NuSil operates state-ofthe-art laboratories and processing facilities in North America. The ability of silicone to reduce stress on devices in harsh environments and at extreme temperatures makes it a reliable material in a variety of industries. providing on-site. offering precise and predictable material performance. • Potting compounds • Encapsulants • Gels • Non-reactive fluids and greases • High elongation elastomers • Hard resins • Adhesives and sealants • Coatings • Foams • Thermally and electrically conductive adhesives and sealants • Functional and non-functional polymers • Gap Fillers Silicones for Engineering Applications Low modulus and low glass transition point enable silicone to remain elastic at low temperatures and resist degradation at high temperatures or in UV light. With silicone’s unique inherent properties and unparalleled versatility. 1 Ice-phobic coatings are the prominent topic of SAE’s soon-to-be-released Aerospace Information Report (AIR) 6232. For example. Below is a list of the types of high quality. unique array of properties silicones provide—to deliver a full range of silicone materials to meet many diverse requirements. and fluorosilicones resist swelling when in contact with various hydrocarbon materials. It is the user's responsibility to adequately test and determine the safety and suitability for their applications and NuSil Technology makes no warranty concerning fitness for any use or purpose. in-person application engineering support worlddwide. high performance silicone materials we offer. some of NuSil’s fluorosilicone coatings also show very favorable ice-phobic performance. Further. from electronics to aircraft. to aerospace. significantly reducing the adhesion of ice on aerodynamic surfaces. What differentiates NuSil from other silicone suppliers is our commitment—afforded by our capacity to optimize the vast. Thermally conductive fillers such boron nitride make silicones excellent Thermal Interface Materials (TIMs) for the transfer of heat between components. phenyl silicones are known for a high refractive index (RI) and broad operating temperature. electrically conductive fillers like carbon and silver can be incorporated into silicone for protection against static accumulation and discharge that can damage sensitive electronic components.ENGINEERING MATERIALS SELECTION GUIDE NuSil Technology is a global leader in the formulation and manufacture of silicones for the engineering industries. new uses such as this continue to emerge. ISO 9001-certified since 1994 and AS 9100-certified since 2008. such as Jet A or JP-8 engine fuels or cleaning solvents. In addition to providing solvent resistance. Key to the popularity and the legacy of silicone in the engineering industries is its ability to be tailored to meet the needs of the intended application. 1 1 . It is the sole responsibility of each purchaser to ensure that any use of these materials is safe and complies with all applicable laws and regulations. prefixed EPM.01% CVCM 125°C @ 10-5 torr for 24 hrs. prefixed CV.Low Volatility Materials As a testament to our expertise.10% Collectd Volatile Condensable Material (CVCM) 125°C @ 10-5 torr for 24 hrs. NuSil can vary the degree of processing in order to meet the desired levels for common contaminants. While standard materials meet no outgassing or ion criteria. Our electronic packaging materials. This is of utmost importance in aerospace applications. our controlled volatility products. Whether or not the application at hand is extraterrestrial.10 % TML ≤ 0. these are common in photonic applications. Low Volatility requirement is ≤ 1% @ 275°C for 1 hour ASTM D 2288 Low Ion Content: < 20 ppm of individual Na. materials for which the National Aeronautics and Space Agency (NASA) and the European Space Agency (ESA) carefully assess volatile content prior to use in space.0 % Total Mass Loss (TML) ≤ 0. mitigation of volatiles is essential in space and terrestrial applications in which sensitive electronics are repeatedly exposed to these conditions. are tested per lot per ASTM E 595 for TML% (Total Mass Loss) and CVCM% (Collected Volatile Condensable Materials). Tested per ASTM E 595 per lot and must meet: ≤ 0. the rest meet or exceed the volatility allowances for various markets. (For more information on low outgassing testing. please see our “ASTM E 595 Test Method” tear sheet. Because a vacuum environment compounds the propensity of volatiles to condense on device components at elevated temperatures. device functionality depends upon avoiding the contamination caused by the volatile species. such as ions and low molecular weight species associated with outgassing. In compliance with space agency specifications. are tested per lot per ASTM D 2288. prefixed SCV. K and Cl ions per MILSTD 883E No outgassing or ion criteria Successful performance history Multiple Applications Heritage 2 . Tested per ASTM E 595 per lot and must meet: ≤ 1.) NuSil’s processing accommodations are shown in the pyramid below. and our Ultra Low OutgassingTM materials. NuSil’s silicones are categorized for application suitability as dictated by their outgassing levels. from standard at the bottom to Ultra Low OutgassingTM at the top. 9) 40 (7.075 1.000 31.000 (6.5) 150 (26.700 (11. H 30 m / 150 15 m / 150 15 m / 150 30 m / 150 24 h / R . A ll P urpose P otting & E ncapsulant M edium w ork tim e.6) 475 (3.6) 80 (14.3) 1.4) 900 (6.5 h 24 h 12 h - 7 d / R .Do not use as a basis for preparing specifications.100 (7.6) 260 (45.7) 500 (3. H : 45 M / 75 °C : 135 M / 150 °C S olventless A dhesive.000 850 750 550 660 525 400 250 60 (10. H 5 m / 177 2 h / 65 2 h / 65 30 m / 150 60 m / 150 24 h / R .09 1.000 A :85..5) 100 (17.9) 50 (0.T . H 7 d/ R .6) 100 (17. G ood A dhesion M edium D urom eter Low V iscosity P ost C ure D urom eter T ype A 75 Low viscosity.225 1:1 1:1 1:1 1:1 1:1 10:1 1:1 1:1 10:1 1:1 1:1 1:1 10:1 10:1 1:1 1:1 1:1 1:1 1:1 1:1 10:1 10:1 10:1 1:1 1:1 100:0.000 5.12 1.000 / B :65.01 1.1) 750 (5.1) 235 (40.2) 1.650 (11.6) 1.41 1. A dhesive F ast C ure A dhesive T ough E lastom er Flowable. V olum e R esistivity 1x10 1 5 ohm ·cm Low / H igh T em perature.000 N on-slum p A :120.7) 1.6) 110 (19.T .8) 750 (5.10 1.000 A :80.175 (8.100 (7.6) 1.5) 150 (25.350 (9.500 / B :1. Q uick C ure E lastom er Longer W ork T im e High Power Electronics Low V iscosity.9) 225 (35.8) 1. Q uick C ure E lastom er Longer W ork T im e..T .250 (8.500 600 650 1:1 1:1 1:1 1:1 1:1 C lear C lear C lear C lear C lear C ure: 30 M / 25 °C : 45 M / 75 °C : 135 M / 150 °C .600 10:1 G ray 0.8) 250 (1.4) *2 ) 600 (4.000 / B :T hixotropic A :83.000 (6.T .3) 110 (0. H 72 h / R .T .7) 1.T .000 A :96..16 1. H 15 m / 150 24 h / R .5 h - 30 / 150 1.200 (8. Ice P hobic..7) 675 (4.3) 900 (6.1) 65 (11.9) 1.T ..5) 20 (3. H 1.1) 80 (14.08 1.6) 1.9) 1.500 9.7) 250 (44.275 Z ahn C up.09 1.09 1.15 1. H : 5 m / 150 C ure: 30 M / R .T ype '00' 65 Low / H igh T em perature E lastom er S prayable F ilm A dhesive R 2-6755 G E L-8100 G E L-8150 G E L1-8155 G E L-8170 G E L-8250 M edium G E L.000 A :0.7) 1. H igh D urom eter.14 1. Cure: 5 m / R . 29% S olids D ispersion C oating / C onform al.12 1. Longer W ork T im e F low able...2) 525 (3. T ough E lastom er Low /H igh T em perature.3) 950 (6.3) *1 ) 235 (1.T .050 1.000 A :83.6) *1 ) 205 (1.000 800 100 325 350 350 750 750 300 320 400 400 625 1.0) 1.000 / B : 50. F low able H igh T em perature.2) 1.T . H 15 m / 120 30 m / 150 30 m / 150 10 m / 150 60 m / 100 60 m / 100 30 m / 150 7 d / R . H S ee C om m ents S ee C om m ents S ee C om m ents S ee C om m ents 30 m / 150 7 d / R . G lob T op Low / H igh T em perature.000 9.200 95 (16.0) - - 50 g/m in A :80 g/min / B : 110 g/min A :45 g/min / B :65 g/min A :40g/min / B :50 g/min A :100 g/min / B :120 g/min A :160 g/min / B :300 g/min A :45 g/min / B : 75 g/min A :45 g/min / B :110 g/min A :25 g/min / B :70 g/min A :25 g/min / B :110 g/min 1:1 1:1 1:1 1:1 1:1 1:1 1:1 1:1 1:1 1:1 T rans T rans T rans T rans T rans T rans T rans T rans T rans T rans R -2200-11 C asting.07 1..12 1. F ast C ure E lastom er Longer W ork T im e.10 1. H 7 d / R .3) 40 (7.1 C lear LS R -5805 LS R -5810 LS R -5815 LS R -5820 LS R -5830 LS R -5840 LS R -5850 LS R -5860 LS R -5870 LS R -5880 Liquid Injection M olding. C reating M olds P latinum > 2. Ice P hobic. Non .3) 500 (3.8) 150 (1. N on-slum p A dhesive.03 1.T . N on-slum p A dhesive.000 / B : 50.ENGINEERING MATERIALS General Purpose NuSil Product Number Cure System Comments Work Time Tack Free Time Cure Time / Temp °C Specific Durometer Gravity Type A Tensile psi (MPa) Elongation % Tear ppi (kN/m) Lap Shear Dielectric Strength psi (MPa) V/mil Flow (Inches) Viscosity (cP/mPa�sec) Extrusion (g/min) Mix Ratio Color TWO PART GELS MOLD LIQUID SILICONE RUBBERS MAKING THREE (LSR) PART ADHESIVES & SEALANTS ONE PART COATINGS Properties listed are typical .000 / B :20.1) *2 ) 625 (4.12 1. P enetration 5 m m • = Designed for Broad Operating Temperatures • • • ••• •• • P latinum P latinum 4h P latinum P latinum P latinum 2h d = day h = hour m = m inutes m m m m m m m m m m / / / / / / / / / / 150 150 150 150 150 150 150 165 165 165 60 m / 100 30 m / 100 30 m / 150 90 m / 80 30 m / 100 R .500 / B :40.1) 300 (52.2) 125 (21.2) 1.300 (9..03 1.7) 650 950 350 1.20 1.12 1.7) 825 (5.1) 1.97 0.000 / B :90 A :6000 B :2500 A :30.07 1.050 1.96 1. Please contact NuSil Technology for assistance and recommendations.5 Inches 1.4) - - A :48.9) 1.14 0.96 1. H igh T ear E lastom er A ll P urpose. Light-weight Elastomer M edium V iscosity. P enetration 0.290 (8.22 1.1 M P a) H igh T em perature E lastom er Thermally Stable Silicone P otting E lastom er S hort W ork T im e.3) 1.400 (9. A ll-purpose.8) 125 (22.500 A : 80.5) 35 (6.08 1.0 g/min A :40.550 (10.10 1.9) 900 (6.T .000 A :70.000 (6.6) 75 (13.0) 20 (3. 3 R -1009 R -1082 R 3-1075 R -1182 R -2180 R -2180-2 R -2182 R -2183 C F 19-2615 R -1130 R -1140 R 2-1140 R 4-1140 R -1400 R -1600 R -2140 R -2145 R 1-2145 R -2160 R -2175 C F 15-2186 C F 19-2186 R -2186 R -2186-2 R 28-2186 R 31-2186 R 32-2186 R 33-2186 R 34-2186 C F 1-6755 R -2185 C F 2-2186 C F 16-2186 C F 20-2186 R -2188 R -2550 R -2560 R -2588 R -2615 R -2615-3 R 21-2615 R -2620 R -2652 R -2655 R -2684 D ispersion C oating / C onform al.9) 1.5) 70 (12.4) 60 (11.2) 1. C up #2.8 10:1 1:1 1:1 10:1 10:1 10:1 2-Part T rans T rans T rans T rans T rans B lack T rans T rans C lear T rans T rans T rans T rans B lack C lear G ray G ray G ray R ed B lack T rans T rans T rans B lack T rans T rans T rans T rans T rans C lear W hite T rans T rans T rans T rans T rans R ed R ed C lear R ed C lear T an C lear C lear T rans B etter A dhesion to P olycarbonate P latinum - - 30 m / 150 1.24 60 800 (5. 20% S olids L ow CoF.9) 700 (4. H igh T ear E lastom er N on-slum p F low able. H 72 h / R .5) 70 (12.09 1.T . H igh D urom eter P latinum P latinum P latinum P latinum P latinum P latinum P latinum P latinum P latinum P latinum > 72 > 72 > 72 > 72 > 72 > 72 > 72 > 72 > 72 > 72 h h h h h h h h h h - 5 5 5 5 5 5 5 5 5 5 1.7) 650 (4.10 1..9) 750 (5.050 (7.9) - - A :150. Low D urom eter A ll P urpose.20 7 11 15 20 30 40 50 60 70 80 450 (3.10 1.5 100:0. = R oom T em perature H = H um idity P rim ed w ith S P -120 P rim ed w ith C F 1-135 *3) P rim ed w ith S P -270 *1) *2) g/min = G ram s P er M inute T rans = T ranslucent 4 .9) 975 (6.600 4. H 7 d / R .000 A : 13. 20% S olids C ure: 30 M / 25 °C : 45 M / 75 °C : 135 M / 150 °C .8) 325 25 (4.4 m m .7) - 1.5 100:3.12 45 25 40 40 45 35 30 35 30 23 25 19 45 40 45 45 20 50 25 25 30 35 25 20 15 20 48 30 40 20 30 30 20 35 55 65 50 50 80 60 See C om m ents 40 25 1..06 0.2) 180 (17.000 (6.0) 385 (2.11 1.5 h 3h 6m 15 m 15 h 2h 18 h 2h 1h 2h 15 m 3h 14 h 6h 1h 4h 2h 2h 4.200 (8.9) 850 (5.97 - - - - - - 500 500 500 500 535 500 14.400 7.150 (7.000 / C :1.T .0) 40 (7.000 A : 38.2) 1.2) 150 (26.1) 100 (17.000 825. H 7 d / R .T .5 Inches 3 Inches 2 inches 400.05 1.050 (7. H 15 m / 150 30 m / 150 2 h / 50 30 m / 150 60 m / 100 60 m / 100 24 h / R .6) 1.300 (9.300 3..2) 1.030 625 600 450 450 650 775 850 725 340 275 280 600 550 600 350 175 125 95 100 100 65 85 130 120 1.T .000 / B :35. H 5 d / R . S elf-leveling A dhesive Low D urom eter...10 1.000 A :80.97 0.9) 830 (5.06 1.12 1.2) 125 (21.4) 1. H 15 m / 200 7 d / R .3) 125 (22.1) 40 (7.6) *1 ) 625 (4.425 (9.000 A :6.000 / B :3. Longer W ork T im e.16 1.3) *2 ) 475 (3.150 (7.blocking.5) 100 (17. Low D urom eter Liquid Injection M olding Liquid Injection M olding Liquid Injection M olding Liquid Injection M olding Liquid Injection M olding Liquid Injection M olding Liquid Injection M olding Liquid Injection M olding Liquid Injection M olding. Y oung's M odulus 300 psi (2.2) 1.050 (7.6) 70 (12.000 (6.150 700 3. Longer W ork T im e F irm G E L.3) 80 (14.9) 175 (30.15 1.9) 300 (52.350 1:1:0.18 1.000 9..12 1.075 3.500 / B : 9. F ast C ure A dhesive.000 / B :650 A :2.6) *1 ) 485 (3.5) 155 90 (15.16 1.0) 140 (24.5) 850 (5.T . E ncapsulant H igh T ear E xtrem ely T ough ..0) 1.7) 1.03 1.300 / B :800 0.13 1.250 500 400 825 825 500 500 730 640 500 730 905 905 500 900 900 450 500 830 500 500 500 6. P enetration 10 m m F irm G E L.000 / B : 18.7) 675 (4.000 / B :T hixotropic A :80.02 Inches A :82.100 (7.1) 20 (3. F ast C ure A dhesive F low able. 32% S olids D ispersion C oating / C onform al.14 20 550 (3. 60% S olids O xim e A cetoxy O xim e P latinum P latinum P latinum P latinum P latinum P latinum O xim e A cetoxy A cetoxy A cetoxy P latinum O xim e P latinum P latinum P latinum P latinum P latinum P latinum P latinum P latinum P latinum P latinum P latinum P latinum P latinum P latinum P latinum P latinum P latinum P latin um P latinum P latinum Alkoxy Alkoxy Alkoxy P latinum P latinum P latinum P latinum P latinum P latinum P latinum > 72 h > 24 h 4h 4h 15 m 60 m 50 m 1h 1m 15 m 2.3) *2 ) 330 (2. 15 sec 850 A :1.5) 700 (4. N on F low able.17 1.400 (9. P enetration 5 m m H igh P urity.0) 125 (22.400 (9.44 1.8) 700 (4.2) 1..T .6 m 10 m 5h 30 m 90 m 80 m 25 m 7m 9m 10 m 30 m 3.12 1.5) 190 (33.4) 150 (25.000 / B :270 A :310 g/min / B :280 g/min A :280 g/min / B :290 g/min A :250.2) 85 (15.5) 1.7) 120 (0. Q uartz F illed Low D urom eter .T . 27 1..0 cP 1.8) 40 (7.. R ..9) - - Tear ppi (kN/m) Lap Shear psi (MPa) Dielectric Strength V/mil Flow (Inches) Viscosity (cP/mPa sec) Extrusion (g/min) Mix Ratio Color 25 90 275 90 275 20 70 35 50 135 325 265 360 275 260 335 425 275 400 400 300 50 400 400 35 (6. H 72 h / R .44 1.T . F uel R esistant Liquid Injection M olding.T .T . 100 m % Liquid Injection Molding Fluorosilicone.6) 700 (4. 30 m / 150 48 h / R .. 1 00 m % F luid.8) 600 (4. A m ber See C om m ents - - - - - 130 - Lt.34 2.33 1.7) 210 (2.T .000 A :4.25 W /m ·K . S oft.150 (7.T .4) *2 ) 380 (2. Low V iscosity.29 P latinum - - 5 m / 150 - H ydrolysis H ydrolysis H ydrolysis H ydrolysis H ydrolysis H ydrolysis H ydrolysis H ydrolysis H ydrolysis H ydrolysis - - - - - P eroxide d = day h = hour m = m inutes - 1 1 1 1 1 1 1 1 1 h h h h h h h h h / / / / / / / / / R .069) 525 (3. D ifficult S ubstrates.200 A :40 g/m i n / B :35 g/m i n 350.1) 700 (4. 40 lb/ft 3 (0. 100 m % Lap Shear after 7 days. Static Dissipation 7 ohm ·cm .80 0.75 W /m ·K ..T ...5 M illion cP 40.35 0. R .00 0. Meets to F E D S pec.000 P aste A :75.98 1. H 30 m / 150 60 m / 65 7 d / R . F uel R esistant S olvent R esistant Fuel Resistant White Gel.30 1.60 1.36 3.11 0.3% m ax.2) 600 (4.9 MPa).T .62 cS t Low / H igh T em perature.001 ohm ·cm .40 1.36 1.5 20:1 15:1 15:1 20:1 15:1 1:1 10:1 1:1 1:1 1:1 1:1 1:1 1:1 1:1 1:1 15:1 - G ray T rans G ray T an T an B lack B lack B lack T an T an W hite W hite G ray W hite T rans R ed T rans B lack T rans B lack G ray W hite T rans T rans G ray W hite G ray T rans T rans T rans W hite T rans T rans - - - - A :800 / B :2.5) 250 (1..77 0.600 N on-slum p 20.5 h 12 h 7h 60 m 12 h 3.0 cP 1.10 1. 100 m % F ast C ure F uel R esistant Liquid Injection M olding.6) 60 (10...84 W /m ·K .100.T .1) 700 (4. H 72 h / R .T .8) 600 (4. R .10 1.625 1:1 1:1 1:1 100:6 100:6 1 P art 10:1 1:1 100:0.8) 45 (7. R .T .000 and 12.8) 275 (1.34 1.30 1. R .45 0.77 0.80 - 1.8) 50 (8. R . 19 lb/ft 3 (0.0 cP 1.77 0. In h ib itin g E n viro nm e n ts .9) 850 (5.8) 50 (8. V olatile C ontent 3% M ax V olatility 0.T ..2% m ax. Low Viscosity 50 ohm ·cm .0 % S olids G eneral P urpose. 15% S olids A ddition C ure S ystem s.48 1.1) 850 (5.T .5% S olids A d d itio n C u re S ys te m s .5 M illion cP M edium G rease 1. - H H H H H H H H H 15 m / 150 R .2) 195 (1.000 Liquid H eavy G rease M edium G rease 1. = R oom T em perature H = H um idity S ee Com m ents - - - - 400 400 400 500 - U p to 7 M illion c P 2 M illion and 2.0 cP 1. 48 h / R . P re c a talyzed *2 2 ) T herm ally C onductive 1. F uel R esistant Extrusion o r C o m p re s s io n M o ld in g . 1) 275 psi (1. R .11 1.01 1.T . Please contact NuSil Technology for assistance and recommendations.T .26 1. A m ber 1.28 1. D urom eter -T ype '00' 50 F uel / S olvent R esistant. H igh D urom eter *2 2 ) 0.41 1.5% S olids A ddition C ure S ystem s.12 2.3) *2 ) 350 (2.9) 65 (11.53 1.T . 100 m % H igh T em perature. 10 m / R ..700 3.75 W /m ·K *2 2 ) 0. V olatility 2% m ax. Low D urom ter.. H 30 m / 120 30 m / 150 72 h / R .31 g/cm 3 ) 8 ohm·cm . 8 .46 W /m ·K *2 2 ) 0. R .ENGINEERING MATERIALS General Purpose NuSil Product Number Cure System Comments Work Time Tack Free Time Cure Time / Temp °C Specific Gravity Durometer Type A Tensile psi (MPa) 75 60 40 80 60 80 70 90 75 20 35 35 30 30 30 10 40 35 40 35 30 30 50 35 25 100 (.0 cP 1.78 0.5% S olids C ondensation C ure S ystem s.55 1. S tiff C onsistency.006 ohm ·cm *2 2 ) 1.5% S tiff C onsistency G rease T herm ally C onductive G eneral P urpose.000 to 2. 28 lb/ft (0.3% m ax. 10% S olids A ddition C ure S ystem s.Do not use as a basis for preparing specifications.000 M edium G rease 980.0 cP 1.9) 700 (4. 25 lb/ft 3 (0. S oft. 4.1) 450 (3.640 g/cm ) 3 3 F lam e R esistant.80 0.9) 425 (2. 15% S olids A ddition C ure S ystem s..01 1.100 / B :5.300 4.000 / B :50. S tiff C onsistency G rease.9) 185 (1. 4.500 T hixotropic T hixotropic 230 g/m i n 250 g/m i n P aste 1.000 1.3% m ax. 20% S olids C F -4721 75 T ype D w ith D icum yl P eroxide C atalyst (C atalyst N ot Included) C F 2-4721 75 T ype D . H 10 m / R .T .T . 100 m % H igh T em perature. V olatile C ontent 4% m ax.29 1.T .77 0. D ispersion C oating Sprayable S F M 5-2350 R 1-2354 R -2356 R -2370 R -2380 R -1505 R -2630 R -2631 R -2634 R -2637 R -2930 R -2939 R -2940 R -2949 G E L-3500 C F 1-3510 C F 2-3521 C F 2-3521-2 C F 3-3521 C F 5-3521-2 R 7-3521-11 F S -3502-1 F S -3511 F S -3606 C F 1-3710-2 F S -3730 F S -3730-11 F S 3-3730 F S -3775 F S -3781 C F 1-3800 R -3930 R -3975 R -2100-2 F ast C ure S -7200 S -7201 S -7205 S -7400 S -7402 G -9000 G -9010 G -9020 G -9030 G -9040 G -9200 G -9340 S P -120 S P -121 S P -124 C F 1-135 C F 2-135 C F 6-135 C F 1-141 S P -142 S P -270 S P -271 V iscosity up to 7 M illion cps.9) 125 (0.V olatile C ontent 0. 50 lb/ft 3 (800 K g/m 3 ) A vailable in G ray / B lack / T ranslucent . Low / H igh T em perature F uel R esistant G el.000 / B :10 P aste A :90 g/m i n / B :150 g/m i n 240.2) 60 (10.2) 50 (8. 100 m % F uel R esistant. H 7 d / R .8) 500 (3.9) 35 (6.35 0.07 3. H 72 h / R .5 % S o lid s A ddition C ure S ystem s. V olum e R esistivity 1x101 5 ohm s·cm F uel / S olvent R esistant F oam .0 cP 1.35 1.26 0. Low /H igh T em p. D ifficult S ubstrates..7) 300 (2.0 cP 1.000 A :12..78 0.T . Low / H igh T em perature 0. V V -D -1078 K inem atic V iscosity 0. V olatile C ontent 0. 6% S olids A ddition C ure S ystem s.23 1.2) 35 (6.2) 750 (5.6) 50 (8.T .4) 1. T ough 0.5 h 60 m 24 h 90 m - 10 m 24 h 10 m 30 m 15 m 15 m 8m - 45 m / 100 10 m / R .8) 550 (3.500 A :70.T .0 cP - See C om m ents - - - - - 125 - Lt. F uel R esistant D ispersion C oating. 1.T .08 1.1) 50 (8. D ispersed in IP A .450 g/cm ) Low D ensity.16 g/cm 3 ) M edium D ensity.850 1:1 B lack C lear C lear T rans T rans T rans G ray T rans T rans G ray C lear C lear W hite C lear R ed T rans C lear C lear T rans R ed T rans T rans T rans Elongation % SILICONE RESINS PRIMERS GREASES FLUIDS INKS FLUOROSILICONES THERMALLY ELECTRICALLY CONDUCTIVE CONDUCTIVE SILICONE FOAMS Properties listed are typical .T . H 72 h / R . 3.8) 35 (6.000 100 g/m i n 90 g/m i n P aste P aste A :70. 4..T .1) 40 (7. 15 m / R .0 cP 1. H 30 m / 150 30 m / 150 30 m / 150 30 m / 150 30 m / 150 45 m / 150 30 m / 150 30 m / 150 48 h / R . Sprayable.9) 850 (5.14 1. V olatility 0.5) 45 (7.000 / B :10.6) 200 - 190 190 10 10 5 880 810 450 920 400 - A :55. F lam e R esistant.97 1.400 g/cm 3 ) 3 H igh S trength.1) 260 (1.77 0.09 *1) *2) P rim ed w ith S P -120 P rim ed w ith C F 1-135 g/min = G ram s P er M inute T rans = T ranslucent 6 .T . 10 lb/ft 3 (0. 4 h / 50 30 m / 150 1 to 4 h / R ... P recatalyzed *22) 5 T ested per A S T M E1530 • = Designed for Broad Operating Temperatures • • • • • • P latinum P latinum P latinum Alkoxy Alkoxy O xim e P latinum P latinum Alkoxy P latinum P latinum P latinum P latinum P latinum P latinum P latinum P latinum P latinum P latinum P latinum P latinu m P latinum P latinum P latinum A cetoxy A cetoxy A cetoxy A cetoxy P eroxide P latinum A cetoxy A cetoxy 23 m 11 h 8h 3h 4h 3h 4h 5h 3. 72 h / R . H 0. V olatile C ontent 0.T .39 1. S oft. H 7 d / R . A vailable in B lack & W hite S elf-leveling. H 7 d / R .*22) 1.9) 950 (6.6 M P a).26 1.5 R ed 100:0. H 7 d / R . H 30 m / 150 0.01% S C V -2585 S C V -2586 S C V -2590 S C V -2590-2 S C V 1-2590 S C V 2-2590 S C V -2596 S C V 1-2596 S C V 1-2599 S C V 2-2599 P ourable E lastom er.49 1.000 / B :40.000 (6. F low able P ourable R T V C ure.000 7.100 500 1.. H 7 d / R .9) 425 (2.000 / B : 43. F ast C ure Low / H igh T em perature.000 / B : 275.6) 950 (6. O ptically C lear P rim erless A dhesion *4) P rim ed Lap S hear 225 psi (1. H 7 d / R .7) 700 (4. F ast C ure Lap S hear 400 psi P ourable E lastom er P ourable E lastom er *4) P rim ed Lap S hear 450 psi (3..6) 900 (6.2) 700 (4.6) 175 (1.8) 350 (2.1 M P a) Low V iscosity.000 / B :40.5 ohm ·cm .12 1.10% C V -1144-0 C V 1-1144-0 C V 3-1144-1 C V -1146-2 C V 2-1147 C V -1148 C V 1-1148 C V -1152 C V -1142 C V 1-1142 C V 1-1142-4 C V 2-1142 C V 3-1142 C V 7-1142-1 C V 9-1142 C V -1143 C V -2189-2 C V -2187 C V -2287 C V -2289 C V -2289-1 C V -2289-2 C V 1-2289-1 C V 2-2289-1 C V 3-2289-1 C V 4-2289-1 C V 7-2289-1 C V -2500 C V -2500-2 C V 3-2500 C V 4-2500 C V 10-2500 C V 14-2500 C V 15-2500 C V 16-2500 C V -2502 C V -2510 C V -2566 C V 1-2566 C V 2-2566 C V -2567 C V -2568 C V 10-2568 60% S olids...000 / B :10.4) (2.500 / B :400.3) (3.800 A :3.400 2. H 7 d / R . H 7 d / R .000 / B :80. H 7 d / R .7) 370 400 490 580 215 225 - 850 540 - A : 56.000 A :8.T .82 1.T .10 1. N on-blocking O vercoat 70% S olids 40% S olids P rotective O vercoat.000 (6.. A tom ic O xygen P rotective O vercoat 50% S olids 60% S olids 72% S olids 60% S olids..01 1.8) 750 (5. *4) P rim ed Lap S hear 475 psi (3. P rim ed Lap S hear 100 psi (0.*4) P rim ed Lap S hear 200 psi (4.10 1..64 W /m ·K 7 TWO PART ADHESIVES & SEALANTS ONE PART COATINGS Controlled volatility or low out-gassing materials are tested in accordance with ASTM E 595 Total Mass Loss (TML) of ≤1.1) 950 (6.000 A :125.02 1.500 2.05 1.000 / B :14.5) 800 (5.T .9) 650 (4.9) 850 (5. H 7 d / R .2 M P a) *1) = Designed for Broad Operating Temperatures P rim ed w ith S P -120 *2) Primed with SP-121 *4) Primed with C F 1 .7) 50 (8.*4) P rim ed Lap S hear 300 psi (2. O ptically C lear Low F low Low / H igh T em perature.11 1.700 A :3.375" P lunge H igh D urom eter.T .10% and Collected Volatile Condensable Materials (CVCM) of ≤ 0.8) (1. Low D ensity.T .2) 750 (5. H 7 d / R . H 7 d / R .. 0.2) 235 (1.000 45.000 A :9.000 125. H 7 d / R .T . C arbon F iber F illed E lectricaly C onductive...T .T . H 7 d / R .5) 600 (4.8) 400 (2.T . H 30 m / 150 15 m / 150 15 m / 150 30 m / 150 30 m / 150 60 m / 65 15 m / 150 60 m / 65 15 m / 150 4 h / 65 7 d / R .000 90.T .2 W /m ·K T herm ally C onductive.64 0.11 1.500 P aste P aste 140 g/min 700 (4. .2) 450 (3. H 7 d / R .T .T . F ast C ure Low V iscosity.1 M P a) Low V iscosity.. Low V iscosity. O ptically C lear Low / H igh T em perature.7 M P a) E lectrically C onductive.4) 675 (4..6) (6.T .2) 650 (4.8) 800 (5. Lo D ensity N on-S lum p Thixotropic T ough.1) 40 (7.7" w ith 0.500 5.5 h 4h 2h 2. F low able.600 A :3.000 T hixotropic 5. H 30 m / 150 H = H um idity 1.500 A :3.000 55.01 1. F ast C ure *4) P rim ed Lap S hear 175 psi (1.T . O ptically C lear Low D urom eter.04 1. B uilt-in U V T racer A vailable in B lack & W hite S pot B onding.02 1.3 Inches 45.500 A :15... A vailable in B lack & W hite F low R ate 0.1) 175 (1. . • •• •• ••• •• ••• •• •• •• • •• •• ••• • • ••• ••• • 50 m 10 m 1h 2h 1h 40 m 50 m 20 m 15 m 20 m 25 m 15 m 3h 15 h 3.5 100:0.*21.000 A :8.T . H 7 d / R .10 1.5 R ed C lear 100:0. P rim ed Lap S hear 175psi P ourable Low V iscosity.4) (3.500 3.3 M P a) F ast C ure.3) (3.02 1.02 1.000 A :65. P otting & E ncapsulant.. H 15 m / 200 15 m / 150 30 m / 150 15 m / 150 15 m / 150 15 m / 150 15 m / 150 4 h / 65 7 d / R . F low able. 22) 1. H 7 d / R .11 1.2 M P a) Low / H igh T em perature..53 - 35 45 45 50 50 45 75 85 75 55 O xim e O xim e O xim e O xim e O xim e O xim e O xim e O xim e O xim e O xim e O xim e O xim e O xim e O xim e O xim e O xim e P latinum P latinum P latinum P latinum P latinum P latinum P latinum P latinum P latinum P latinum P latinum P latinum P latinum P latinum P latinum P latinum P latinum P latinum P latinum P latinum Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy P latinum - 7 d / R ..50 1.000 / B : 1.19 3.06 1.5 R ust 100:0.1) - 320 320 535 445 370 400 490 330 180 245 845 1.02 1. H 7 d / R ..T . O ptically C lear H igh D urom eter.6) 1.00 1.45 1.1 M P a).5 h 2h 3h - 15 m / 150 30 m / 150 15 m / 150 30 m / 150 15 m / 150 4 h / 65 30 m / 150 30 m / 150 7 d / R .06 1. Low D ensity *1).4) 725 (5. Low D ensity.600 0.2) 900 (6.2) 55 (9.000 7.5 h 30 m 4h 30 m 5h 20 h 12 h 30 m 10 h 2h 10 h 3h 6h 3h 6h 2h 15 h 3h 5h 3h 6h 2h 4h 3h 3h 2h 6. H 7 d / R .6) (6.000 A : 1.34 1.Do not use as a basis for preparing specifications.000 A :60. H 7 d / R .1 3 5 *21) T ested per A S T M C 1045 *22) T ested per A S T M E 1530 • Cure System Work Time Tack Free Time Cure Time / Temp °C Specific Gravity P latinum P latinum P latinum P latinum P latinum P latinum P latinum P latinum P latinum P latinum 1h 4h 4.000 1. A dded M icro-baloons for B ond Line C ontrol N on-flow able P rim erless A dhesion P ourable.000 8.000 A :65. H 7 d / R . Please contact NuSil Technology for assistance and recommendations.07 1.000 A : 57.6) 300 200 200 300 300 85 400 700 400 400 350 350 400 350 250 125 400 375 125 150 100 130 150 90 100 200 200 150 160 140 150 60 170 60 (10. O ptically C lear Low V iscosity.000 g/min = G ram s P er M inute 1:1 1:1 10:1 10:1 1:1 10:1 10:1 20:1 15:1 20:1 T rans R ed C lear B lack C lear C lear B lack T an W hite W hite T rans C lear W hite B lack T rans B lack B lack C lear T rans T rans T rans T rans T rans W hite W hite T rans B lack 10:1 T rans 10:1 T rans T rans 1:1 1:1 W hite 1:1 B lack 1:1 W hite 1:1 W hite 1:1 W hite 1:1 W hite 1:1 W hite 10:1 C lear 10:1 B lack 10:1 C lear 1:1 C lear 1:1 C lear 1:1 T rans 1:1 C lear 10:1 C lear 10:1 T rans 100:0.180 900 955 850 825 645 860 240 850 900 2.000 85.01 0.60 W /m ·K *22) 0.8) 40 (7.5 M P a) *2) P rim ed Lap S hear 625 psi (4.06 1.2) 80 (0.76 45 30 35 50 45 40 55 45 17 35 30 30 30 30 30 30 35 30 30 50 50 40 25 50 30 50 40 40 45 55 50 55 21 50 40 Durometer Type A Tensile Elongation Tear psi (MPa) % ppi (kN/m) CTE ppm/°C Dielectric Strength V/mil Flow (Inches) Viscosity (cP/mPa·sec) Extrusion (g/min) Mix Ratio Color Properties listed are typical .T .42 1.5) 750 (5.5) 700 (4.8) 400 (2.300 35 g/min 13.005 ohm ·cm .7) 75 (13.6) 55 (9.1) (1.15 1.6) (6.19 1.750 / B :2. A vailable in B lack & W hite S elf-leveling...T . *1) P rim ed Lap S hear 500 psi (3.CONTROLLED VOLATILITY MATERIALS General Purpose NuSil Product Number Comments ULTRA LOW OUTGASSING™ Materials are tested in accordance with ASTM E 595 Total Mass Loss (TML) of≤ 0.1) 55 (9.300.T ..05 1.8) 1.2) 925 (6.T .T .5 R ed 1:1 R ed T rans = T ranslucent C le a r = C le a r to T ra ns p a re n t 8 .000 A : 375.T .4 M P a) *1) P rim ed Lap S hear 650 psi (4.5 h 4h 3h h = hours m = m inutes 700 225 950 950 925 4 75 475 450 200 400 (4.74 1.3 M P a) D iluent for T in C ondensation C V S ilicones Long W orktim e.5 W hite 100:0.. H 7 d / R .0) 750 (5.T .0% and Collected Volatile Condensable Materials (CVCM) of ≤0.69 M P a) F ast C ure.04 1..02 1.800 / B :2.T .8) 300 150 125 150 90 85 90 30 225 40 (7.11 1. *4) P rim ed Lap S hear 250 psi (1.000 / B :40. 2.000 60 g/min Non-slump Non-slump 20 g/min 35 g/min Non-slump 225.000 A :14.13 0.000.500 7. 100% S olids S pot B onding.*4) P rim ed Lap S hear 175 psi (1.T . 5 h 2h 2h 2h - 10 m 10 h 40 m 4h 4. *5) P rim ed Lap S hear 120 ps i (0. 3.004 ohm·cm Electrically Conductive. 2.9) 435 580 215 185 130 275 430 540 - Non-slump T hixotropic A :300 g/min / B :150 g/min A :1. Primed Lap Shear 275 psi (1.2 10:1 B lack B lack B lack B lack B lack B lack T an T an T an T an G ray/G reen W hite G ray G ray W hite W hite W hite W hite 1. R .T .5 h 2.0 ohm·cm.250.005 ohm·cm. 7.27 0.0 W/m•K.005 inches (127 microns) Double Side Tape...000 P aste P aste 0.06 1.800 1:1 1:1 C lear C lear P latinum - - 1 h / R .0 1.07 1.5 ohm·cm.5 h 3h 4h 13 h - 7 d / R .T .T .5) 475 (3.012 inches (305 microns) Thick.3 MPa) *22) *4) 1.T .8) 650 (4.T .40 CTE ppm/°C = Designed for Broad Operating Temperatures P rim ed w ith S P -120 P rim ed w ith S P -130 *4) P rim ed w ith C F 1-135 *5) P rim ed w ith S P -270 *21) T ested per A S T M C 1045 *22) T ested per A S T M E1530 *1) *3) • d = days h = hours m = m inutes h h h h h h / / / / / / R .000 - C lear C V -1161 50% Solids..000 / B :8. - H H H H H H R.T . Penetration 4.5 h 2h 2h 3h 2. H 7 d / R .5) 55 (9.*1) Primed Lap Shear 325 psi (2..T . Carbon Fiber Filled 25 ohm·cm ..8 W/m•K Low Viscosity. LUBRICANTS & GREASES THERMALLY CONDUCTIVE ELECTRICALLY CONDUCTIVE / STATIC DISSAPATIVE Materials are tested in accordance with ASTM E 595 Total Mass Loss (TML) of ≤ 1.9) 45 (7.T . 22) 0. Lap Shear 250 psi (1. H 30 m / 150 7 d / R . H 7 d / R .T . Primed Lap Shear 160 psi (1. Please contact NuSil Technology for assistance and recommendations.4) 20 90 225 350 120 100 90 70 150 15 35 30 225 30 110 30 (5.1 MPa) *22) 0. R .5 ppi Release Force - - - - - - C V 2-1161 35% Solids. Remains Conductive at High Temperature *22) 0.77 0.500 1.4) 400 (2.T . H 72 h / R .4 MPa).Do not use as a basis for preparing specifications. Soft. H 24 h / R . 1. H 30 m / 150 30 m / 150 10 d / R .*22) 0.48 MPa) CV-2681-12 Dielectric Strength V/mil Flow (Inches) Viscosity (cP/mPa·sec) Extrusion (g/min) Mix Ratio Color Properties listed are typical .224g/cm ) C V -2391 SP1-204 S P -120 S P -121 C F 2-135 C F 1-141 S P -270 1 and 2 P art R TV S ystem .9 inches 0 inches 4 inches 40 g/min P aste P aste P aste 140 g/min P aste A :130.500 1:1 C lear - - - - - - - 2.0 1.2 x 10 ohm·cm *22) 0. Difficult Substrates. Low Temp *22) *4) 0.000 M edium G rease 10:1 1:1 10:1 20:1 - W hite W hite W hite W hite C lear W hite 1.2 W/m•K.23 2.32 W/m•K *4) 2.T .5 ppi Release Force P eroxide - - 1 h / 60 + 1 h / 175 - - - - - - - A :16.9) - 60 50 40 250 - 55 (9.7) 45 (7.000 1:10 W hite H ydrolysis H ydrolysis H ydrolysis H ydrolysis H ydrolysis H ydrolysis H ydrolysis - - 1 1 1 1 1 1 0.19 1.77 0.5 h 2h 2. 125 ohm·cm.T .003 ohm·cm.2) 275 (1. IPA Based.T . Pumpable Carbon Black Filled 6 2.. 1.0 1..CONTROLLED VOLATILITY MATERIALS General Purpose NuSil Product Number Cure System Comments Work Time Tack Free Time Elongation Tear Cure Time Specific Durometer Tensile psi (mPa) % ppi (kN/m) / Temp °C Gravity Type A FILMS TAPES PRESSURE SENSITIVE PRIMERS FOAMS GELS FILM ADHESIVES DAMPENING FLUIDS.T .9) 525 (3.8) 250 (1...5 20:1 100:0.25 1.. Primed Lap Shear 375 psi (2..20 3.000 A :10. 15% Solids S P -271 Addition Cure Systems. Thermally conductive Thermally Conductive 0.0 1.5) 750 (5. Primed Lap Shear 150 psi (1.53 1.77 0..000 52. Primed Lap Shear 205 psi (1.0 W /m•K . Primed Lap Shear 250 psi (1.30 - - - - - 465 - M edium G rease M edium G rease - 2-Part G rey W hite T rans - - - - - - - - 2-Part B lack - - - - - 3. Thin Bond Line *22) *3) 2.7) 205 (1.34 80 75 40 30 25 85 85 80 90 75 65 85 90 75 55 80 60 650 (4.0% Solids General Purpose. 20% Solids • 9 *3) 0.6) 500 (3.6) 500 (3.3) 525 (3.T .39 3.2 W/m•K 0.0 W/m•K.9) 425 (2.6 W/m•K. R .0 ppi - - - - - - - - - - - - - T rans Low Viscosity.77 0. Tert Butyl Acetate..4) 400 (2. Low Temperature *22) *4) 1. H - - - - - - - 3.07 1.9 MPa) Refractive Index 1.7) 180 (1. 2-Part Film.T . 4.200 100:1 C lear 0. H** 7 d / R .000 10:1 10:1 1:1 1:1 20:1 20:1 100:0.000 P aste 100 to 100.8 MPa) C V 2-1148 C V -1500 C V -2640 C V 1-2640 C V 2-2640 C V 3-2640 C V -2644 C V 2-2644 C V -2646 C V 1-2646 C V 2-2646 C V -2900 C V -2942 C V -2943 C V -2946 C V 2-2946 C V -2948 C V -2960 C V 1-2960 C V 1-2964 C V -2961 C V -2963 C V -7300 *22) •• • • • • • • • Volume Resistivity.2) 200 (1.T .. 1.45 2.04 3.7 MPa).80 - - - - - - - - - - - - - 1.1 W/m•K *22) 1. Kapton® Center.T .8) - 275 - - A :900.8 W/m•K.7 MPa) C V -9042 C V -9052 C V -9341 C V -2680-12 O xim e O xim e P latinum P latinum P latinum P latinum P latinum P latinum Alkoxy Alkoxy Alkoxy O xim e P latinum Alkoxy P latinum P latinum Alkoxy P latinum P latinum P latinum P latinum P latinum - - 2h 60 m 3h 2.80 0.61 75 65 75 60 - 250 (1.5 h 1.3) 60 (10. H 30 m / 150 2 h / 65 24 h / R .7) 55 (9.0 C lear C lear R ed C lear R ed T rans Trans C V 3-1161 C V 4-1161-5 C V -8151 C V 1-8151 C V -8251 3 3 Low density.9) 50 (8.000 / B :100.7) 90 (15. Penetration 3 mm P latinum P latinum P latinum > 30 h 24 h - 30 m / 150 30 m / 150 40 m / 150 - - - - - - - 2...10 2. 0.5 100:0. H 7 d / R .6 W/m•K.0 MPa) *22) *4) 0.7) 45 (7.. Thermally Conductive 15 Volume Resistivity 1x10 ohm•cm.5 W/m•K . 14lb/ft (0.2 15:1 20:1 100:0.38 1.005 ohm·cm *21.5 100:0.5% Solids Addition Cure Systems.79 0. 3.86 2. Primed Lap Shear 475 psi (3.97 1.9) 50 (8.4) 70 (0.40 2. Lap Shear 70 psi (0. R .5 W/m•K .500 100:1 C lear Non-VOC Solvent.0% and Collected Volatile Condensable Materials (CVCM) of ≤ 0.T.01 3.4 mm Low/High Temperature. 4.. Primed Lap Shear 205 psi (1.000 / B :10. R .0 1.55 1.1) 400 (2.6 W/m•K.T . H 7 d / R .5% Solids Addition Cure Systems.T .007 ohm·cm 0.0 mm Penetration 0.000 A :300.. = Room Temperature H = H um idity ** P ost-cure 15 m / 150 g/min = G ram s P er M inute - T rans = T ranslucent C lear = C lear to T ransparent 10 .8) 55 (9. . 2. Low Viscosity *22) 1. 6% Solids Addition Cure Systems. Difficult Substrates.6 MPa) *22) *3) 1.57 1.5 h 3.2 MPa).4 MPa). H 7 d / R .8) 300 (2.33 2.3% S olids General Purpose.10% 100% S olids 3. H 7 d / R . H 4 h / 65 15 m / 150 30 m / 150 4 h / 65 4 h / 65 4 h / 65 P latinum 4h - P latinum 4h - 1.34 1.5 ppi Release Force P eroxide - - - - - - - - - - 1. 2 ) 90 90 151 95 305 100 65 400 500 337 - 1 :1 1 :1 1 :1 1 0 :1 1 :1 1 :1 1 :1 490 - - - 3 5 0 o r 1 . General Purpose NuSil Product Number OPTICAL GELS L S -3 2 3 8 Resistant to Hydrocarbon Solvents Low Volatility.4 1 1 .000 A :3 . Glass Index Matches BK7. use with Phosphor Contains adhesion promoter.4 1 1 .4 0 1 .5 5 0 575 1 .700/B:2.5 2 6 h 10 / 65 425 30 m / 150 - - - 1 :1 1 .51. Encapsulant Bonding. Dispersing Phosphor Bonding.000/B:35. use with Phosphor Longer work time for dispensing applications. Optical Fiber. Casting or Injection Molding Bonding.5 4 1 .500 535 1 4 . Encapsulant Bonding.6 0 0 5 . Penetration 0.0) 7 5 0 (5 .4 6 - - - - - - - - L S 1 -3 2 0 0 All Purpose Primer for Optical Applications 1 . Encapsulant.4 0 1 . Penetration 9.4 to 1 .38 1. non-phenyl containing Firm and Tacky Gel.5 4 1 . Potting Encapsulant. non phenyl containing Soft and Tacky Gel.3 8 11 h 1 .0 0 0 360 - 1 0 :1 1 0 :1 1 :1 1 . Penetration 5 mm Index matches to glass such as fused silicates (Glass.550 A:3.5 4 1 .2 0 0 60 m / 70 60 m / 70 60 m / 70 60 m / 70 - - 1 :1 1 . the last 2 digits of the product name are the last 2 digits of the refractive index measured at 589 nm. Optical Fiber.® MATERIALS Product Name Legend Index Matching The key properties of NuSil Technology’s LightSpan™ Materials can easily be distinguished by the product name. use the following LS products for index matching.0 - - - - - L S 2 -3 2 0 0 Improves Adhesion to Difficult Substrates - 1 .0 - - - - - Adheres to Difficult Substrates - - - - - Improves Adhesion to Difficult Substrates L S 3 -3 2 0 0 • Maintains Transparency at 400 nm = Designed for Broad Operating Temperatures M B P = M easured by P enetration Tested per N uS il TM 017 *32) Tested per N uS il TM 036 *31) 1 .3 8 125 120 275 - 1 .000 4 h / 65 60 m / 100 Application Index Matches MgF2. 80 °C minimum cure Primerless version of LS1-6140 Non-phenyl containing L S -5 2 3 8 Resistant to Hydrocarbon Solvents. Infrared Illumination L S -1 2 4 6 Flows Under Pressure. non-phenyl containing Broad opearting temperature range Broad opearting temperature range Primed Lap Shear 510 psi.4 0 1 . shown in the table below.46 1. non-phenyl containing LS-6140 with longer work time for dispensing.4 2 5 1 . Glass Assemblies.1 ) 9 0 0 (6 . 80 °C minimum cure L S -3 1 4 0 L S -3 4 4 0 L S -3 4 4 1 L S -3 4 4 3 L S -3 2 4 6 L S -3 2 4 9 L S -3 3 5 1 L S -3 2 5 2 OPTICAL OPTICAL PRIMERS GREASES OPTICAL FLUIDS OPTICAL ADHESIVES AND ELASTOMERS L S -3 3 5 4 L S 2 -3 3 5 4 L S 3 -3 3 5 4 L S 4 -3 3 5 4 11 Refractive Index 589 nm Comments L S -6 1 4 0 L S 1 -6 1 4 0 L S 2 -6 1 4 0 L S -6 9 4 1 L S 1 -6 9 4 1 L S 2 -6 9 4 1 L S -8 9 4 1 L S -6 1 4 3 L S -6 9 4 3 L S -6 9 4 6 Low Volitility. COP Magnesium Fluoride Fused Silica Acrylate Borosilicate Cyclic Olefin For all materials.2 ) 6 7 5 (4 .4 0 1 . non-phenyl containing Very Soft. LightSpan™ materials are very effective for index matching of common materials used in Optical Applications.5 1 Tough.500/B:25. Material Type Optical Gels (Soft to 00 Durometer): LS-3XXX Optical Thermosets (Type A and D durometer): LS-6XXX Optical Fluids (do not cure): LS-5XXX Acronym MgF2 SiO2 PMMA BK COC. Potting Encapsulant. Encapsulant Excellent for Dispersing Phosphor Excellent for LCD Display and LED Encapsulation Excellent for Dispersing Phosphor Excellent for Dispersing Phosphor Excellent for Dispersing Phosphor Excellent for Dispersing Phosphor Bonding.2) 1.000/B:50.039 (7.4 3 1 .0 0 0 5 .500 A:2. Casting or Injection Molding Bonding.1 1 :1 4 . non-phenyl containing Work Time Durometer ‘0 0’ / ‘0 0 0 15 / NA Viscosity cP/mPa-sec Cure Time/ Temp °C Tensile psi (MPa) Elongation % CTE ppm/ ºC Mix Ratio 1 .4 6 1 .2 5 0 (8 . excluding primers.5 0 0 A:500/B:650 1 .4 3 1 .300 (9. LCD Bonding Bonding.000 A :1 . Molding Index Matches MgF2.52 RI.4 1 1 .5 0 0 30 m / 150 - - - MBP MBP *31) MBP *31) MBP 10 / NA 60 A:16. 8 ) 1 .2 0 0 - 1 :1 1 .450/B:2.4 to 1 . Some common materials.6 ) 6 0 0 (4 .0 0 0 - 30 m / 150 60 m / 100 30 m / 150 30 m / 100 60 m / 65 60 m / 75 - - 411 300 300 - 1 :1 1 :1 1 :1 1 :1 1 :1 1 :1 1 :1 NA / 55 6 . Non-Slumping.4 1 1 .4 mm.5 h >24 h 2 h 2 h Type ‘A’ 50 50 45 50 50 30 80 40 40 30 A:3.0 0 0 60 m / 100 - - - 1 :1 *31) *32) 1 .2) 1. Encapsulant Lenses made by Injecting or Compression Molding Lower Durometer where Stress is Concerned Lenses made by Injecting or Compression Molding Bonding.4 3 1 .900/B:1.4 to 1 .52 LS Products LS-3238 LS-3246 LS-3249 LS-3252 LS-3252 For example: LS-3351 is an optical gel when cured and the refractive index is 1. Penetration 0.5 7 - - 30 m / 150 - 1 2 0 ( 0.2 0 0 /B :8 0 0 15 m / 150 60 m / 150 60 m / 150 15 m / 150 30 m / 150 30 m / 150 30 m / 150 850 (5.000/B:8.5 4 9 0 m (2 xV i) 2 h m in (2 xV i) 8 0 m (2 xV i) - 65 / 65 15 / 53 60 / 55 60 5 . Index Matches BK7.2 xV i) 1 . Optical Fiber.5 2 1 .4 1 1 . Glass Adheres to Various Substrates d = day h = hour m = m inutes 12 . Glass.4 mm.9) 900 (6.4 9 > 24 h > 24 h 8 h 48 h 160 m (1 . Potting Index Matches Silica. Ionizing Radiation.4 2 5 - - 1 . Tensile 750 psi.4 0 0 A:40. Non-Curing 1 . Youngs Modulus 425 psi • • - L S -5 2 4 6 L S -5 2 5 2 L S -5 2 5 7 1 .4 6 1 . AR Coating Encapsulant.4 6 3 h 4 h >24 h 5 .0 mm.4 1 1 . Tear 80 ppi Low viscosity. Index matches to plastic such as COC Use with Phosphor Contains adhesion promoter.3 0 0 A:75. available in 350 cPs & 1000 cPs • High Durometer to reduce tackiness.Index matches to Crown Glass such as BK7 Index matches to plastics such as COC Low Viscosity and 1.716 5 .0 1 . AR Coating Index Matches Silica. Potting Encapsulant.49 1.7 ) - 1 .4 0 0 6 . Refractive Index 1. The first digit of the product name represents the hardness of the optical silicone. Quartz) Index matches to acrylates such as PMMA Use with Phosphor.4 2 5 - - Index Matches Silica.52 1.4 0 0 - - - - - A:27. GlassUse with Phosphor. 000 1.2) 50 - 3.4) 30 50 (8.000 / B :100.6 W /m·K T ested per A S T M C1045 T ested per A S T M E1530 • T in/O xim e 2h 7 d / R .3 x 10 14 P latinum 2h 30 m / 150 <5 / <1 / <1 - 75 250 (1.01 40 A Durometer Silicone 20 “00” Durometer Silicone 14 .02 50 800 (5.000 - B lack W hite 1 x 10 15 *23) 400 - - - <5 / <2 / <4 2.01 30 400 (2. = R oom T em perature h = hour H = H um idity m = m inutes *27) T ested per M IL S T D 883E 0.000 / B :9.T .000 / B :40.7) P latinum 13 h 15 m / 150 <6 / <3 / <5 2. S elf-leveling.4) - - 0. reference ASTM D2288 E P M -2490 E P M -2492 *22) *22) 0..7) 300. Also available in B lack and W hite Low V iscosity.8) 150 - - - A :2. < 5/ < 5/ < 5 2.600 10:1 C lear P latinum 60 m 24 h / R.800 (m ixed) 1:1 T rans P latinum >8 h 15 m / 200 - 1. G eneral A dhesive and E ncapsulant E P M -2422 E P M -2480 Useful for Potting Intricate Assemblies Due to Low Viscosity E P M -2411-2 ELECTRICALLY GREASE CONDUCTIVE STATIC DISSAPATIVE C arbon black filled for E M I shielding applications E P M -2481 T ough F irm G el E P M -2482 1.7 W /m ·K .4) 350 30 (5. S hear T hinning Index 2.005 - P aste 20:1 T an 100:0..200 1:1 C lear P latinum 3h 15 m / 150 <5 / <2 / <4 1.10 inch spacing M edium G rease - P latinum 3h 30 m / 150 <5 / <7 / <5 3.43 R efractive Index • • • • G lob T op encapsulant.16 17 750 (5. rem ains conductive over broad operating tem perature range • Low viscosity for com plex geom etries 0.000 1:1 B lack P latinum 24 h 30 m / 150 <5 / <1 / <2 - F irm G el - - - 1 x 10 14 - 3.2) 700 55 (9.000 1:1 W hite 540 P aste 15:1 W hite - A :470.750 / B :2.T.5) 90 - 1 x 10 15 *23) 550 A :3.34 65 180 (1.3) 535 - A :1.000 1:1 T rans P latinum 5.ELECTRONIC PACKAGING MATERIALS General Purpose NuSil Product Number Cure System Comments Work Time @ 25°C Cure Time / Temp °C *27) Ionic Content CI / K / Na ppm Specific Gravity Durometer Type A Tensile psi (MPa) Elongation % Tear ppi (kN/m) *28) Volume Resistivity ohm·cm Dielectric Strength V/mil Viscosity cP / mPa·sec Mix Ratio Color E P M -2410 E P M -2420 E P M -2421 Ideal for S tatic M ix and D ispense A pplications.43 R efractive Index GLOB TOP POTTING & ENCAPSULATING MATERIALS EPM 's meet a low volatility specification of <1% weight loss when exposed to a minimum of 275°C for 1 hour.30 80 300 (2. B LT 200 µn. - *23) - 36.5 P latinum 30 m 15 m / 150 <5 / <2 / <4 - 30 675 (4. good adhesion to A lum inum *21. < 5 / < 3 / < 10 1.4 x 10 13 P latinum 2h 7 d / R .T.5 W /m ·K .1) 100 - 1 x 10 15 *23) 550 A :3.000 (m ixed) 1:1 T rans P latinum 24 h 30 m / 150 <5 / <1 / <2 - V ery F irm G el - - - 1 x 10 14 - A :15.6 W /m ·K .000 Storage Modulus (MPa) 100 10 1 Epoxy TIM 0.53 75 200 (1. Z inc filled 1.1 13 0..700 1:1 C lear P latinum 7. S elf-leveling A dhesive to P olyester and P olyether Low V iscosity. H < 5 / < 10 / < 5 3.49 W /m ·K *22) • • 0.5 G reenG ray *24) E P M -2401 E P M -2462 E P M -2463 E P M 1-2493 ADHESIVES THERMAL INTERFACE MATERIAL (TIM) E P M -2461 POTTING & ENCAPSULATING GELS 1.95 W /m ·K *22) B ulk T herm al C onductivity 1.000 cP s max after 2 h 4 h / 65 <5 / <1 / <1 1.7) 350 - 1 x 10 15 - A :62. B LT < 1 µn.H.000 cP s max after 2 h 60 m / 65 <2 / <1 / <8 1. B N filled *22) E P M -2890 *21) *22) 0.T .33 65 400 (2.2 W /m ·K .7) 40 - - T in/O xim e - 72 h / R.8) 5. 22) 1.250.003 8 Inches per min. H <5 / <1 / <6 - 30 500 (3.T .39 85 550 (3.30 - - - - 1 x 10 15 13 kV @ 0.000 1:1 C lear P latinum 24 h 40 m / 150 <5 / <1 / <4 - F irm G el - - - 1 x 10 14 - 1.1) 75 55 (9.8) 150 - - = Designed for Broad Operating Temperatures d = day R .04 40 600 (4.450 / B :1.000 10:1 W hite - - 1-P art W hite *28) T ested per D 257 *23) *24) T ested per A S T M D 149 T ested per A S T M D 877 TIM Storage Modulus Log (MPa) Epoxy versus Silicone 10.