captek

CAPTEK™ MANUAL TABLE OF CONTENTSSection 1: Furnace Calibration • • • • • • • • • • • • • High Temperature Calibration (Ritemp Calibration) Firing Cycle for “P” & “G” Low Temperature Calibration (UC Calibration) Firing Cycle for UCP Bonder Firing Cycle for Inflow D Firing Cycle for Pontic Cover Firing Cycle for Capbond Programming Fast Firing Porcelain Furnaces Pages 1-3 3-3 4-5 5-5 6-6 6-6 6-6 7-8 1-1 2-3 4-7 7-7 7-7 8-8 1-4 4-4 5-8 7-8 8-8 9-12 13-15 15-15 15-15 16-18 1-5 1-2 3-3 4-4 5-5 6-8 9-9 Section 2: Refractory Die Preparation Master Die Preparation Duplication of Master Die Capvest AV Refractory Die Investment Repairing Refractory Dies Curing Refractory Dies • Apply CAPTEK™ Adhesive Section 3: “P” & “G” Application • • • • • • • • • • • • • • • • • Anterior “P” Application “P” Layer Repairs Anterior “G” Application Anterior “G” Repairs on the Refractory Die Insufficient or Excess “G” - Anterior Posterior “P” Application Posterior “G” Application Posterior “G” Repairs on the Refractory Die Insufficient or Excess “G” - Posterior Pneumatic P Press Instructions Metal Collar Techniques Metal Collar Using Strips of Scrap “P” Metal Collar Using Margin “P” Metal Collar Using Build-Up Material Metal Collar Using the Collar Mold Metal Linguals, Occlusal Stops or Islands Re-Establishing Gold Color after Porcelain Application Section 4: Metal Collars, Metal Linguals and Occlusal Stops CAPTEK™ Training Manual Table of Contents 7/15/05 Section 5: Finishing CAPTEK™ Copings • • • Refractory Die Removal Finishing Margins on CAPTEK™ Copings Swedging of CAPTEK™ Copings Pages 1-2 3-5 6-8 Section 6: Build-Up for Porcelain Support • Build-Up During “P” Application • Build-Up on divested Copings with Pontic Cover Material Section 7: CAPTEK™ Bridge Techniques • • • • • • CAPTEK™ Bridges Using Capcon & Capfil CAPTEK™ Pontic Cover Material The Cast-To-Coping Bridge Technique Splinting CAPTEK™ Copings Inconnect Material Bridge Technique Inconnect Material with Laser or Electric Welding 1-2 3-4 1-8 9-11 12-14 15-17 18-21 22-25 Section 8: Repairing of CAPTEK ™ Copings after Divesting • • • Repairs with Repair Paste or Scrap “P” Material Repairs with Pontic Cover Material Inflow D Replenishing Gold Color on Copings 1-3 4-4 5-6 Section 9: CAPTEK™ Bonding Agents • • UCP Bonder Application (Universal Coupler Porcelain) Capbond Application 1-2 3-4 Section 10: Opaquing CAPTEK™ Copings • Opaquing Instructions 1-2 1-2 Section 11: CAPTEK™ Glossary CAPTEK™ Training Manual Table of Contents 7/15/05 Section 1: FURNACE CALIBRATION Why is calibration necessary? Calibration is necessary because the temperature inside a furnace is never exactly what it shows on the furnace display. In order to know the actual temperature, a material of a known melting point is fired. When it melts, we know the actual temperature inside the furnace, no matter what the display indicates. In the case of CAPTEK™, we use two different gold alloy strips, one that melts at 1075ºC and one that melts at 1040ºC, corresponding to the temperatures required for the higher temperature processes and lower temperature processes that are used to fire the various CAPTEK™ products. These two calibrations must be done before any of the CAPTEK™ materials can be properly fired. The two calibrations required are accomplished utilizing CAPTEK™ Calibration strips (higher temperature, or Ritemp) and UC Calibration strips (lower temperature). Before firing any CAPTEK™ materials you must first determine at what temperature your furnace begins to melt gold. There are two calibrations required, CAPTEK™ Calibration (high temperature, Ritemp) and UC Calibration (lower temperature). 1. The CAPTEK™ Calibration (high temperature or Ritemp) will determine the firing temperature for: Final cure of the refractory dies Firing CAPTEK™ “P” and “G” Capcon for connecting bridges and splints • CAPTEK™ repairs and build-ups on refractory dies. To calibrate for high temperature processes, strips from the CAPTEK™ Calibration Kit (Ritemp) are used. Refer to page 2. 2. The UC Calibration will determine the firing temperature for: • UCP Bonder • Inflow D • Pontic Cover • Original Capbond • • • To calibrate for low temperature processes, strips from the UC Calibration Kit are used. Refer to page 4. CAPTEK™ Training Manual Section 1 7/15/05 1 If the strip is unchanged proceed to step 4a. make note of this temperature and enter in the calibration log. Ritemp) Place a calibration strip in the crucible. Honeycomb trays work well. Note: New furnaces. Place a calibration strip (1075ºC will be stamped on the strip) in the center well of the calibration crucible. and furnaces not previously used for CAPTEK™ may require a break-in period. To ensure accuracy the furnace should be calibrated from once a week to once a month Step 1. Program the furnace DRY TIME: ENTRY TEMP: TEMP RATE: HIGH TEMP: HOLD TIME: COOL TIME: VACUUM: 0-1 minute 600º C (1100º F) 65º C per minute (120º F) 1075º C (1967º F) 1 minute 0 0 Enter Calibration Program Step 2. muffles. the calibration strip should be bent over by 90 degrees (See Figure 2). Step 3. Preheat the Furnace Every day prior to beginning CAPTEK™ processing. Fig. If the strip has melted into a ball proceed to 4b. Note: To ensure accuracy do not use a calibration strip for more than three firings. it is recommended to preheat the furnace by completing at least one CAPTEK™ firing cycle. (See Figure 1).High Temperature Calibration Procedures CAPTEK™ Calibration (Ritemp) Note: Muffle temperatures will change after continuous use. lightweight firing tray. Firing CAPTEK™ Calibration Strips (High Temp. Correct High Calibration Temperature The calibration strip should be bent over by 90 degrees When the firing cycle is complete. Place the crucible in the center of a firing tray and fire. Note: Additional cleaning of the muffle chamber can be accomplished by using a purging system or by using previously burned out high temperature investment pieces as purging material during the preheat cycle. Note: Use a new. 2 are on the following page). Firing additional preheat cycles will help stabilize muffle temperatures. (Steps 4a and 4b Fig. CAPTEK™ Training Manual Section 1 7/15/05 2 . This is the correct “High” Calibration Temperature. 1 Step 4. It should not be slumped completely down the outside edge of the crucible. Some Furnaces Require a Different High Temperature Firing Program Some furnaces radiate heat differently. (Example: Ivoclar Progromat P-80 thru P-200. DRY TIME: ENTRY TEMP: TEMP RATE: HIGH TEMP: HOLD TIME: VACUUM: 3-4 minutes 500º C . If the Calibration Strip is Unchanged The High Temperature is too Low If the calibration strip is unchanged. 4 Step 5. Fig. If the Calibration Strip has melted into a Ball The High Temperature is too high If the Calibration Strip has melted into a ball. (See Figure 4) replace with a new calibration strip and lower the high temperature setting in 10º C (18º F) increments until the strip bends over by 90 described as described in step 4 on the previous page.firing. increase the high temperature by 5ºC (9ºF) and fire again. (See Figure 3) increase the high temperature in 10ºC (18ºF) increments and fire again until the strip bends over by 90 degrees as described in step 4 on the previous page. Jelrus Vista.600º C (930º F . Fig. Programming the “P” & “G” Cycle 3-4 minutes 500º C . They may require less heat for the CAPTEK™ “P” & “G” firing cycle. If the strip is only slightly bent.600º C (930º F .Step 4a.1100º F) 65º C per minute (120 º F) “Calibration Temperature” minus 5º to a plus 10º C (-9º to 18º F) 4 minutes 0 CAPTEK™ Training Manual Section 1 7/15/05 3 . and the Focus 2007) Fast Fire furnace programs on pages 7 and 8.1100º F) 65º C per minute (120º F) “High Calibration Temperature” plus 10º to 15º C (18-25º F) 4 minute 0 0 DRY TIME: ENTRY TEMP: TEMP RATE: HIGH TEMP: HOLD TIME: VACUUM: COOL TIME: Note: The high temperature for the “P” & “G” cycle may be modified slightly up or down based on the look of the CAPTEK™ copings after the “G”. 3 Step 4b. Place the crucible in the center of a firing tray and fire. Note: New furnaces. Keep them separate. it is recommended to preheat the furnace by completing at least one CAPTEK™ “P” & “G” firing cycle. (See Figure 1). muffles. They are colored red and fire at a lower temperature.600º C (930º F . Step 1. Step 3. 1 CAPTEK™ Training Manual Section 1 7/15/05 4 . Program the Furnace Enter UC Calibration Program 500º C . and furnaces not previously used for CAPTEK™ may require a break-in period.1100º F) 0 -1 Minutes 80º C (145º F) 40º C (72º F) below the CAPTEK™ High Temperature calibration 1 Minute 0 0 ENTRY TEMP: DRY TIME: TEMP RATE: HIGH TEMP: HOLD TIME: COOL TIME: VACUUM TIME: Step 2. To ensure accuracy the furnace should be calibrated from once a week to once a month.Low Temperature Calibration Procedures (UC Calibration) UC Calibration strips are different than the High Temperature Calibrations strips. Place a UC Calibration Strip in the Crucible Fig. lightweight firing tray. Firing additional preheat cycle will help stabilize muffle temperatures. Note: Use a new. Firing UC Calibration Strips Place a UC Calibration Strip (colored red) in the center well of the calibration crucible. Note: Additional cleaning of the muffle chamber can be accomplished by using a purging system or by using previously burned out high temperature investment pieces as purging material during the preheat cycle. Note: Muffle temperatures will change after continuous use. Honeycomb trays work well. Preheat the Furnace Every day prior to beginning CAPTEK™ processing. If the strip is unchanged proceed to step 4a. Programming the Furnace for UCP: Programming the Firing Cycle for UCP Bonder DRY TIME: ENTRY TEMP: TEMP RATE: HIGH TEMP: HOLD TIME: VACUUM: COOL TIME: 2 Minutes 500º C . (See Figure 1) increase the high temperature by 5ºC (9ºF) increments and fire until the strip begins to melt.Step 4. Fire until only the exposed part of the strip begins to melt. leaving the strip inside the crucible un-melted. (See Figure 2) Step 4b.600º C (930º F . CAPTEK™ Training Manual Section 1 7/15/05 5 . If the strip has melted into a ball proceed to 4b. add a new strip and lower the temperature by 5ºC increments. The Correct UC Calibration Temperature The exposed part of the UC Calibration Strip will bend over and begin to melt leaving the strip inside the crucible un-melted (See Figure 2). If the UC Calibration Strip Completely Melts If the UC Calibration strip completely melts (See Figure 3). 2 Step 4a. If the UC Calibration Strip is Unchanged The High Temperature is too Low If the calibration strip is unchanged. 3 Step 5. leaving the strip inside the crucible un-melted.1100º F) 80º C per minute (145º F) UC Calibration temperature minus -10º C (18º F) 1 Minute 0 0 Firing cycle continued to next page. The Calibration Strip Starts to Melt Fig. (See Figure 2) The High Temperature is too High Fig. Step 6. Programming the Firing Cycle for Inflow D and Pontic Cover Material Programming the Firing Cycle for Inflow D / Pontic Cover DRY TIME: ENTRY TEMP: TEMP RATE: HIGH TEMP: HOLD TIME: VACUUM: COOL TIME: 2 to 3 Minutes 500º C to 600º C (930º F to 1100º F) 80º C per minute (145º F) UC Calibration Temperature 30 Seconds 0 0 Step 7. Programming the Firing Cycle for Capbond Programming the Firing Cycle for Capbond DRY TIME: ENTRY TEMP: TEMP RATE: HIGH TEMP: HOLD TIME: VACUUM: COOL TIME: 2 Minute 500º C to 600º C (930º F to 1100º F) 80º C per minute (145º F) UC Calibration minus -40º C (72º F) 4 Minutes 0 0 CAPTEK™ Training Manual Section 1 7/15/05 6 . High Temperature CAPTEK™ Calibration Program (Ritemp) Dry Time: Entry Temp: Temp Rate: High Temp: Hold: Cool Time: Vacuum: 0 – 1 minute 500º C – 600º C (930º F – 1100º F) 120º C (216º F) 1075º C (1967º F) see calibration steps in the manual 1 minute 0 0 Note: There are two different programs for the “P” & “G” cycle with different rates of climb Program the “P” Cycle Dry Time: 3 – 5 minutes Entry Temp: 500º C – 600º C (930º F – 1100º F) Temp Rate: 80º C (145º F) High Temp: High calibration temperature (every furnace fires differently) Note: The high temperature may vary from your predetermined calibration temperature up to 10ºC (18ºF) above calibration. Note: Always calibrate at the same temperature rate that you will fire your CAPTEK™ materials.Programming Fast Firing Porcelain Furnaces Focus 2007-8 Pro-100plus These furnaces are designed to fire at a faster rate of climb and a higher temperature. Hold Time: Cool Time: Vacuum: 4 – 6 minutes 0 0 CAPTEK™ Training Manual Section 1 7/15/05 7 . Some furnaces may be a few degrees below calibration. Hold Time: Cool Time: Vacuum: 6 – 8 minutes 0 0 Program the “G” Cycle Dry Time: 3 – 5 minutes Entry Temp: 500º C – 600º C (930º F – 1100º F) Temp Rate: 120º C (216º F) High Temp: High calibration temperature (every furnace fires differently) Note: The high temperature may vary from your predetermined calibration temperature up to 10º C (18º F) above calibration. minus 40º C (72º F) 4 minutes 0 0 CAPTEK™ Training Manual Section 1 7/15/05 8 .Low Temperature Calibration Program (UC Calibration) Entry Temp: Dry Time: Temp Rate: High Temp: Hold Time: Cool Time: Vacuum: 500º C – 600º C (930º F – 1100º F) 2 minutes 80º C (145º F) Starting point 40º C (72º F) below the high temperature calibration – see calibration steps in the manual 1 minute 0 0 Programming the firing cycle for UCP Bonder Dry Time: Entry Temp: Temp Rate: High Temp: Hold Time: Cool Time: Vacuum: 2 minutes 500º C – 600º C (930º F – 1100º F) 80º C (145º F) 10 º – 15 º C (9 º -18 º F) below the UC Calibration 1 minute 0 0 Programming the Firing Cycle for Inflow D and Pontic Cover Entry Temp: Dry Time: Temp Rate: High Temp: Hold Time: Cool Time: Vacuum: 500º C – 600º C (930º F – 1100º F) 2 – 3 minutes 80º C (145º F) Same as UC Calibration Temperature 30 seconds 0 0 Programming the Firing Cycle for Traditional Capbond Entry Temp: Dry Time: Temp Rate: High Temp: Hold Time: Cool Time: Vacuum: 500º C – 600º C (930º F – 1100º F) 2 minutes 80º C (145º F) UC Calibration Temperature . Shoulder or chamfer margins will stand out with less trimming. make sure they are completely dry before duplication. this will allow you to readapt and control the fit of your finished CAPTEK™ copings by using a swedger. Trim the Master Dies Trim and ditch the contour of the dies at the margins so the margins will be easy to find during the CAPTEK™ “P” application. first check the articulated models for occlusal clearance. Fig. It is important to have approximately 1. 2 Step 4. Fig.5 mm reduction on posterior occlusal surface for maximum strength. Feather or disappearing-type margins should be ditched. 3 Note: Chemical residue from die hardener and die spacer may prevent the silicone duplication material from completely curing around the dies. Block-out Undercuts Aggressively block-out all undercuts and voids above the margin on the master die. Mark Margins with a Red Pencil (See Figure 2) Fig. Apply Die Hardener and Spacer as Required When die hardener or die spacer are used.Section 2: REFRACTORY DIE PREPARATION Before starting the CAPTEK™ process. (See Figure 1) Caution: over ditching and thinning of margins may cause flaking or chipping of the margins during the CAPTEK™ coping fabrication. Step 3. This will result in an inaccurate duplication. (See Figures 3 and 4) Fig. leaving an oily wet surface in the mold and on the die. Step 1. 1 Step 2. Use a hard resin type block-out material (“Zap-It” works well). 4 CAPTEK ™ Training Manual Section 2 7/15/05 1 . (See Figure 2) b. 5 CAPTEK ™ Training Manual Section 2 7/15/05 2 . medium & large) (See Figure 1) Size Small Medium Large No. of space between each die and the sides of the duplication flask ring. (See Figure 5) Fig. If one margin extends lower. over the top of dies. Flatten and smooth the clay between the dies as much as possible. Position Dies in the base a. (See Figures 3 and 4) At the same time. (See Figure 2) c. Try to level the margins of each die parallel to the clay base. Place dies in the clay base of the correct size duplication flask. 1 Step 1. 2 10 mm. 4 d. of Dies 1-2 Dies 3-4 Dies 4 or more Total Amount of Capsil A & B 20 grams total 30 grams total 50-60 grams total Fig. Place the ring securely in the base. Fig.DUPLICATION There are three duplication flask sizes (small. Fig. position the dies in the clay base so the dies are as close as possible to the same height. 3 from buccal to lingual – labial to lingual. tilt the die to level the margins. Leave a minimum of 3 to 4 mm. and a minimum of 5 to Fig. Duplication Setting Time (30 Minutes) Remove Master Dies from the Duplication The total setting time of the Capsil duplicating material is a minimum of 30 minutes. Step 6. Now push the Capsil mold from the duplication flask ring. 7 Step 3. clean with a steam cleaner and Dawn dish soap. Measure equal amounts of Capsil A & B into a mixing cup. Step 4. Remove the cured Capsil mold from the duplication flask by first separating the base from the flask ring. b. pour a small amount of Capsil over the dies. 6 Fig. thereby coating the dies. or quickly pour the Capsil into the flask covering the dies and then pour it back into the mixing cup. (See Figures 6 and 7) Size Small Medium Large No. 8 (Option) Placing the duplication flask in a pressure chamber for 15 minutes or until initial set of the silicone mold will force out the remaining trapped air bubbles (40 to 60 psi) (5 bars). Mix the Duplication Material Gently mix to avoid incorporating bubbles for 15 to 20 seconds until it looks homogeneous. Raise the mixing cup at least 8 inches above the ring and pour a thin stream of Capsil into the flask until the tallest dies are covered by at least 5 to 10 mm. Step 5. Place a mixing cup on a gram scale and zero out the scale reading. Note: Check the dies for uncured silicone (oily wet surface on die). Remove the master dies by flexing the sides of the mold and applying pressure to the bottom and lifting out the dies. b. coating the entire surface. To minimize bubbles. Measure the Duplication Material a. If the dies are contaminated. a. of Dies 1-2 Dies 3-4 Dies 4 or more Total Amount of Capsil A & B 20 grams total 30 grams total 50-60 grams total Fig. Weigh as close as possible equal amounts of Capsil A & B. of silicone (See Figure 8). Pouring the Duplication Material a.Step 2. CAPTEK ™ Training Manual Section 2 7/15/05 3 . Re-seal and dry completely and re-duplicate. Fig. b. Shake the Capsil A & B bottles. or weigh equal amounts of Capsil A & B on a gram scale. use 6. The higher the percentage of distilled water to Capvest AV liquid the less the expansion and the tighter the fit. c. thus the looser the coping will fit on the master die. use the 60 ml. Controlling expansion You may alter the ratio of Capvest AV liquid to distilled water to control the amount of expansion of the investment.5ml. the greater the expansion of the investment.5 ml. and thus the fit of the CAPTEK™ coping to the master die. distilled water).5 ml. Follow mixing recommendations for each batch of Capvest (included in each box). (See Figure 1) Fig.REFRACTORY DIE INVESTMENT Capvest AV Refractory Die Investment Step 1. of Capvest AV liquid/distilled water ratio. a. Capvest AV mixing bottles and pre-mix large quantities of liquid ratios for consistency and convenience if desired. Once the preferred fit is achieved. b. One envelope of 30 grams should be mixed with a total of 6 ml. Capvest liquid. d. 1. a. of total liquid. b. Posterior recommended ratio: 50% Capvest AV liquid to 50% distilled water (3 ml. Note: For a slightly looser mix and more working time. 3 ml. The higher the percentage of Capvest AV liquid to distilled water. Anterior recommended ratio: 75% Capvest AV liquid to 25% distilled water (4. Capvest Liquid. c. use 5 ml. distilled water or straight Capvest AV liquid. distilled water). For very small and parallel anterior dies. Capvest AV liquid to 1 ml. Step 2. 1 CAPTEK ™ Training Manual Section 2 7/15/05 4 . Capsil Relief Spray Spray the silicone mold with Capsil Relief Spray and completely dry the mold with compressed air. Empty a 30-gram package of Capvest AV refractory investment into a mixing bowl. (Option) If a pressure chamber was used during silicone duplication. Fig. 5 Mix under full vacuum for 60 seconds. (See Figure 2 & 3) Fig. Hand mix with a spatula for 10 to 15 seconds until all the powder is completely mixed and wet. it cannot be used during the setting of the refractory investment.Step 1. b. Mixing the Refractory Investment a. Note: If a pressure chamber was not used during duplication. b. Measure the Capvest Liquid a. leaving the bowl slightly damp. Measure the desired ratio of Capvest AV liquid to distilled water and dispense into a small damp vacuum-mixing bowl. 3 Step 2. (See Figure 6) Note: When using an old Whip-Mix vacuum mixer continue hand mixing with a spatula for a total of 30 seconds and vacuum mix for 30-45 seconds. Use water to wet the small vacuum-mixing bowl. 2 Fig. Dry all the excess water from the mixing bowl. (See Figure 4) Fig. (See Figure 5) Fig. Note: A separate small vacuum-mixing bowl for refractory investment is recommended to avoid contamination. it may also be used during initial setting of the refractory investment to eliminate bubbles (40 – 60 psi) (5 bars) (10-15 minutes for initial set of investment). 6 CAPTEK ™ Training Manual Section 2 7/15/05 5 . 4 Step 3. Step 4. use a model trimmer to trim the base as small as possible while still maintaining enough base to hold on to. 7 b. After removal of the refractory dies from the duplicating mold. trim the base to level the margins. Minimum Set Time of the Refractory Investment is 40 Minutes Note: A slightly longer set time (60 minutes) will ensure a stronger refractory die for a safe removal from the Duplication. CAPTEK ™ Training Manual Section 2 7/15/05 6 . Step 6. Trimming the Base of the Refractory Dies a. b. If one margin extends lower. (See Figure 7) Fig. breaking the surface tension. (See Figure 8) Fig. 8 c. Carefully vibrate a small amount of investment into each die in the duplication mold. At the same time trim each base flat so that the margins of the die are as level as possible from facial to lingual and mesial to distal. The investment will rise and fall coating the sides of the mold. Hold a finger over the die before blowing to prevent damaging the die. Fill the remaining portion of the mold with investment. Gently squeeze the mold slowly in and out while on the vibrator. Try to keep the dies close to the same height. Fig. (See Figure 10) Note: A small stream of compressed air between the mold wall and each die will help release the die from the mold. (See Figure 9) Fig. 10 Step 7. remove the refractory dies by carefully flexing the mold open and gently pushing the mold from the bottom and removing the refractory dies. filling from the incisal or occlusal up to the margins. Removal of the Refractory Dies from the Duplication After the investment has completely set (minimum 40 minutes). 9 Step 5. Vibrate Investment into the Duplication Mold a. first wet the refractory die with clean water. Transfer the refractory dies to the porcelain furnace for final curing using the normal CAPTEK™ “P” & “G” cycle (See Section 1). (See Figure 11) Fig. 13 & 14) Fig. check the dies for bubbles.Step 8. Mix refractory investment with straight Capvest liquid to a thick creamy consistency and fill any bubbles. or undercuts. Burn-out and Curing of Refractory Dies a. After trimming each refractory die. voids. Repairing Refractory Dies Fig. Let the repair set for a minimum of 5 to 10 minutes before the burnout and curing of the dies. 12 b. If a die requires correction. defects. 14 Step 9. Contour to match the shape of the die. Place the refractory dies in a burnout furnace at room temperature. b. Run the furnace up to 1300ºF (700ºC) at 40ºF (22ºC) per minute. (See Figure 12. or missed undercuts on the preparation. 13 c. Fig. CAPTEK ™ Training Manual Section 2 7/15/05 7 . This will remove harmful gases and moisture from the refractory dies. 11 a. without letting it puddle. you can thin the adhesive by warming the bottle and shaking well.ADHESIVE Applying CAPTEK™ Adhesive to the Refractory Dies Step 1. When the adhesive becomes thick and stringy. Discard the bottle and start with a new bottle of adhesive. Note: CAPTEK™ adhesive will eventually thicken with age and exposure to air. 4 Step 3. Mark the Margins After curing the refractory dies. Minimum Dry Time is 15 minutes a. 1 Step 2. to the die. use a soft red pencil to mark the margin line around the entire refractory die. b.4) Fig. CAPTEK ™ Training Manual Section 2 7/15/05 8 . The adhesive should be painted down to the margin. Shake the adhesive bottle to thoroughly mix the liquid. (See Fig. This may cause voids or bubbles in the “P” layer. Apply the Adhesive a. (See Figure 1) Fig. lumps of adhesive will remain on the surface of the refractory die. b. It’s OK to let the adhesive sit longer or even stand overnight. if covered to keep dust free. Allow the adhesive to air dry a minimum of 15 minutes. 2 Fig. 2 . For a temporary fix. Apply a liberal amount of adhesive. but not over or below the margin. 3 Fig. box forms. It should extend slightly over the gingival margin and slightly past the incisal edge of the die. Step 1. Pre-Adapting “P” Material into Irregular Areas a. Do not press or burnish at or below the margins just let the “P” material drape over the labial margin. Now. Place the die on the cut strip of “P” material on its mesial or distal surface and measure from just below the labial gingival margin to slightly past the incisal edge. This should divide the strip into roughly a rectangle and a square. 2 Step 3. If the die has any retention grooves. Press it to place on the incisal half of the die only. 1 b. or a deep shoulder or chamfer. Mark the die with a refractory pencil as a reminder to add a little extra “G” material for these areas. b. (See Figure 3 & 4) b. 4 CAPTEK ™ Training Manual Section 3 7/15/05 1 . Fig. Step 2. Place the Labial Piece of “P” Material a. carefully press or adapt the “P” material around to the interproximal surfaces of the die. rectangular piece onto the labial surface of the die. Lay out a sheet of Anterior “P” material. Measure and Cut the “P” Material a. (See Figure 1) Fig. adapt some extra “P” material in the undercut area. Secure the strip of material by burnishing the lingual incisal edge to the refractory die. This will allow some extra thickness for internal adjustment when fitting the CAPTEK™ copings. (See Figure 2) Fig. place the die on top of the sheet and cut a strip of material that is slightly wider than the mesial/distal width of the die at the gingival margin. and then cut the strip.Section 3: “P” & “G” APPLICATION Anterior “P” Application Note: Anterior “P” will be applied in two pieces. first fill and adapt a small amount of scrap “P” material in these areas before applying the “P” layer. If an undercut was missed during the model and die work. Pick up and place the measured. c. 3 Fig. c. The two remaining corners can be lightly pressed or adapted around the interproximals. (See Figure 5) Fig. Fig. (See Figure 6) Fig. Process in the P Press (See Figure 10 & 11) (See Pages 16 . slightly overlapping the labial piece. 7 b. 8 Hold and lightly tack the piece in place at the corners. 9 Step 5. Place the Lingual Piece a. Hold the remaining square piece in a diamond configuration and place it on the lingual surface so that the top corner is extending over the incisal edge and the bottom corner is slightly over the lingual margin. Fig. (See Figure 7) c. Do not press or burnish into place near the margins. 10 Fig. Press the piece to place in the incisal ½ of the die only. The die is now ready to process in the P Press. & 9) Note: Any small gaps will be filled and burnished into place after processing in the P Press. 11 CAPTEK ™ Training Manual Section 3 7/15/05 2 . (See Figure 8. 5 Step 4. Remove any overlapping pieces of material on the lingual surface.18) Fig. 6 Fig. b. Burnish and slightly smooth any overlapping areas. b. Remove any overlaps that extend toward the labial or lingual surface. If this is the case. Use a CAPTEK™ knife at a 90-degree angle and remove the excess “P” material below the margin. fill in any gaps and burnish the pieces together. Burnish and Smooth the Overlapping Areas and Margins a. 12 c. With the CAPTEK™ instrument lightly burnish the “P” material at the margins being careful to maintain the thickness of the “P” material. lightly burnish and condense the material at the margins. Trim and Adapt the Margins a. 14 Step 8. Fill in Gaps and Remove Over-laps a.3 mm or so collar at the margin when finished. the “P” material was over worked and overthinned. 13 Step 7. lingual or incisal surfaces that will thicken the coping and interfere with room for application of porcelain. (See Figure 14). There should be a small 0. With the CAPTEK™ knife or burnishing instrument remove any overlaps on the labial. Fig.Step 6. It is not necessary to completely smooth these areas. 16 Note: If there is no “collar”. If the margins were properly ditched. After processing in the P Press. (See Figure 12 & 13) Fig. (See Figure 16) Fig. Leave any small overlaps in the interproximal area. Fig. 15 b. This will create extra strength in the CAPTEK™ coping. add more “P” material back to the margins CAPTEK ™ Training Manual Section 3 7/15/05 3 . Fig. (See Figure 15) Using the round end of the CAPTEK™ adapting instrument. the excess should easily “crack” and fall away. Angle the incisal of the refractory die downward and then hold the adapting tool against the refractory die at a position and angle that will maintain the thickness of the “P” material. (See Figure 17) Step 9. check the “P” layer for any cracks or voids. The anterior “P” material is now ready for processing. 19 Step 10.c. 20 Fig. (See Figure 20-21) Fig. Fig. always be careful to maintain the thickness of the “P” material at the margins. Reburnish and seal the margins with the CAPTEK™ instrument if needed. Place the refractory dies in the center of the firing tray and fire in a porcelain furnace on the “P” & “G” cycle (See Figures 18 and 19) Do not fire more than 5 to 6 copings at one time. fire only 3 to 4 copings at one time. 22 Step 11. carefully trim any over-extensions away from the margins. Process in the Porcelain Furnace a. 21 Fig. looking for the marked red line. Check the “P” material for any cracks or voids and burnish together with the CAPTEK™ instrument. If the refractory dies are large. The Coping is Now Ready to Apply the “G” Layer CAPTEK ™ Training Manual Section 3 7/15/05 4 . After Processing. If cracks or voids are found. carefully fill with scrap “P” material before applying the “G” layer. Fig. Trim as close to the margins as possible. 17 Using the tip of the CAPTEK™ knife. 18 Fig. Place the die on top of the cut strip of “G” material on its mesial or distal surface and measure from approximately 1 mm. Place the die on top of the sheet and cut a strip of material the exact mesial/distal width of the die at the gingival margin. The application of the “G” material layer should not take more than one to two minutes. you do not have to burnish or smooth the “G” material layer to a uniform surface like the “P” layer. then cut the strip. 1 b. The “G” material layer will be applied short of the margins requiring less material than the “P” material layer. (See Figure 1) Fig. short of the margin and to the incisal edge of the die and quickly adapt with finger pressure and the CAPTEK™ instrument. (See Figure 2) Fig. You can have slight overlaps or gaps at the joints.Anterior “G” Application Note: The Pneumatic P Press will not be used for the “G” material application. approximately 1 mm. This should divide the strip into roughly a rectangle and a square. Lay out a sheet of anterior “G” material. Add Extra “G” for any Pre-Adapted Irregular Areas in the “P” Layer If any extra “P” material was applied during the “P” application an equal amount of “G” material needs to be applied during the “G” application. 4 CAPTEK ™ Training Manual Section 3 7/15/05 5 . When fired (processed). 2 Step 3. 3 Fig. Step 2. the “G” material will melt and flow into the “P” layer through capillary attraction and travel to all areas of the coping including the internal surfaces. Pick up and place the measured rectangular piece on the labial surface. Place and Adapt the Labial Piece a. (See Figures 3 & 4) Fig. Step 1. Measure and Cut the “G” Material a. short of the labial gingival margin to the incisal edge. Therefore. The other corners should extend to the labial piece in the interproximals. Remove any large overlaps and burnish just enough to hold in place. (See Figure 5) Fig. type of furnace used. Trim the Margins Cut the “G” material layer short of the margins on anteriors approximately 1 to 1. 6 a. You can have slight overlaps or gaps at the joints. 7 b. (See Figure 8) Fig.5 mm. 8 Step 5. Place and Adapt the Lingual Piece Fig. Place the remaining piece on the lingual surface in the shape of a diamond. and firing temperature. 9 Fig. (See Figures 9 and 10) Note: The amount of “G” cut back at the margins will be determined by the amount of overlap in the “P” layer. 10 CAPTEK ™ Training Manual Section 3 7/15/05 6 .b. Fig. and burnish just enough to hold the “G” material in place. Place the piece so that one corner is extending over the incisal edge and another corner to the lingual margin. Remove any overlapping excess “G” material on the lingual surface. 5 Step 4. (See Figures 6 & 7) Fig. Process in the Porcelain Furnace The “G” layer is now ready to process. Repairs After “G” Firing Holes or Tears After firing the “G” layer. Fig. 12 Fig. Place the refractory dies in the center of the firing tray and fire in a porcelain furnace on the “P” & “G” cycle. There are two ways to repair this while the coping is still on the refractory die: Fig.Step 6. and apply CAPTEK™ Pontic Cover material mixed with Capcon Liquid accurately to the area with a small brush and fire on the CAPTEK™ High Calibration program. (See Figures 12-14) Option 2: Wet the die in water. Step 7. Add a small amount of scrap “G” material somewhere else on the coping to maintain the gold color and re-fire on the “P” &”G” cycle. fire only 3 to 4 copings at one time. readapt the margins to the refractory die by hand burnishing with the CAPTEK ™ instrument. blow off the excess. This usually indicates thin areas in the “P” layer. 11 (See Section 1) (See Figure 11) Note: If the margins lift during the “G” firing. (About 15ºC (25ºF) below the “P” & “G” high temp with a one minute hold) CAPTEK ™ Training Manual Section 3 7/15/05 7 . 13 Fig. check for any holes or tears. 14 Option 1: Simply adapt some scrap “P” material or repair paste into the voids and apply an equal amount of “G” material next to the repair. If the refractory dies are large. or readapt with the swedger before divesting. Do not fire more than 5 to 6 copings at one time. 18 Correct this by adapting a small amount of “P” material to the interproximal area and re-fire on the “P” & “G” cycle. Fig. 17 Excess “G” Material If too much “G” material was used. 16 Note: You will need to heat and dry the added “G” material slowly to avoid it melting and dripping off the CAPTEK™ coping. 19 The excess gold will draw to the added “P” material in the interproximal.Insufficient Amount of “G” Material If an insufficient amount of “G” material was used. 15 Correct this by adding a small piece of “G” material to the incisal or occlusal area and re-firing on the “P” & “G” cycle. Proceed to Divesting and Finishing CAPTEK ™ Training Manual Section 3 7/15/05 8 . (See Figure 15) Fig. (See Figures 16 and 17) Fig. (See Figure 20) Fig. You can then grind off the small piece if desired. (See Figure 18) Fig. 20 Step 8. (See Figure 19) Fig. the coping will have excess puddling of gold near the margins. the coping will have a pale gold appearance. Posterior “P” Application Note: Posterior “P” material will be applied in four pieces. Lay out a sheet of posterior “P” material. Place the die on top of the cut strip of “P” material on its mesial or distal surface and measure from just below the buccal gingival margin to slightly past the occlusal incisal edge. Step 2. or a deep shoulder or chamfer. Place the Buccal Piece of “P” Material a. Fig. place the die on top of the sheet as a guide and cut a strip of material that is slightly wider than the mesial/distal width of the die at the gingival margin. If the die has any retention grooves. (See Figures 4 & 5) Fig. Mark the die with a refractory pencil as a reminder to add extra “G” material for these areas. first fill and adapt scrap “P” material in these areas before applying the “P” layer. 2 b. Step 1. (See Figure 3) Fig. 4 b. This will allow some extra thickness for internal adjustment when fitting the CAPTEK™ copings. 5 CAPTEK ™ Training Manual Section 3 7/15/05 9 . Secure the strip of material by burnishing the occlusal incisal edge to the refractory die. Fig. Pre-Adapting “P” Material into Irregular Areas a. Press it to place on the occlusal half of the die only. then cut the strip. box forms. While holding the buccal piece in place. (See Figure 2) Fig. 3 Step 3. adapt some extra “P” material in the undercut area. Pick up and place the measured piece on the buccal surface of the die so it extends slightly over the gingival margin and the occlusal incisal edge of the die. carefully wrap the “P” material around to the interproximal surfaces of the die. (See Figure 1) If an undercut was missed during the model and die work. c. Do not press or burnish at or below the margins just let the “P” material drape over the buccal margin. 1 b. Measure and Cut the “P” Material a. Measure and cut the next piece of “P” material so it will extend from where the first strip ended on the interproximal to the lingual surface. Large overlaps can be removed with a CAPTEK™ knife. (See Figure 7) c. (See Figure 11) It is now ready to process in the P Press. Note: Any small gaps will be filled after processing in the P Press. 6 Fig. Again. (See Figure 8) Fig. 11 CAPTEK ™ Training Manual Section 3 7/15/05 10 . (See Figure 7) Fig. Place the Occlusal Piece a. Lightly tack the piece in place. Smooth and burnish the occlusal area to avoid having thick areas or internal lines in the “P” material. Carefully wrap onto the lingual surface.Step 4. (See Figure 10). 8 b. press it to place on the occlusal half of the die only. Fig. Place the remaining piece on the occlusal surface of the refractory die. d. Overlap all seams slightly as you proceed around the die. Place the second piece on the refractory die slightly overlapping the first piece on the interproximal. Fig. just let the “P” material drape over the labial margin. (See Figure 9) Fig. Measure and Place the Interproximal and Lingual Piece of the “P” Material a. 9 c. Secure the strip by burnishing the occlusal incisal edge to the refractory die. (See Figure 6) b. Do not press or burnish at or below the margins. 7 Step 5. It may overlap onto the other surfaces. Repeat this process around the rest of the die until all axial walls are covered. 10 d. 12 Fig. 17 CAPTEK ™ Training Manual Section 3 7/15/05 11 . lightly burnish and condense the material at the margins. 15 Fig. Process in the P Press a.3 mm or so collar at the margin when finished. the excess should easily “crack” and fall away. the “P” material was over worked and over-thinned.Step 6. If the margins were properly ditched. (See Figure 15) Fig. (See Figure 13) c. With the CAPTEK™ instrument lightly burnish the “P” material at the margins being careful to maintain the thickness of the “P” material Fig. b. 13 Step 7. Fig. With the CAPTEK™ knife or burnishing instrument shave off any overlaps on the buccal. lingual or occlusal surfaces that will thicken the coping and interfere with room for application of porcelain. Leave any overlaps in the interproximal area that will not interfere with room for porcelain application. There should be a small 0. Burnish and slightly smooth any overlapping areas. 16 b. Angle the occlusal of the refractory die downward and hold the adapting tool against the refractory die at a position and angle that will maintain the thickness of the “P” material. This will create extra strength in the CAPTEK™ coping. 14 Step 8. After processing in the P Press (See Figure 12). Trim and Adapt the Margins a. If there is no “collar”. fill in any gaps and burnish the pieces together. Using the round end of the CAPTEK™ adapting instrument. add more “P” material back to the margin. Use a CAPTEK™ knife at a 90-degree angle and remove the excess “P” material below the margin. It is not necessary to completely smooth these areas. If this is the case. (See Figure 14) b. Burnish and Smooth the Overlapping Areas and Margins a. (See Figures 16 & 17) Fig. Place the refractory dies in the center of the firing tray and fire in a porcelain furnace on the “P” & “G” cycle. Leave the piece visible as a reminder to apply an equal amount of “G” material. looking for the marked red line. short of the margins and extending up to the occlusal marginal ridge. 19 Fig. Trim as close to the margins as possible. do not burnish smooth. Place the piece about 1 mm. always be careful to maintain the thickness of the “P” material at the margins. If the refractory dies are large. place a piece of scrap “P” material about 3 to 4 mm. After furnace firing.Fig. 18 c. Process in the Porcelain Furnace a. (See Figure 20) Fig. Fig. c. To strengthen the posterior CAPTEK™ coping. The posterior “P” material is now ready for processing. Check the “P” material for any cracks or voids and burnish together with the CAPTEK™ instrument. (See Figure 19) b. fire only 3 to 4 copings at one time. (See Section 1) (See Figure 21) Do not fire more than 5 to 6 copings at one time. 21 c. wide in the interproximal. b. Re-burnish and seal the margins with the CAPTEK™ instrument if needed. (See Figure 18) Recommended Option: a. carefully trim any overextensions away from the margins. Using the tip of the CAPTEK™ knife. check the fired “P” layer for any cracks or voids and carefully fill with scrap “P” material before applying the “G” layer (see page 4 in Anterior “P”) Step 10. The coping is now ready to apply the “G” layer Fig. 22 CAPTEK ™ Training Manual Section 3 7/15/05 12 . Adapt into place. 20 Step 9. from slightly short of the margin to the incisal occlusal edge of the die. you do not have to burnish or smooth the “G” layer to a uniform surface like the “P” layer.Posterior “G” Application Note: The Pneumatic P Press will not be used for the “G” application. Fig. When fired (processed). Place the die on top of the sheet as a measuring guide and cut a strip of material the exact mesial/distal width of the die at the gingival margin. 3 CAPTEK ™ Training Manual Section 3 7/15/05 13 . and then cut the strip. Step 1.5 mm. Measure and Cut the “G” Material a. Pick up and place the measured piece on the buccal surface. You can have slight overlaps or gaps at the joints. (See Figure 1) Place the die on top of the cut strip of “G” material on its measial or distal surface and measure from slightly short to 0. Therefore. Lay out a sheet of posterior “G” material. short of the labial gingival margin to the incisal edge. Place and Adapt the Buccal Piece of “G” Material a. the “G” material will melt and flow into the “P” layer through capillary attraction and travel to all areas of the coping including the internal surfaces. (See Section 4) Step 3. 2 Note: Extend the “G” to completely cover the margins where extra “P” material was added for metal collars. The application of the “G” layer should not take more than one to two minutes. 1 b. The “G” layer will be applied short of the margins requiring less material than the “P” layer. (See Figure 3) Note: Extend the “G” to completely cover the margins where extra “P” material was added for metal collars. (See Section 4) Fig. Add Extra “G” Material to any Pre-Adapted Irregular Areas in the “P” Layer If any extra “P” material was applied during the “P” application an equal amount of “G” needs to be applied during the “G” application. (See Figure 2) Fig. Step 2. Fig. Place the Occlusal Piece of “G” Material a. 4 Quickly adapt with finger pressure and the CAPTEK™ instrument and burnish just enough to hold the “G” in place. Place it on the die butting up to or slightly overlapping the first piece in the interproximal. Fig. Measure and cut the next piece of “G” material so it will extend from where the first piece ended on the interproximal to the lingual surface. and firing temperature. Trim the Margins Trim the “G” material short of the margins approximately 0.5 mm. type of furnace used. Carefully wrap to the lingual surface.b. 5 Step 4. short of margins on molars. (See Figures 4 & 5) Fig. Measure and Place the Interproximal and Lingual Pieces of the “G” Material a. (See Figure 8) Note: Extend the “G” to completely cover the margins where extra “P” material was added for metal collars. (See Section 4) Fig. (See Figure 7) Remove any unwanted overlaps of “G” material. Step 6. 8 Note: The amount of “G” cut back at the margins will be determined by the amount of overlap in the “P” layer.5 to 1 mm. (See Figure 6) b. 7 Place the remaining piece on the occlusal surface. Fig. Apply finger pressure and burnish with the CAPTEK™ instrument just enough to hold in place. Repeat this process until all axial walls are covered. CAPTEK ™ Training Manual Section 3 7/15/05 14 . Step 5. on bicuspids and slightly short of the margins to 0. 6 c. b. 11 & 12) Note: You will need to heat and dry the added “G” material slowly to avoid it from melting and dripping off the CAPTEK™ coping. Insufficient “G” Material Fig. (See Figures 10. Fig. the coping will have excess puddling of gold near the margins. 13 Fig. (See page 7 in Anterior “G” for instructions). check for any holes or tears. This usually indicates thin areas in the “P” layer. or readapt with the swedger before divesting. (See Figure 13) Correct this by adapting a small amount of “P” material to the interproximal area and refire on the “P” & “G” cycle. Proceed to Divesting and Finishing 15 CAPTEK ™ Training Manual Section 3 7/15/05 . (See Figure 15) Step 9. (See Section 1) (See Figure 9) Do not fire more than 5 to 6 copings at one time.Step 7. (See Figure 10) Correct this by adding a small piece of “G” material to the incisal or occlusal area and refire on the “P” & “G” cycle. 10 Fig. Process in the Porcelain Furnace The “G” layer is now ready to process. readapt the margins to the refractory die by hand burnishing with the CAPTEK™ instrument. You can then grind off the small piece if desired. 11 Fig. 14 Fig. 12 If an insufficient amount of “G” material was used. the coping will have a pale gold appearance. If the refractory dies are large. (See Figure 14) The excess gold will draw to the added “P” material in the interproximal. Excess “G” Material Fig. 9 Step 8. fire only 3 to 4 copings at one time. Repairs After firing the “G” layer. Place the refractory dies in the center of the firing tray and fire in a porcelain furnace on the “P” & “G” cycle. 15 If too much “G” was used. Note: If margins lift during the “G” firing. 4 Fig. Leave the talcum powder on the remaining spare blue cone inserts as a preservative. There are two different size blue rubber cone inserts for pressing different size dies. Check the O-rings to make sure they are in the proper position to seal the removable lid to the pressure chamber. Take one cone of each size and clean off the white talcum powder with water and completely dry. CAPTEK ™ Training Manual Section 3 7/15/05 16 .Press The Pneumatic P Press is designed to quickly and evenly adapt the “P” material to the refractory die. It will eliminate the need to hand adapt the “P” material to form a CAPTEK™ coping.Adapting “P” Material Using the Pneumatic P. (See Figure 1) Fig. 3 3. Place the metal washer over the blue rubber cone.90 psi). 5 Important Note: Do not use Vaseline or other petroleum products on the floor or base of the pressure chamber. These products chemically attack and damage the natural rubber components. (See Figure 2) 2. Check the P Press for the proper amount of air pressure (maximum of 75 . 2 1. (See Figure 3) Fig. (See Figure 5) Fig. 1 Before Using The P Press: Fig. (See Figure 4) 4. Place the selected cone over the refractory die. (See Figures 8 & 9) Note: If the cone does not fit passively on the pressure chamber floor. Secure the lid by turning clockwise until snug. (See Figure 7) b. Replace the lid by lowering it straight down onto the P Press. Select the correct sized blue rubber cone insert (remove talcum powder). The cone should fit passively over the die and lay flush with the chamber floor. 9 Step 3. Place a Blue Rubber Cone a. Place the refractory die. There are two sizes to choose from.Press Instructions Step 1. Step 2. either select the larger blue rubber cone or trim the base of the die to make it smaller. Place the Die with the applied “P” Material in the Pressure Chamber a. Place the metal washer over the blue rubber cone. (See Figure 6) Fig. Activate the Pressure Chamber a. lining up the black lines on the lip of the lid and the base of the pressure chamber. and will not adapt the “P” material to the refractory die. 8 If you hear air escaping. Fig. 10 CAPTEK ™ Training Manual Section 3 7/15/05 17 . 6 b.P. Fig. Remove the lid to the pressure chamber by turning the cap one quarter turn (counterclockwise) in the direction of the arrow marked “OPEN” and lift straight up. (See Figure 10) Fig. with the applied “P” material on its base in the center of the pressure chamber floor. Fig. the chamber will leak air when the P Press is activated. 7 c. Finish the “P” Application For finishing of the CAPTEK™ “P” layering process. 13 Step 5. open the pressure chamber lid and make sure the cone insert and washer are correctly positioned in the chamber. Depress the air pressure button and hold for 2 seconds. CAPTEK ™ Training Manual Section 3 7/15/05 18 . Open the pressure chamber lid and remove the die (counterclockwise). (See Figure 11) Note: a. 12 b. If not repeat the Pressing Cycle. (See Figure 12) Fig. If air is heard escaping while pressing the button. release and depress a second time holding for 2 seconds. b. Remove the Pressed Coping a. 11 Step 4. (See Figure 13) Fig. The finished pressed “P” material should be completely adapted to the surface of the refractory die and the overlapping “P” areas. Secure the lid and repeat the pressing cycle. The cone should fit passively over the die and sit flush on the chamber floor. refer to the instructions in this manual for Anterior or Posterior “P” application.b. Fig. Do not over burnish to ensure that you maintain the thickness of the strips. Place the Strips of “P” Material Fig.Section 4: METAL COLLARS. 2 a. There are four proven techniques and materials that can be used to make metal collars on CAPTEK ™ copings. The correct one is the one you find the easiest: • • • • Applying cut strips from scrap “P” material before or during the “P” application. (See Figure 3) Fig. Place the strips of “P” material on the refractory die and secure the pieces exactly to the margins where the metal collar is desired. Note: It will be easier to apply several small pieces of scrap “P” material rather than one or two long pieces. 3 CAPTEK™ Training Manual Section 4 7/15/05 1 . METAL LINGUALS AND OCCLUSAL STOPS Metal Collar Application Because of CAPTEK™’s unique physical properties. Making a collar from the CAPTEK™ Collar Mold. (See Figure 1) Fig. there are advantages over traditional porcelain-fused-to-metal crowns where metal is exposed for margins. wide. Burnish the “P” strips at the margins and lightly burnish to the axial walls. Cut Strips of “P” Material Cut strips of “P” material approximately 1mm. (See Figure 2) b. The extremely small particles in CAPTEK™’s composite metal structure create an electrically “polar” surface that demonstrates a substantial resistance to bacteria and plaque accumulation. Applying CAPTEK™ Build-Up material during “P” application or optionally after the coping is completed. 1 Step 2. Metal Collar Using Strips of Scrap “P” Material Step 1. Applying Margin “P” material before or during the “P” application. 7 CAPTEK™ Training Manual Section 4 7/15/05 2 . burnishing and trimming of margins. Step 6. short of margins where no extra “P” material was added for a collar. (See Figure 5) b.5mm. Follow instructions for the P.Step 3. 6 Fig. Now follow the steps for the “P” layer application and apply the “P” layer over the collar material. Follow the “P” layer instructions for adapting. finishing and polishing.Press. (See Section 3) Fig. Adapt and Shape the Collar With the CAPTEK™ instrument. Apply the “G” Layer Follow the instructions for the “G” application a. Apply “P” Layer a. Process the “P” Layer in the Furnace a. (See Figure 4) b. Cut the gold layer approximately 0. Step 5. adapt the over-laying pieces together and shape the collar for a porcelain finish line. The “G” layer must completely cover the margins where the extra “P” material was added for the metal collar. 5 Step 7. Step 4. (See Section 1) b. Process the “G” Layer in the Furnace Process in the furnace on the “P” & “G” cycle (See Section 1) (See Figure 7) Fig. Note: Always make the collars slightly over-contoured for porcelain contouring. Place the refractory die on a firing tray and fire in the porcelain furnace on the “P” & “G” cycle. 4 c. After processing check the fired “P” layer for any cracks or voids and carefully fill with “P” material before applying the “G” layer. (See Figure 6) Fig. This will achieve the proper amount of gold. After processing check the fired “P” layer for any cracks or voids and carefully fill with “P” material before applying the “G” layer. The “G” layer must completely cover the margins where the Margin “P” material was added. Follow all steps for the “P” application. Step 6.Metal Collar Using Margin “P” Material The Margin “P” material is designed to quickly make large metal collars during the “P” application. Step 4. Cut the strips of Margin “P” material to the desired size for the metal collar. b. rather than one or two long pieces. b. (See Section 1) CAPTEK™ Training Manual Section 4 7/15/05 3 . b. Step 2. Note: It will be easier to apply several small pieces. You must also add another piece of “G” material to the collar area because of the extra thickness of the Margin “P” material to achieve the proper amount of gold. Follow the instructions for the “G” application. “G” Application a. Place the Margin “P” Strips a. Process the “P” Layer in the Furnace a. Place and adapt the strips into place. Process the “G” Layer in the Furnace Process in the furnace on the “P” & “G” cycle. Process in the furnace on the “P” & “G” cycle. c. finishing and polishing. Step 1. Step 3. With the CAPTEK™ instrument adapt the overlapping pieces together and shape the collar for a porcelain finish line. Step 5. The material is twice as thick as Posterior “P” material. Note: Always make the collars slightly over-contoured for porcelain contouring. Step 6.Metal Collar using CAPTEK™ Build-Up Material Step 1. Mix the Build-Up Material Note: Use only Capcon Liquid when mixing CAPTEK™ powders for build-ups. Step 4. b. Add extra “G” strips just above the collar that are the same width as the collar. Note: Always make the collars slightly over contoured for porcelain contouring. Step 3. Apply CAPTEK™ “G” in the normal fashion. Mix a small amount of CAPTEK™ Build-Up material with Capcon liquid in a small container (a Capcon mixing dish works best) until it reaches a smooth consistency. (See Section 1) Step 5. (See Section 1) CAPTEK™ Training Manual Section 4 7/15/05 4 . Using a small brush and apply the Build-Up material to the edge of the die where the collar is desired. “G” Application a. “P” Application Finish the “P” application but do not fire. Step 2. Process the “G” Layer in the Furnace Process in the furnace on the “P” & “G” cycle. Apply the Build-Up Material a. Process the “P” Material in the Furnace Process in the furnace on the “P & G” cycle. Shape it to the desired dimensions. finishing and polishing. b. Process the “G” Layer in the Furnace Process in the furnace on the “P” & “G” cycle. Adapt and smooth the collar to the coping. Note: Maintain the porcelain finish line. c. Step 5. (See Section 1) CAPTEK™ Training Manual Section 4 7/15/05 5 . b. Step 2. Trim the margins. Remove the collar form the mold with a CAPTEK™ knife. instead of one long piece. Step 4. b. the thick square side will create a porcelain finish line and the tapered edge will extend to the margins. Add extra “G” pieces just above the collar that are the same size as the collar. After processing. When applying the collar material. wrapping the material around the coping to create the desired metal collar. b. Note: Die Lube or DVA Very Special Separator work well. Carefully adapt the collar into place. Step 6. Apply the Collar Material a. d. check the fired “P” layer for any cracks or voids and carefully fill with “P” material before applying the “G” layer.Making a Collar from the CAPTEK™ Collar Mold Step 1. Process the “P” Layer in the Furnace a. c. Add more pieces as needed. Note: It may take more than one extra piece of “G” material to achieve the right amount of gold for the collar. Firmly adapt scrap “P” material into the mold form to the desired size and length. Process in the furnace on the “P” & “G” cycle. Lubricate the selected mold form. Finish the “P” Application but do not Fire Form a Collar from the Mold a. Apply CAPTEK™ “G” material in the normal fashion. “G” Application a. Note: The width may be adjusted to the desired size with a CAPTEK™ knife. Note: It may be easier to apply the collar in several pieces. (See Section 1) b. Step 3. Metal Linguals, Occlusal Stops or Islands Step 1. Seat the Coping. a. Finish the coping but leave the margins slightly thick to protect them during processing. b. Seat the coping on the articulated model. (See Figure 1) Fig. 1 Step 2. Mix the Build-Up Material (Capcon Liquid) Mix a small amount of Build-Up material with Capcon Liquid to a thick, creamy consistency. (See Figure 2) Fig. 2 Step 3. Apply the Build-Up Material a. With a small brush, apply the Build-Up material to the desired area. (See Figure 3) Fig. 3 b. Lightly tapping on the model will help to smooth and condense the Build-Up material. Fig. 4 c. Slightly over build the edges. These will be shaped later to create a sharp finish line. (See Figures 4 and 5) Fig. 5 Step 4. Check Occlusion a. When the Build-Up material no longer has a wet look, carefully close the articulator to check for occlusion. Only light occlusion is necessary. Fig. 6 b. Avoid centric contact on the finish line. Build the material slightly past the contact area. (See Figure 6) CAPTEK™ Training Manual Section 4 7/15/05 6 Step 5. Remove the Coping from the Model a. Carefully remove the coping and check for the proper contour. b. Add to any deficient areas if needed. (See Figure 7) Fig. 7 c. Carefully shape the finish line. (See Figure8) Fig. 8 Step 6. Process in the Furnace Place on a firing peg and tray and fire on the Inflow D cycle to fuse the Build-Up material. (See Figure 9) Fig. 9 Step 7. Apply the “G” Material a. With a thickness gauge, measure the fired build-up area or lingual in 4 to 5 areas to establish an average thickness. A measurement of .5 mm to .6 mm equals one sheet of posterior “G” material. Compensate for more or less “G’ material as needed according to the measurement. (See Figure 10) b. Apply the correct amount of “G” material. (See Figure 11) Fig. 10 Fig. 11 Step 8. Apply the CAPTEK™ Solder Investment a. Mix a small amount of CAPTEK™ Solder Investment with UCP Liquid. Fig. 12 b. Paint a thin layer of the mixed solder investment on the inside of the CAPTEK™ coping and slightly cover the margins. This will prevent the gold from flowing through to the inside. (See Figure 12) 7 CAPTEK™ Training Manual Section 4 7/15/05 Step 9. Process in the Furnace a. Place the coping on a firing peg and tray and fire on the High Calibration cycle. Add a 2 to 3 minute dry time to the cycle. Fig. 13 b. Check for the correct amount of gold on the built area. More gold may be added if needed. (See Figures 13 and 14) Option: The Butane Hand Torch may also be used to melt and infiltrate the “G” material into Build-Up material. Fig. 14 Step 10. Remove the Solder Investment a. Remove investment with a sharp instrument. b. Place the coping in acid (Super Strip-it) and clean in the ultrasonic. Step 11. Seat the Coping on the Model a. Seat the coping on the articulated model. (See Figure 15) b. Adjust the occlusion. (See Figure 16) Fig. 15 c. Contour and sharpen finish lines with a carbide bur. (See Figure 17) d. Finish with rubber wheels to a smooth surface. e. Repair any pits or voids with Pontic Cover material or Inflow D. Fig. 17 Fig. 16 Step 12. Step 13. Finish the Margins and Apply the Bonder Apply Porcelain CAPTEK™ Training Manual Section 4 7/15/05 8 Re-Establishing Gold Color on Exposed CAPTEK™ Metal after Porcelain Application Step 1: Step 2: Step 3: Step 4: Completely Finish the Porcelain Application Finish the exposed CAPTEK™ metal to a smooth satin finish. Lightly vibrate to smooth the Inflow D material. (See Figure 2) Fig. but will not melt. 2 Step 7: Carefully polish with rubber wheels and polishing paste. Fig. Apply a thick coat of Inflow D on the exposed metal. Apply Inflow D. 1 Step 6: Hand burnish the fired Inflow D to a luster. 4 Note: If there is insufficient gold this process may be repeated. (See Figure 1) Fig. the Inflow D will fuse to the coping. Step 5: Fire at approximately 700ºC to 750ºC (1295ºF to 1385ºF) At this temperature. Use the CAPTEK™ adapting tool and aggressively burnish to a high luster. Mix Inflow D to a thick creamy consistency with Inflow Liquid. CAPTEK™ Training Manual Section 4 7/15/05 9 . 3 Fig. a. b. you may pre-finish with a rubber wheel approximately 50% of the margins thickness. (See Figures 2 and 3) Fig. lingual of anteriors and deep fossa areas of occlusal. 3 CAPTEK™ Training Manual Section 5 7/15/05 1 . Step 2. The gold layer is only 20 to 30 microns thick and can easily be removed by sandblasting. Use a bur and carefully grind out the major portion of the refractory die from inside the coping. Fig. 1 a. exposing the gray “P” layer. Option: After readapting on the refractory die. Divest the Coping If the CAPTEK™ coping does not release from the refractory die. (See Figure 1) Fig. Stay within 1-2 mm. Important Note: CAPTEK™ copings cannot be sandblasted with aluminum oxide for divesting. of the margins. shoulder-chamfer areas. Be careful not to hit the sides of the coping.Section 5: FINISHING Refractory Die Removal Instructions: Step 1. 2 b. cut and break the base away from the coping. Readapt these areas by hand with a CAPTEK™ instrument or light swedging (See Pages 6-8). Readapt the Copings on the Refractory Die During the firing of CAPTEK™ copings you may experience some lifting from the refractory die at the margins. You can use a small knife to chip away the remaining pieces of investment from inside the coping. Step 3. b. Place the divested coping in acid and remove any remaining investment by cleaning with the aide of an ultrasonic cleaner for 10 to 20 minutes. CAPTEK™ Training Manual Section 5 7/15/05 2 . Seat and Finish the Coping The coping is now ready to be seated on the master die and finished. 4 Note: Recommended Acid: “Super Stripper” or “Super Strip-It. Use tweezers to remove the CAPTEK™ coping from the acid and rinse thoroughly in water Step 4. (See Figure 4) Fig. Note: The more investment left in the coping the longer it will take to remove the investment. avoid any contact with the acid. Remove the Remaining Investment in Acid a.” (See Figure 4) Use safety precautions. The more investment left in the coping the longer it will take to remove it in the ultrasonic cleaner. (See Figure 2) Fig. lingual of anteriors and deep fossa areas of occlusal. Note: During the firing of CAPTEK™ copings you may experience some lifting from the refractory die at the margins. discard the spare die. You will only grind on and finish the last 1 to 2 mm. shoulder-chamfer areas. Position the coping and the hand-piece so the rotation of the grinding tool will remove the extensions from the margins outwards and away from the inside of the coping.2 mm. Readapt these areas by hand with a CAPTEK™ instrument or light swedging. c. (See Figure 1) b. Do not grind on or finish the surface of a CAPTEK™ coping. of the margins of a CAPTEK™ coping. If the margins have lifted carefully adapt the margins including the shoulder-chamfer area to the die with the round end of the CAPTEK™ instrument. of the margins. b. Finishing Directions: Step 1. The processed CAPTEK™ copings will be a uniform thickness throughout (. to .3 mm. 2 Fig. It can be a spare master die or a die from the Capsil duplication mold. If they are different. When spare dies are used always check them for accuracy and compare the fit to the master die. Seat Copings a. Use a rubber wheel. (Option) It is recommended to use a spare die for the initial seating and finishing of CAPTEK™ copings to avoid damaging the master die. There are also resin and epoxy materials available.) requiring less finishing than traditional porcelain-fused-to-metal copings. you may pre-finish with a rubber wheel approximately 50% of the margins thickness. After readapting on the refractory die. 1 CAPTEK™ Training Manual Section 5 7/15/05 3 . (See Pages 6-8) b.Finishing Margins on CAPTEK™ Copings a. Stay with in 1-2 mm. Option before Divesting: a. a small carbide or diamond bur to remove all the overextensions at the margins until the coping is completely seated on the die. 4 Step 3. Be careful not to chip the margins of the die. 5 Note: Hand burnishing can be done at any stage during finishing of the margins. Fig. Fig. The coping should have a passive fit. Remove the Remaining Unwanted Thickness at the Margins Any additional thickness at the margins can be removed with a coarse or medium diamond grinding tool. check the fit of the coping on the master die. Readapt Open or Lifted Margins Use the round end of the CAPTEK™ instrument and carefully hand burnish the margins to the die.Step 2. (See Figures 3 & 4) Fig. Remember to stay within 1 to 2 mm. which if not treated properly. Note: If the coping fits too loose or too tight it can be adjusted by swedging. Evaluate Fit At this point. 3 Important Note: Do not use grinding stones or diamonds for fast bulk cutting of these areas. rubber wheel or carbide bur. (See Pages 6-8 for swedging instructions) Step 4. 6 CAPTEK™ Training Manual Section 5 7/15/05 4 . of the margins. They may roll the material and trap air and grinding materials. (See Figure 6) Fig. Finish Margins Use a rubber wheel or carbide bur to remove the thickness at the margins. can cause gassing during the porcelain firing. (See Figure 5) Step 5. CAPTEK™ Training Manual Section 5 7/15/05 5 . 11 Step 8. (See Figures 9-11) Note: To break any smooth surface tension. Re-burnish if needed. Inflow D can be used to replenish the gold layer on finished CAPTEK™ copings and margins (See Section 8 for Inflow D instructions). 9 Use a brown course Meister Stick Point (by Noritake) or a small tapered fine or medium grit diamond for the final finishing and sealing of the margins. CAPTEK™ Copings are now Ready to Clean and Apply the Bonder (See Section 9 for bonder instructions). you will grind into the “P” layer leaving a slightly less gold color at the margin. (See Figures 9 & 10) Fig. 8 Step 7. 7 Fig. 10 Fig. light texturing of the margins with a fine diamond after hand burnishing is recommended. CAPTEK ™ margins will stretch and elongate during finishing.Step 6. Final Finishing and Sealing of Margins Fig. (See Figure 7 & 8) Fig. Option: When finishing CAPTEK ™ margins. Recheck Margins Always recheck the margins and remove any over extensions after finishing and burnishing. the margins should be slightly thinned for best results. Fig. 2 Important Note Before Swedging: 1. (See Figures 1 & 2) Note: Clay must extend above the metal rims. 3. the margins will sometimes lift away from the refractory die affecting the over all fit. You will find the need to swedge posteriors (molars) more than anteriors. Once CAPTEK™ copings are fitted to the master die or spare die. Under-cuts on dies should have been blocked out during die preparation with a hard resin type material.Swedging of CAPTEK ™ Copings The swedger is a tool used to adjust the fit of CAPTEK™ copings. The expansion and sintering of the refractory dies will also affect the fit. Most copings do not need swedging. Hand burnishing and adapting takes longer and only affects the margins. 2. During the firing of CAPTEK™ copings. The swedger can be used to readapt the entire coping evenly to maintain a passive fit. The clay must be filled slightly above the metal rims as shown below to ensure proper compression when Swedging (remove excess clay from sleeve guide when needed). 1 Fig. CAPTEK™ Training Manual Section 5 7/15/05 6 . Swedger Parts The base and piston have depressions to be filled with clay. CAPTEK™ copings must be free of overextension or flash at margins. This is a natural reaction from the “G” layer being drawn into the “P” layer through capillary attraction. Place the outer sleeve into place and slide the piston down inside the sleeve until fully seated using firm hand pressure. Seat the Coping a. c. Swedge Coping a. b. b. Seat the coping on the master die or spare die. Place the wrapped coping in the base with the occlusal or incisal facing down into the clay and the dowell pin straight up. Place the swedger on the floor or solid surface. Fig. 7 CAPTEK™ Training Manual Section 5 7/15/05 7 . (See Figure 7) Fig.Swedging Directions Step 1. Tap once with the dead blow hammer to compress the clay. Wrap the coping and die with thin plastic sheeting (or Saran Wrap). (See Figure 4) Note: Be sure the coping does not separate from the die. Place the Wrapped Coping in the Swedger a. (See Figure 3) Fig. (See Figures 5 & 6) Fig. 3 Step 2. 6 Step 3. Note: The harder the blow. 5 Fig. not tilted. the tighter the fit. Then strike 2 or 3 times with the hammer. 4 b. (See Figure 11) Fig. Reverse Swedge to Create a Passive Fit You can also loosen the fit of your coping by swedging. 8 a. actually expanding the coping. Step 5. Note: You may repeat swedging as needed to adjust the fit of your coping. 10 Note: Readapting by swedging can be done at any point from the refractory stage through the opaque stage. 9 b. Wrap the coping and die with more plastic sheeting as before and swedge lightly. You are now ready for the final finishing and burnishing of margins.Step 4. Wrap the master die with thin plastic sheeting (Saran Wrap) and place the coping on the die over the sheeting. Fig. Remove the Coping Remove the coping from the swedger and check the fit. Fig. creating a passive fit. (See Figures 8 -10) Note: The plastic sheeting works as a die spacer. Fig. 11 CAPTEK™ Training Manual Section 5 7/15/05 8 . b. Add the extra “P” material for the build-up. Lubricate the desired collar mold form. 1 Step 2. Furnace technique using Pontic Cover material on a completed coping. a cusp tip or incisal. (See Figure 1) Note: Keep track of the amount of extra “P” used for the build-up. 3 Fig.Section 6: CAPTEK BUILD-UP FOR PORCELAIN SUPPORT Because of CAPTEK™’s unique properties you do not need to follow the standard porcelain-fused-tometal rules when designing a coping and building porcelain. but do not fire in the furnace. Applying “P” Material or CAPTEK™ Build-Up Powder during the “P” application. such as narrow occlusals and mesial/distal spaces over 2 mm. CAPTEK™ is a stress free metal and uses a mechanical bonder. (See Figure 3) c. Firmly press scrap “P” material into the mold form. Fig. You will need to duplicate this in the “G” layer. This only applies to areas directly over the coping. (See Figures 4 & 5) Fig. There are two simple techniques to build metal support for porcelain on CAPTEK™ copings: • • Applying “P” material or CAPTEK™ Build-Up Powder during the “P” application. 2 a. thus evening the thickness of the porcelain. (See Figure 2) Fig. 4 Fig. 5 CAPTEK ™ Training Manual Section 6 7/15/05 1 . Option 1: Create a build-up segment with scrap “P” material in the CAPTEK™ collar mold. Complete the “P” application on the refractory die. and not to any areas that will extend off the coping and be unsupported. Step 1. This allows you to build a greater amount of porcelain on the CAPTEK™ coping without building metal support areas. Remove the segment with a knife and burnish into place creating a marginal ridge with a shelf-like appearance. (See Figure 8) Fig. Apply the “G” layer plus extra “G” material to equal the amount of extra “P” material used for the build-up. 9 Fig. (See figure 7) Fig. Mix Build-Up material with Capcon Liquid. apply Build-Up material to the desired area creating a shelf-like appearance. 10 Fig. 8 Step 4. The collar mold and scrap “G” material may also be used to achieve the correct amount of “G” material. With a small brush. (See Figures 9 & 10) Fig. Process the “P” layer with Build-Up on the “P” & “G” Cycle. You will need to duplicate this in the “G” layer Step 3. CAPTEK ™ Training Manual Section 6 7/15/05 2 . (See Figure 11) The coping is now ready for CAPTEK™ Bonder. a.Option 2: Apply “powder” Build-Up material directly to the build-up area. 7 Note: Keep track of the amount of extra “P” used for the build-up. Step 6. 6 b. Seat and finish the CAPTEK™ coping and adjust the Build-Up area if needed. Apply the “G” layer and process in the furnace. 11 Step 5. (See Figure 6) Fig. Mix a small amount of Pontic Cover material with Capcon Liquid. 12 Step 2. Completely finish the CAPTEK™ coping and seat on the articulated model. (See Figure 14) Fig. (See Figure 13) Fig. Process in the furnace. Fig. Shape or add more Pontic Cover material if needed. Close the articulator to check the occlusion for clearance. (See figure 16) Fig. then fire on the Inflow cycle. 14 b.Furnace Technique using Pontic Cover Material on a Completed Coping Step 1. 16 CAPTEK ™ Training Manual Section 6 7/15/05 3 . (See Figure 12) Pontic Cover Material is a mixture of “P” material and gold in a powder form. 13 Step 3. Note: During finishing leave the margins slightly thicker until the build-up is completed to protect the margins during firing. Carefully remove the coping from the model and hold with CAPTEK™ tweezers. Fig. Place the coping on a firing peg and tray. It will be applied and fired in one process. It can be used as build-up material on CAPTEK™ copings. (See Figure 15) c. With a brush. apply the Pontic Cover material to the coping in small increments creating a shelf-like appearance. a. 15 Step 4. Apply Pontic Cover Material. Step 6. Finish the margins and adjust the build-up area if needed. 17 CAPTEK ™ Training Manual Section 6 7/15/05 4 . Remove flux from the coping.Step 5. flux was added to reduce the oxides. (See Figure 17) Fig. Clean and remove the flux from the coping with “Super-Stripper” or “Super Strip-It” for 10-15 minutes in the ultrasonic cleaner. Note: Pontic Cover material was designed for oxidizing cast metals. 1 Note: You can leave the margins of the abutment copings slightly thicker than normal for added protection during firing of the bridge joints.2 mm. Select the proper size pre-cast metal pontic or custom wax and cast the pontic in metal (use recommended high temp alloys). After firing of the bridge joints. (See Figures 3 . If the space is more than 15 mm. you can fill a space up to approximately 20 mm. Position the metal pontic over the copings and mark the pontic arms where to trim.6) Fig. Fit and finish each of the abutment copings and seat them on the model to be used for connecting the bridge together. The same CAPTEK™ bridge rules apply to all techniques (no base alloys): • 1 to 2 pontics in the posterior. • 3 to 4 pontics in the anterior. b. Step 1. occlusal to margin space for a good connector. 2 c. (See Figure 2) Fig. • Inconnect Due to strength considerations and the high firing temperature required of CAPTEK™ materials. Select and Adjust the Metal Pontic a. b. Adjust the arms until the space between the coping and each arm is between 0. Step 2. 3 Fig. 5 CAPTEK™ Training Manual Section 7 7/15/05 1 . you need to check the case for good vertical clearance. complete the final finishing and thinning of the margins. When a posterior bridge has more than one pontic. and 0. Please contact a certified CAPTEK™ representative to consider all other alloys (no base alloys). (See Figure 1) Fig.Section 7: CAPTEK™ BRIDGE TECHNIQUES There are three approved CAPTEK™ bridge techniques: • Traditional CAPTEK™ bridge using Capcon and Capfil. 4 Fig. and that the patient has a good bite and is not a “bruxer”. Seat the Copings on the Model a. you should first measure the space between the abutments. Lightly tack the copings to the model with sticky wax to hold in place. • Cast-to-Coping technique – casting the pontic directly to the CAPTEK™ coping. If the case is ideal. CAPTEK™ uses a 2% gold high palladium alloy for pre-cast pontics.5mm. To align the pontic into position. 11 Fig. (See Figure 8) Fig. Also. Remove the sticky wax at the margins and carefully remove the connected bridge from the model. Connect the Bridge Together Connect all the bridge parts together by luting a metal bar (old bur or a large paper clip) across all the units to be connected with sticky wax and let it cool. It is important to keep the resin luting material away from the gaps left at the connector areas to avoid oxidizing the pontic when removing the resin material with a torch. (See Figure 10) b. 9 Step 5. 12 CAPTEK™ Training Manual Section 7 7/15/05 2 . Fig. (See Figure 7) Fig. place a small amount of CAPTEK™ pontic wax (soft red wax) on the ridge of the pontic. (See Figure 9) Note: Low shrinkage resin material or thick CA glue (Zap-It or similar) can be used to connect the bridge together in place of sticky wax. Check for enough occlusal space. 8 Step 4. avoid having the metal bar touch the adjacent teeth so you can recheck the bridge for fit or rocking on the model. Fig.Note: The pontic arms should never contact the CAPTEK ™ abutment copings. 10 Fig. Remove the positioning wax from under the pontic and place the bridge back on the model and recheck the fit. 7 b. Position the Adjusted Pontic a. Place the pontic on the ridge of the model and move the pontic to the correct position between the abutments. 6 Step 3. Block Out the Interproximal Connector Areas a. (See Figures 11 & 12) Fig. 16 Fig. as it will interfere with the bridge connections. Fig. Place the connected bridge on the flat base of investment and slightly sink the bridge into the base until the excess soldering investment in the copings covers the margins by at least 1.Fig. 13 c. 14 d. 21 CAPTEK™ Training Manual Section 7 7/15/05 3 . Note: Make sure there is enough investment remaining in the bowl to cover the lingual stud on the pontic. 19 c. Remove the bridge and hold with the metal bar. Next use enough investment to form a base about 3/8 inches thick.0 mm. (See Figures 18 & 19) Fig. 17 Fig. Aggressively block out the interproximal areas to keep the investment from filling in these areas. into the investment. Invest the Bridge a. In a small bowl mix the CAPTEK™ soldering investment with water to a thick creamy consistency. 18 Fig. Blot the soldering investment for the base with a paper towel to stiffen and form the base. (See Figures14 & 15) Fig. 20 d. Cut away any wax that has covered over the margin so the margins will extend at least 1. (See Figure 20) e.0 mm. Carefully fill the copings with investment using a vibrator. Fig. (See Figure 13) Fig. Overfill the copings with excess investment above the margins. (See Figures 16 & 17) b. Turn the bridge over and flow soft red rope wax in the interproximal areas from underneath the pontic connector. (See Figure 21) Note: Do not sink the bridge deeply into the investment. 15 Step 6. Fig. but keeping it away from the interproximal connectors. If resin or glue was used. Fig. (See Figures 26 & 27) b. utilizing the inner blue reducing portion of the flame in order to prevent oxides from forming. Occasionally when heating with a torch the investment may break from escaping steam. check the invested bridge for access to the connectors. After the wax or glue is removed. slowly dry and heat the bridge. It is not necessary to heat to red-hot. 25 Fig. 26 c. Remove all wax and residue by heating the bridge connections with the butane hand torch. (See Figure 22) Step 7. With a knife. burn off with a butane hand torch. Use the remaining soldering investment in the mixing bowl to completely cover the lingual stud of the pontic. Trim the base to make it as small as possible to avoid absorbing too much heat during the bridge connection firing cycle. remove any investment that may block easy access with a Capcon brush to the pontic arms and connection areas. b.Fig. The Investment Set Time a. 24 b. Remove the wax with boiling water. 22 f. Remove the Wax and Glue a. (See Figures 24 & 25) (A steam cleaner may break the investment and loosen the pontic) Fig. Note: a. To prevent steam. 27 CAPTEK™ Training Manual Section 7 7/15/05 4 . Step 8. (See Figure 23) Fig. Let the investment set for a minimum of 20 minutes. 23 Note: The size of the base can be adjusted after the initial set with a knife. 31 a. Do not dry. Mix the Capcon Material a. creamy consistency.Step 9. Note: Mix only enough Capcon for each case to ensure best results Fig. (See Figures 31 and 32) This will mix with the flux and completely fill the gap. (See Figures 29 and 30) Fig. 32 b. Next apply a thin layer of mixed Capcon completely around the pontic arms and flare the Capcon onto the abutments. This will enlarge the connecting area slightly and strengthen and support the abutments. (See Figure 28) Fig. Leave a little excess flux directly in the joint. b. Apply the Liquid Flux a. 33 CAPTEK™ Training Manual Section 7 7/15/05 5 . In the other side. apply a thin layer of Pro-Shine liquid flux to all surfaces of the bridge where Capcon will be applied. Note: Try to avoid contact between the investment and the Capcon mixture. 29 b. (See Figure 33) Fig. Fig. leave wet. Apply the mixed Capcon directly into the top of the gap between the pontic arms and the abutments. 30 Step 11. 28 Step 10. Apply the Capcon to the Connectors Fig. Use one side of the Capcon mixing dish and mix a small amount of Capcon powder with Capcon liquid to a thick. With a brush. place Capcon liquid to wet the Capcon brush and to re-wet the Capcon mixture for controlling the consistency and shaping of the bridge connector. 36 b. 38 Step 13. Applying Capfil Gold Strips • • The Capfil gold strips have pre-measured lines to easily measure and cut the correct amount. 39 b. Process in the Furnace a. Place the invested bridge on a firing tray and process in the furnace on the CAPTEK™ “P” & “G” cycle.Option a: You can apply a thin layer of Capcon across the facial of the pontic connecting the two joints. 40 CAPTEK™ Training Manual Section 7 7/15/05 6 . This indicates the complete penetration of the Capcon and the correct amount of Capfil gold. (See Section 1) (See Figure 39) Fig. It should look similar to the surface of a CAPTEK™ coping. 35 Fig. extra Capfil will also be required (1 to 2 lines per pontic). (See Figure 35 & 36) The amount of Capfil used will be determined by the size of the bridge connectors and the amount of Capcon used. (See Figure 40) Fig. 37 c. to 2 ½ to 3 lines for a larger connector. apply Capcon on the pontic wherever a gold color is desired and the Capfil gold will flow across the applied Capcon surface. the Capcon surface should have a shiny. Cut 1½ lines for a small connector. (See Figure 34) Option b: To achieve a gold color on the pontic during the firing of the connectors. After measuring and cutting the Capfil pieces slightly bend into a semi-circle and place on top of each connector. (See Figure 36) Fig. If the Capcon has been applied to the pontic to achieve gold color. allowing the Capfil gold to flow across and even-out the amount of gold between the two joints. 34 Step 12. Fig. (See Figures 37 and 38) Fig. a. slightly textured gold color. After processing. Fig. Note: If too much Capfil gold was used. Note: If a bridge does not fit the model correctly Fig.c. Make the cut as close as possible to the CAPTEK™ abutment and reconnect the bridge following the bridge instructions. Step 14. (See Figure 42) Note: The less investment left on the bridge the less time in acid. 45 CAPTEK™ Training Manual Section 7 7/15/05 7 . 42 Step 15. b. (See Figures 43 . 43 Seat the bridge on the model.45). Seat and Contour the Bridge Connections Fig. (See Figure 41) c. Fig. you will usually find puddling of excess gold on occlusals and around the shoulder chamfer area of the margins of the CAPTEK™ coping. a. Fig. Carefully section the bridge with an ultra thin grinding disk. 44 a. Add small pieces of Capfil or scrap pieces of “G” material onto the Capcon connectors and fire again on “P” & “G” cycle. Place in “Super-Stripper” or “Super Strip-It” acid in the ultrasonic for 10 to 20 minutes to remove remaining investment and flux. Fig. Divest the bridge easily by holding the bridge with a strong pair of hemostats around the pontic. Divest the CAPTEK™ Bridge a. Add more Capcon and re-fire on the “P” & “G” cycle. 41 b. Then tap the hemostats with a metal instrument until the bridge breaks free from the investment. Use a small knife and carefully remove any remaining investment from inside the CAPTEK™ copings. You can remove the excess gold by grinding with finishing tools or b. where indicated contour the connections to the desired shape with the correct finishing tools. If the Capcon has a pale gold color this indicates an insufficient amount of Capfil gold. The Bridge is now Ready for CAPTEK™ Bonder CAPTEK™ Training Manual Section 7 7/15/05 8 . Step 18. Step 17. (Option): Pontic Cover Material a. Seat the bridge and check the margins b. You may also apply a small amount of CAPTEK ™ Inflow to the margins to replenish the gold color if needed. Readapt the margins if needed and do the final finishing of the margins. Note: Do not apply Inflow D too heavy or thick. b. Final Finishing of the CAPTEK™ Bridge a.Step 16. You may gold coat the pontic with Pontic Cover Material. The UCP Bonder will be drawn into the excess Inflow and be melted or rounded over. Applying too much Inflow may adversely affect the UCP Bonder. Both products fire on the same cycle (Inflow firing cycle). Pontic Cover Material is a mixture of CAPTEK™ materials designed to cover the gray cast metal with gold. a. b. the cover material needs more gold added. Test the Pontic Cover Material Test the Pontic Cover material for the correct gold color and texture. After attaching the pontic to the abutments: Step 2. Add approximately 1% of Build-up material to the bottle and shake well. apply a small amount on a spare coping or pontic and fire. CAPTEK™ Training Manual Section 7 7/15/05 9 . c. so go to the next step. If the sample has a dull textured appearance. Contour Pontics a. there is too much gold. Make sure the pontic is free of oxides. and then adjust as needed. Make the pontic slightly smaller. Add approximately a 2% mixture of the Inflow D to the Pontic Cover material bottle and shake well d. Mix a small amount of Pontic Cover material with UCP Liquid. If the sample has a slight shiny textured appearance. similar to a CAPTEK™ coping. With a brush. If the sample as a shiny smooth surface. leaving room for the cover material. Adjust the pontic to the correct size and shape.CAPTEK™ Pontic Cover Material • • CAPTEK™ Pontic Cover material is for covering the oxidized gray metals of cast pontics with CAPTEK™ materials to create a gold appearance. (See repairs Section 8) Instructions Step 1. b. Pontic Cover material may all be used for small repairs on CAPTEK™ copings. this is the correct mixture. Fig. Mix Pontic Cover Material Mix the cover material with UCP Liquid to a thick consistency. fire on the Inflow cycle. apply a thick coat similar to applying opaque. 4 b. During the application of Pontic Cover material. 1 Step 4. If gold color is lost on the CAPTEK™ copings during the firing of Pontic Cover material. Place the CAPTEK™ units on a firing peg and tray. Option: Apply Inflow to CAPTEK™ Coping a. you may re-apply Inflow D and fire to replenish the gold color. Apply Pontic Cover Material a. Process in the Furnace a.Step 3. it is an option to apply Inflow D inside or outside where needed to replenish the gold color. Note: Be careful not to apply too much Inflow D as it can adversely affect the UCP Bonder by melting or rounding over the UCP particles. If the fired Pontic Cover material appears too dull and textured. but still be able to apply it with a brush. (See Figure 1) Note: Adding a drop of Capcon Liquid to your mixture will facilitate a faster drying time for better control and coverage Fig. (See Figures 4 & 5) Fig. With a brush. paint the surface with Inflow D and repeat the Inflow D firing cycle. 5 Step 6. Fig. (See Figures 2 & 3) Fig. 2 b. b. (See Figure 6) Fig. It may take a second thin coat to completely cover the pontic. 3 Step 5. 6 CAPTEK™ Training Manual Section 7 7/15/05 10 . Apply Bonder The covered pontic will be bonded the same as the CAPTEK™ copings. It must be removed before applying bonder or porcelain. CAPTEK™ Training Manual Section 7 7/15/05 11 .Step 7. Remove Flux Clean in “Strip-It” for 10 to 20 minutes in the ultrasonic cleaner to remove the flux. Note: Flux has been added to the Pontic Cover material to reduce oxides on cast metals. Step 8. making a large enough connector to strengthen the coping wall. Seat the copings on the master model. Fig. Process the CAPTEK™ Abutment Copings a. 2 and 3) b. d. splints and metal support areas. Apply a thin layer of sticky wax on the resin material. When the molten metal hits the CAPTEK™ coping the two will alloy together to easily form bridges.The Cast-To-Coping Bridge and Splinting Technique In the Cast-To-Coping technique you will be casting ceramic alloy directly to the CAPTEK™ copings. Wax the Pontic into Place or Splint Copings Together a. During the CAPTEK™ “P” & “G” application add an extra thickness of both the “P” and the “G” material in the connector area of the bridge. 7 CAPTEK™ Training Manual Section 7 7/15/05 12 . 2 Fig. Wax the custom pontic or splint into place. Check the bridge for proper fit. 3 c. Apply a thin layer of cyano-acrylate material (superglue) (Zap It works well) on the CAPTEK ™ coping in the interproximal connector area. (See Figures 1. (Rocking) Fig. Fig. Fig. 1 Step 1. Finish the copings on the master die but leave the margins slightly thicker to protect the margins during divesting. (See Figure 6) c. 5 b. 4 Step 2. 6 Note: Make sure to flare the interproximal connector arms overlapping onto the coping. Use recommended high temperature alloys only. (See Figure 7) Fig. This will allow more room for the cast metal to alloy with the CAPTEK™ coping. (See Figure 5) Note: Wax does not stick well to metal. (See Figure 4) Fig. not leaving any voids. Carefully invest the bridge. b. c. Invest using a ring-less technique with high temperature. fast fire investment. Be careful not to bend the margins. Do not burn out higher than 1550ºF or hold longer than 45 minutes to avoid losing gold color of the CAPTEK™ copings. you must use a high temperature alloy (no base alloys). 10 d. Step 6. (See Figure 8) Note: On small pontics place one sprue in the middle of the pontic Fig. Cast with ceramic alloy to match your porcelain system (CTE) Note: Due to strength considerations and the high firing temperature required of CAPTEK™ materials. Carefully remove the investment from the bridge (do not sandblast). Please contact a certified CAPTEK™ representative to consider all other alloys. Burn out and Cast a. Mix the special liquid/water ratio for less expansion to avoid expanding the CAPTEK™ copings. (See Figure 12) Fig. 11 Step 5.Step 3. 8 Note: Run an auxiliary sprue to any wax that is wrapped around the copings for a metal support area. b. Break away the investment in small pieces with plaster nippers. Sprue the Bridge a. (See Figures 10 and 11) Fig. Follow the manufacturer’s recommendations for the setting time of the investment. away from the coping. Place a sprue in each joint connection at least 1. Fig.0 mm. b. CAPTEK™ Training Manual Section 7 7/15/05 13 . Invest the Bridge a. 9 Step 4. completely filling the coping with investments. (See Figure 9) Fig. Note: Straight water may work well for less expansion. 12 Note: You may lightly tap the button with a small hammer to help remove the investment. Divest Bridge (DO NOT SANDBLAST) a. Connect the sprues to a horizontal bar and the crucible former. Readapt and finish if needed. 13 Step 7. Where indicated. readapt if needed. c. (See Figure 14) Fig. Seat the bridge and check the margins. Seat and Finish Bridge a. (See Figure 13) Fig. Make the cut as close as possible to the CAPTEK ™ abutment and re-connect the bridge following the CAPTEK ™ Capcon bridge instructions. (See Figure 15) Fig. Be careful not to hit the sides on the coping. Remove the investment from inside the coping with a bur.b. Gold Coat the Pontic a. Check the margins. 14 b. CAPTEK™ Training Manual Section 7 7/15/05 14 . Seat the bridge on the model and check the fit. 15 Note: If a bridge does not fit the model correctly. (See Section 5) Step 9. carefully section the bridge with an ultra thin grinding disk. Pontic Cover material is a mixture of CAPTEK™ materials designed to cover the gray cast metal with CAPTEK™ gold materials. contour the connections to the desired shape with the correct finishing tools. Step 8. and complete the finishing. Note: The cast metal may not fully alloy with the CAPTEK ™ coping at the edges of the joint. (Option) You may gold coat the pontic with Pontic Cover material. fill and seal these areas with Pontic Cover material or Inflow. Place in acid for 10 – 20 minutes (Super Strip-It or Super Stripper) and clean in an ultrasonic until the investment is removed. The Bridge is now Ready for CAPTEK™ Bonder. c. (See Figures 1 and 2) b. Fig. Please contact a certified CAPTEK™ representative to consider all other alloys. Step 2. Inconnect Due to strength considerations and the high firing temperature required of CAPTEK™ materials. Position the Connector Bar Connect the copings together by luting a metal bar or stiff wire using sticky wax or glue. 3 CAPTEK™ Training Manual Section 7 7/15/05 15 .5mm. CAPTEK™ uses a 2% gold high palladium alloy for pre-cast pontics (no base alloys). 1 a. Measure and cut the connector piece to length leaving about 0. Cast-to-Coping technique – casting the connector directly to the CAPTEK™ copings. Choose a Connector Bar Option 1: (From Pontic Kit) Choose the appropriate pre-cast connector bar (Anterior or Posterior) Option 2: Wax and cast a connector bar (use recommended high temperature alloys). Measure and Cut the Connector Bar Fig. Fig. gap on each side. (See Figure 3) Note: Low shrinkage resin material or thick CA glue (Zap-It or similar) can be used to attach the connector bar in place of sticky wax. • • • Traditional CAPTEK™ bridge using Capcon and Capfil. Set this connector piece aside temporarily. 2 Step 3.Splinting CAPTEK™ Copings Together All bridge techniques can be used for splinting CAPTEK™ copings. Instructions: Step 1.2 to 0. so the margins can be protected by solder investment. (See Figure 4) Cut away any wax that has covered over the margins. (See Figures 6 & 7) Fig. Invest in the CAPTEK™ soldering investment. (See Figure 5) Fig. 8 CAPTEK™ Training Manual Section 7 7/15/05 16 . 7 Step 9. 5 Step 8. Fig. Step 6. Block out the connector area with wax. (See Figure 8) Fig. Complete the joint by covering the bar with more Capcon. 6 Flux the previously cut connector bar and position into place against the Capcon that was applied on the sides of the copings.Step 4. Step 7. 4 Step 5. Boil off wax Apply Capcon Material Place a thin layer of Capcon on the side of each abutment coping where the connection will be made. Apply Flux to Bar Fig. Step 10. Place Capfil on the Connector Area (See Figure 9) Cut a piece from the pre-measured lines on the Capfil gold strip. depending on the size of the connector. Fig. contour and finish the connector area. Apply Bonder CAPTEK™ Training Manual Section 7 7/15/05 17 . b. Fig. 9 Step 11. After firing. 10 Step 12. Fire on the “P” & “G” Cycle (See Figure 10) a. Use approximately 1 to 2 1/2 lines. Check and finish the margins. Wax a small occlusal (or incisal) rest onto the coping to provide a vertical stop to help hold the pontic in place. CAPTEK™ Training Manual Section 7 7/15/05 18 . Additional support structures can be waxed over and around on the abutment copings depending on case requirements. Fit the copings on the master dies. b. Invest the Pontic a. Follow the manufacturer’s recommendations for mixing and setting time. Seat the CAPTEK™ copings on the model to be used for the bridge connection. 4 Step 4. Anterior bridges will have a smaller connector. c. Wax the pontic according to traditional cast metal design for appropriate porcelain support and strength with a minimum 3 by 2 mm. but leave the margins slightly thick to protect the margins during the firing of the Inconnect material. Process the Abutment Copings a. b. Wax the Custom Pontic into Place a. The connector area (flare) can be larger if needed to create more strength. 2 Fig 1. Sprue the Pontic Sprue the pontic and carefully connect to the crucible former. This can be removed if needed after the connectors are completed. b. Fig. Step 2.Inconnect Material Bridge Technique Step 1. Adjust the special liquid/water ratio for less expansion to create a passive fit (mostly water). (See Figures 1-3) Note: Do not leave excess space between the wax connector and the coping. Fig. connector arm. Step 3. (See Figures 1-3) Fig 3. The connector arms should flare mesial to distal onto the abutment copings approximately 46 mm. in diameter and up to the occlusal marginal ridge. Divest and Seat Pontics a. palladium alloy.Step 5. (See Figure 7) Fig. 7 Step 8. The alloy choice for pontics must have a high yield strength. Connect the bridge parts together by luting a metal bar across the units to be connected with sticky wax or low shrinkage resin material (thick CA glue or Zap-It). Follow the manufacturer’s instructions for burnout time and temperatures. b. Connect The Bridge Together a. resistant to sag and creep. Do not create excess space between the connector and the coping.8 Fig. High gold alloys are not recommended for high CAPTEK™ temperatures and strength considerations. b. It is recommended that the gold content not exceed 65% to 70%. Blot the solder investment with a paper towel to stiffen and form the base. Step 6. (See Figure 9) 19 CAPTEK™ Training Manual Section 7 7/15/05 . Over fill the copings with excess investment above the margins. and a coefficient that is matched to your porcelain. Carefully fill the copings with investment using a vibrator. (See Figure 6) Fig. (See Figure 6) c. 5 c. 6 b. (See Figure 8) c. Step 7. Divest as usual and remove all oxides. In a small bowl mix the CAPTEK™ soldering investment with water to a thick creamy consistency. Next use enough investment to form a base approximately 3/8 inches thick. Position the copings and pontic on the model to be used for the bridge connection. The standard pontic metal for CAPTEK™ bridgework is a 2% gold. Carefully adjust the pontic connectors to passively fit onto the CAPTEK™ abutments. Adjust the interproximal connector flare to the correct size. Invest The Bridge a. Fig. (See Figure 5) Fig. Burnout and Cast a. b. 9 d. Block out interproximal areas with wax to keep investment from filling in these areas. Apply The Inconnect Material (UCP Liquid) a. Step 10. (See Figure 11) b. 11 Fig. (See Figure 11) c. Apply Inconnect to the inside of the connectors and seat the pontic into place. Remove any wax residue with the hand torch being careful not to form oxides on the pontic. Fig. Fig. If resin or glue was used. Trim the base to avoid absorbing too much heat during the firing cycle.0 mm. Remove any investment that may interfere with the removal of the pontic. (See Figure 10) Step 9. Remove Wax And Glue a. b. Note: Flux is not recommended as is it may become trapped within the sealed connector joint causing porosity. Mix Inconnect to a thick creamy consistency with UCP Liquid. The Investment Set Time a. burn off with the butane hand torch. Check the invested bridge for access to the connectors.e. Remove the wax with boiling water. (See Figure 13) CAPTEK™ Training Manual Section 7 7/15/05 20 . Be careful not to lock the pontic into the investment for easy removal. (See Figure 12) d. 10 Place the bridge on the flat base of investment and slightly sink the bridge into the base until the excess investment in the copings covers the margins at least 1. With a knife remove any investment that may interfere with the connector. Remove the pontic from the investment. Let the investment set for a minimum of 20 minutes. Fig. 12 Step 11. 13 b. c. 600º C (930º . Smooth and contour the connector areas as desired. Option: Apply Pontic Cover Material Apply Bonder CAPTEK™ Training Manual Section 7 7/15/05 21 . Place in “Supper. Apply Pontic Cover Material To help prevent oxides form forming. Step 17. 14 Step 13. (See Figure 14) Fig. Place the bridge on a firing tray and process at the same temperature as the “P” & “G” material with a 1-minute hold time. This will help to fill any gaps in the seams and allow for shrinkage. Raise or lower the high temperature as needed. If there are any remaining voids or spaces in the connector seam. Finish the margins Step 16. Dry Time: Entry Temp: Temp Rate: High Temp: Hold Time: 3-4 minutes 500º.Strip It” acid in the ultrasonic for 10 to 20 minutes to remove the remaining investment. fill with Pontic Cover material or Inflow and process on the Inflow cycle. Process In The Furnace (Modified) “P” & “G” Cycle With a One-Minute Hold a. Finish The CAPTEK™ Bridge a. The Inconnect should have a gold sheen and slightly more texture than the CAPTEK™ copings.1100º F) 65º.80º C (120º F . b. b. Divest the bridge from the investment and remove the remaining investment from inside the copings with a small knife or instrument. Fig. completely cover the connector joint with Pontic Cover material. Divest The Captek Bridge a. To Prevent Oxides. c. Step 15.Step 12.Stripper” or “Supper. Do not over thin or remove the flared connector areas on the CAPTEK™ copings. 15 b.145º F) “P”& “G” High Temp 1 minute Step 14. Step 4. Process the Abutment Copings a. Wax a small occlusal (or incisal) rest onto the coping to provide a vertical stop to help hold the pontic in place.5mm thick. in diameter and approximately . 4 Fig. Follow the manufacturer’s recommendations for mixing and setting time. 1 b. (See Figure 4) a. Fig. Sprue the Pontic Invest the Pontic Sprue the pontic and carefully connect to the crucible former. Adjust the special liquid/water ratio for less expansion to create a passive fit (mostly water). Fit the copings on the master dies but leave the margins slightly thick to protect the margins during welding and firing of the Inconnect material. Fig. connector arm. (See Figures 1 and 2) Fig. Step 3. The flare will become larger after welding. To prevent welding through the CAPTEK™ copings it is recommended to apply a double layer of “P” & “G” material in the connector area during the “P” & “G” application. 3 c. c. The connector arms should flare onto the abutment copings approximately 4-5mm. (See Figures 3 and 4) b. Wax the pontic according to traditional cast metal design for appropriate porcelain support and strength with a minimum 3 by 2mm. This can be removed if needed after the connectors are completed. Anterior bridges will have a smaller connector. It will be easier to slightly over wax the connector flare and cut it back after casting. CAPTEK™ Training Manual Section 7 7/15/05 22 . The connector area (flare) can be larger if needed to create more strength. b. Seat the CAPTEK™ copings on the model to be used for the bridge connection. Additional support structures can be waxed over and around on the abutment copings depending on case requirements. Wax the Custom Pontic into Place a.Inconnect Material with Laser or Electric Welding Step 1. 2 Step 2. Follow the manufacturer’s instructions for burnout time and temperatures. Do not create excess space between the connector and the coping. High gold alloys are not recommended for high CAPTEK™ temperatures and strength considerations. Seat the copings on the model for the bridge connection. It is recommended that the gold content not exceed 65% to 70%. resistant to sag and creep. Step 6. Burnout and Cast a. Fig 5. c. and a coefficient that is matched to your porcelain. Divest as usual and remove all oxides. palladium alloy. 8 d. b.Step 5. Sticky wax can be applied to the saddle of the model to allow the glue to be removed without damaging the model. in diameter on the posterior bridge. b. 9 CAPTEK™ Training Manual Section 7 7/15/05 23 . (See Figures 5-7) Fig. The standard pontic metal for CAPTEK™ bridgework is a 2% gold. b. Fig. (See Figures 8 and 9) c. Apply the Inconnect Material (UCP Liquid) a. To help hold the pontic in place during welding you may attach the pontic to the ridge with thick super glue. Adjust the interproximal connector flare to the correct size. Apply Inconnect to the inside of the connectors and seat the pontic into place. they may be larger if needed. with blunt edges for welding.5mm. Do not make the connector smaller than 3-4 mm. 6 Fig 7. The thickness should be approximately . Carefully adjust the pontic connectors to passively fit onto the CAPTEK™ abutments. The alloy choice for pontics must have a high yield strength. Divest and Seat Pontics a. Fig. Step 7. Mix Inconnect to a thick creamy consistency with UCP Liquid. Weld the buccal and lingual flare areas in an “X” pattern: First weld one side of a connector to its abutment coping and then weld the opposite side of the other connector to its abutment coping. 12 b. Repeat this for the remaining two welds. Direct the weld at the blunt edge of the connection flare. 10 b. and to fill any open seams (the Inconnect may shrink slightly). added thickness and additional strength to the coping and connector. (See Figure 14) Fig. The weld must be strong enough to secure the bridge during the Inconnect firing.80º C (120º F . 11 Step 9. Fig.1100º F) 65º. The Inconnect and Pontic Cover material should have a gold sheen but have slightly more texture than the CAPTEK™ copings.600º C (930º . Place the bridge on a firm pillow tray or metal firing pins and process and fire at 15ºC (25ºF) below the “P” & “G” firing temperature. Add Pontic Cover material around the connector to help prevent oxides from forming. Process in the Furnace a. Four spot welds will be necessary to secure the pontic. (See Figures 10 and 11) c. This will help create more flare. (See Figure 12) Fig. Raise or lower the high temperature as needed. Fig. Weld the Pontic into Place a. 14 Dry Time: Entry Temp: Temp Rate: High Temp: Hold Time: 3-4 minutes 500º. Fig.Step 8. Direct the weld at a slight angle toward the coping in order to extend or push the cast metal onto the CAPTEK™ copings. (See Figure 13) Note: In many ovens this will be the same temperature as the High Calibration cycle. 13 c.145º F) Approximately 15º C (25º F) below the “P” & “G” Temp 1 minute CAPTEK™ Training Manual Section 7 7/15/05 24 . Option: Apply Pontic Cover Material Apply Bonder CAPTEK™ Training Manual Section 7 7/15/05 25 . Step 12. Do not over thin or remove the flared connector areas on the CAPTEK™ copings.Step 10. Finish the Captek Bridge a. (Figures 15 and 16) b. Fig. Finish the margins. Fig. 16 Step 11. 15 Smooth and contour the connector areas as desired. (See Figures 1 and 2) Step 3: Remove the Coping Remove the coping from the die and check to see if the repair is complete. 3 Use repair paste or “P” material and adapt it into the repair area slightly overlapping the material onto the CAPTEK™ coping. but takes a little practice and experience. Fig. (See Figure 3) CAPTEK ™ Training Manual Section 8 7/15/05 1 . Step 2: Apply Repair Material Fig. even after the coping is divested. 1 Fig 2. short or damaged margins on the CAPTEK™ coping: Oven Repair Technique Step 1: Paint the die with a release agent (die lube).Section 8: REPAIRING OF CAPTEK™ COPINGS AFTER DIVESTING CAPTEK™ copings have the unique ability to be easily repaired during each stage until the porcelain is applied. To repair holes. The safest and easiest technique for repairing a CAPTEK™ coping is to fire the repaired coping in a porcelain furnace on the Inflow D cycle. The butane hand torch technique is faster. (See Figure 5) Fig. Apply Repair Material Use repair paste or “P” material and adapt it into the repair area slightly overlapping the material onto the CAPTEK™ coping. Note: A thin layer of Inflow may be applied inside or outside of the coping to replenish or maintain the gold color during the repair cycle. Step 2: Remove the Coping Remove the coping from the die and check to see if the repair is complete. With a brush apply a thick drop of Inflow D gold to the repair area. Step 1: Step 2: Paint the die with a release agent (die lube). Step 6: Check the Repair Seat the repaired coping on the die. Step 5: Process in the Furnace Fire in the furnace on the Inflow D cycle (See Calibration Section). CAPTEK ™ Training Manual Section 8 7/15/05 2 . (See Figure 4) Fig 4. 5 Butane Hand Torch Technique The Butane hand torch technique is faster but takes a little practice and experience.Step 4: Apply Inflow D Paint a thin amount of Inflow D to the repair on the inside of the coping. Make sure to apply enough Inflow D to completely fill and penetrate the repair area with gold. smooth and finish the repair area. melt an equal amount of “G” material on the repair area. With a butane hand torch heat the CAPTEK™ coping slowly to avoid swelling of the wax in the repair material. (Option) You may substitute Inflow D for “G” material. c. With the butane torch heat the coping until the gold melts and completely penetrates through the repair. Note: Avoid applying the flame directly on the margins. b. fusing the repair “P” material.Step 3: Fire with a Butane Hand Torch a. smooth and finish the repair area. Step 4: Seat the repaired coping on the die. Heat the coping by aiming the flame from incisal or occlusal downward towards the margins. leaving a gold color on the inside of the repair. which flows at a lower temperature. While the coping is still hot. CAPTEK ™ Training Manual Section 8 7/15/05 3 . Heat the coping to red-hot. (See Figures 1-3) Step 3: Remove the Coping After letting the repair dry.Oven Repair Using Pontic Cover Material Step 1: Paint the die with a release agent (die lube). 2 Fig. Mix Pontic Cover material with Capcon Liquid to a thick creamy consistency. 1 Fig. smooth and finish the repair area. 3 With a brush apply Pontic Cover material to the repair area. Slightly overlap the material onto the CAPTEK™ coping. 4 CAPTEK ™ Training Manual Section 8 7/15/05 4 . Step 2: Mix Pontic Cover Material with Capcon Liquid. Fig. (See Figure 4) Fire in the furnace on the Inflow D cycle (See Calibration Section). remove the coping from the die and check to see if the repair is complete. Let the repair dry for 5-10 seconds or until the liquid sheen is gone. Step 3: Apply Pontic Cover Material Fig. Step 5: Step 6: Process in the Furnace Check the Repair Seat the repaired coping on the die. paint a thin layer of Inflow D on the areas you need to replenish the gold layer (inside or outside). For copings that are low in gold color. Fig. Remove excess gold by finishing or re-firing on the Inflow D cycle. 2 Note: For best results and penetration process in the furnace. 4 CAPTEK ™ Training Manual Section 8 7/15/05 5 . The UCP Bonder will be drawn into the excess Inflow and be melted or rounded over.5) Repeat this step if the Inflow penetrates and disappears leaving the coping dull.CAPTEK™ Inflow D Material Inflow D is used to replenish the gold layer on CAPTEK™ copings after they are divested. (See Figures 3 . • Copings that are low in gold color.com Fig. • Small repairs in conjunction with CAPTEK™ repair paste or “P” material. For finished margins or gray dull areas. (See Figure 1) Note: Do not apply Inflow D too heavy or thick. 3 Note: Excess Inflow D or “G” material on the coping can adversely affect the UCP Bonder by melting or rounding over the UCP particles. b. Fig. it will puddle and affect the fit (coping will not fully seat). For best results fire the Inflow D in a porcelain furnace. Mix Inflow D Powder with Inflow Liquid (IPC) to a creamy paste (similar to paste opaque). (See Figure 2) Note: Be careful not to apply too much inside the coping. (See repairs) Step 1. • On areas where the gold has been finished away. Inflow D is used for: • Gray dull areas inside and outside the copings. Fig. john@gcgr. Apply Inflow D a. Applying too much Inflow may adversely affect the UCP Bonder. 1 Step 2. a thin layer can be applied over the completed coping to replenish and brighten up the gold layer. Mix Inflow D a. ENTRY TEMP DRY TIME: TEMP RATE: HIGH TEMP: Fig. 5 HOLD TIME: 600º C (1100º F) 2 minutes 80º C (145º F) UC Calibration Temp (See UC calibration section) 30 seconds Step 3. Process the Inflow D in the Furnace Option: Firing Inflow with a Butane Hand Torch Note: Inflow D does not penetrate as well using the torch technique and may adversely affect the UCP Bonder. Processing in the furnace is the easiest, safest and the most effective technique. a. Adjust the butane hand torch to the desired flame. b. Hold the CAPTEK™ coping with CAPTEK™ tweezers and heat the coping until the Inflow D flashes and penetrates the coping. c. Rotate the coping in the flame to fire all sides of the coping evenly. Remove from the flame immediately. Note: Avoid applying the flame directly on the margins. Heat the coping by aiming the flame from incisal or occlusal downward towards the margins. CAPTEK ™ Training Manual Section 8 7/15/05 6 Section 9: CAPTEK™ BONDING AGENTS UCP Bonder Application (Universal Coupler Porcelain) UCP Bonder uses small particles of “P” material to create a mechanical bond. UCP is a mixture of “P” particles and gold. When fired, the gold melts and coats the “P” particles, attaching the particles to the CAPTEK™ coping. • • • UCP Bonder will be the last step in fabricating a CAPTEK™ coping. Use the CAPTEK™ tweezers whenever holding a CAPTEK™ coping off the die, as hemostats or other instruments may damage the coping. The UCP Bonder will be applied to the surface of the CAPTEK™ coping in a thin even layer to create a mechanical bond and a long interface between the porcelain and the CAPTEK™ metal, reducing stress and propagation of cracks in the porcelain. UCP Bonder Instructions Note: Excess Inflow D or “G” material on the coping can adversely affect the UCP Bonder by melting or rounding over the UCP particles. Remove excess gold by finishing or re-firing on the Inflow D cycle. Step 1. Clean the CAPTEK™ Coping Clean the CAPTEK™ coping before applying the bonder. Handling and finishing will leave oils and grinding residue on the surface. Do not handle after cleaning. Option a: With a hand torch, evenly heat the CAPTEK™ coping by waving the flame around the coping to a slight red glow (not red hot). (See Figure 1) Option b: Place the coping in (Strip-It) acid and then into an ultrasonic cleaner for 5 minutes. Fig. 1 Step 2. Mix the UCP Bonder a. Shake the UCP Bonder jar thoroughly prior to dispensing into a mixing jar to completely mix the high and low fusing particles. b. In a mixing jar, mix a small amount of UCP Powder with UCP Liquid. The UCP mixture should be mixed thin enough to be easily applied with a brush. (See Figures 2 and 3) 1 Fig. 2 CAPTEK ™ Training Manual Section 9 7/15/05 Note: It is VERY important to mix thoroughly or the high and low fusing particles can separate, negating the effectiveness of the bonder! c. Mix only enough UCP Bonder for that day. Mix in new UCP Bonder each day to prevent settling and clumping of the bonder material. Fig. 3 Note: Always keep containers covered to prevent contamination from dust particles. If containers become contaminated start with fresh bonder. Step 3. Apply the UCP Bonder a. Place the coping back on the die or hold the coping with CAPTEK™ tweezers. Note: Avoid touching the surface of the coping Fig. 4 b. With a brush, use long strokes and apply a thin even layer over the entire surface to be covered with porcelain. Do not let it puddle. Do not dab with the brush, this will create thick areas of UCP Bonder trapping air. Do not apply too thick; you should see some of the CAPTEK™ coping reflecting through the bonder. (See Figure 4) Step 4. Process in the Furnace Place on a firing peg and tray and fire in the furnace on the UCP firing cycle (See Section 1) (See Figures 5 and 6) Note: After firing, the UCP Bonder should have a textured surface and a lighter gold color than the reflective gold coping. If the UCP Bonder looks shiny or rounded over after processing, it was either over-fired or had too much gold on the coping. This will compromise the bonder. Lightly resurface the coping with a diamond bur and reapply the UCP Bonder. Fig. 5 Note: Avoid touching the surface of the CAPTEK ™ coping after firing of the bonder. If the coping is handled after firing the bonder, clean by firing in the furnace to 750ºC and hold for 30 seconds OR place in (Strip-It) acid in the ultrasonic for 5 to 10 minutes. Fig. 6 Step 5. Opaque application The coping is now ready for the opaque application. CAPTEK ™ Training Manual Section 9 7/15/05 2 Step 2. Place the coping in (Strip-It) acid and then into an ultrasonic cleaner for 5 minutes. 1 b. Mix in new Capbond material each day to prevent settling and clumping of the Capbond. The Capbond mixture should be as thick as possible but still be able to apply with a brush. Clean the CAPTEK™ Coping Clean the CAPTEK ™ coping before applying the bonder. Capbond will be the last step in fabricating a CAPTEK™ coping. Use the CAPTEK™ tweezers whenever holding a CAPTEK™ coping off the die. Do not handle after cleaning.Capbond Application • • • • Capbond uses small particles 99% gold approximately 25 microns in size to create a mechanical bond The bonder will be applied to the surface of the CAPTEK™ coping in a thin even layer to create a mechanical bond and a long interface between the porcelain and the CAPTEK™ metal. reducing stress and propagation of cracks in the porcelain. (See Figures 2 and 3) Fig. as hemostats or other instruments may damage the coping. Mix the Capbond a. Handling and finishing will leave oils and grinding residue on the surface. 2 b. (See Figure 3) Fig. mix a small amount of Capbond Powder with Capbond Liquid or UCP Liquid. With a hand torch. Options a. 3 CAPTEK ™ Training Manual Section 9 7/15/05 3 . Mix only enough Capbond for that day. In a mixing jar. evenly heat the CAPTEK ™ coping by waving the flame around the coping to a slight red glow (not red hot) (See Figure 1) or Fig. Capbond Instructions Step 1. Fig. Apply Capbond a. Do not dab with the brush. 4 Option: The bonder can be dried at the muffle opening to set the bonder in place. 6 If the coping is handled after firing the bonder. Note: Avoid touching the surface of the coping. you should see some of the CAPTEK™ coping reflecting through the bonder. Fig. CAPTEK ™ Training Manual Section 9 7/15/05 4 . Process in the Furnace Place on a firing peg and tray (See Figure 5) and fire in the furnace on the Capbond cycle (See Section 1). use long strokes and apply a thin even layer over the entire surface to be covered with porcelain. With a brush. Fig. Place the coping back on the die or hold the coping with CAPTEK™ tweezers. Opaque Application The coping is now ready for the opaque application. Do not apply too thick. (See Figure 4) Step 4. (See Figure 6) Note: Avoid touching the surface of the CAPTEK™ coping after firing of the bonder. b. clean by firing in the furnace to 750ºC and hold for 30 seconds OR place in (Strip-It) acid in the ultrasonic for 5 to 10 minutes. Do not let it puddle. 5 Step 5. this will create thick areas of Capbond trapping air. c.Step 3. to .2 mm. 1 c. it will transfer to the inside of the CAPTEK™ coping. Do not use firing pegs with opaque attached. A second thin layer will be applied just thick enough to achieve the proper color to match the shade guide. b. of opaque to completely block out the metal. Apply a Wash Opaque layer a. Small amounts of opaque are very hard to see on gold and you cannot sand blast the opaque off without removing the gold layer of the CAPTEK™ coping. CAPTEK™ has no oxides and a warm gold color that only requires 1/3 (. Check and remove any opaque on the inside of the coping and then fire on the opaque firing cycle. Place the coping on the die or hold with the CAPTEK™ tweezers. With traditional gray oxidizing metals it takes from . (See Figure 1) Fig. The opaque will be applied in 2 layers: • • • The first layer is a thin wash coat that is worked into the bonder and fired. Opaquing Instructions: Step 1. It’s very important to keep the opaque from getting on the inside of the CAPTEK™ coping. Thin the opaque mixture and apply a thin wash coat. creating an optical effect. This will allow light to penetrate through the thin layer of opaque and reflect out from the CAPTEK™ coping and the bonder. 2 CAPTEK™ Training Manual Section 10 7/15/05 1 . (See Figure 2) Fig. working it into the bonder.05) the opaque compared to gray oxidizing metals.3 mm.Section 10: OPAQUING CAPTEK™ COPINGS Opaquing CAPTEK™ Copings Opaque on CAPTEK™ is no longer a block-out material but a color coat. Note: CAPTEK™ copings should not be handled after firing of the bonder. (See Figure 4) b. remove it carefully with a grinding tool or place porcelain etching gel in the coping and dissolve the porcelain and rinse clean. The coping can still be re-adapted or swedged at this stage. Second Opaque Layer a. Process in the Furnace Follow the porcelain manufacturer’s opaque firing cycles. Seat the CAPTEK™ coping back on the die and check the fit. Fig. 4 c. 3 Step 3. (See Figure 3) Fig. Check and remove any opaque on the inside of the coping and then fire on the opaque firing cycle.Step 2. CAPTEK™ Training Manual Section 10 7/15/05 2 . If the opaque is found on the inside of the coping. Apply the second slightly thicker layer covering the bonder. metal collars. Liquid for applying Capcon Powder and Build-Up Powder. Also used in conjunction with Pontic Cover material for repairs. CAPTEK™ wax and metal sheets used to form posterior copings Investment for soldering CAPTEK™ bridges and splints. Polyvinyl Siloxane (silicone) for duplicating master dies. CAPTEK™ wax and metal sheets used to form anterior copings Powder for building CAPTEK™ metal linguals. High Temperature Calibration for CAPTEK™ high temperature processes. Butane torch for repairs and cleaning CAPTEK™ copings.CAPTEK™ GLOSSARY OF TERMS Adhesive: Big Shot Torch: CAPTEK™ Calibration Kit: (Ritemp) Capbond Liquid: Capbond Plus: Capcon Liquid: Applied to the refractory die to adhere the CAPTEK™ “P” material to the die. Liquid for applying Capbond. 1 Capcon Powder: Capfil: Capsil “A” & “B”: CAPTEK™ Adapting Instrument: CAPTEK™ Anterior: CAPTEK™ Build-up: CAPTEK™ Posterior: CAPTEK™ Soldering Investment: CAPTEK™ Tweezers: Capvest: CAPTEK™ Training Manual Glossary 7/15/05 . Bonding agent for porcelain interface to CAPTEK™ copings. and porcelain support (mix with Capcon Liquid). bonding and opaquing. Inflow. For holding CAPTEK™ coping during repairs. Refractory die investment. “G” in a solder form for Capcon joint connections. For adapting and shaping the wax “P” & “G” material and readapting CAPTEK™ copings. “P” & “G” and bridge materials. For bridge joint connection and splinting CAPTEK™ copings. For initial adapting of the wax “P” layer to the refractory die. Inflow D and Pontic Cover. Inflow Liquid (IPC): Margin “P”: Pneumatic Adapter (P Press): Pontic Cover (LT2 ): Pro-Shine Liquid Flux: Relief Spray: Repair Paste: Scalpel & Blade: Swedger & Dead Blow Hammer: UC Bonder: UC Calibration Kit: UCP Bonder: UCP Liquid: CAPTEK™ Training Manual Glossary 7/15/05 2 . Advanced bonder for composite resin interface to CAPTEK™ copings.Duplicating Flask: Inconnect: Inflow D: Flasks for duplicating the master dies. For gold coating cast metal pontics. Liquid for applying UCP Bonder. To reduce oxides on cast alloys during the bridge joint connection and splinting. Inconnect and Pontic Cover material. Capbond. Advanced bonding agent for porcelain and composite resin interface to CAPTEK™ copings. For replenishing the gold layer on finished margins or dull gray areas (inside or outside) on CAPTEK™ copings. Re-adapting CAPTEK™ copings on dies after the processing of the “P” & “G” material. A powder used for bridge connections. A thick wax and metal sheet for large metal collars and build-ups during the “P” layer process. For cutting and carving “P” & “G” material. UC Bonder. Low temperature calibration for Bonder. Used to relieve surface tension in the duplicating molds. Liquid for applying Inflow D. and to make repairs in conjunction with “P” material or Repair Paste. Combination of wax and metal paste for repairing copings before and after divesting.