane options and then add them to the server: – PCI Express I/O expansion kit option part number 588139-B21 – PCI-X / PCI Express I/O expansion kit option part number 588137-B21 NOTE: ProLiant DL980 G7 servers may be unable to provide MMIO (Memory Mapped I/O) memory to all slotted PCI devices during Power-On Self-Test (POST) in large I/O configurations. Release the locking latch. 3. To prevent network connections from dropping. To replace the component. XNC module 1. 2. Disconnect all cables from the SAS backplane. 7. SAS backplane To remove the component: 1. Remove the access panel. Extend the server from the rack. Release the latches on the release lever. the network connection may drop or the NIC may stop responding. 5.20. Power down the server.10 or Version 10. This can occur while running Windows Server 2008 R2 and HP Network Configuration Utility for Windows Server 2008 R2 Version 10. upgrade to HP Network Configuration Utility for Windows Server 2008 R2 Version 10. SAS backplane 67 . Power off the server (“Power off the server” (page 22)).30 (or later).NOTE: On an HP ProLiant DL980 G7 server with a 128 logical CPU configuration. 2. Remove all hard drives (“SAS/SATA hard drive” (page 22)). Remove the SAS backplane. 6. reverse the removal procedure. 4. if an HP NC382T PCI Express Dual Port Multifunction Gigabit Server Adapter is located in any Low Profile IO slot. reverse the removal procedure. 68 Removal and replacement procedures .3. and then remove the component from the server.8 kg (48 lb) with these components removed and might require two people to remove the server from the rack. all component firmware must be updated (“Flashing firmware using Smart Components” (page 77)) before replacing any other component. To reduce the risk of injury due to the weight of the server. upper CPU board. CAUTION: If replacing this component with a new part. If you believe the system board requires replacement. read the information about protecting against electrostatic discharge (“Preventing electrostatic discharge” (page 21)). remove the following components before removing the server from the rack: • Processor memory module • Hard drives • Power supplies The server weighs 21. To replace the component. lower CPU board or XNC boards with new components at the same time. CAUTION: Do not replace either the SPI board. CAUTION: Only authorized technicians trained by HP should attempt to remove the system board.6 kg–93 kg (160 lb–205 lb). main I/O board. Failure to cable the XNC will result in the lower processor memory drawer not being recognized by the server. System board WARNING! The server weighs approximately 72. contact HP Technical Support before proceeding. CAUTION: Before starting this procedure. CAUTION: XNC cabling (“XNC cabling” (page 102)) is required for eight processor systems. Lower the handle. To replace a system board: 1. Install the access panel. System board 69 . Remove the system board. if installed. Remove the I/O expansion board. 2. Remove the SPI board (“Remove the SPI board” (page 56)). 5. 3. Replace all components removed from the failed system board.1. Remove the server from the rack. 7. Install the spare system board. 6. Power off the server (“Power off the server” (page 22)). Remove the processor memory drawer (“Remove the upper or lower processor memory drawer or processor memory drawer blank” (page 26)). 3. Remove all expansion boards (“Non-hot-plug expansion board” (page 52)). Disconnect all cables from all installed expansion boards. 8. 2. 9. 4. Remove the access panel. 2. 3. press the F9 key to access RBSU. 5. Power backplane To remove the component: 1. Remove the access panel. 4. 5. 70 Removal and replacement procedures . 6. Slide the server back into the rack. Select Serial Number. Enter the product ID. Power up the server. you must re-enter the server serial number and the product ID. Extend the server from the rack. 9. and press the Enter key. you must re-enter the server serial number and the product ID. The server automatically reboots. Enter the product ID and press the Enter key. 1. The following warning is displayed: Warning: The serial number should ONLY be modified by qualified service personnel. Press the Esc key to close the menu. This value should always match the Product ID on the chassis. The following warning is displayed: Warning: The Product ID should ONLY be modified by qualified service personnel. Press the F10 key to confirm exiting RBSU. The following warning appears: Warning: The Product ID should ONLY be modified by qualified personnel. Enter the serial number and press the Enter key. The following warnings appear: WARNING! WARNING! WARNING! The serial number is loaded into the system during the manufacturing process and should NOT be modified. press the F9 key to access RBSU. Press the Enter key to clear the warning. Warning: The serial number should ONLY be modified by qualified personnel. Press the Esc key to exit RBSU. During the server startup sequence. After you replace the system board. Press the Enter key to clear the warning. 4. This value should always match the Product ID located on the chassis. 7. 5. 2. Press the Esc key to exit RBSU. 3. 4. 6. Remove all power supplies (“Hot-plug power supply” (page 24)). Select Service Options. Re-entering the server serial number and product ID After you replace the SPI board. 3. Remove the XNC module (“XNC module” (page 67)). The server automatically reboots. 1. Select Product ID. 9. During the server startup sequence. This value should always match the serial number located on the chassis. This option should only be used by qualified service personnel.4. Select Serial Number. Enter the serial number. Press the F10 key to confirm exiting RBSU. 10. This value should always match the serial number sticker located on the chassis. Press the Esc key to close the menu. 10. Select the Advanced Options menu. Select the Advanced Options menu. Power off the server (“Power off the server” (page 22)). 11. 2. 8. 8. 5. This value should always match the serial number located on the chassis. 7. Select Product ID. Remove the SPI board (“SPI board components” (page 96)). 9. Disconnect the lower cables from the power supply backplane: a. Disconnect the upper cables from the power supply backplane: a. Remove the lower fan power cable from the cable management slot. Remove the system board (“System board” (page 68)). 8. Disconnect the lower power cable from the power supply backplane. c.6. c. Lift the release latch. b. Remove the processor memory drawers (“Remove the upper or lower processor memory drawer or processor memory drawer blank” (page 26)). b. 10. Disconnect the lower fan power cable from the power backplane. Remove the screws and disconnect the power cable. Power backplane 71 . 7. Disconnect the upper fan power cable. Upon locating a broken or disfigured rivet on an installed TPM.11. slide the plastic retainer to the rear of the server. CAUTION: Any attempt to remove an installed TPM from the system board breaks or disfigures the TPM security rivet. administrators should consider the system compromised and take appropriate measures to ensure the integrity of the system data. To replace the component. and then remove the backplane. Remove the two screws (if present). reverse the removal procedure. 72 Removal and replacement procedures . HP Trusted Platform Module The TPM is not a customer-removable part. If you suspect a TPM board failure. HP Trusted Platform Module 73 . leave the TPM installed and remove the system board (“System board” (page 68)). Contact an HP authorized service provider for a replacement system board and TPM board. 5. or reduced memory performance. Failure to follow these guidelines may result in the inability to recognize memory. CAUTION: Ensure that you follow DIMM installation guidelines (“DIMM installation guidelines” (page 35)) and memory cartridge population guidelines (“Memory cartridge population guidelines” (page 36)). 4. CAUTION: XNC cabling is required for eight processor systems. Power off the server and disconnect the power cords (“Power off the server” (page 22)). 9. 6. Verify server operation by monitoring POST messages and checking the iLO IML log. Upgrading a 4s configuration to an 8s configuration . Connect the power cords and power on the server. Remove the lower processor memory drawer (“Remove the upper or lower processor memory drawer or processor memory drawer blank” (page 26)). 7. 8. such as the power profile I/O assembly. 74 Install any additional components. Verify that the current system firmware is the latest available and if necessary upgrade the system firmware (“Flashing firmware” (page 75)). memory errors. Remove the processor memory drawer cover (“Remove a processor memory drawer cover” (page 27)). 3. Failure to cable the XNC will result in the lower processor memory drawer not being recognized by the server. Install processors 5 through 8 in the lower processor memory drawer. For instructions on installing a processor.3 Upgrading a 4s configuration to an 8s configuration To upgrade your DL980 G7 server from a 4s configuration to an 8s configuration: 1. Install DIMMs in the lower processor memory drawer (“DIMMs” (page 30)). Connect XNC cabling (“XNC cabling” (page 102)). see the HP ProLiant DL980 G7 Server User Guide. 2. main I/O board. • The server must only contain supported I/O cards.com/go/assistance).4 Flashing firmware Flashing firmware requirements A firmware update is required when upgrading to Intel® Xeon® E7 Family processors or when replacing a SPI board. see the Support & Drivers website (http:// www8. The following cards are no longer supported on the DL980 G7 Server with Intel Xeon E7 Family® processors. I/O Card Part number HP NC364T PCIE 4 Port 1GbE 435508-B21 HP NC522SFP Dual Port 10GbE Server Adapter 468332-B21 SC08Ge 488765-B21 To upgrade system firmware. In the United States: • To contact HP by phone.com/us/en/support-drivers.html).hp. always attempt to resolve problems by completing the procedures in this guide. For continuous quality improvement. If you have purchased a Care Pack (service upgrade). see the Contact HP website (http:// www. • Flashing firmware using Smart Components. or XNC assembly with a new part. upper CPU board. If the problem cannot be resolved at the website.hp. • If upgrading the CPUs. call Flashing firmware requirements 75 .The CPUs and heatsinks must be replaced with the new CPUs and heatsinks. Before contacting HP. use one of the following methods: • Flashing firmware using Offline Update Method. call 1-800-334-5144. For United States and worldwide contact information. calls may be recorded or monitored. NOTE: Collect the appropriate server information and operating system information before contacting HP for support. lower CPU board. This is the preferred method for all operating system. • The system firmware must be upgraded to a minimum level of HWM5. This method may be used for Windows and Linux operating systems.1. Go to the Contact HP United States (http://welcome.hp. CAUTION: Physical access to the server is required for updating these components. Solaris and VMware operating systems. Linux. Select Drivers and Software. Do no replace either the SPI board. After several minutes you will be presented with a splash screen. main I/O board. b. accepting each of the three updates as they occur. Allow the system to boot normally. or XNC assembly with new components at the same time. system management applications. Flashing firmware using Offline Update This procedure can be used for Windows.html). lower CPU board.4 hours to complete. f. Do not stop at any point during the update.hp. b. Obtain the Flash System Programmable Logic Offline Update ISO Image and the latest BIOS (System ROM): a. complete the entire update. Do not use vMedia Functionality. flash System Programmable Logic.1-800-633-3600. upper CPU board. Enter a product name/number (for example: DL980). see the HP website (http:// pro-aq-sama. and utilities. and click Search. all component firmware must be updated before replacing any other component. flash iLO. 2. For more information about Care Packs. 1.html) webpage. Using the web interface. a. Proceed with the update. 4. d. This procedure cannot be performed remotely or with automated deployment. CAUTION: If replacing a SPI board. Flashing firmware .houston. software. e. Using the Offline Update ISO Image by following the installation instructions in the README. or XNC assembly with a new part. Once the upgrade is started. • In other locations. To retrieve an index of all available drivers. upper CPU board. firmware.com/country/ us/en/contact_us.hp. Insert the update media (CD or USB key) into the DL980 G7 server. click your operating system.com/services/cache/10950-0-0-225-121. Power down to Stand-By (dc power off). main I/O board. BIOS. Select Support and Driver downloads. it will auto-boot into the update media. 3.com/country/us/en/ contact_us.html) webpage. see the Contact HP worldwide (in English) (http://welcome. CAUTION: Physical access to the server is required for updating these components. 5. CAUTION: While upgrading the firmware. lower CPU board. NOTE: Read through the entire firmware update process before beginning. CAUTION: All steps of this procedure must be performed in the exact order given in this procedure. c. NOTE: This procedure will take approximately 2 . Flash BIOS (System ROM) by following the component installation instructions. 76 NOTE: Read through the entire firmware update process before beginning. do not power off the server or attempt any operations. and power up or reset the system. This procedure cannot be performed remotely or with automated deployment. Click HP ProLiant DL980 G7 Server. c.txt file included in the zip file with the ISO image. 10. the power must cycle for the changes to take effect. CAUTION: After flashing the System Programmable Logic Devices. Flashing firmware using Smart Components CAUTION: Physical access to the server is required for updating these components. Click HP ProLiant DL980 G7 Server. software. d. This procedure cannot be performed remotely or with automated deployment. Smart Components are self-extracting executables. f. with a filename based on the component number. Power up the server. Power down to Stand-By. firmware. Do not stop at any point during the update. 2. BIOS. Disconnect all power cables from the server. 7. NOTE: While upgrading the firmware. You must install the iLO Channel Interface driver to use this component. "The software is not supported for installation on this system. and wait at least 30 seconds. HP recommends verifying post by watching POST codes through iLO IRC (bottom banner). Connect the power cables to the server. Select Drivers and Software. 8. 9. Procedure for Windows and Linux operating systems CAUTION: All steps of this procedure must be performed in the exact order given in this procedure. system management applications. • On the Linux operating system.4 hours to complete. The appropriate device driver must be installed and running before using this flash component. install them now. click your operating system. CAUTION: If the appropriate device driver is not installed and running before using this flash component.html) webpage. complete the entire update. and click Search. Once the upgrade is started. This procedure uses Smart Components. do not power off the server or attempt any operations.com/country/us/en/ contact_us. you will receive the following error message if the driver is not running. install the HP ProLiant iLO 3 Management Controller Driver Package. Select Support and Driver downloads. e. All power cables must be unplugged for at least 30 seconds to allow the components to lose their residual charge. Enter a product name/number (for example: DL980). Pressing the power button is not sufficient. and utilities. Flashing firmware using Smart Components 77 . install the HP ProLiant Channel Interface Device Driver for iLO. • On the Windows operating system. 4. Go to the Contact HP United States (http://welcome. NOTE: This procedure will take approximately 2 . If installing new processors (“Processor” (page 44)). Obtain the latest BIOS (System ROM) and device drivers: a. To retrieve an index of all available drivers. b. 1.hp. Follow the component installation instructions to flash BIOS (System ROM)." 3. c. NOTE: Read through the entire firmware update process before beginning.6. If running. Click yes to stop the services indicated. enter Windows operating systems: Run Services. 9. you can select "Close" and continue with the rest of the firmware update process. Power on the system. For components other than is CPLD. . service hp-snmp-agents stop . 6. Use the web interface to flash iLO. • For Linux operating systems. Click Stop to stop the service. d. you must select "install" and update the CPLD.15 minutes. Flash the FPGA using the FPGA Smart Component. c. NOTE: When updating the individual components. For the CPLD. 8.5. disable SNMP agents service. • For a. Boot the system to the OS. TIP: 78 Flashing firmware The estimated time for this update is 10 . 7. b. the Smart Components will detect if the component is already at the correct revision by displaying the message pictured below. Select SNMP Service. Click "Install" when prompted.hp. Flash the CPLD using the CPLD Smart Component. retry flashing the FPGA.a. execute the downloaded file. Upon successful update. • Download the FPGA firmware for the Linux operating system (ftp://ftp. If the first update pass fails. • Download the FPGA firmware for the Windows operating system (ftp://ftp. Retry flashing the FPGA. Download the Smart Component to a directory on the hard drive and change to that directory. 10. From that drive and directory. f.com/pub/ softlib2/software1/sc-linux-fw/p1486976799/v68026).com/ pub/softlib2/software1/sc-windows-fw/p2013128495/v68025). g. and use the Reset button to reset iLO. Do not restart the server at this time. b. e. c.hp.scexe represents the filename of the component. Click Restart Later. CAUTION: Do not power off or power down the server until the firmware for all components in this procedure have been updated. d. If the second update pass fails. browse to the iLO web information Diagnostics tab. Flashing firmware using Smart Components 79 .scexe" where CPxxxxxx. the following dialog boxes will appear. Linux users can execute "sh CPxxxxxx. you can select "Close" and continue with the rest of the firmware update process.com/pub/ softlib2/software1/sc-linux-fw/p290132142/v68931). For the CPLD. Download the Smart Component to a directory on the hard drive and change to that directory. you must select "install" and update the CPLD. c. Linux users can execute "sh CPxxxxxx. 11. f. e. Do not restart the server at this time. Click "Install" when prompted.scexe represents the filename of the component. Upon successful update. the Smart Components will detect if the component is already at the correct revision by displaying the message pictured below. the Smart Components will detect if the component is already at the correct revision by displaying the message pictured below. NOTE: When updating the individual components. From that drive and directory. TIP: a. browse to the iLO web information Diagnostics tab and use the Reset button to reset iLO. • Download the CPLD firmware for the Linux operating system (ftp://ftp. Retry flashing the CPLD. retry flashing the CPLD. CAUTION: Do not power off or power down the server until the firmware for all components in this procedure have been updated.hp. you can select "Close" and continue with the rest of the firmware update process. 80 Flashing firmware . For components other than is CPLD. If the first update pass fails. For components other than is CPLD.NOTE: When updating the individual components.com/ pub/softlib2/software1/sc-windows-fw/p350928355/v68911). the following dialog box will appear.scexe" where CPxxxxxx. If the second update pass fails. execute the downloaded file. you must select "install" and update the CPLD. • Download the CPLD firmware for the Windows operating system (ftp://ftp. b. d. The estimated time for this update is approximately one hour. Flash the FMP using the FMP Smart Component.hp. For the CPLD. retry flashing the FMP. Verify post by watching post codes through iLO IRC (bottom banner). 12. If the second update pass fails. Unplug all power cables from the server. All power cables must be unplugged for at least 30 seconds to allow the components to lose their residual charge. Shutdown the OS. 17. d. Linux users can execute "sh CPxxxxxx. Click "Install" when prompted. and wait at least 30 seconds. 14. Download the Smart Component to a directory on the hard drive and change to that directory.com/ pub/softlib2/software1/sc-windows-fw/p2062200202/v68009). • Download the FMP firmware for the Linux operating system (ftp://ftp. c. 13. • Download the FMP firmware for the Windows operating system (ftp://ftp. Connect the power cables to the server. 16. b. execute the downloaded file.scexe represents the filename of the component. CAUTION: After flashing the System Programmable Logic Devices. the power must cycle for the changes to take effect.scexe" where CPxxxxxx. 15.hp.com/pub/ softlib2/software1/sc-linux-fw/p1438027470/v68004). browse to the iLO web information Diagnostics tab and use the Reset button to reset iLO. If installing new processors (“Processor” (page 44)). Retry flashing the FMP. From that drive and directory. e.hp. the following dialog box will appear. Flashing firmware using Smart Components 81 . This step is optional. Upon successful update.TIP: a. If the first update pass fails. install them now. The estimated time for this update is approximately one hour. but recommended. Pressing the power button is not sufficient. Power up the server (dc on). CAUTION: Do not power off or power down the server until the firmware for all components in this procedure have been updated. f. 82 Flashing firmware .Procedure for Solaris and VMware operating systems For Solaris and VMware operating systems use the Flashing firmware using Offline Update Method. 5 Component identification Front panel components Item Description 1 Hard drive bay 1 2 Hard drive bay 2 3 Hard drive bay 3 4 Hard drive bay 4 5 Hard drive bay 5 6 Hard drive bay 6 7 Hard drive bay 7 8 Hard drive bay 8 9 Optical drive bay 10 UID button and LED 11 Health LED 12 NIC 1 LED 13 NIC 2 LED 14 NIC 3 LED 15 NIC 4 LED 16 Power on/Standby button and LED 17 SID 18 USB connectors 19 Video connector Front panel components 83 . Item Description 20 Processor memory tray (upper) 21 Processor memory tray (lower) Front panel LEDs Item Description Status 1 UID button and LED Blue—Activated Blue (flashing)—Server being managed remotely Off—Deactivated 2 Health LED Green—Normal (system on) Amber (flashing)—Internal system health degraded Red (flashing)—Internal system health critical Off—Normal (system off) 3 NIC 1 LED Green—Linked to network Green (flashing)—Linked with activity on the network Off—No network connection 4 NIC 2 LED Green—Linked to network Green (flashing)—Linked with activity on the network Off—No network connection 5 NIC 3 LED Green—Linked to network Green (flashing)—Linked with activity on the network Off—No network connection 6 84 Component identification NIC 4 LED Green—Linked to network . System Insight Display LEDs LED Component POWER System power Description Green—Normal (system on) Off—Normal (system off) BOOT PROGRESS Boot progress Green—Normal (system on) Green (flashing)—Normal (system on reset) Amber (flashing)—No POST code within first timeout period Red (flashing)—No POST code within a subsequent second timeout period Off—Normal (system off) System Insight Display LEDs 85 .Item Description Status Green (flashing)—Linked with activity on the network Off—No network connection 7 Power on/Standby button and LED Amber—System has AC power and is in standby mode. Green—System has AC power and is powered on. Off—System has no AC power. LED Component EXT HEALTH External component health Description Green—Normal (system on) Amber (flashing)—Internal system health degraded Red (flashing)—Internal system health critical Off—Normal (system off) POWER CAP Powering capping Green—System on or requesting power on Flashing amber—Power on denied Off—Standby OVER TEMP Over temperature Off—Normal Amber—Failed or missing component AMP Advanced memory protection Off—No protection Green—Protection enabled Amber—Memory failure occurred Amber (flashing)—Memory configuration error PS X Power supply Off—Normal Amber—Failed or missing component FAN X Fan Off—Normal Amber—Failed or missing component SPI ILK SPI board not properly seated Off—Normal Amber—Failed or missing component XNC XNC board not properly seated Off—Normal Amber—Failed or missing component CABLE LOWER CPU INK UPPER CPU ILK PROC X XNC J-Link cables or management cable Amber—Failed or missing component Off—Normal Lower processor memory drawer not fully seated Amber—Failed or missing component Upper processor memory drawer not fully seated Amber—Failed or missing component Processor Off—Normal Off—Normal Off—Normal Amber—Failed or missing component UPPER CPU LOWER CPU MEMORY BOARD X DIMM 1A-8D Indicates upper CPU tray with associated CPUs. memory risers and DIMMs DIMM slot Off—Normal Amber—Failed or missing component Off—Normal Amber—Failed or missing component Off—Normal Amber—Failed or missing component 86 Component identification . memory risers and DIMMs Indicates lower CPU tray with associated CPUs. off. or flashing Steadily blue The drive is operating normally. off. The drive is part of an array that is undergoing capacity expansion or stripe migration. On Amber. Flashing regularly (1 Hz) Amber. To minimize the risk of data loss. Removing a drive may terminate the current operation and cause data loss.Processor and memory board configuration / logical (physical) location Upper processor memory board is shown on the left. flashing regularly (1 Hz) Do not remove the drive. Hard drive LEDs Item Description 1 Fault/UID LED (amber/blue) 2 Online LED (green) Hard drive LED combinations Online/activity LED (green) Fault/UID LED (amber/blue) Interpretation On. Hard drive LEDs 87 . flashing regularly (1 Hz) A predictive failure alert has been received for this drive. On. and it has been selected by a management application. but it is not active currently. but a predictive failure alert has been received for this drive. do not replace the drive until the expansion or migration is complete. or a predictive failure alert has been received for this drive. it also has been selected by a management application. Replace the drive as soon as possible. On Off The drive is online. Lower processor memory board is shown on the right. or flashing Alternating amber and blue The drive has failed. flashing regularly (1 Hz) A predictive failure alert has been received for this drive. Replace the drive as soon as possible. or not configured as part of an array. but a predictive failure alert has been received for this drive.Online/activity LED (green) Fault/UID LED (amber/blue) Interpretation Flashing regularly (1 Hz) Off Do not remove the drive. flashing regularly (1 Hz) The drive is active. or it is part of an array that is undergoing capacity expansion or stripe migration. Replace the drive as soon as possible. and the controller has placed it offline. Off Amber. Rear panel components 88 Item Description 1 Torx T-15 Tool 2 iLO 3 connector 3 Mouse connector Component identification . Off Off The drive is offline. a spare. Flashing irregularly Amber. Removing a drive may terminate the current operation and cause data loss. The drive is rebuilding. and it is operating normally. Flashing irregularly Off The drive is active. Off Steadily amber A critical fault condition has been identified for this drive. Replace the drive as soon as possible. Item Description 4 Serial connector 5 NIC connector 2 6 NIC connector 4 7 UID 8 NIC connector 3 9 NIC connector 1 10 Video connector 11 Keyboard connector 12 USB connectors 13 I/O expansion slots 14 Small form factor I/O expansion slots (optional) 15 XNC connectors 16 XNC management connector 17 Power supply 8 18 Power supply 7 19 Power supply 6 20 Power supply 5 21 Power supply 4 22 Power supply 3 23 Power supply 2 24 Power supply 1 Rear panel components 89 . Rear panel LEDs Item Description LED color Status 1 iLO3 NIC Activity LED Green On or flashing—Network activity Off—No network activity 2 iLO3 NIC Link LED Green On—Linked to network Off—Not linked to network 3 NIC 2 Activity LED Green On or flashing—Network activity Off—No network activity 4 NIC 2 Link LED Green On—Linked to network Off—Not linked to network 5 NIC 4 Activity LED Green On or flashing—Network activity Off—No network activity 6 NIC 4 Link LED Green On—Linked to network Off—Not linked to network 90 Component identification . Item Description LED color Status 7 UID LED Blue On—UID active Off—UID inactive 8 NIC 3 Link LED Green On—Linked to network Off—Not linked to network 9 NIC 3 Activity LED Green On or flashing—Network activity Off—No network activity 10 NIC 1 Link LED Green On—Linked to network Off—Not linked to network 11 NIC 1 Activity LED Green On or flashing—Network activity Off—No network activity Power supply LED Power LED Status Off No AC power to power supply units Green AC is present. Off Power supply failure (includes overvoltage and overtemperature) Power supply LED 91 . Standby output is on. Standby output is on. output is disabled. Green AC is present. power supply DC output is on and OK. Fan location 92 Component identification . Item Description 1 Fan 4 2 Fan 3 3 Fan 2 4 Fan 1 5 Fan module 6 6 Fan module 5 Fan location 93 . 1) 3 Slot 8 PCIe2 x8 (4. 2. 1) 7 SPI board connector 8 Internal USB connectors (2) 9 NMI jumper 10 System maintenance switch 11 Optical drive connector 12 Video/USB connector 13 Solid state drive connector 14 Power button/UID connector Component identification . 2. 2. 1) 6 Slot 11 PCIe2 x8 (8. 4. 1) 5 Slot 10 PCIe2 x8 (4. 2. 4. 2.System board components Item Description 1 Optional I/O expansion board connectors: • PCI-X/PCI Express I/O expansion board • PCI Express I/O expansion board 94 2 Slot 7 PCIe2 x8 (4. 1) 4 Slot 9 PCIe2 x16 (8. On = System configuration is locked. Position Description Function S1 iLO3 security Off = iLO3 security is enabled.System maintenance switch The system maintenance switch (SW1) is an eight-position switch that is used for system configuration. S2 Configuration lock Off = System configuration can be changed. The default position for all eight positions is Off. S3 Reserved Reserved S4 Reserved Reserved S5 Password protection override Off = No function On = Clears power-on password and administrator password S6 Invalidate configuration Off = Normal On = Clears NVRAM S7 Reserved Reserved S8 Reserved Reserved System board components 95 . On = iLO3 security is disabled. SPI board components Item Description 1 Mini SAS connectors (2) 2 SAS cache connector 3 TPM connector 4 Fan data connector 5 RMII connector 6 SD card slot 7 Battery 8 10Gb NIC connector 9 NIC cache connector 10 NIC 3 connector 11 NIC 1 connector 12 Video connector 13 Keyboard connector 14 USB connectors (2) 15 iLO 3 connector 16 Mouse connector 17 Serial connector 18 NIC 2 connector 19 NIC 4 connector Expansion board components • 96 PCI-X/PCI Express I/O expansion board Component identification . 2. 4. 2. 2. 1) 3 Slot 4 PCIe2 x8 (4. 2. 1) 3 Slot 3 PCIe2 x16 (16. 4. 1) 4 Slot 3 PCIe2 x16 (8. 1) 5 Slot 2 PCIe2 x16 (8. PCI Express I/O expansion board Item Description 1 Slot 6 PCIe2 x16 (8. 4. 4. 2. 4. 8. 1) 2 Slot 4 PCIe2 x8 (4. 2. 2. 2. 1) 4 Slot 2 PCI-X 5 Slot 1 PCI-X 1 • 1 Slot 4 is physically a x8 slot but operates electrically as a x4 slot. 8. 1) 2 Slot 5 PCIe2 x16 (8. 4. 1) 1 2 3 4 Expansion board components 97 .Item Description 1 Slot 6 PCIe2 x16 (16. The paired banks are identified by the letters A through D. 1) 2 Slot 13 Low profile PCIe2 x8 (4. 2. 5 and 6 are physically x16 slots but operate electrically as x8 slots. 3. Low profile I/O expansion board Item Description 1 Slot 12 Low profile PCIe2 x8 (4. 98 Component identification . 2. 6 Slots 1 and 4 are physically x8 slots but operate electrically as x4 slots. 5 and 6 are physically x16 slots but operate electrically as x8 slots.Item Description 5 6 • Slot 1 PCIe1 x8 (4. 2 Slots 2. 3. 5 and 6 are physically x16 slots but operate electrically as x8 slots. 3. 1) 4 Slot 15 Low profile PCIe x8 (4. 1) DIMM slot locations Each memory module contains 8 DIMM slots. 5 Slots 2. 4 Slots 2. 3 Slots 1 and 4 are physically x8 slots but operate electrically as x4 slots. 3. 1) 3 Slot 14 Low profile PCIe2 x4 (2. 2. 1) 5 Slot 16 Low profile PCIe x8 (4. 1) 6 1 Slots 2. 5 and 6 are physically x16 slots but operate electrically as x8 slots. 2. 2. This power supply is used to maintain the battery charge and provide supplementary power to the cache microcontroller. Device numbers 99 . The auxiliary voltage is used to preserve BBWC data and is available any time that the system power cords are connected to a power supply.3V auxiliary voltage is detected. This LED is on when 3.Device numbers Battery pack LEDs Item Color Description 1 Green System Power LED. 2 Green Auxiliary Power LED. This LED is on when the system is powered up and 12 V system power is available. see the following table. Flashing (1 Hz) Flashing (1 Hz) An alternating green and amber flashing pattern indicates that the cache microcontroller is executing from within its boot loader and receiving new flash code from the host controller. Flashing (1 Hz) — An open circuit exists across the battery terminals or within the battery pack. and posted write data is stored in the cache. and the cache contains data that has not yet been written to the drives. To interpret the illumination patterns of this LED. then pause The cache microcontroller is waiting for the host controller to communicate. A fully-charged battery can normally preserve data for at least 2 days. capacity expansion. Features that require a battery (such as write cache. In the absence of auxiliary power. Off Off The battery pack is fully charged. Off On The battery pack is fully charged. Data preservation time is extended any time that 3.hp. Off Flashing (1 Hz) The battery pack is below the minimum charge level and is being charged.com). as indicated by LED 2.Item Color Description 3 Amber Battery Health LED. The recharge process takes between 15 minutes and 2 hours.3 V auxiliary power is available. To interpret the illumination patterns of this LED. depending on the initial capacity of the battery. 4 Green BBWC Status LED. battery power alone preserves the data. The battery lifetime also depends on the cache module size. see the controller QuickSpecs on the HP website (http:// www. On — A short circuit exists across the battery terminals or within the battery pack. stripe size migration. and no posted write data exists in the cache. For more information. BBWC features are disabled until the battery pack is replaced. Restore system power as soon as possible to prevent data loss. see the following table. BBWC features are disabled until the 100 Component identification . Off Double flash. The life expectancy of a battery pack is typically more than 3 years. and RAID migration) are unavailable temporarily until charging is complete. LED3 pattern LED4 pattern Interpretation Off Flashing (2 Hz) The system is powered down. Battery pack LEDs 101 .LED3 pattern LED4 pattern Interpretation battery pack is replaced. The life expectancy of a battery pack is typically more than 3 years. follow the recommend connection order. 102 Cabling . Failure to cable the XNC will result in the lower processor memory drawer not being recognized by the server. For best cable management.6 Cabling XNC cabling CAUTION: XNC cabling (“XNC cabling” (page 102)) is required for eight processor systems. Refer to cabling illustrations and table to make connections 9 though 16.1. For example. use the cable connected to lower board 4. to upper board 1. Connection sequence Board Number Connects to Connection sequence Board Number Seventh Lower 4 Connects Ninth Upper 1 Third Lower 3 Connects Tenth Upper 2 Eighth Lower 2 Connects Eleventh Upper 3 Fourth Lower 1 Connects Twelfth Upper 4 Fifth Lower 8 Connects Thirteenth Upper 5 First Lower 7 Connects Fourteenth Upper 6 Sixth Lower 6 Connects Fifteenth Upper 7 Second Lower 5 Connects Sixteenth Upper 8 DVD-ROM drive cabling DVD-ROM drive cabling 103 . to make the ninth connection. Make connections labeled 1 through 8 in the illustration. 2. 7 Specifications Environmental Specifications Specification Value System inlet temperature — Operating 10° to 35°C (50° to 95°F) at sea level with an altitude derating of 1.0°C per every 305 m (1.8°F per every 1000 ft) above sea level to a maximum of 3050 m (10,000 ft), no direct sustained sunlight. Maximum rate of change is 10°C/hr (18°F/hr). The upper limit may be limited by the type and number of options installed. System performance may be reduced if operating with a fan fault or above 30°C (86°F). Non-operating -30° to 60°C (-22° to 140°F). Maximum rate of change is 20°C/hr (36°F/hr). Relative humidity (non-condensing) — Operating 10 to 90% relative humidity (Rh), 28°C (82.4°F) maximum wet bulb temperature, non-condensing. Non-operating 5 to 95% relative humidity (Rh), 38.7°C (101.7°F) maximum wet bulb temperature, non-condensing. Altitude — Operating 3050 m (10,000 ft). This value may be limited by the type and number of options installed. Maximum allowable altitude change rate is 457 m/min (1500 ft/min). Non-operating 9144 m (30,000 ft). Maximum allowable altitude change rate is 457 m/min (1500 ft/min). Acoustic noise Listed are the declared A-Weighted sound power levels (LWAd) and declared average bystander position A-Weighted sound pressure levels (LpAm) when the product is operating in a 23°C ambient environment. Noise emissions were measured in accordance with ISO 7779 (ECMA 74) and declared in accordance with ISO 9296 (ECMA 109). Idle L WAd 7.5 Bels L pAm 59.7 dB Operating L WAd 7.5 Bels L pAm 89.7 dB Emissions Classification (EMC) — FCC rating Class A Normative Standards CISPR 22; EN55022; EN55024; FCC CFR 47, Pt 15; ICES-003; CNS13438; GB9254; K22;K24; EN 61000-3-2; EN 61000-3-3; EN 60950-1; IEC 60950-1 104 Specifications Server Specifications Specification Value Dimension — Height 35.36 cm (13.92 in) Depth 87.63 cm (34.5 in) Width 48.26 cm (19.0 in) Weight (maximum) 93 kg (205 lb) Weight (one hard drive, power supply and processor installed) 75 kg (165 lb) Input requirement1 — Rated line voltage 100-240 VAC Rates input current 9.3A @ 100 VAC 9.5A @ 108-120 VAC 6.6A @ 200-240 VAC Rated input frequency 50–60 Hz +/- 3hz Input power (maximum) 4600 W BTUs rating (maximum) 14,444 BTU/hr (worst case configuration and utilization) Power supply output (per power supply) — Rated steady-state power 800 W @ 100 VAC 900 W @ 110-120 VAC 1200 W @ 200-240 VAC Rated input power 950W @ 100 VAC 1075W @ 108–120 VAC 1375W @ 200-240 VAC Maximum peak power 960 W @ 100 VAC 1080 W @ 110-120 VAC 1440 W @ 200-240 VAC 1 To ensure the server has sufficient power during normal operation, a server configured with eight populated CPU sockets or a detected high power GPU requires high line (200 - 240 V) ac server configuration. As a precaution, if these configurations are detected on a low line (100 - 127 V) ac configured server the server will halt at Power-On Self-Test with a "Low line (100-120 VAC) power delivery is not sufficient for this configuration. High line (200-240 VAC) delivery is required to operate the system in its current configuration" message and only boot to RBSU. At POST, the server automatically detects whether the power supplies are connected to high-line power or low-line power. If the server is configured with eight populated CPU sockets or a detected high power GPU, the system will halt if it detects that the server is plugged into low-line power. This occurs by design because systems configured eight processors, and/ or high power graphics cards, with a large amount of memory, hard drives, or other options might require more power than can be provided by low-line power. POST halts this low-line configuration as a precaution against the server having insufficient power during operation. If a you wish to operate a server in this configuration when utilizing low-line power, the power supply solution should be verified as sufficient using the HP Power Advisor (http://www.hp.com/ go/hppoweradvisor). If the power solution is not deemed sufficient, the server may not have Server Specifications 105 sufficient power to operate normally. If the solution is deemed sufficient, a ROM-Based Setup Utility option, outlined below, can be used to allow the system to operate in this configuration. If the HP Power Advisor has determined that the server can be reliably powered at low-line power in this configuration, perform the following steps to override the Power Supply Requirements setting in ROM-Based Setup Utility (RBSU): 1. When the server halts, access RBSU. 2. Select "Advanced Options". 3. Scroll down to "Power Requirements Override" and choose to enable it. 4. Exit RBSU,which will reboot the server and should bypass the message on the subsequent boot. 106 Specifications 8 Acronyms and abbreviations ABEND abnormal end AMP Advanced Memory Protection ASR Automatic Server Recovery BBWC battery-backed write cache FBWC flash-backed write cache GPU graphics processing unit IEC International Electrotechnical Commission iLO 3 Integrated Lights-Out 3 IML Integrated Management Log NVRAM nonvolatile memory ORCA Option ROM Configuration for Arrays PCIe peripheral component interconnect express PCI-X peripheral component interconnect extended POST Power-On Self Test RBSU ROM-Based Setup Utility 107 . SAS serial attached SCSI SD Secure Digital SFF small form factor SIM Systems Insight Manager SPI system peripheral interface SSD support software diskette TPM Trusted Platform Module UID unit identification USB universal serial bus 108 Acronyms and abbreviations . Include the document title and part number. send any errors. 109 .9 Documentation feedback HP is committed to providing documentation that meets your needs. suggestions. To help us improve the documentation. or comments to Documentation Feedback. or the URL when submitting your feedback. version number. 25 fans. 25 Upper fans. 50 Non-hot-plug expansion board. iLO3. front panel Front panel components. 96 battery pack LEDs. 58 H hard drive backplane. 35 Hemisphere mode. SPI (System Peripheral Interface) Re-entering the server serial number and product ID. 96 connector. 54 Removing the BBWC cache module. 54 SPI board components. 84 components. 23 DVD-ROM drive cabling. 55 Removing the BBWC battery pack. 96 connector. 103 cabling. and quad-rank DIMMs. 52 expansion boards Expansion board options. 37 DIMM slot locations. 53 blank. video. rear Rear panel components. 75 firmware. system board System board components. 63 Low profile I/O expander. 22 DVD drive. removing Fans. 103 DVD-ROM drive. 102 cabling. 75 firmware requirements. 23 board. 94 C cables. 83 firmware. 34 drives. 56 SPI board components. 74 B battery Battery. 61 iLO 3 connector. 96 connector. 54 BBWC (battery-backed write cache) Battery pack LEDs. 5 components. 94 System maintenance switch. 96 System board components. 55 Recovering data from the battery-backed write cache. 96 . 70 Remove the SPI board. keyboard. 96 components. 75 firmware update. removing. 99 Battery-backed write cache procedures. 53 BBWC low profile I/O expander location. 75 front bezel. 96 110 Index connector. 99 battery-backed write cache (BBWC) Battery pack LEDs. DVD-ROM drive. 53 Recovering data from the battery-backed write cache.Index Symbols 4s to 8s upgrade. identification Component identification. 95 connector. 87 Hard drive LEDs. 102 components. 94 F fans Fans. NIC. power supply. 99 DIMM installation guidelines DIMM installation guidelines. replacing Fans. 98 DIMMs DIMM identification. 83 Front panel LEDs. 25 features. 103 DVD-ROM drive DVD-ROM drive. updating. 90 components. SPI board. 25 fans. mouse. 21 expansion board. 25 Upper fans. 35 Single-. 83 Illustrated parts catalog. 23 E electrostatic discharge. 96 battery-backed write cache battery pack Battery-backed write cache procedures. removing. 55 Removing the BBWC battery pack. XNC. 25 Hot-plug power supply. 88 Rear panel LEDs. 24 Upper fans. 87 I I/O expansion boards. 60 SPI board components. 96 D device numbers. dual-. 96 connector. 52 expansion slots. 99 Battery-backed write cache procedures. 67 hard drive LEDs Hard drive LED combinations. USB. 53 Removing the BBWC battery pack. power supply. 99 power supplies. 9 system maintenance switch System board components. 94 tools. 67 SAS hard drive LEDs Hard drive LED combinations. system. 40 mouse connector. 70 Remove the SPI board. 90 LEDs. front panel. 104 server warnings and cautions. 90 LED. system maintenance. 70 server asset text. 21 SAS backplane. 24 processor. 104 specifications. 84 LEDs. 32 memory performance optimization. removing. 104 Specifications. 38 memory requirements. 39 Mirrored Memory population guidelines. 90 LEDs. removing. environmental Environmental Specifications. 94 static electricity. 99 switch. removing. 85 LEDs. clearing. 68 system board switches. 72 Trusted Platform Module (TPM). 96 system board components System board components. 38 mirrored memory. unit identification (UID). 21 keyboard connector. 70 server specifications Server Specifications. 74 USB connectors. 99 M mechanical components Illustrated parts catalog. 82 solid state drive. 96 system power LED. 96 111 . 21 safety information. health. 21 TPM (Trusted Platform Module). UID Front panel LEDs. 95 system components Component identification. battery pack. 84 LED. 40 memory options. 27 Remove the upper or lower processor memory drawer or processor memory drawer blank. hard drive Hard drive LED combinations. battery pack. 44 processor memory module Processor and memory board configuration / logical (physical) location.K Removal and replacement procedures. 83 System components. 91 LEDs. 104 Specifications. 88 Rear panel LEDs. 84 Rear panel LEDs. 95 system board replacement. 94 system battery. 95 P power LEDs. 21 Required tools. 59 specifications. 21 SID. 96 N NIC connectors. 91 LEDs. 57 Solaris environments. 87 Remove a processor memory drawer cover. 94 System maintenance switch. 91 power supply. 96 L S LED. 87 Hard drive LEDs. 87 serial connector. 84 safety considerations. 105 Specifications. 72 U upgrade 4s to 8s configuration. 21 status lights. 96 System board components. 52 NVRAM. 24 power supply bays. 5 Mechanical Components. 87 LEDs. 95 System Peripheral Interface (SPI) board. 23 power supply LEDs. 34 memory cartridge. 5 memory. 96 serial number. 87 Hard drive LEDs. 94 System maintenance switch. 96 non-hot-plug expansion boards. 27 memory module population guidelines Advanced ECC memory population guidelines. 99 LEDs. 104 SPI (System Peripheral Interface) board Re-entering the server serial number and product ID. rear panel. iLO 3 link Rear panel components. Systems Insight Display. 91 power supply blank. installing. 56 SPI board components. 26 R required tools T three slot option card connectors. server Environmental Specifications. 96 VMware ESX Server. 82 X XNC Module. 67 112 Index .V video connector. configuring.
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