8515 Service Ma8515 service manuanual (1)

March 19, 2018 | Author: zanatur | Category: Usb, Dynamic Random Access Memory, Texture Mapping, Electrical Connector, Bios


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SERVICE MANUAL FOR 8515BY: Guangna Zhang Technical Maintenance Department/GTK MTC Oct.2007/R02 8515 N/B Maintenance Contents 1. Hardware Engineering Specification ……………………………………………………………………. 3 1.1 Introduction ……………………………………………………………………………………………………………… 3 1.2 System Hardware Parts ………………………………………………………………………..…………………….…. 5 t t n e e r c m 2. System View and Disassembly ………………………………………………………………………….... e u S c c Do a iT ial M t …………………………………………………………. 3. Definition & Location of Connectors/Switches n e id f nComponents …………………………………………………………... 4. Definition & Location of Major o C 5. Pin Description of Major Component …….…………………………………………………………….. 1.3 Other Functions ………………………………………………………………………………………..………………... 39 1.4 Peripheral Components ………………………………………………………………………………………………… 45 1.5 Power Management ………………………………………………………………...…………………………………… 47 50 2.1 System View ……………………………………………………………………………………………………………… 50 2.2 Tools Introduction …………………………………………………………………………………………………..…… 53 2.3 System Disassembly ……………………………………………………………………………………………………… 54 72 3.1 Mother Board …………………………………………………………………………………………………................. 72 74 4.1 Mother Board …………………………………………………………………………………………………................ 74 76 5.1 Intel Merom Processor CPU ………………………………………………………………….………………………… 76 5.2 VIA VN896 North Bridge ………………………………………………………………………..……………………… 81 5.3 VIA VT8237A South Bridge ……………………………………………………………………………………………. 85 1 8515 N/B Maintenance Contents 6. System Block Diagram ……………………………………………………………………………………. 93 7. Trouble Shooting …………………………………………………………………………………………. 94 7.1 No Power …………………………………………………………………………………………………………….…… 96 7.2 No Display ……………………………………………………………………………………………………………….. 101 7.3 Graphics Controller Test Error LCD No Display ……………………………………………....………….…………. 104 7.4 External Monitor No Display …………………………………………………………………………………………… 106 7.5 Memory Test Error ……………………………………………………………………………………………..……….. 108 7.6 Keyboard (K/B) or Touch-Pad (T/P) Test Error ………………………………………………………………….…... 110 7.7 Hard Disk Drive Test Error ……………………………………………………………………………………………. 112 7.8 ODD Drive Test Error …………………………………………………………………………………………….…….. 115 7.9 USB Port Test Error …………………………………………………………………………………………………..… 117 7.10 Audio Test Error ……………………………………………………………………………………………………….. 119 7.11 LAN Test Error …………………………………………………………………………………………….………..…. 122 7.12 Mini Express (Wireless) Socket Test Error …………………………………………….………………….…………. 124 7.13 Express Card Socket Test Error ………………………………………………………………….……………...……. 126 t t n e e r c m e u S c c Do a iT ial M t n e id f n o C 8. Reference Material ………………………………………………………………………………………… 128 2 The VN896CE integrates VIA’s most advanced system controller with high-performance UniChrome Pro 3D/2D graphics and video controller. The VN896 provides superior performance between the CPU. LCD panel and TV-Out interfaces. DRAM. A 16-Lane port. The VN896CE implements a deep In-Order Queue and supports Intel Hyper-Threading Technology to maximize system performance for multithreaded software applications. with up to 4 GB/sec bidirectional data transfer rate. The VN896CE North Bridge interfaces to the South Bridge through a high speed (up to 533 MB/sec) 8x 66 MHz Data Transfer interconnect bus called V-link interface.0a compliant PCI Express controller. t t n e e r c m e u S c c Do a iT ial M t n e id f n o C 3 . which supports up to two high bandwidth PCIe ports. V-link and internal AGP 8x graphics controller with pipelined. The VN896CE includes a PCI Express 1. and another 1-Lane port designed for PCIe peripheral devices.1 Introduction The 8515 motherboard implements CORE 2 DUO processor for mobile. burst and concurrent operation. Hardware Engineer Specification 1.8515 N/B Maintenance 1. PCIe. is implemented to support high-end PCI Express compliant graphics controller. 478-pin Micro-FCPGA packages. 8515 platform implements VN896CE/VT8237A core logic. The VN896CE supports 800/667 MHz FSB Intel Pentium M/Merom super-scalar processors. 667 MT/s (667 MHz) and 800 MT/s (800 MHz) FSB support. The VN896 supports 64-bit memory data bus access and up to 2 double-sided DDR2 667 / 533 for 4 GB maximum physical memory. Microphone-in and headphone-out audio jacks. There are two communication VIA VT6103L Ethernet PHY to support RJ-45 LAN jack and Modem module to support Modem RJ11 jack. User interface includes internal keyboard.3 compliant 10/100 Mbps Ethernet MAC with MII interface to external PHY receiver Universal serial bus controller with eight USB 2. Following chapters will have more detail description for each individual sub-systems and functions. A full set of software drivers and utilities are available to allow advanced operating systems such as Windows Vista and Windows XP to take full advantage of the hardware capabilities. Features such as bus mastering IDE. software-controlled power shutdown. plug and play. state-of-the-art PC systems: Dual-channel serial ATA/RAID controller Dual-channel enhanced IDE controller IEEE 802.8515 N/B Maintenance The VT8237A integrates extensive peripheral controllers for modern. Advanced Configuration Power Interface (ACPI) with application restart. 8515 system provides a New card/Express card and Mini PCI-E card. t t n e e r c m e u S c c Do a iT ial M t n e id f n o C 4 . Realtek ALC268 High Definition (Azalia) Audio Codec based multimedia interface includes built-in stereo speaker.0 ports Full System Management Bus (SMBus) interface Keyboard controller with PS/2 mouse support Real time clock with 256 bytes extended CMOS Power management unit compliant with ACPI and legacy APM requirements Plug and play functions with steerable PCI interrupts User expendable peripheral interface built on 8515 system are 4 USB ports. touch pad. 7 mm) 15. resolution: 1280x800 ICS 953009 and DDRⅡ buffer ICS 9P956. SATA I/F Combo/DVD-Dual. ALC268) Built-in stereo speaker Sound volume control by S/W 2 CH Memory HDD ODD Display Clock Generator VGA Control LVDS Transmitter LAN Express Card Audio System t t n e e r c m e u S c c Do a iT ial M t n e id f n o C 5 .2 System Hardware Parts CPU Core Logic System BIOS Mobile Merom Celeron/Pentium M CPU Thermal spec 35 W TDP VIA VN896CE + 8237A chipset Phoenix BIOS 512 KB flash EPROM Include system BIOS Plug & play capability ACPI 0 MB DDRII 533 SDRAM memory on board 2 memory SO-DIMM slots for memory expansion 1. PATA.5" 60 GB/80 GB/100 GB/120 GB HDD (9.25-inch height memory module supported 200 pins DDRII 533 SDRAM SO-DIMM memory module Support 2048 MB Support 2. super multi (12. LVDS ICS MK1707 Internal VIA VN896CE VIA VT1637 VIA VT6103L Power switch TPS2231 Built-in sound system Azalia I/F (HD Audio codec.5 mm) 5400/7200 rpm.8515 N/B Maintenance 1.4" WXGA. 0 x4 (Individual) USB Modem t t n e e r c m e u S c c Do a iT ial M t n e id f n o C 6 .8515 N/B Maintenance Continue to previous page 6 Kbps (V.92) fax modem (MDC (Azalia I/F)) and 10/100 (Reserved for 1000) Base-TX LAN Wireless LAN Intel (Mini PCI-E Interface IEEE802.11 b. g) Wireless LAN Keyboard Controller (CIR) WINBOND W83L951D USB2. 1.1 CPU Mobile Intel Merom CPU Processor 1.1 Mobile Intel Merom CPU Processor ™ Processor support • CORE 2 DUO processor for mobile • 667 MT/s (667 MHz) and 800 MT/s (800 MHz) FSB support • On-die.8515 N/B Maintenance 1. 2-MB second level cache with advanced transfer cache architecture shared between the two cores • Advance gunning transceiver logic (AGTL +) bus driver technology frequency points • Enhanced Intel speed step technology to enable real-time dynamic switching between multiple voltage and • Source synchronous double-pumped (2×) address • Source synchronous quad-pumped (4×) data • Other key feature are: t t n e e r c m e u S c c Do a iT ial M t n e id f n o C Support for DBI (Data Bus Invor ersion) Support for MSI (Message signaled interrupt) 7 .2.2. 5 V VCCP 1.05 V t t n e e r c m e u S c c Do a iT ial M t n e id f n o C 8 .05 V ™ Merom based Intel Pentium M Processor Feature • On-die 1 MB second level cache with advance transfer cache architecture shared between the two cores • 478-pin Micro-FCPGA packages • VCCA 1.8515 N/B Maintenance 32-bit interface to address up to 4 GB of memory A12 deep In-Order Queue to pipeline FSB commands AGTL+ bus driver with integrated AGLT termination resist 478-pin Micro-FCPGA and 49-ball Micro-FCBGA packages VCCA 1.5 V • VCCP 1. 2.7 V current-mode differential CPU pairs • 1 – 0.2 Clock Generator 1.318 MHz • 3 – 3 V66.1 ICS 953009 System Frequency Synthesizer ™ Recommended Application • VIA VN896CE systems using Intel Merom processors ™ Output Features • 2 – 0.8515 N/B Maintenance 1.2. 66.2. 33 MHz • 2 – REF.66 MHz • 1 – 48 MHz • 1 – 24/48 MHz t t n e e r c m e u S c c Do a iT ial M t n e id f n o C • 5 – PCI-Express 0.7 V current mode differential pairs 9 .7 V current-mode differential CPU/PCI-Express selectable pair • 7 – PCI. 14. 318 MHz reference input.8515 N/B Maintenance ™ Features/Benefits • Programmable output frequency • Programmable asynchronous 3 V66&PCI frequency • Programmable asynchronous PCI-Express frequency • Programmable output divider ratios • Programmable output skew • Programmable spread percentage for EMI control • Watchdog timer technology to reset system if system malfunctions • Programmable watch dog safe frequency • Support I2C index read/write and block read/write operations • Uses external 14. external crystal load caps are required for frequency tuning t t n e e r c m e u S c c Do a iT ial M t n e id f n o C 10 . 8515 N/B Maintenance 1.2.53% t t n e e r c m e u S c c Do a iT ial M t n e id f n o C 11 .2.2 DDR II Buffer ICS 9P956 System Frequency Synthesizer ™ Low skew. fanout buffer ™ I2C for functional and output control ™ Single bank 1-6 differential clock distribution ™ 1 pair of differential feedback pins for input to output synchronization ™ Supports up to 2 DDR DIMMs ™ 667 MHz DDR II output frequency support ™ Switching characteristics • Output – Output skew: <100 ps • Output rise and fall time for DDR outputs: 650 ps – 950 ps • Duty cycle: 47% . PCI express bus controller and UniChrome Pro 3D / 2D graphics & video controllers in a single chip • Advanced 64-bit SDRAM controller supporting DDR2 667/533 and DDR 400/333/266/200 SDRAM • Combines with VIA VT8237A/VT8237R plus for 10/100 LAN.2. LPC. serial ATA and high definition audio (VT8237A) • 37.5 mm HSBGA package (Ball grid array with heat spreader) with 952 balls and 1.2.00 mm ball pitch ™ CPU interface • Supports 800/667/533/400 MHz FSB VIA C7 and Intel Pentium M processors • Supports Intel hyper-threading technology • Supports DBI (Dynamic Bus Inversion) • Supports trust configuration cycle • Deep In-order Command Queue (IOQ) t t n e e r c m e u S c c Do a iT ial M t n e id f n o C • Integrated CPU-to-DRAM write buffers and CPU-to-DRAM read prefetch buffers 12 .3 VIA VN896CE North Bridge ™ Defines highly integrated solutions for value notebook PC designs • High performance UMA north bridge: Integrated VIA C7 and Intel Pentium M north bridge with 800 / 667/ 533 / 400 MHz FSB support.8515 N/B Maintenance 1. ATA133 IDE.0. USB 2.5x37. PCIe.e.g. internal graphics controller and V-link access for minimum memory access latency • Rank interleave and up to16-bank page interleave (i. 16 pages open simultaneously) based on LRU to effectively reduce memory access latency t t n e e r c m e u S c c Do a iT ial M t n e id f n o C • Seamless DRAM command scheduling for maximum DRAM bus utilization (e..8515 N/B Maintenance • Built-in phase lock loop circuitry for optimal skew control within and between clocking regions ™ Memory interface • Supports DDR2 mode • Supports DDR2 667/533 memory • Supports mixed 64/128/256/512/1024/2048x8/16 DDR2 SDRAMs • Supports 2 unbuffered double-sided DIMMs and up to 4 GB of physical memory • Supports CL 2/3/4/5 for DDR2 667/533 • Programmable I/O drive capability for memory address.. data and control signals • DRAM interface pseudo-synchronous with host CPU for optimal memory performance • Concurrent CPU. precharge other banks while accessing the current bank) • CPU read-around-write capability for non-stalled operation 13 . 8515 N/B Maintenance • Speculative DRAM read before snoop result to reduce PCI master memory read latency • Supports Burst Read and Write operations with burst length of 4 or 8 • Optional dynamic Clock Enable (CKE) control for DRAM power reduction during normal system state (S0) • Supports self-refresh and CAS-before-RAS DRAM refresh with staggered RAS timing ™ Advanced High Bandwidth PCI Express Interface • Supports PCI express 1. Configurable lane width. through hand-shaking for transfer rate up to 4 GB/sec bi-directional Supports two upstream virtual channels 2nd port: A 1-Lane port for peripheral devices • Supports interconnect power management • Supports polarity reversal • Supports trust configuration cycle • Supports hot plug t t n e e r c m e u S c c Do a iT ial M t n e id f n o C 14 . 16/8/4/2/1.0a • Supports up to two PCI express ports 1st port: A 16-Lane port for high end graphics interface. 8515 N/B Maintenance • Loop-back testing mode for easy debugging mode for PCI express ™ High bandwidth 533 MB/sec 8-bit V-link host controller • Supports 66 MHz. 4x and 8x transfer modes. V-link interface with 533 MB/sec total bandwidth • Half duplex transfers with separate command/strobe for 4x 8-bit mode and full duplex for 8x 4-bit mode • Request/data split-transaction • Transaction assurance for V-link host-to-client access eliminates V-link host-client retry cycles • Intelligent V-link transaction protocol to minimize data wait-state and throttle transfer latency to avoid data overflow • Highly efficient V-link arbitration with minimum overhead ™ Integrated graphics with 2D/3D/video controllers • Optimized Unified Memory Architecture (UMA) • Supports 16/32/64 MB frame buffers size t t n e e r c m e u S c c Do a iT ial M t n e id f n o C • Graphics engine clocks up to 333 MHz decoupled from memory clock • Internal AGP 8x performance 15 . source color key and destination color key • Bresenham line drawing/style line function • Transparency mode ™ 3D acceleration features • 3D graphics processor t t n e e r c m e u S c c Do a iT ial M t n e id f n o C . 256 operations • Supports 8 bpp.Dual pixel rendering pipes .Dual texture units 16 .128-bit 3D graphics engine . 15/16 bpp and 32 bpp color depth modes • BitBLT (Bit Block Transfer) functions including alpha BLTs • Color expansion.8515 N/B Maintenance • Two 128-bit internal data paths between north bridge and graphics core for frame buffer and texture/command access ™ 2D acceleration features • 128-bit 2D graphics engine • Supports ROP3. 8515 N/B Maintenance . 8 bbp palletized (ARGB). Linear. LOD-Bias. bi-linear.Texture sizes up to 2048x2048 .Supports ROP2 .High quality texture filter for Nearest. polygon offset.Internal full 32-bit ARGB format for high rendering quality . including: 16/32 bbp ARGB.Hardware back-face culling 17 .Flat and gouraud shading .Supports various texture formats. edge anti-aliasing and alpha blending .8 K texture cache .Floating-point setup engine .Linear address • Capability .Z-Bias.Vertex fog and fog table t t n e e r c m e u S c c Do a iT ial M t n e id f n o C . YUV 422/420 and compressed texture (DXTC) .Bump mapping and cubic mapping . tri-linear and anisotropic modes . Pixel rate up to 400 million pixels per second for 2 textures each .Dedicated DVP2 for TV encoder • CRT display t t n e e r c m e u S c c Do a iT ial M t n e id f n o C 18 .8515 N/B Maintenance .Two textures per pass .16/32-bit Z test and 24+8 Z+ stencil test support • Performance .High quality dithering ™ Extensive display support for external video output • A dedicated CRT interface • Supports three 12-bit digital video ports .Texel bilinear fill rate up to 266 million texels per second .Specular Lighting .5 million polygons per second .Multiplexed DVP0 and DVP1 for LVDS transmitter .Triangle rate up to 4. Supports CRT resolutions up to 2048x1536 at 75 Hz • 12-bit DDR/18-bit/24-bit LVDS transmitter interface for LCD panel . SMM and STPCLK mechanisms • Supports enhanced Intel Speedstep technology • Low-leakage I/O pads ™ Advanced graphics power management support t t n e e r c m e u S c c Do a iT ial M t n e id f n o C 19 .Built-in digital phase adjuster to fine tune signal timing between clock and data bus ™ Advanced system power management support • ACPI 2.1 compliant • Supports suspend-to-DRAM (STR) and DRAM self refresh • Supports dynamic Clock Enable (CKE) control for DRAM power reduction during normal system state (S0) • Supports SMI.CRT display interface with 24-bit true-color RAMDAC up to 300 MHz pixel rate with gamma correction capability .0 and PCI bus power management 1.12-bit DDR and clock rate up to 165 MHz .8515 N/B Maintenance . 4 VIA VT8237A South Bridge u S c c Do a T al i • M ti n • e d i f • n o C • ™ High bandwidth 1 GB/sec ultra V-link controller Half duplex.2.8515 N/B Maintenance • Built-in reference voltage generator and monitor sense circuits • Automatic panel power sequencing and VESA DPMS (Display Power Management Signaling) CRT power-down • External I/O signal controlling enabling graphics accelerator into standby/suspend-off state • Auto clock gating for each engine to achieve power saving t t n e e r c m e 1. 66 MHz. Ultra V-link interface with 1 GB/sec maximum bandwidth Full duplex. in 8x mode • Transaction assurance for V-link host to client access eliminates V-link host-client retry cycles • Intelligent V-link transaction protocol to minimize data wait-state. in 4x mode Request/data split transaction • I2C serial bus and DDC monitor communications for CRT plug-and-play configuration Supports 16-bit. throttle transfer latency to avoid data overflow • Highly efficient V-link arbitration with minimum overhead 20 . with 16-bit data bus. 4x and 8x transfer modes. with separate 8-bit Up and Down data path and command/strobe.2. RAID Level 1 and JBOD • S-ATA drive transfer rate is capable of up to 150 MB/s per channel (serial speed of 1.5 Gbit/s) • External crystal input for serial ATA port operation • Supports defer spin up and port multiplier ™ High definition (HD) audio controller • High definition audio controller with 192 KHz sample rate.8515 N/B Maintenance ™ Dual channel serial ATA/RAID controller • Complies with serial ATA specification revision 1. 24-bit per sample and up to 8 channels • Microsoft UAA (Universal Audio Architecture) driver support • Up to four independent playback streams and audio codecs • Multiple recording channels for array microphone • Supports jack sensing/retasking 21 t t n e e r c m e u S c c Do a iT ial M t n e id f n o C .0 • Dual Channel master mode PCI • On-chip two-channel Serial ATA (S-ATA) PHY for support of up to two S-ATA devices directly • S-ATA devices can be configured in multiple RAID configurations – supports RAID Level 0. 1 root hubs • USB 2.1 and Universal Host Controller Interface (UHCI) v1.0 compliant • USB 1.0 root hub and four USB 1.0 ports with integrated PHY • One USB 2.0 and Enhanced Host Controller Interface (EHCI) v1.0 debug port ™ Fast Ethernet controller • High performance PCI master interface with scatter/gather and bursting capability • Standard MII interface to external PHYceiver • 1/10/100 MHz full and half duplex operation • Independent 2 K byte FIFOs for receive and transmit 22 t t n e e r c m e u S c c Do a iT ial M t n e id f n o C .8515 N/B Maintenance ™ Universal serial bus controller • Eight USB 2.1 compatible • Integrated physical layer transceivers with optional over-current detection status on USB inputs • Eighteen level (doublewords) data FIFO with full scatter and gather capability • Legacy keyboard and PS/2 mouse support • One USB 2. and multicast address filtering using hashing function • Magic packet and wake-on-address filtering • Software controllable power down ™ Ultra DMA-133/100/66/33 bus master EIDE controller • Dual channel hard disk controller supporting up to four enhanced IDE devices • Data transfer rate up to 133 MB/sec to cover PIO mode 4.8515 N/B Maintenance • Flexible dynamically loadable EEPROM algorithm • Physical. broadcast. multi-word DMA mode 2 and UltraDMA-133 interface • Dual DMA engines for concurrent dual channel operation • Full scatter gather capability • Supports ATAPI compliant devices including DVD devices • Supports PCI native and ATA compatibility modes • Bus master programming interface for SFF-8038i rev.0 and Windows-95 compliant • Complete software driver support t t n e e r c m e u S c c Do a iT ial M t n e id f n o C 23 .1. and suspend to disk (soft-off). all with hardware automatic wake-up 24 t t n e e r c m e u S c c Do a iT ial M t n e id f n o C . and PCI/CPU clock generator stop control • Supports multiple system suspend types: power-on suspends (POS) with flexible CPU/PCI bus reset options. suspend to DRAM (STR). Power Management Enable (PME) control.0 • I2C devices compatible • Supports SMBus Address Resolution Protocol (ARP) by using host commands through software • Supports slave interface for external SMBus masters to control resume events • Supports alert on LAN II through a SMBus-interfaced register ™ Sophisticated mobile power management • ACPI 2.2 Compliant • Supports On Now power management • Supports Intel enhanced SpeedstepTM with dedicated pins • Supports PCI Express WAKE suspend resume event • Supports CPU clock throttling and clock stop during ACPI C0 / C1 / C2 / C3 states • Supports PCI clock run.8515 N/B Maintenance ™ System management bus interface • Compliant with System Management Bus (SMBus) revision 2.0 and APM v1. plus a 24/32-bit ACPI compliant timer • Supports normal. external modem ring indicator. a peripheral timer and a general purpose timer. doze. suspend and conserve modes • Global and local device power control • Supports system event monitoring with two event classes • Primary and secondary interrupt differentiation for individual channels for system wake-up • Dedicated input pins for power and sleep buttons. and century field • Thermal alarm on external temperature sensing circuit • I/O pad leakage control ™ Plug and play functions t t n e e r c m e u S c c Do a iT ial M t n e id f n o C 25 .8515 N/B Maintenance • Multiple suspend power plane controls and suspend status indicators • Integrates an idle timer. and notebook lid open/close • 32 general purpose input ports and 32 output ports • Multiple internal and external SMI sources for flexible power management models • Enhanced integrated Real Time Clock (RTC) with date alarm. sleep. month alarm. Windows 98TM and plug and play BIOS compliant ™ Integrated legacy functions • Integrated keyboard controller with PS2 mouse support • Integrated DS12885-style real time clock with extended 256 bytes CMOS RAM and day/month alarm for ACPI • Integrated DMA. timer. Windows NTTM.8515 N/B Maintenance • Steerable PCI interrupts • Steerable interrupts for integrated peripheral controllers • Microsoft Windows XPTM. Windows 2000TM. and interrupt controller • Serial IRQ for docking and non-docking applications • Fast reset and gate A20 operation t t n e e r c m e u S c c Do a iT ial M t n e id f n o C 26 . 5 V core power for low power consumption ™ 48-pin LQFP package (7x7x1.2.4 mm) ™ Available for lead-free package t t n e e r c m e u S c c Do a iT ial M t n e id f n o C 27 .3 VT1637 LVDS Transmitter ™ Supports single/dual LVDS transmitter function ™ Compatible with TIA/EIA-644 LVDS standard ™ Supports LVDS 18-bit Output ™ Supports dual channel UXGA panel display ™ Supports 2D dither for 18-bit Panel ™ Supports DVO input mode with 25 to 165 MHz input clock ™ Programmable input clock and strobe select ™ Narrow bus reduces cable size and cost ™ PLL requires no external components ™ 2.8515 N/B Maintenance 1. 8515 N/B Maintenance 1.2.4 TI TPS2231 Single-Slot PC Card Power Interface Switch ™ Meets the express card™ standard (Express card 34 or express card 54) ™ Available in a 32-pin power PAD™ HTSSOP (Dual) ™ Compliant with the express card™ compliance checklists ™ – 40°C to 85°C ambient operating temperature range ™ Available in a 20-pin TSSOP, a 20-pin QFN, or 24-pin power PAD™ HTSSOP (Single) ™ Fully Satisfies the express card™ implementation guidelines ™ Supports systems with wake function ™ TTL-logic compatible inputs ™ Short circuit and thermal protection 1.2.5 Realtek ALC268 High Definition Audio System ™ Single-chip multi-bit sigma-delta converters with high S/N ratio t t n e e r c m e u S c c Do a iT ial M t n e id f n o C ™ 1 stereo DAC supports 16/20/24-bit PCM format with 44.1/48/96/192 KHz sample rate 28 8515 N/B Maintenance ™ 2 stereo ADCs support 16/20-bit PCM format with 44.1/48/96 KHz sample rate ™ Applicable for 2-channel 192 KHz DVD-audio solutions ™ Line-out, HP-out, Line 1, Line 2, MIC1, and MIC2 are stereo input and output re-tasking ™ MONO line level output to subwoofer speaker for 2.1 channel applications ™ High-quality differential CD analog input ™ External PCBEEP input is applicable, and internal BEEP generator is integrated ™ Power-off CD mode supported (Only in ALC268 & ALC268-LF) ™ Power management and enhanced power saving features ™ Power support: digital: 3.3 V; analog: 3.8 V/5.0 V ™ Selectable 2.5 V/3.75 V VREFOUT ™ Two jack detection pins (Each designed to detect 4 jacks) ™ Supports 44.1/48/96/192 KHz S/PDIF output ™ Supports 44.1/48/96 KHz S/PDIF input t t n e e r c m e u S c c Do a iT ial M t n e id f n o C ™ 48-pin LQFP packages (lead (Pb)-free packages also available) 29 8515 N/B Maintenance ™ Supports external volume knob control ™ External PCBEEP Pass-Through when link is in RESET state (Not supported in the ALC268(D)-VE and ALC268(D)-VE-LF) ™ –64 dB ~ +30 dB with 1 dB mixer gain resolution for finer volume control t t n e e r c m e u S c c Do a iT ial M t Amplifier 1.2.6 ANPEC APA2056 Audio Power n e id f n o C ™ Impedance sensing capability for each re-tasking jack ™ Built-in headphone amplifier for each re-tasking jack ™ Supports external volume knob control ™ Supports GPIO (General Purpose Input/Output) for customized applications ™ Compatible with PC 99 desktop line-out Into 10-KW load ™ Internal gain control, which eliminates external gain-setting resistors ™ 2-W/Ch output power Into 3-W load ™ Input MUX select terminal ™ PC-beep input 30 8515 N/B Maintenance ™ Depop circuitry ™ Stereo input MUX ™ Fully differential input ™ Low supply current and shutdown current t t n e e r c Universal m e 1.2.7 Keyboard System – Winbond W83L951D Keyboard Controller u S c c o a D T l i ia • M t n e • d i f • n o C • ™ Surface-mount power packaging 24-Pin TSSOP power PAD ™ Core logic 8-bit turbo 8052 microprocessor code based. speed up to 24 MHz 256 bytes Internal RAM 64 K bytes embedded programmable flash memory 2 K bytes external SRAM ™ Host interface • Software optional with LPC interface • Primary programmable I/O address communication port in LPC mode 31 . 8515 N/B Maintenance ™ SMBus • Support 2 SMBus interface support master mode ™ Timers • Support four timer signal with three pre-scalars • Timer 1 and 2 shard the same pre-scalar and are free-running only event counter and pulse width measurement ™ PWM • Timer X and Y have individual pre-scalar and support up to four control modes, free. Running, pulse output, • Support four PWM channels • PWM 0 and 1 are 8-bits and programmable frequency from 62 Hz to 7.5 KHz • PWM 2 and 3 are 16-bits and programmable frequency from 6 Hz to 3 MHz ™ Fan Tachometer t t n e e r c m e u S c c Do a iT ial M t n e id f n o C • Support two fan tachometer input ™ A/D converter • Firmware programmable optional with 10-bit or 8-bit resolution 32 8515 N/B Maintenance • Support eight channels ™ D/A converter • 8-bit resolution • Support two channels ™ PS2 • Support three hardware PS2 channels • Optional PS2 clock inhibit by hardware or firmware ™ Keyboard controller • Support 16*8 keyboard matrix-scan, expanding to 18*8 and 20*8 ™ GPIO • Support 104 useful GPIO pins totally and bit–addressable to facility firmware coding ™ Flash t t n e e r c m e u S c c Do a iT ial M t n e id f n o C • Support external on-board 64 K flash via matrix interface (GP0, 1, 3) ™ CIR 33 8515 N/B Maintenance • Support decoding for the NEC consumer IR remote control format ™ RTC • Real time clock generator with 32.768 KHz input ™ ACPI t t n e e • r c m e u S c c Do a • iT ial M t n – SST49LF004B e 1.2.8 System Flash Memory (BIOS) id f n o C • Support ACPI appliance Secondary programmable I/O address communication port in LPC mode ™ Package 128 pin QFP and 128 pin LQFP package options ™ 512 K x 8 (4 Mbit) ™ Flexible erase capability • Uniform 4 KByte sectors • Uniform 64 KByte overlay blocks • Chip-erase for PP mode only 34 8515 N/B Maintenance ™ Single 3.768 KHz input ™ Superior reliability • Endurance: 100.000 cycles (typical) • Greater than 100 years data retention ™ Low power consumption • Active read current: 6 mA (typical) • Standby current: 10 µA (typical) ™ Fast sector-erase/byte-program operation • Sector-erase time: 18 ms (typical) • Block-erase time: 18 ms (typical) • Chip-erase time: 70 ms (typical) t t n e e r c m e u S c c Do a iT ial M t n e id f n o C • Byte-program time: 14 µs (typical) • Chip rewrite time: 8 seconds (typical) 35 .0-3.6 V read and write operations • Real time clock generator with 32. 8515 N/B Maintenance ™ Two operational modes • Low Pin Count (LPC) interface mode forin-system operation • Parallel Programming (PP) mode for fast production programming ™ LPC interface mode • 5-signal LPC bus interface supporting byte read and write • 33 MHz clock frequency operation • WP# and TBL# pins provide hardware write protect for entire chip and/or top boot block • Block locking registers for individual block write-lock and lock-down protection • JEDEC standard SDP command set • Data# polling and toggle bit for end-of-write detection • 5 GPI pins for system design flexibility • 4 ID pins for multi-chip selection t t n e e r c m e u S c c Do a iT ial M t n e id f n o C ™ Parallel Programming (PP) mode • 11-pin multiplexed address and 8-pin data I/O interface 36 . 8515 N/B Maintenance • Supports fast programming in-system on programmer equipment ™ CMOS and PCI I/O compatibility 1.3. full/half duplex t t n e e r c m e u S c c Do a iT ial M t n e id f n o C ™ Meet all applicable IEEE 802.2.9 VIA VT6103L 10Base – T/100Base – TX Integrated Ethernet LAN PHY/Transceiver ™ Single chip 100Base -TX/10Base -T physical layer solution ™ Dual speed – 100/10 Mbps ™ Half and full duplex ™ MII interface to Ethernet controller ™ MII Interface to Configuration & Status ™ Auto power saving mode ™ Auto negotiation: 10/100. 10Base -T and 100Base -Tx standards ™ On chip wave shaping – no external filters required ™ Adaptive equalizer 37 . 8515 N/B Maintenance ™ Baseline wander correction ™ LED outputs • Link status • Duplex status • Speed status • Collision ™ 48 pin SSOP package t t n e e r c m e u S c c Do a iT ial M t n e id f n o C 38 . 1 Hot Key Function Keys Combination Fn + F1 Fn + F2 Fn + F3 Fn + F4 Fn + F5 Fn + F6 Fn + F7 Fn + F8 Fn + F9 Fn + F10 Fn + F11 Fn + F12 Feature Wireless LAN on/off Meaning Enable or disable wireless LAN function t t n e e r c m e u S c c Do a iT ial M t n e id f n o C Mute off/on Panel off/on Suspend to DRAM/HDD Volume down Audio volume down Volume up Audio volume up LCD/external CRT switching Rotate display mode in LCD only.3.3.8515 N/B Maintenance 1. CRT only and simultaneously display Brightness down Decreases the LCD brightness Brightness up Increases the LCD brightness Toggle mute on/off Toggle panel on/off Force the computer into either suspend to HDD or suspend to DRAM mode depending on BIOS setup 1.2 Quick Key Function ™ Internet. e-mail. P1 39 .3 Other Functions 1. 2 ACPI Mode • None • Standby ™ At ACPI mode.1 APM Mode ™ At APM mode.4 Cover Switch e id f n o C 1. ™ Continue pushing power button over 4 seconds will force system off at ACPI mode ™ System automatically provides power saving by monitoring cover switch.3. "power off“ or "hibernate” (Must enable hibernate function in power management) to power button function.3.3.3.8515 N/B Maintenance 1.3 Power on/off/suspend/resume Button 1. windows power management control panel set power button behavior. power button is on/off system power t t n e e r c m e u S c c Do a iT ial M t n 1.3. You could set "standby".3. It will save battery power and prolong the usage time when user closes the notebook cover ™ At ACPI mode there are three functions to be chosen at windows XP power management control panel 40 . 3.5. num lock status. power status. caps lock status. battery charge status.1 Six LED Indicators Above Keyboard e u S c c Do a iT ial M t n e • id f n • o C ™ WLAN power status On: WLAN power on Off: WLAN power off ™ Power status ™ System has six status LED indicators to display system activity. which include six above keyboard ™ From left to right that indicates WLAN. HDD/ODD status • On: System power on • Off: Suspend to RAM power management mode (Flash rate: 1 Hz) 41 .5 LED Indicators t t n e e r c m 1.8515 N/B Maintenance • Off • Hibernate (Must enable hibernate function in power management) 1.3. flash rate: 1 Hz) ™ CAPS lock status • Green: Active state ™ NUM lock status • Green: Active state ™ HDD/ODD status • The LED light green when HDD or ODD is working t t n e e r c m e u S c c Do a iT ial M t n e id f n o C 42 .8515 N/B Maintenance • Off: System power off ™ Battery charge status • Green: Battery was fully charged (AC mode) • Orange: Battery was under charging (AC mode) • Red (Flash): Battery low (Under 10%. battery mode. and battery capacity is below 5%.1 Battery Warning ™ System also provides battery capacity monitoring and gives user a warning so that users have chance to save his data before battery dead.4 volts.6.6. Also.3 Battery Dead State o C ™ System will suspend to HDD after 2 minutes to protect users data ™ Battery warning: Capacity below 10%.3.2 Battery Low State a iT ial M t n e id f n 1.8515 N/B Maintenance 1. this function protects system from mal-function while battery capacity is low t t n e e r c m e u S c c Do 1. system will shut down automatically in order to extend the battery packs' life 43 . battery capacity LED flashes per second.3.3. system will generate beep sound for twice per second ™ When the battery voltage level reaches 7.6 Battery Status 1. system beeps per 2 seconds ™ After battery warning state.3.6. 8 CMOS Battery e u S c c Do a iT ial M t n e id f n o C ™ There is a standard CR2032 3 V 220 mAh lithium coin battery to supply RTC power. When AC in or system main battery inside. Fan speed is depended on CPU temperature.8515 N/B Maintenance 1.1 CPU Fan ™ FAN is controlled by W83L951D embedded controller-using ADM1032 to sense CPU temperature and W83L951D PWM control fan speed.3. Higher CPU temperature will get faster fan speed t t n e e r c m 1.7.7 Fan Power on/off Management 1. CMOS battery consumes no power to save coin battery’s life cycle 44 .3.3. resolution: 1280x800 t t n e e r c m e u S c c Do a 1.DIMM n o C 1.4.4 DDR SO .4.3 ODD iT ial M t n e id f 1.4.4" WXGA.5" 60 GB/80 GB/100 GB/120 GB HDD (9.4.5 mm) 5400/7200 rpm.4 Peripheral Components 1.8515 N/B Maintenance 1.7 mm) ™ 0 MB DDRII 533 SDRAM memory on board ™ 2 memory SO. super multi (12.DIMM slots for memory expansion ™ 200 pins DDRII 533 SDRAM SO-DIMM memory module ™ Support 2.2 HDD ™ Combo/DVD-dual. PATA.1 LCD Panel ™ 15. SATA I/F 45 . 8515 N/B Maintenance 1.4.5 Keyboard ™ European keyboard layout ™ 19 mm key pitch/3 mm stroke t t n e e r c m e u S c c Do a iT ial M t n e id f n o C 46 . CPU: Stop grant 47 . The CPU power consumption and temperature is lower in this mode ™ Standby Mode t t n e e r c m e u S c c Do a iT ial M t n e id f n o C • For more power saving.8515 N/B Maintenance 1. it turns of the peripheral components. In this mode.5.1 System Management Mode ™ Full on mode • In this mode. each device is running with the maximal speed. Following are the descriptions of the power management modes supported 1. User can enable and configure different degrees of power management modes via ROM CMOS setup (Booting by pressing F2 key). CPU will be toggling between on & stop grant mode either.5 Power Management ™ The 8515 system has built in several power saving modes to prolong the battery usage. CPU clock is up to its maximum ™ Doze Mode • In this mode. This can save battery power without loosing much computing capability. The technology is clock throttling. the following is the status of each device . LCD: Backlight off . the following is the status of each device .PCMCIA: Suspend .CPU: Off .Audio: Off .8515 N/B Maintenance .SDRAM: Self refresh ™ Suspend to HDD t t n e e r c m e u S c c Do a iT ial M t n e id f n o C • All devices are stopped clock and power-down.VGA: Suspend . In this mode. All system status will be restored when powered on again 48 . System status is saved in HDD.HDD: Spin down ™ Suspend to DRAM • The most chipset of the system is entering power down mode for more power saving.Twister K: Partial off . the system leakage current shall be less than 0. In addition. Universal Keyboard Controller (KBC) will be power off. In this mode.2 Battery Only Power off Mode ™ The 8515 system has built in battery only power off mode to prolong the battery usage. therefore system power consumption is lower in this mode t t n e e r c m e u S c c Do a iT ial M t n e id f n o C 49 .5 mA.8515 N/B Maintenance 1.5. 1.2 Left-side View n e id f n o C n Top Cover Latch n Power Jack o USB Port*1 q HP Jack r External MIC Jack s Express Card Socket p Ventilation Openings n p o n r q ○ ] 50 . System View and Disassembly 2.8515 N/B Maintenance 2.1.1 System View 2.1 Front View t t n e e r c m e u S c c Do a iT ial M t 2. 3 Right-side View n ODD Drive n 2.1.1.4 Rear View n Kensington Lock o RJ-11 Connector p RJ-45 Connector q USB Port*2 r CRT Connector s USB Port*1 t t n e e r c m e u S c c Do a iT ial M t n e id f n o C p ○ n o q r] 51 .8515 N/B Maintenance 2. 6 Top-open View iT ial M t n e id f n o C n LCD Screen n o Device LED Indicators q Power Button r Keyboard p Mail/Internet/P1 Button o p q r s Stereo Speaker Set t Internal MIC u Touch Pad s t u t 52 s .5 Bottom View n Battery Park o CPU & DDR2 SO-DIMM & Mini Express Card (Wireless) & HDD o n t t n e e r c m e u S c c Do a 2.1.8515 N/B Maintenance 2.1. M2. Screw driver with bit size for notebook assembly & disassembly. Auto screw driver for notebook assembly & disassembly.0-2.8515 N/B Maintenance 2.0 53 . 2. t t n e e 2 mm r c m e u S c c Do a iT ial M t n e id f n o C Tooling Auto Screwdriver Tor. 2 mm 2.5 kg/cm2 Bit Size #0 Bit Size #0 Screw Size 1.2 Tools Introduction 1. 2 Keyboard 2. NOTEBOOK t t n e e r c m e u S c c Do a iT ial M t n e id f n o C Modular Components LCD Assembly Components Base Unit Components 2.8 LCD Panel 2.5 HDD Module 2.9 Inverter Board 2.6 ODD Drive 2.10 System Board 2.11 Modem Card 54 .3 CPU 2.1 Battery Pack 2. NOTE: Before you start to install/replace these modules.3 System Disassembly The section discusses at length each major component for disassembly/reassembly and show corresponding illustrations.3.3. disconnect all peripheral devices and make sure the notebook is not turned on or connected to AC power.3.3.3.3.4 DDR2-SDRAM 2.3.3.3.Use the chart below to determine the disassembly sequence for removing components from the notebook.3.3.7 LCD ASSY 2.8515 N/B Maintenance 2. Take the battery pack out of the compartment (n). The battery pack should be correctly connected when you hear a clicking sound. Carefully put the notebook upside down.1 Battery Pack Disassembly 1. 2. Replace the battery pack into the compartment. (Figure 2-1) Reassembly t t n e e r c m e u S c c Do a iT ial M t n e id f n o C n n Figure 2-1 Remove the battery pack 1. 55 .3.8515 N/B Maintenance 2. 2 Keyboard Disassembly 1. (Refer to section 2. (Figure 2-2. Remove one screw then push firmly to slide the easy start buttons cover to the right (n).1 Disassembly) 2.3. Figure 2-3) Figure 2-2 Remove one screw t t n e e r c m e u S c c Do a iT ial M t n e id f n o C o n Figure 2-3 Left the keyboard cover 56 . Then lift the easy start buttons cover up (o).8515 N/B Maintenance 2.3. Remove the battery pack. 1 Reassembly) t t n e e r c m e u S c c Do a iT ial M t n e id f n o C Figure 2-4 Remove the keyboard 57 . (Refer to section 2.3. (Figure 2-4) Reassembly 1.8515 N/B Maintenance 3. Replace the battery pack. Slightly lift up the keyboard and disconnect the cable from the system board to detach the keyboard. 2. Replace the keyboard cover and secure with one screw. 3. Reconnect the keyboard cable and fit the keyboard back into place. (Refer to section 2.3.3. disconnect the fan’s power cord from system board and remove four screws fastening the heatsink.1 Disassembly) 2.3 CPU Disassembly 1. Remove three screws that secure the fan.8515 N/B Maintenance 2. Remove four screws fastening the CPU cover. (Figure 2-6) Figure 2-5 Remove four screws t t n e e r c m e u S c c Do a iT ial M t n e id f n o C Figure 2-6 Free the heatsink and fan 58 . (Figure 2-5) 3. Remove the battery pack. replace the fan and heatsink. (Figure 2-7) Reassembly 1. then insert CPU pins into the holes. then secure with seven screws. Replace the CPU cover and secure with four screws. 3.8515 N/B Maintenance 4. align the arrowhead corner of the CPU with the beveled corner of the socket. loosen the screw by a flat screwdriver. 2.3. To remove the existing CPU. (Refer to section 2.1 Reassembly) t t n e e r c m e u S c c Do a iT ial M t n e id f n o C Figure 2-7 Remove the CPU 59 . Replace the battery pack. Carefully. Tighten the screw by a flat screwdriver to locking the CPU. Connect the fan’s power cord to the system board. 4. upraise the CPU socket to unlock the CPU. match the DDR2's notched part with the socket's projected part and firmly insert the SODIMM into the socket at 20-degree angle.3 Disassembly) 3. (Refer to section 2. Remove four screws fastening the CPU cover.3.3. 3.3.3.8515 N/B Maintenance 2. Then push down until the retaining clips lock the DDR2 into position 2. To install the DDR2.1 Disassembly) 2. (Figure 2-8) t t n e e r c m e u S c c Do a iT ial M t n e id f n o C Figure 2-8 Remove the SO-DIMM Reassembly 1. Remove the battery pack.4 DDR2-SDRAM Disassembly 1. Replace the battery pack. Pull the retaining clips outwards (n) and remove the SO-DIMM (o).1 Reassembly) 60 . (Refer to section 2. Replace the CPU cover and secure with four screws. (See section 2. Remove the battery pack.8515 N/B Maintenance 2. then slide the HDD module out of the compartment.3 Disassembly) 3.3. Remove four screws fastening the CPU cover.3. Carefully put the notebook upside down. (Refer to section 2.3.1 Disassembly) 2. (Refer to section 2. Remove one screw fastening the HDD.5 HDD Module Disassembly 1. (Figure 2-9) t t n e e r c m e u S c c Do a iT ial M t n e id f n o C Figure 2-9 Remove HDD module 61 . 3. Remove four screws to separate the hard disk drive from the bracket. Attach the bracket to hard disk drive and secure with four screws.1 Reassembly) t t n e e r c m e u S c c Do a iT ial M t n e id f n o C Figure 2-10 Remove hard disk drive 62 .3. Replace the battery pack. Slide the HDD module into the compartment and secure with one screw. (Refer to section 2. 4.8515 N/B Maintenance 4. 2. remove the hard disk drive. (Figure 2-10) Reassembly 1. Replace the CPU cover and secure with four screws. (Figure 2-11) 3.1 Disassembly) 2. (Figure 2-11) t t n e e r c m e u S c c Do a iT ial M t n e id f n o C n o Figure 2-11 Remove the ODD drive Reassembly 1.3. such as a straightened paper clip. Replace the battery pack. Push the ODD drive into the compartment and secure with one screw.3.1 Reassembly) 63 . 2. Then gently pull out the ODD drive by holding the tray that pops out (o).3.8515 N/B Maintenance 2. (Refer to section 2. Insert a small rod. into ODD drive’s manual eject hole (n) and push firmly to release the tray. Remove the battery pack. Remove one screw fastening the ODD drive. (Refer to section 2. Carefully put the notebook upside down.6 ODD Drive Disassembly 1. 1 and 2.7 LCD ASSY Disassembly 1.3 Disassembly) 3.3.3. keyboard. Remove four screws fastening the CPU cover.8515 N/B Maintenance 2. (Figure 2-13) Figure 2-12 Remove the hinge covers t t n e e r c m e u S c c Do a iT ial M t n e id f n o C Figure 2-13 Remove four screws 64 . Remove four screws.3.2 Disassembly) 2. (Refer to sections 2. then carefully put the notebook upside down. (Refer to step 2 of section 2. Remove two hinge covers.3. Remove the battery pack. (Figure 2-12) 4. Reconnect the LCD cable and replace two hinge covers. (Refer to sections 2. 2.2 and 2.3) 4. Attach the LCD assembly to the base unit and secure with six screws. Replace the CPU cover and secure with four screws.3. (Figure 2-14) Reassembly 1. Remove two screws to free the LCD assembly. (Refer to section 2.1 Reassembly) t t n e e r c m e u S c c Do a iT ial M t n e id f n o C Figure 2-14 Free the LCD assembly 65 .3.3. Disconnect LCD cable from the system board.8515 N/B Maintenance 5. 3. Replace the keyboard and battery pack. 3.3.7 Disassembly) 2.3. keyboard and LCD assembly.1. Repeat the process until the cover is completely separated from the housing. (Refer to section 2. (Figure 2-15) 3. Remove two screws fastening the LCD cover. Remove the battery.8 LCD Panel Disassembly 1. 4. (Figure 2-16) Figure 2-15 Remove LCD cover t t n e e r c m e u S c c Do a iT ial M t n e id f n o C Figure 2-16 Remove six screws and disconnect two cables 66 . 2. Insert a flat screwdriver to the lower part of the LCD cover and gently pry the frame out. Remove six screws and disconnect two cables.3.2 and 2.8515 N/B Maintenance 2. keyboard. 2.2 and 2. Replace the LCD assembly. Disconnect the LCD cable to free the LCD panel. (Figure 2-18) Figure 2-17 Remove four screws Reassembly 1. Reconnect the LCD cable to the LCD panel. battery pack. 2. 4. 5. Replace the LCD panel into LCD housing.3.8515 N/B Maintenance 5. Replace the LCD cover and secure with two screws.1Reassembly) t t n e e r c m e u S c c Do a iT ial M t n e id f n o C Figure 2-18 Free the LCD panel 67 . Attach the LCD panel’s bracket back to LCD panel and secure with four screws.7.3. Remove four screws that secure with the LCD bracket.3. fasten the LCD panel by six screws. 3. (See sections 2. (Figure 2-17) 6. keyboard. 2. LCD assembly.38 Disassembly) 2. 2.9 Inverter Board Disassembly 1.3. 2. Fit the inverter board back into place and secure with three screws.7. Remove three screws and free the inverter board. LCD assembly and LCD panel.8515 N/B Maintenance 2. (Refer to sections 2.8. 2.3.3. keyboard and battery pack.3.3. (Refer to section 2. 2. (Figure 2-19) Reassembly 1.2 and 2.2. Remove the battery. Replace the LCD Panel.3.1 Reassembly) t t n e e r c m e u S c c Do a iT ial M t n e id f n o C Figure 2-19 Remove three screws 68 .7 and 2.3.3.1. 3.5.3. (Figure 2-20.3. CPU. HDD.6 and 2.4. 2.8515 N/B Maintenance 2.2. Figure 2-21) Figure 2-20 Remove fifteen screws t t n e e r c m e u S c c Do a iT ial M t n e id f n o C Figure 2-21 Free the system board 69 . 2. 2.3. keyboard. ODD drive and LCD assembly. Remove the battery. Remove fifteen screws and two hex nuts fastening the housing. 2.3.7 Disassembly) 2.3.3. 2.10 System Board Disassembly 1. (Refer to sections 2.1. DDR2.3.3. Secure with fifteen screws and two hex nuts fasten the housing. Replace the LCD assembly. CPU. 4. Remove two screws and disconnect the two speaker’s cables. ODD. HDD. then free the system board. keyboard and battery pack.8515 N/B Maintenance 3. Replace the system board back into the housing. DDR2. (Figure 2-22) Reassembly 1. secure with two screws and reconnect two speaker’s cables. (Refer to previous section reassembly) t t n e e r c m e u S c c Do a iT ial M t n e id f n o C Figure 2-22 Free the system board 70 . Replace the top cover into the housing. 2. 3. 3.11 Modem Card Disassembly 1. CPU. then free the modem card. ODD. HDD. 2. Replace the system board. DDR2. 2. keyboard and battery pack.3. DDR2.2. LCD assembly and system board. (Refer to previous section reassembly) 71 . Replace the modem card back into the system board and secure with two screws. ODD. Disconnect the modem cable and remove two screws. 2. Remove the battery.3.4.3.7 and 2. 2. keyboard.3. 2.3. HDD.10 Disassembly) 2.3.6.3.1. then reconnect the cable. 2.3. the LCD assembly. 2.5.8515 N/B Maintenance 2. (Figure 2-23) t t n e e r c m e u S c c Do a iT ial M t n e id f n o C Figure 2-23 Remove the modem card Reassembly 1. (Refer to sections 2.3. CPU. J519 : Stereo Speaker Connector 72 .8515 N/B Maintenance 3.1 Mother Board (Side A) PJ501 J506 J503 J501 J504 J502 J505 J507 t t n e e r c m e u S c c Do a iT ial M t n e id f n o C J512 J514 J510 J513. J506 : USB Port ¾ J504 : USB Port*2 ¾ J505 : MDC Jump Wire Connector ¾ J507 : MDC Connector ¾ J510 : SATA HDD Connector ¾ J512 : HP Jack ¾ J514 : External MIC Jack ¾ J513.J515 J518 J516 J519 PJ502 J511 ¾ PJ501 : Power Jack ¾ PJ502 : Battery Connector ¾ J501 : CRT Connector ¾ J502 : RJ11 & RJ45 Connector ¾ J503. J515 : DDR2 SO-DIMM Socket ¾ J516 : Mini Express (Wireless) Connector ¾ J518. Definition & Location of Connectors/Switches 3. Definition & Location of Connectors/Switches 3.8515 N/B Maintenance 3.1 Mother Board (Side B) J4 SW6 SW7 t t n e e r c m e u S c c Do a iT ial M t n e id f n o C SW5 J1 SW2 SW3 SW4 J3 J2 ¾ J1 : LCD Inverter Connector ¾ J2 : Internal Keyboard Connector ¾ J3 : Touch-Pad Connector ¾ J4 : Express Card Socket ¾ SW2 : Mail Button ¾ SW3 : Internet Button ¾ SW4 : P1 Button ¾ SW5 : Power Button ¾ SW6 : Touch-Pad Left Button ¾ SW7 : Touch-Pad Right Button 73 . 1 Mother Board (Side A) U507 U513 U512 U506 t t n e e r c m e u S c c Do a iT ial M t n e id f n o C U514 ¾ U506 : LAN Controller VT6103L ¾ U507 : Intel Merom Socket ¾ U512 : Clock Generator ICS953009 ¾ U513 : VIA VN896 North Bridge ¾ U514 : VIA VT8237A South Bridge 74 . Definition & Location of Major Components 4.8515 N/B Maintenance 4. 1 Mother Board (Side B) U21 t t n e e r c m e u S c c Do a iT ial M t n e id f n o C U10 ¾ U10 : W83L951D Keyboard Controller ¾ U21 : System BIOS 75 .8515 N/B Maintenance 4. Definition & Location of Major Components 4. address decode.1 Intel Merom Processor CPU -1 CPU Pin Description Signal Name A[35:3]# Type I/O Description A[35:3]# (Address) define a 2*36-byte physical memory address space. A[35:3]# are source synchronous signals and are latched into the receiving buffers by ADSTB[1:0]#. All bus agents observe the ADS# activation to begin parity checking. or deferred reply ID match operations associated with the new transaction. All FSB agents must receive these signals to drive their outputs and latch their inputs.8515 N/B Maintenance 5. Refer to the platform design guides for more implementation details. Address signals are used as straps which are sampled before RESET# is deasserted. A[16:3]# ADSTB[0]# A[35:17]# ADSTB[1]# The differential pair BCLK (Bus Clock) determines the FSB frequency. In sub-phase 2. BPM[3:0]# (Breakpoint Monitor) are breakpoint and performance monitor signals. CPU Pin Description (Continued) Signal Name BNR# Type I/O Description BNR# (Block next request) is used to assert a bus stall by any bus agent who is unable to accept new bus transactions. During a bus stall. chipset and clock synthesizer. these pins transmit the address of a transaction. to ensure recognition of this signal following an Input/Output write instruction. Asserting A20M# emulates the 8086 processor’s address wrap-around at the 1-Mbyte boundary. BPRI# (Bus Priority Request) is used to arbitrate for ownership of the FSB. the processor masks physical address bit 20(A20#) before looking up a line in any internal cache and before driving a read/write transaction on the bus. Strobes are associated with signals as shown below. They are outputs from the processor that indicate the status of breakpoints and programmable counters used for monitoring processor performance. The Celeron processor 500 series operates at a 533-MHz system bus frequency (133MHz BCLK[1:0] frequency). A20M# I ADS# I/O ADSTB[1:0]# I/O t t n e e r c m e u S c c Do a iT ial M t n e id f n o C BPM[2:1]# BPM[3. A20M# is an asynchronous signal. The arbitration is done between Celeron processor (Symmetric Agent) and (G) MCH-M (High Priority Agent). The priority agent keeps BPRI# asserted until all of its requests are completed. Pin Descriptions of Major Components 5. BSEL[2:0] (Bus Select) are used to select the processor input clock frequency. A[35:32] should remain unconnected If A20M# (Address-20 Mask) is asserted. Assertion of A20M# is only supported in real mode. Observing BPRI# active (as asserted by the priority agent) causes the other agent to stop issuing new requests. The table defines the possible combinations of the signals and the frequency associated with each combination. it must be valid along with the TRDY# assertion of the corresponding Input/Output Write bus transaction. internal snoop.0]# I/O BPRI# I BR0# I/O BSEL[2:0] O COMP[3:0] Analog BCLK[1:0] I 76 . Address strobes are used to latch A[35:3]# and REQ[4:0]# on their rising and falling edges. BSE[2:0] Encoding for BCLK Frequency BCLK BSEL[2] BSEL[1] BSEL[0] Frequency L L L Reserved L L H 133MHz COMP[3:0] must be terminated on the system board using precision (1% tolerance) resistors. This includes debug or performance monitoring tools. protocol checking. the current bus owner can not issue any new transactions. ADS# (Address Strobe) is asserted to indicate the validity of the transaction address on the A[35:3]# and REQ[4:0]# pins. these pins transmit transaction type information. unless such requests are part of an ongoing locked operation. The required frequency is determined by the processor. Note: When paired with a chipset limited to 32-bit addressing. Signals Associated Strobe REQ[4:0]#. BPM[3:0]# should connect the appropriate pins of all Celeron FSB agents. All external timing parameters are specified with respect to the rising edge of BCLK0 crossing VCROSS. All agents must operate at the same frequency. BR0# is used by the processor to request the bus. then releases the bus by deasserting BPRI#. These signals must connect the appropriate pins of both agents on the Celeron FSB. In sub-phase 1 of the address phase. It must connect the appropriate pins of both FSB agents. However. DINV[0]# DSTBN[0]# D[31:16]#. DBSY# (Data Bus Busy) is asserted by the agent responsible for driving data on the FSB to indicate that the data bus is in use. DPSLP# is driven by the ICH8M I/O controller. DINV[3:0]# Assignment To Data Bus Bus Signal Data Bus Signals DINV[3]# D[63:48]# DINV[2]# D[47:32]# DINV[1]# D[31:16]# DINV[0]# D[15:0]# DPRSTP# is not used by the Celeron processor. Assertion of DEFER# is normally the responsibility of the addressed memory or Input/Output agent. and must connect the appropriate pins on both agents. DINV[1]# DSTBN[1]# D[47:32]#. DPWR# is a control signal used by the chipset to reduce power on the processor data bus input buffers. In a multi-common clock data transfer. The bus agent will invert the data bus signals if more than half the bits. DINV[3]# DSTBN[3]# DBR# O DBSY# I/O DEFER# I t t n e e r c m e u S c c Do a iT ial M t n e id f n o C DPRSTP# DPSLP# I I DPWR# I DRDY# I/O DSTBN[3:0]# I/O 77 . D[63:0]# are quad-pumped signals and will thus be driven four times in a common clock period. This signal must connect the appropriate pins on both FSB agents. D[63:0]# are latched off the falling edge of both DSTBP[3:0]# and DSTBN[3:0]#. If a debug port is implemented in the system. DBR# is a no connect in the system. DRDY# (Data Ready) is asserted by the data driver on each data transfer.8515 N/B Maintenance 5. the DINV# pins determine the polarity of the data signals. When the DINV# signal is active. The data bus is released after DBSY# is deasserted. These signals provide a 64-bit data path between the FSB agents. DINV[2]# DSTBN[2]# D[63:48]#. DRDY# may be deasserted to insert idle clocks. This signal must connect the appropriate pins of both FSB agents. CPU Pin Description (Continued) Signal Name DINV[3:0]# Type I/O Description DINV[3:0]# (Data Bus Inversion) are source synchronous and indicate the polarity of the D[63:0]# signals. would change level in the next cycle. DBR# is used by a debug port interposer so that an in-target probe can drive system reset. The following table shows the grouping of data signals to data strobes and DINV#.1 Intel Merom Processor CPU -2 CPU Pin Description (Continued) Signal Name D[63:0]# Type I/O Description D[63:0]# (Data) are the data signals. indicating valid data on the data bus. Each group of 16 data signals corresponds to one DINV# signal. The DINV[3:0]# signals are activated when the data on the data bus is inverted. Data strobe used to latch in D[63:0]#. DEFER# is asserted by an agent to indicate that a transaction cannot be guaranteed in-order completion. DPSLP# must be deasserted. Signals Associated Strobe D[15:0]#. within the covered group. The data driver asserts DRDY# to indicate a valid data transfer. the corresponding data group is inverted and therefore sampled active high. This is not utilized by the Celeron processor 500 series. DBR# (Data Bus Reset) is used only in processor systems where no debug port is implemented on the system board. In order to return to the Sleep state. This signal must connect the appropriate pins of both FSB agents. Quad-Pumped Signal Groups Data Group DSTBN#/DSTBP# DINV# D[15:0]# 0 0 D[31:16]# 1 1 D[47:32]# 2 2 D[63:48]# 3 3 Furthermore. For termination requirements please refer to the platform design guide DPSLP# when asserted on the platform causes the processor to transition from the Sleep state to the Deep Sleep state. Each group of 16 data signals correspond to a pair of one DSTBP# and one DSTBN#. DBR# is not a processor signal. it must be valid along with the TRDY# assertion of the corresponding Input/Output Write bus transaction. Assertion of IERR# is usually accompanied by a SHUTDOWN transaction on the FSB. which can be continued by reasserting HIT# and HITM# together. For termination requirements please refer to the appropriate platform design guide. refer to Volume 3 of the Intel Architecture Software Developer’s Manual and the Intel Processor identification and CPUID instruction application note. then the processor executes its Built-in Selt-Test(BIST). when asserted. However. The processor will keep IERR# asserted until the assertion of RESET#. an assertion of FERR#/PBE# indicates that the processor has a pending break event waiting for service. Signals Associated Strobe D[15:0]#.1 Intel Merom Processor CPU -3 CPU Pin Description (Continued) Signal Name DSTBP[3:0]# Type I/O Description Data strobe used to latch in D[63:0]#. Both of these signals must be software configured via BIOS programming of the APIC register space to be used either as NMI/INTR or LINT[1:0]. to ensure recognition of this signal following an Input/Output write instruction. a nonmaskable interrupt. In both cases. operation of these pins as LINT[1:0] is the default configuration. DINV[1]# DSTBP[1]# D[47:32]#. For additional information on the pending break event functionality. Both signals are asynchronous. When STPCLK# is asserted. CPU Pin Description (Continued) Signal Name IGNNE# Type I Description IGNNE# (Ignore Numeric Error) is asserted to force the processor to ignore a numeric error and continue to execute noncontrol floating-point instructions. it must be valid along with the TRDY# assertion of the corresponding Input/Output Write bus transaction. HIT# (Snoop Hit) and HITM# (Hit Modified) convey transaction snoop operation results. DINV[0]# DSTBP[0]# D[31:16]#. This transaction may optionally be converted to an external error signal (e. and is included for compatibility with systems using MS-DOS* type floating-point error reporting. the processor generates an exception on a noncontrol floating-point instruction if a previous floating-point instruction caused an error. FERR#/PBE# O GTLREF I HIT# HITM# I/O I/O t t n e e r c m e u S c c Do a iT ial M t n e id f n o C INIT# I LINT[1:0] I IERR# O 78 . a maskable interrupt request signal. INIT# must connect the appropriate pins of both FSB agents. When FERR#/PBE# is asserted. resets integer registers inside the processor without affecting its internal caches or floating-point registers. or INIT#. to ensure recognition of this signal following an Input/Output Write Instruction. Assertion of PREQ# when STPCLK# is active will also cause an FERR# break event. GTLREF determines the signal reference level for AGTL+ input pins. The processor then begins execution at the power-on Reset vector configured during power-on configuration. indicating a break event.Please refer to the appropriate platform design guide for details on GTLREF implementation.g. The processor continues to handle snoop requests during INIT# assertion. and LINT1 becomes NMI. FERR# is similar to the ERROR# signal on the Intel 387 coprocessor. INIT# is an asynchronous signal. BINIT#. IGNNE# is an asynchronous signal. including identification of support of the feature and enable/disable information. GTLREF is used by the AGTL+ receivers to determine if a signal is a logical 0 or logical 1. FERR#/PBE# assertion indicates that an unmasked floating point error has been detected. However.8515 N/B Maintenance 5.. the LINT0 signal becomes INTR. Because the APIC is enabled by default after Reset. If IGNNE# is deasserted. When the APIC is disabled. LINT[1:0] (Local APIC Interrupt) must connect the appropriate pins of all APIC Bus agents. assertion of FERR#/PBE# indicates that the processor should be returned to the Normal state. NMI) by system core logic. INTR and NMI are backward compatible with the signals of those names on the Pentium processor. INIT#(Initialization). GTLREF should be set at 2/3 VCCP . When STPCLK# is not asserted. IERR# (Internal Error) is asserted by a processor as the result of an internal error. DINV[3]# DSTBP[3]# FERR# (Floating-point Error)/PBE#(Pending Break Event) is a multiplexed signal and its meaning is qualified by STPCLK#. IGNNE# has no effect when the NE bit in control register 0 (CR0) is set. If INIT# is sampled active on the active to inactive transition of RESET#. it will remain asserted until STPCLK# is deasserted. Either FSB agent may assert both HIT# and HITM# together to indicate that it requires a snoop stall. DINV[2]# DSTBP[2]# D[63:48]#. from the time that the power supplies are turned on until they come within specification. This indicates that the processor Thermal Control Circuit (TCC) has been activated. The processor requires this signal to be a clean indication that the clocks and power supplies are stable and within their specifications. Probe Ready signal used by debug tools to determine processor debug readiness. the processor exits Sleep state and returns to Stop-Grant state. and must connect the appropriate pins of both FSB agents. and the processor begins program execution from the SMM handler. Reserved/ These pins are RESERVED and must be left unconnected on the No Connect board. I RS[2:0]# (Response Status) are driven by the response agent (the agent responsible for completion of the current transaction). restarting its internal clock signals to the bus and processor core units. without glitches. Processor Power Status Indicator signal. causes the processor to enter the Sleep state. The processor will recognize only assertion of the RESET# signal. If SMI# is asserted during the deassertion of RESET# the processor will tristate its outputs. This enables symmetric agents to retain ownership of the FSB throughout the bus locked operation and ensure the atomicity of lock. The signal must then transition monotonically to a high state. For a power-on Reset. During Sleep state. CPU Pin Description (Continued) Signal Name RESET# Type I Description Asserting the RESET# signal resets the processor to a known state and invalidates its internal caches without writing back any of their contents. It should be driven high throughout the boundary scan operation. ‘Clean’ implies that the signal will remain low (capable of sinking leakage current). it is used to protect internal circuits against voltage sequencing issues.1 Intel Merom Processor CPU -4 CPU Pin Description (Continued) Signal Name LOCK# Type I/O Description LOCK# indicates to the system that a transaction must occur atomically. if enabled. PROCHOT# (Processor Hot) will go active when the processor temperature monitoring sensor detects that the processor has reached its maximum safe operating temperature. and removal of the BCLK input while in Sleep state. if enabled. If SLP# is deasserted.it will wait until it observes LOCK# deasserted. The PWRGOOD signal must be supplied to the processor. Probe Request signal used by debug tools to request debug operation of the processor. Processors in this state will not recognize snoops or interrupts. LOCK# is asserted from the beginning of the first transaction to the end of the last transaction. This signal may require voltage translation on the motherboard. the processor saves the current state and enter System Management Mode (SMM). There is a 55-Ω(normal) on die pull up resistor on this signal. However. This signal is asserted when the processor is in a lower state (Deep Sleep). PRDY# PREQ# PROCHOT# O I I/O PSI# O PWRGOOD I t t n e e r c m e u S c c Do a iT ial M t n e id f n o C RS[2:0]# RSVD SLP# SMI# REQ[4:0] I/O 79 . As an output. On accepting a System Management Interrupt. Please refer to the appropriate platform design guide for more details. leaving only the Phase-Locked Loop (PLL) still operating. On observing active RESET#. If DPSLP# is asserted while in the Sleep state. deassertion of SLP#. As an input. TCC will remain active until the system deasserts PRCCHOT#. assertion of PROCHOT# by the system will activate the TCC. This signal must connect the appropriate pins of both FSB agents. the processor will exit the Sleep state and transition to the Deep Sleep state. When the priority agent asserts BPRI# to arbitrate for ownership of the FSB. These signals are source synchronous to ADSTB[0]#. For a locked sequence of transactions. it is recommended that routing channels to these pins on the board be kept open for possible future use. For termination requirements please refer to the appropriate platform design guide.8515 N/B Maintenance 5. I SLP# (Sleep). They are asserted by the current bus owner to define the currently active transaction type. All processor straps must be valid within the specified setup time before RESET# is deasserted. I SMI# (System Management Interrupt) is asserted asynchronously by system logic. Please refer to the IMVP-6 Mobile processor and Mobile chipset voltage regulation with power status indicator(PSI) specification for more details on the PSI# signal. RESET# must stay active for at least two milliseconds after VCC and BCLK have reached their proper specifications. both FSB agents will deassert their outputs within two clocks. when asserted in Stop-Grant state. REQ[4:0]#(Request Command) must connect the appropriate pins of both FSB agents. the processor stops providing internal clock signals to all units. An SMI Acknowledge transaction is issued. PWRGOOD (Power Good) is a processor input. 1mohm loadline at the processor die. Conversely. Processor core power supply. TEST2 TEST3. The processor will stop all execution when the junction temperature exceeds approximately 125°C. the VR output must be disabled until the voltage supply for the VID pins becomes valid. The processor protects itself from catastrophic overheating by use of an internal thermal sensor. and stops providing internal clock signals to all processor core units except the system bus and APIC units. The VID pins are needed to support the processor voltage specification variations.1 mohm loadline at the processor die. when asserted. to route the TEST3 and TEST4 pins through a ground referenced 55 ohm trace that ends in a via that is near a GND via and is accessible through an oscilloscope connection. CPU Pin Description (Continued) Signal Name Vcc_sense Type O Description Vcc_sense together with Vss_sense are voltage feedback signals to Intel MVP6 that control the 2. It should be used to sense or measure ground near the silicon with little noise. This sensor is set well above the normal operating temperature to ensure that there are no false trips. causes the processor to enter a low power Stop-Grant state. TRST# must be driven low during power on Reset. TRDY# (Target Ready) is asserted by the target to indicate that it is ready to receive a write or implicit writeback data transfer. Vcca provides isolated power for the internal processor core PLL’s. but not required. It should be used to sense or measure power near the silicon with little noise. Vss_sense together with Vcc_sense are voltage feedback signals to Intel MVP6 that control the 2. Unlike some previous generations of processors. TEST4 I THERMDA THERMDC THERMTRIP# Other Other O TMS TRDY# I I t t n e e r c m e u S c c Do a iT ial M t n e id f n o C Vss_sense O TRST# Vcc Vcca Vccp I I I I 80 . The VR must supply the voltage that is requested by the pins. TDO (Test Data Out) transfers serial test data out of the processor. TDO provides the serial output needed for JTAG specification support.8515 N/B Maintenance 5. STPCLK# is an asynchronous input. The assertion of STPCLK# has no effect on the bus clock. This is signalled to the system by the THERMTRIP# (Thermal Trip) pin. TRDY# must connect the appropriate pins of both FSB agents. VID[6:0] (Voltage ID) pins are used to support automatic selection of power supply voltages (Vcc).1 Intel Merom Processor CPU -5 CPU Pin Description (Continued) Signal Name STPCLK# Type I Description STPCLK# (Stop Clock). VID[6:0] O TCK TDI TDO I I O TEST1. these are CMOS signals that are driven by the Celeron processor. Thermal Diode Cathode. Processor I/O Power Supply. or disable itself. TEST1 and TEST2 must have a stuffing option of separate pull down resistor to Vss. TCK (Test Clock) provides the clock input for the processor Test Bus (also known as the Test Access Port). TDI (Test Data In) transfers serial test data into the processor. TMS (Test Mode Select) is a JTAG specification support signal used by debug tools. Thermal Diode Anode. The processor issues a Stop-Grant Acknowledge transaction. TRST# (Test Reset) resets the Test Access Port (TAP) logic. the processor restarts its internal clock to all units and resumes execution. The processor continues to snoop bus transactions and service interrupts while in Stop-Grant state. The voltage supply for these pins must be valid before the VR can supply Vcc to the processor. When STPCLK# is deasserted. For testing purposes it is recommended. TDI provides the serial input needed for JTAG specification support. Bus request output to CPU. HADSTB1# is the strobe for HA[31:17]# and HADSTB0# is the strobe for HA[16:3] and HREQ[4:0]#. Note: The ball HADSTB0# means HADSTB0P# in V4 Bus. Inputs during CPU cycles and driven by the North Bridge during cache snooping operations. 16:3]# and HREQ[2:0]# on even and odd data beat transfers respectively. Host CPU Dynamic Bus Inversion. CPU Reset. All CPU cycles sampled with the assertion of HLOCK# and ADS# until the negation of HLOCK# must be atomic. Defer. and HDBI0# for HD[15:0]#). HDBI1# for HD[31:16]#.8515 N/B Maintenance 5. HDSTB3P#/HDSTB3N# are the strobes for HD[63:48]# & HDBI3#. Priority Agent Bus Request. HDSTB2P#/HDSTB2N# are the strobes for HD[47:32]# & HDBI2#. This signal is used to dynamically control the processor bus pipeline depth. (P4 Host Protocol) Source synchronous strobes used to transfer HA[31:3]# and HREQ[4:0]# at a 2x transfer rate. HDSTB1P#/HDSTB1N# are the strobes for HD[31:16]# & HDBI1#. and HDSTB0P#/HDSTB0N# are the strobes for HD[15:0]# & HDBI0#. Bus Request 0. Driven along with HD[63:0]# to indicate if the associated signals are inverted or not. These signals are connected to the CPU data bus. Used to block the current request bus owner from issuing new requests. Data Ready. Connect to the address bus of the host CPU. Indicates that the target of the processor transaction is able to enter the data transfer phase. Hit Modified. The VN896 drives this signal to gain control of the processor bus. Connect to mobile CPU if used. Used by the data bus owner to hold the data bus for transfers requiring more than one cycle. The VN896 uses a dynamic deferring policy to optimize system performance. This signal has priority over symmetric bus requests and causes the current symmetric owner to stop issuing new transactions unless the HLOCK# signal is asserted. Host CPU Differential Data Strobes. In the second clock. (V4 Host Protocol) HADSTB0P# / HADSTB0N# are negativeedge going data strobes used to latch HA[30. t t n e e r c m e u S c c Do a iT ial M t n e id f n o C HRS[2:0]# O HDPWR# O HBREQ0# HBPRI# IO O HBNR# IO HDEFER# O CPURST# O HTRDY# O 81 . Reset output to CPU. Host Target Ready. the signals carry additional information to define the complete transaction type. Data Bus Busy. Request to reduce power on the mobile CPU data bus input buffer. The VN896 also uses the DEFER# signal to indicate a processor retry response. In the first clock. Indicates that a caching agent holds an unmodified version of the requested line. Used to limit the number of simultaneously switching signals to 8 for the associated 16-bit data pin group (HDBI3# for HD[63:48]#. Indicates the type of response per the table below: RS[2:0]# Response type RS[2:0]# Response type 000 Idle State 100 Hard Failure 001 Retry 101 Normal Without Response Data 010 Defer 110 Implicit Response Writeback 011 Reserved 111 Normal With Data Data Bus Power Reduction. Also driven in conjunction with HITM# by the target to extend the snoop window. HDBIn# is asserted such that the number of data bits driven low for the corresponding group does not exceed 8. HADSTB0P# (HADSTB0#) HADSTB0N# HADSTB1# IO HD[63:00]# HDBI[3:0]# IO IO HDSTB[3:0]P# HDSTB[3:0]N# IO HADS# HDBSY# HDRDY# HHIT# IO IO IO IO HHITM# HLOCK# IO IO Hit. the signals define the transaction type to a level of detail that is sufficient to begin a snoop request. Source synchronous strobes used to transfer HD[63:0]# and HDBI[3:0]# at a 4x transfer rate. Response Signals. Host Address Strobe. Asserted during both clocks of the request phase. Host CPU Data. HDBI2# for HD[47:32]#. Asserted for each cycle that data is transferred. The owner of this signal will always be the next bus owner. CPU Interface Signals (Continued) Signal Name HREQ[4:0]# Type IO Description Request Command. Block Next Request.2 VIA VN896 North Bridge -1 CPU Interface Signals Signal Name HA[31:3]# Type IO Description Host CPU Address Bus. External pullup and filter capacitor to ground should be provided per CPU manufacturer’s recommendations. Host Lock. Address strobe: The CPU asserts ADS# in T1 of the CPU bus cycle. Asserted by the CPU to indicate that the address is modified in the L1 cache and needs to be written back. Dot Clock (Pixel Clock) Out. DDR SDRAM Memory Controller Signal Descriptions Signal Name MD[63:0] MA[13:0] MSRAS# MSCAS# MSWE# MBA[2:0] Type IO O O Description Memory Data. V-Link Complement Strobe from Client to Host. DDR Data Strobe. V-Link Command from Host (North Bridge) to Client (South Bridge). Parity. Host Clock. Output to CRT.5 GHz onchip for use by the integrated PCI Express PHY to transmit/receive data. DDR Data Mask. V-Link Command from Client (South Bridge) to Host (North Bridge). DISPCLKO O 82 . V-Link Strobe from Client to Host. Strap high for DDR2. VD[7:0] are used to transmit strap information from the South Bridge. Used for external EMI reduction circuit if used. This signal receives the host CPU clock (100/133/166/200 MHz). V-Link Strobe from Host to Client. t t n e e r c m e u S c c Do a iT ial M t n e id f n o C O MCS[3:0]# O MDQM[7:0]# MCKE[3:0] O MDQS[7:0]+/IO O MEMDET I Description MODT[3:0] O CRT and Serial Bus Signal Descriptions Signal Name Type AO O Description CRTAR. READ. or PRECHARGE command. Multiplied up to 2. Bank Address: defines which bank will receive an ACTIVE. Vertical Sync. This signal receives the 66 MHz clock used to generate the internal clocks required by V-Link interface between the North Bridge and South Bridge. On Die Termination. It is typically used for CRT display DDC communications. Chip Select. Tie to GND through an external resistor to control the RAMDAC full-scale current value. PCI Express Differential Clock. Horizontal Sync. Output from internal clock generator to external memory interface clock buffer (if required for fanout) Memory (SDRAM) Clock Complement.2 VIA VN896 North Bridge -2 V-Link Signal Descriptions Signal Name VD[7:0] Type IO Description V-Link Data Bus. These signals are connected to the DRAM data bus. CRTAB CRTHSYNC CRTVSYNC CRTRSET Analog Red/Green/Blue. Data signals used for serial data transfer. Clock for serial data transfer. Dot Clock (Pixel Clock) In. Memory (SDRAM) Clock. Connect to GND if external EMI reduction circuit not implemented. Memory Detect: Strap low for DDR. Data mask of each byte lane. Used for Quad Data Transfer on host CPU bus. NC if external EMI reduction circuit not implemented. DRAM address lines.8515 N/B Maintenance 5. V-Link Complement Strobe from Host to Client. O AI IO IO DVPSPCLK DVPSPD CRTSPCLK CRTSPD Reference Resistor. Memory (SDRAM) Clock Feedback. Host Clock Complement. Output to CRT. Memory Address. Row Address. Clock Enables. DAC outputs. CRTAG. Clock enables for each DRAM bank for powering down the SDRAM or clock control for reducing power usage and for reducing heat/temperature in highspeed memory systems. During system initialization. Column Address and Write Enable Command Indicator Set. Data strobe of each byte . Used for external EMI reduction circuit if used. This clock is used by all VN896 logic that is in the host CPU domain. Check the strapping table for details. WRITE. V-Link Byte Enable. Enables termination resistance internal to the DDR2 SDRAM VPAR VBE# VUPCMD VUPSTB+ VUPSTB– VDNCMD VDNSTB+ VDNSTB– IO IO I I I O O O Clock Signal Descriptions Signal Name VCLK Type I HCLK+ I HCLK– PEXCLK+ PEXCLK– I I MCLKO+ MCLKOMCLKI DISPCLKI O O I I V-Link Clock. These signals receive the 100 MHz clock used by the internal PCI Express logic. Input from MCLKO. DVPSPCLK is typically used for I2C communications DVPSPD is typically used for I2C communications Serial Port Clock and Data. Chip select of each bank. For DVP1 in 12-bit mode. 1.3V ±5%) DVP0HS DVP0VS DVP0DE DVP0CLK DVP1HS DVP1VS DVP1DE DVP1DET DVP1CLK O O O O O O O I O Display Detect. Clock Output. Connect to main ground plane. Power for Memory Clock PLL (3. 18-Bit LVDS Mode: DVP0D[11:06. 133. 24-bit mode or DVP0 in 12-bit mode. See Design guide for details. 83 . P P VSUS15PEX P PCI Express Suspend Power. 03:00] and DVP1D[11:10. and 200 MHz.2 VIA VN896 North Bridge -3 PCIe-multiplexed Digital Video Port Interface Signal Signal Name DVP0D[11:0] DVP1D[11:0] Type O Description 12-Bit LVDS Mode: DVP1D[11:00] is for 12-Bit LVDS Interface.3V ±5%). Power for PCI Express Port. Power for Memory I/O Interface Logic. Dedicated Digital Video Interface Signals Signal Name DVP2D[11:00] DVP2HS DVP2VS DVP2CLK DVP2TVCLKR/ DVP2DET DVP2DE Type O O O O I O Data Output [11:00]. Clock Out.5V ±5% P LCD Panel Power Control Signal Descriptions Signal Name LVDSENVDD LVDSENBLT Type O O Enable Panel VDD Power. Data Enable. t t n e e r c m e u S c c Do a iT ial M t n e id f n o C VCCA33DAC[2:1] GNDADAC GNDAPEX[2:0] GNDAPEXCK P P P P VCCA33PEX[2:0] VCCA33PEXCK P P Signal Name Type P VTT Ground for DAC. Connect to main ground plane. Horizontal Sync. For DVP1 in 12-bit mode.5V ±5% Description VCCMEM VCC15VL P P VCC33PEX VCC15 P VCC33GFX VSUS15 GND P Power for Graphics Display I/O Logic.3V ±5%) Ground for Memory Clock PLL.5V ±5% Power for PCIe I/O Interface Logic. Power for V-Link I/O Interface Logic.8V (DDR2) ±5%.5V ±5% Digital Ground. Description T r u s t e d P la t fo r m M id u le S ig n a l D e s c r ip tio n s S ig n a l N a m e TCSEN # Ty p e I D e s c r ip tio n T r u s te d C o n f ig u r a tio n S p a c e E n a b le . 1. Connect to main ground plane. Vertical Sync. 1.5V (DDR)/1. Power Signal Descriptions (Digital Power/Ground) Description Power for CPU I/O Interface Logic.3V ±5%). Ground for Host CPU Clock PLL. Vertical Sync. For DVP1 in 12-bit mode. Clock Output. Data Enable. 1. Horizontal Sync. Ground for PCI Express Ports. Power for DAC. 2. Ground for PCI Express Clock. Data Enable.3V ±5% Suspend power. Connect to main ground plane. 07:02] are for 18-Bit LVDS Interface. 24-bit mode or DVP0 in 12-bit mode. Power for PCI Express Clock. 24-Bit LVDS Mode: DVP0D[11:00] and DVP1D[11:00] are for 24-Bit LVDS Interface. For DVP1 in 12-bit mode.3V ±5% Power for internal Logic. Voltage is CPU dependent.8515 N/B Maintenance 5. Horizontal Sync. 3. 24-bit mode or DVP0 in 12-bit mode. (3. Enable Panel Back Light. 3. Ground for Graphics Controller PLL. Clock Return. Connect to main ground plane. 24-bit mode or DVP0 in 12-bit mode. 400 MHz for CPU/DRAM frequencies of multiples of 100. Vertical Sync. Power for Graphics Controller PLL (3. For DVP1 in 12-bit mode. Power Signal Descriptions (Analog Power/Ground) Signal Name VCCA33HCK GNDAHCK VCCA33MCK GNDAMCK VCCA33PLL[3:1] GNDAPLL Type P P P P P P Description Power for Host CPU Clock PLL (3. 625V ±2% derived using a resistive voltage divider. Connect to South Bridge interrupt input to indicate that an interrupt condition was detected on PCI Express bus or the internal APIC. Used to determine the presence of an external PCI Express device Test Enable.8515 N/B Maintenance 5. General Purpose Output. PCI Express Port 0 Compensation Resistor. PCI Express PME SCI. System Control Interrupt to indicate Power Management Event. PCI Express Port G Compensation 0. this pin reflects the state of CR5C[0]. PC I Express Port 0 D ifferential Transm it D ata 0. This signal is used to inform North Bridge when the processor is in C3/C4 state. PCI Express Port G External Resistor 0. GPIO. 0. Input from the South Bridge chip. Wire-OR with other system WAKE# signals (including PEWAKE# on the PCI Express bus connector) and connect to the South Bridge PME input. Connect to South Bridge SCI input (GPIO pin). When asserted. Memory interface IO buffer calibration. PCI Express Wake. AGTL P Compensation. For implementation of the Suspend-to-DRAM feature. Memory Voltage Reference. Indicates that a system wake event has occurred on the PCI Express bus. Connect to an external pull-up to disable. ½ VCCMEM ±2% typically derived using a resistive voltage divider. PCI interrupt output (handled by the interrupt controller in the south bridge). V-Link N Compensation. When SR1A[4] is cleared. Busy. PCI Express Port G External Resistor 1. this signal resets the VN896 and sets all register bits to the default value. This signal is used for testing. These signals are multiplexed w ith D igital V ideo Port Signal. Suspend Status. External 14. 84 .45V / 0. 2/3 VTT ±2% typically derived using a resistive voltage divider. Reset. PC I Express Interface Signals Signal N am e Type I PEX R X [15:00]+/– PEX T X [15:00]+/– PEX R X 16+/– PEX T X 16+/– D escription O I O PC I Express Port G D ifferential R eceive D ata [15:00]. Connect to South Bridge and Power Good circuitry. This signal reflects the state of SRD[0]. AGTL N Compensation. Interrupt and Test Signal Descriptions Signal Name XIN Type I Description Reference Frequency Input. Used to waken the chip from deep sleep mode (S3/S4/S5 states). Input from SLP# of South Bridge chip. System Control Interrupt to indicate Hot Plug occurred. Indicates that master cycles are pending in the chip. See design guide. Description PWROK SUSST# RESET# I I I CPUSLPIN# BUSY# I O GPOUT GPO0 PEXWAKE# O O OD PEXPMESCI# OD PEXHPSCI# OD PEXINTR# OD INTA# PEXDET TESTEN# O I I General Output Port. PCI Express Detect. Interrupt. Power Control. All internal graphics controller clocks are synthesized on chip using this frequency as a reference. PC I Express Port G D ifferential Transmit D ata [15:00]. PCI Express Hot-Plug SCI. Connect to South Bridge SCI input (GPIO pin). PC I Express Port 0 D ifferential R eceive D ata 0. V-Link Voltage Reference. The rising edge of this signal is used to sample all power-up strap options. Compensation Signal Descriptions Signal Name VLCOMPP VLCOMPN HGTLCOMPP HGTLCOMPN MEMCOMP PEXCOMP0 PEXREXT0 PEXREXT1 PEXREXT2 PEXCOMP1 PEXCOMP2 Type AI AI AI AI AI V-Link P Compensation. Power OK. DRAM Compensation. t t n e e r c m e u S c c Do a iT ial M t n e id f n o C AI AI AI AI AI AI Signal Name Type P HGTLVREF[1:0] MEMVREF[1:0] VLVREF P P Reference Voltage Signal Descriptions Description Host CPU Interface AGTL+ Voltage Reference.31818 MHz clock source. PCI Express Interrupt. PCI Express Port G Compensation 1.2 VIA VN896 North Bridge -4 Reset. PCI Express Port 0 Compensation. Used by the power management system to avoid changing the system power state while a master cycle is in progress. V-Link Clock. Strobe from Host-to-Client.8515 N/B Maintenance 5. Connect to same named pin on north bridge. Ignore Numeric Error. Logical combination of the A20GATE input (from internal or external keyboard controller) and Port 92 bit-1 (Fast_A20). Connect to same named pin on north bridge. General Purpose Output 3. This signal is connected to the CPU “ignore error” pin. Byte Enable. Complement Strobe from Host-to-Client. Connect to same named pin on north bridge. Sleep. SATA LED SATA External Resistor.2 K pullup to 2. This signal is tied to the coprocessor error signal on the CPU. General Purpose Output 9. CPU Interrupt. Strobe from Client-to-Host. This signal is to indicate a thermal trip from the processor. Command from Client-to-Host.5 V. General Purpose Output 5. STPCLK# is asserted by the VT8237A to the CPU to throttle the processor clock. General Purpose Output 1. General Purpose Output 7. Internally generates interrupt 13 if active. Supplied by clock gennerator. If VPAR is not implemented in the north bridge chip or is incompatible with the VT8237A (4x V-Link north bridges) connect this signal to an 8. Command from Host-to-Client. General Purpose Output 6. SATA Crystal In. Numerical Coprocessor Error. NMI is used to force a non-maskable interrupt to the CPU. SATA Port 1 Differential Receiver. Connect to same named pin on north bridge. O O AI 85 . this pin should be connected to the north bridge VPAR. Connect to same named pin on north bridge. FERR# I VPAR IO VBE# VCLK UPCMD DNCMD UPSTB+ UPSTBDNSTB+ DNSTB- IO I O I O O I I General Purpose Output Interface Signals Signal Name GPO0 GPO1 GPO2/SUSA# GPO3/SUSST# GPO4/SUSCLK GPO5/CPUSTP# GPO6/PCISTP# GPO7/GNT5# GPO9 Type O O O O O O O O O General Purpose Output 0. Connect to same named pin on north bridge. Initialization. INTR is driven by the VT8237A to signal the CPU that an interrupt request is pending and needs service. Connect to A20 mask input of the CPU to control address bit-20 generation. t t n e e r c m e u S c c Do a iT ial M t n e id f n o C IGNNE# INIT# OD OD INTR NMI OD OD SLP# OD SMI# OD STPCLK# OD I THRMTRIP#/GPI1 System Management Interrupt. only bits 7-0 are used). The VT8237A generates an NMI when PCI bus SERR# is asserted. Connect to same named pin on north bridge. VD[7:0] are also used to send strap information to the chipset north bridge (see strap table below for details). The VT8237A asserts INIT# if it detects a shut-down special cycle on the PCI bus or if a soft reset is initiated by the register. O O I SATA Port 0 Differential Transmitter. CPU Interface Signals Signal Name A20M# Type OD Description A20 Mask. Stop Clock. Thermal Detect Power Down. General Purpose Output 2. SATA Crystal Out. 66 MHz. If the VPAR function is implemented in a compatible manner on the north bridge.3 VIA VT8237A South Bridge -1 V-Link Interface Signals Signal Name VD[15:0] Type IO Description Data Bus. All bits 15-0 are implemented for use with VIA north bridge chips which support this capability (if not. Non-Maskable Interrupt. Used to put the CPU to sleep. SMI# is asserted by the VT8237A to the CPU in response to different Power-Management events. SATA Port 1 Differential Transmitter. Complement Strobe from Client-to-Host. General Purpose Output 4. Parity. Serial ATA Interface Signals Signal Name Type I I SRX0+/– SRX1+/– STX0+/– STX1+/– SXI SXO SATALED# SREXT Description Description SATA Port 0 Differential Receiver. The specific interpretation of these straps is north bridge chip design dependent. Target Ready. PCI Reset. REQ0# GNT5#/GPO7. INTF#/GPI13. SMBus Interface Signals Signal Name Type OD OD SMBCK1 SMBDT1 Description SMB/I2C Channel 1 Clock. Byte enables corresponding to supplied or requested data are driven on following clocks. Mater Mode. REQ2#. Device select. Parity Error. Asserted when the initiator is ready for data transfer. REQ4#./ GPO14. SMB/I2C Channel 1 Data. SMBCK2/GPI27/ GPO27 SMBDT2/GPI26/ GPO26 SMBALT# OD OD I SMB SMB Alert. GNT4#. Negation indicates that one more data transfer is desired by the cycle initiator. Assertion indicates the address phase of a PCI transfer. This signal indicates whether the PCI clock is or will be stopped (high) or running (low). External devices may assert this signal low to request that the PCI clock be restarted or prevent it from stopping. GNT2#. Upon sampling SERR# active. the VT8237A can be programmed to generate an NMI to the CPU. REQ3#.3 VIA VT8237A South Bridge -2 PCI Bus Interface Signals Signal Name AD[31:0] Type IO Description Address/Data Bus. Slave Mode. The address is driven with FRAME# assertion and data is driven or received in following cycles. Multiplexed address and data. The VT8237A asserts this signal to claim PCI transactions through positive or subtractive decoding./ GPO13. System Error. PCI Bus Clock Run./ GPO12. assertion generates an IRQ or SMI interrupt or a power management resume event. PERR#. The INTA# through INTD# pins are typically connected to the PCI bus INTA#-INTD# pins per the table below. BIOS settings must match the physical connection method. These signals are driven by the VT8237A to grant PCI access to a specific PCI master./ GPO15 IO I t t n e e r c m e u S c c Do a iT ial M t n e id f n o C O O I CLKRUN# IO PCI Grant. INTA# INTB# INTC# INTD# PCI Slot 1 INTA# INTB# INTC# INTD# PCI Slot 2 INTB# INTC# INTD# INTE# PCI Slot 3 INTC# INTD# INTE# INTF# PCI Slot 4 INTD# INTE# INTF# INTG# PCI Slot 5 INTE# INTF# INTG# INTH# PCI Slot 6 INTF# INTG# INTH# INTA# PCI Bus Interface Signals (Continued) Signal Name REQ5#/GPI7. The command is driven with FRAME# assertion. INTG#/GPI14. INTE-H# are enabled by setting. Initiator Ready. This signal is used to reset devices attached to the PCI PCI Clock. As an input. SERR# can be pulsed active by any PCI device that detects a system error condition. Parity. SMB/I2C Channel 2 Clock. A single parity bit is provided over AD[31:0] and C/BE[3:0]#. Asserted when the target is ready for data transfer. The VT8237A drives this signal low when the PCI clock is running (default on reset) and releases it when it stops the PCI clock. When the chip is enabled to allow it. INTH#/GPI15. GNT3#. Command/Byte Enable. 86 . These signals connect to the VT8237A from each PCI slot (or each PCI master) to request the PCI bus CBE[3:0]# IO DEVSEL# IO FRAME# IO IRDY# TRDY# STOP# SERR# IO IO IO I PERR# - PAR INTA# INTB# INTC# INTD# INTE#/GPI12. Frame. Mater Mode. REQ1#. This signal provides timing for all transactions on the PCI bus. Enabled by System Management Bus I/O space. Slave Mode. Stop. GNT1#. SMB/I2C Channel 2 Data. DEVSEL# indicates the response to a VT8237A-initiated transaction and is also sampled when decoding whether to subtractively decode the cycle. is only for the reporting of data parity errors during all PCI transactions except for a Special Cycle. sustained tri-state. PCI Interrupt Request. GNT0# PCIRST# PCICLK Type I Description PCI Request.8515 N/B Maintenance 5. Asserted by the target to request the master to stop the current transaction. Parallel transmit data lines synchronized to MTXC. t t n e e r c m e u S c c Do a iT ial M t n e id f n o C MRXC MRXD[3:0] MRXDV MRXER MTXC I I I I MTXD[3:0] MTXEN O O PHYRST# O Description MII Receive Data.3 VIA VT8237A South Bridge -3 CPU Speed Control Interface Signals Signal Name VGATE/GPI8/ GPO8 VIDSEL/GPI28/ GPO28 Type I OD Description Voltage Gate. MII Management Data Clock. PC/PCI Request B. The state of this signal may be read in the SMBus 2 registers. PCS0# can optionally be used as GPIO20. PC/PCI Grant B. MII Transmit Enable. Voltage Regulator Deep Sleep. PCS1# can optionally be used as GPIO21. Signal from the CPU voltage regulator. Connect to the CPUMISS signal of the CPU socket. MII Transmit Clock. AGP Busy. MII Receive Error. AZSDIN3 is multiplexed with this pin. Low indicates that an AGP master cycle is in progress (CPU speed transitions will be postponed if this input is asserted low). Output when PHY is in power state as D1 hot. Used to put the CPU into a deeper sleep mode. External PHY Reset. PHY Power Down. Connected to the CPU voltage regulator. Low selects the voltage ID from the CPU. LPC DMA/Bus M aster Request 0. LPC Frame. Sent to the external PHY as a timing reference for MDIO. used to select high speed (L) or low speed (H). Connected to the AGP Bus AGPBZ# pin.5 or 25 MHz clock recovered by the PHY. MII Management Data I/O. VRDSLP/GPI29/ GPO29 GHI#/GPI22/ GPO22 DPSLP#/GPI23/ GPO23 CPUMISS/GPI17 OD OD OD I AGPBZ#/GPI6 I APIC Interface Signals Signal Name APICD1/GPIO11 APICD0/GPIO10 APICCLK/GPI19 Type O O I Internal APIC Data 1. Voltage Regulator ID Select. MII Interface Signals Signal Name MCOL MCRS MDC MDIO Type I I O IO I Description MII Collision Detect. PHYPWRDN# O PC/PCI DMA Interface Signals Signal Name Type I I PCREQA/GPI24/ GPO24 (GPIOA) PCREQB/GPI25/ GPO25 (GPIOB) PCGNTA/GPI30/ GPO30 (GPIOC) PCGNTB/GPI31/ GPO31 (GPIOD) Description PC/PCI Request A. Internal APIC Data 0. high selects a different fixed voltage ID (the lower voltage used for CPU deep sleep mode). CPU Speed Select. MII Carrier Sense. From the external PHY. D es cr ip tio n O O PC/PCI Grant A. CPU Deep Sleep. MII Receive Data Valid. S er ia l IR O In te r fa c e S ig n a ls S ig n a l N a m e S E R IR Q Ty p e I S e ria l IR Q . Programmable Chip Select 1. Used to detect the physical presence of the CPU chip in its socket. Parallel receive data lines driven by the external PHY synchronous with MRXC. Programming Chip Selects Signals Signal Name PCS0#/AZSDIN2/ GPIO20 PCS1#/AZSDIN3/ GPIO21 Type O Description Programmable Chip Select 0. MII Receive Clock. Connected to the CPU voltage regulator. AZSDIN2 is multiplexed with this pin. T h is sig n al h a s a n in te rn a l p u ll-u p re sisto r.5 or 25 MHz clock supplied by the PHY. Connected to the CPU voltage regulator.8515 N/B Maintenance 5. Description O 87 . D2 hot or D3 hot with no PME and WOL enable. Read from the MDI bit or written to the MDO bit. Always active 2. Signals that transmit is active from the MII port to the PHY. High indicates no CPU present. 2. High selects the proper voltage for deep sleep mode. High indicates the voltage regulator output os stable. Low Signal Count Pin Interface Signals Signal Name LPCAD[3-0] LPCFRAM E# LPCDRQ[1-0]# Type IO O I LPC Address/Data. Asserted by the PHY when it detects a data decoding error. Internal APIC Clock. CPU Missing. MII Transmit Data. Asserted by the external PHY when the media is active. USB Port 6 Over Current Detect. USB Port 2 Over Current Detect. Serial EEPROM Data Input. Serial EEPROM Data Output. Port 1 is disabled is disabled of low. General Purpose Input 17. From internal keyboard controller.0 Interface Signals Signal Name USBP0+/– USBP1+/– USBP2+/– USBP3+/– USBP4+/– USBP5+/– USBP6+/– USBP7+/– USBCLK USBOC0# USBOC1# USBOC2# USBOC3# USBOC4# USBOC5# USBOC6# USBOC7# USBREXT Type IO IO IO IO IO IO IO IO I I I I I I I I I AI Description USB Port 0 Differential Data. Connect to EEPROM Data In pin. From internal mouse controller. USB Port 5 Differential Data. USB External Resistor. S peaker Interface Sign als S ig na l N am e SPK R Typ e O D escrip tion S peaker. M ouse Data. From internal keyboard controller. Port 0 is disabled is disabled of low. General Purpose Input 8. USB Port 3 Differential Data. USB Port 4 Differential Data. General Purpose Input 19. General Purpose Input 5. Description Serial EEPROM chip select. General Purpose Input 7. USB Port 7 Differential Data. USB Port 2 Differential Data. USB Port 1 Differential Data. General Purpose Input 3. USB Port 7 Over Current Detect. Keyboard Data. General Purpose Input 4. Strap lo w to enable (high to disab le) C P U freq uency strap ping. Serial EEPROM Interface Signals Signal Name SEECS SEECK SEEDO SEEDI Type O O I O Serial EEPROM clock. Port 3 is disabled is disabled of low. General Purpose Input 2. Internal K eyboard Controller Interface Signals Description M ouse Clock. Port 2 is disabled is disabled of low. USB Port 5 Over Current Detect. USB Port 1 Over Current Detect. From internal mouse controller. t t n e e r c m e u S c c Do a iT ial M t n e id f n o C I I I I GPI16/ INTRUDER# GPI17/CPUMISS GPI18/THRM#/ AOLGPI GPI19/APICCLK I I I I Signal Name Type IO IO M SCK M SDT KBCK KBDT IO IO General Purpose Input 6. General Purpose Input 9. General Purpose Input 1. Port 7 is disabled is disabled of low. USB Port 3 Over Current Detect. General Purpose Input Interface Signals Signal Name GPI0 GPI1/THRMTRIP# GPI2/EXTSMI# GPI3/RING# GPI4/LID# GPI5/BATLOW# GPI6/AGPBZ# GPI7/REQ5# GPI8/GPO8/ VGATE GPI9 Type I I I I I I General Purpose Input 0. Connect to EEPROM Data Out pin. 48 MHz clock input for the USB interface USB Port 0 Over Current Detect. Keyboard Clock. General Purpose Input 18. Port 4 is disabled is disabled of low.8515 N/B Maintenance 5. USB Port 4 Over Current Detect. 88 . USB Port 6 Differential Data. General Purpose Input 16.3 VIA VT8237A South Bridge -4 USB 2. Port 6 is disabled is disabled of low. Port 5 is disabled is disabled of low. Description USB Clock. This signal corresponds to CS17X# on the secondary IDE connector. PDA[2:0] are used to indicate which byte in either the ATA command block or control block is being accessed. The host may assert SHDMARDY to pause input transfers Second Host Strobe. Secondary Disk Address. Primary channel input flow control. Output strobe (both edges). 89 . Secondary channel DMA acknowledge Primary Channel Interrupt Request. Assertion of STOP by the host during or after data transfer in UltraDMA mode signals the termination of the burst Enhanced IDE Interface Signals (Continued) Signal Name SDIOW#/SSTOP Type O Description EIDE Mode: Secondary Device I/O Write. Secondary Master Chip Select.3 VIA VT8237A South Bridge -5 Enhanced IDE Interface Signals Signal Name PDIORDY/ PDDMARDY/ PDSTROBE Type I Description EIDE Mode: Primary I/O Channel Ready. SDA[2:0] are used to indicate which byte in either the ATA command block or control block is being accessed. This signal corresponds to CS3FX# on the primary IDE connector. This signal corresponds to CS37X# on the secondary IDE connector. Input flow control. Device ready indicator UltraDMA Mode: Secondary Device DMA Ready. The device may stop SDSTROBE to pause input data transfers EIDE Mode: Primary Device I/O Read. Device read indicator UltraDMA Mode: Primary Device DMA Ready. Primary Disk Data. Device write strobe UltraDMA Mode: Primary Stop. Primary Device DMA Request. The device may assert PDDMARDY to pause output transfers Primary Device Strobe. Output data strobe (both edges). Primary channel DMA request SDIORDY/ SDDMARDY/ SDSTROBE I PDIOR#/ PHDMARDY/ PHSTROBE O SDIOR#/ SHDMARDY/ SHSTROBE O PDIOW#/PSTOP O t t n e e r c m e u S c c Do a iT ial M t n e id f n o C PDDREQ I SDDREQ I PDDACK# SDDACK# IRQ14 IRQ15 O O I I PDCS1# PDCS3# SDCS1# O O O SDCS3# O PDA[2:0] O SDA[2:0] O PDD[15:0] SDD[15:0] IO IO Secondary Device DMA Request. negated by the host before data is transferred in an UltraDMA burst. The host may stop PHSTROBE to pause output data transfers EIDE Mode: Secondary Device I/O Read. Input data strobe (both edges). Output flow control. Primary Master Chip Select. Secondary Slave Chip Select. Device read strobe UltraDMA Mode: Primary Host DMA Ready.8515 N/B Maintenance 5. Device read strobe UltraDMA Mode: Secondary Host DMA Ready. Primary Slave Chip Select. Stop transfer: Asserted by the host prior to initiation of an UltraDMA burst. The device may stop PDSTROBE to pause input data transfers EIDE Mode: Secondary I/O Channel Ready. Primary Disk Address. The host may assert PHDMARDY to pause input transfers Primary Host Strobe. The device may assert SDDMARDY to pause output transfers Secondary Device Strobe. Device write strobe UltraDMA Mode: Secondary Stop. Secondary Disk Data. Primary channel DMA acknowledge Secondary Device DMA Acknowledge. Stop transfer: Asserted by the host prior to initiation of an UltraDMA burst. Secondary channel DMA request Primary Device DMA Acknowledge. This signal corresponds to CS1FX# on the primary IDE connector. Secondary Channel Interrupt Request. Input data strobe (both edges). The host may stop SHSTROBE to pause output data transfers EIDE Mode: Primary Device I/O Write. negated by the host before data is transferred in an UltraDMA burst Assertion of STOP by the host during or after data transfer in UltraDMA mode signals the termination of the burst. Strap information is communicated to the north bridge via VD[6:4]. Output flow control. 5V ±5%. General Purpose I/O 14. t t n e e r c m e u S c c Do a iT ial M t n e id f n o C AZSDIN2/PCS0#/ GPIO20 I AZSDIN3/PCS1#/ GPIO21 I Signal N am e Type AI P V LCO M P V LV REF C om pensation and R eference V oltage Signal D escription D escription V-Link Compensation. High definition audio bit clock. High definition audio serial data input 1. General Purpose I/O C/30. General Purpose I/O D/31. Connect to VCC through a ferrite bead. Analog Power and Ground (PLL Analog) Signal Name Type P P Description VCCA25PLL PLL Analog Power. High Definition Audio Serial Data Input 3 Point-to-point serial data input signal 3. V-Link Voltage Reference. SATA Analog Ground. AZSDIN3 can optionally be used as GPIO21. General Purpose I/O A/24. Connect to GND through a ferrite bead. SATA Analog Power. High definition audio serial data input 2. General Purpose I/O 26. GNDAPLL 90 . General Purpose I/O 11. General Purpose I/O B/25. 2.5V ±5%. SATA Analog Ground. General Purpose I/O 20. AZSDIN2 is multiplexed with PCS0#. AZSDIN3 is multiplexed with this pin PCS1#. General Purpose I/O 28. SATA Analog Power. Description SATA Oscillator Power.5V ±5%.3 VIA VT8237A South Bridge -6 General Purpose Input/Output Interface Signals Signal Name GPIO8/VGATE/ SLPBTN# GPIO10/APICD0 GPIO11/APICD1 GPIO12/INTE# GPIO13/INTF# GPIO14/INTG# GPIO15/INTH# GPIO20/AZSDIN2/ PCS0# GPIO21/AZSDIN3/ PCS1# GPIO22/GHI# GPIO23/GPI23/ DPSLP# GPIO24/GPIOA/ PCREQA GPIO25/GPIOB/ PCREQB GPIO26/SMBDT2 GPIO27/SMBCK2 GPIO28/VIDSEL GPIO29/VRDSLP GPIO30/GPIOC/ PCGNTA GPIO31/GPIOD/ PCGNTB Type IO IO IO IO IO IO IO IO IO IO IO IO IO IO IO IO IO IO IO General Purpose I/O 8. AZSYNC AZSDOUT AZSDIN0 AZSDIN1 O O I I High Definition Audio Interface Signals Signal Name AZRST# AZBITCLK Type O O Description High definition audio reset. 2. General Purpose I/O 27. Point-to-point serial data input signal 0. 2. 48 KHz Frame Sync and outbound tag signal High definition audio serial data output. General Purpose I/O 22. Bussed serial data output signal 0. Point-to-point serial data input signal 2. General Purpose I/O 15. General Purpose I/O 29. General Purpose I/O 12. 2. General Purpose I/O 21. Analog Power and Ground (SATA Controller) Signal Name VCCA25SXO GNDASXO VCCA25RXSATA VCCA25TXSATA GNDARXSATA GNDATXSATA Type P P P P P P SATA Oscillator Ground. AZSDIN2 can optionally be used as GPIO20.5V ±5%. Point-to-point serial data input signal 1. General Purpose I/O 10.8515 N/B Maintenance 5. General Purpose I/O 13. 24MHz High Definition Audio Sync. PLL Analog Ground. Description General Purpose Output 23. High definition audio serial data input 0. The VT8237A will assert this pin during power-up or from the control register. Asserted during power management STR and STD suspend states. Battery Low Indicator. It is an output clock of the RTC generator circuit to use by other chips for refresh clock. AOLGPI is multiplexed with this pin. For a Wake-up Event. CPU Missing. SLPBTN#/ VGATE/GPIO8 RSMRST# I I SUSC# O EXTSMI#/GPI2 IO PME# SMBALT# LID#/GPI4 I I I INTRUDER#/ GPI16 THRM#/GPI18/ AOLGPI I I RING#/GPI3 I BATLOW#/GPI5 CPUSTP#/GPO5 PCISTP#/GPO6 WAKE# SUSA#/GPO2 I O O I O SMB Alert. This signal may be used as CPUMISS and GPI17 at the same time. Suspend Plane A Control. May be connected to external modem circuitry to allow the system to be re-activated by a received phone call. This signal is to enable the throttling mode for the duty cycle control of stop clock. Suspend Plane C Control. Clock and Power Status Interface Signals Description Power Good. RTC Crystal Input: 32. PCI Reset. Active low reset signal for the PCI bus. Ring Ondicator. Typically connected to the North Bridge to provide information on host clock status. SMI. Asserted when the system may stop the host clock. PCI Clock Stop. Connect to PCI Express PEWAKE# signal. or STD suspend states. Used to control the primary power plane. Signals the system clock generator to disable the PCI clock outputs. Oscillator. GPI18 and THRM# all at the same time. THRM# can optionally be used as GPI18. RTC Crystal Output: 32. assertion generates an IRQ. The state of this pin may be read in the SMBus 2 registers. Resume Reset. The state of this pin may be read in the SMBus 2 registers. Suspend Clock. Connect to the CPUMISS pin of the CPU socket. Used by the Power Management subsystem to monitor an external sleep button or switch. and STD suspend states. Thermal Alarm Monitor. Used by the Power Management subsystem to monitor the opening and closing of the display lid of notebook computers. EXTSMI# can optionally be used as GPI2 Power Management Event. INTRUDER# can optionally be used as GPI16. When enabled to allow it. Can be used to detect either low-to-high or high-to-low transitions to generate an SMI#. Resets the internal logic connected to the VSUS33 power plane and also resets portions of the internal RTC logic. Used by the Power Management subsystem to monitor an external system on/off button or switch. 14. STR. Asserted during power management POS. Intrusion Indicator. Used to control the tertiary power plane.3 VIA VT8237A South Bridge -7 Power Management and Event Signals Signal Name PWRBTN# Type I Description Power Button. Internal logic powered by VBAT. Asserted during power management STD suspend state. Alert On LAN. such as Stop Clock or during POS. Notebook Computer Display Lid Open / Closed Monitor. or power management event. Power OK. Test Pin Output. Power Management and Event Signals (Continued) Signal Name SUSB# Type O Description Suspend Plane B Control. a falling edge on this input causes an SMI# to be generated to the CPU to enter SMI mode. Not connected if not used. Internal logic powered by VSUS33. External System Management Interrupt. Signals the system clock generator to disable the CPU clock outputs. Connected to the Power Good signal on the Power Supply. 91 . CPU Clock Stop.8515 N/B Maintenance 5. Used to control the secondary power plane. RING# can optionally be used as GPI5. Sleep Button. BATLOW# can optionally be used as GPI5. Suspend Status 1. This signal may be used as AOLGPI.768 KHz crystal or oscillator input. Resets. Used to detect the physical presence of the CPU chip in its socket. Internal logic powered by VSUS33. Not connected if not used. High indicates no CPU present.768 KHz crystal output. STR. Output pin for test mode. LID# can optionally be used as GPI4.31818 MHz clock signal used by the internal Timer. t t n e e r c m e u S c c Do a iT ial M t n e id f n o C SUSST#/GPO3 O SUSCLK O I CPUMISS/GPI17 AOLGPI/GPI18/ THRM# I Signal Name Type I PWRGD PWROK O PCIRST# OSC O I RTCX1 RTCX2 TEST TPO I O I O Test. Also connected to ATX power-on circuitry. When programmed to allow it. 3V ±5%.5V ±5%. RTCX2). 2. If the “soft-off” state is not implemented. 2. USB Power. then these signal balls can be connected to VCC33. 2.3 VIA VT8237A South Bridge -8 Digital Power and Ground Signal Name VCC25 Type P Description Core Power.5V ±5%. This supply is turned on only when the mechanical switch on the power supply is turned on and the PWRON signal is conditioned high. USB Suspend Power. 2. MII Power.5V ±5%. 3.8515 N/B Maintenance 5. t t n e e r c m e u S c c Do a iT ial M t n e id f n o C Description 92 . 3.5V ±5%.3V ±5%. I/O Power. 2.5V ±5%. RTC Battery. Connect to GND through a ferrite bead.5V ±5%. VCC33 VBAT GND VCC25VL VSUS25 VSUS33 P P P P P P VCC33MII VSUS25MII VCC33USB GNDUSB VSUS25USB P P P P P Suspend Power. Analog Power and Ground (USB Controller) Signal Name VCCA25PLLUSB GNDAPLLUSB Type P P USB PLL Analog Voltage. 3. Suspend Power.3V ±5%. USB PLL Analog Ground. 2. Always available unless the mechanical switch of the power supply is turned off. MII Suspend Power. V-Link Compensation Circuit Voltage. Battery input for internal RTC (RTCX1. Ground. Connect to VCC through a ferrite bead. Connect to primary motherboard ground plane. 3. USB Ground.3V ±5% I/O Power for LAN Media Independent Interface (interface to external PHY). 8515 N/B Maintenance 6.318 MHz CLOCK GENERATOR ICS953009 U507 CPU Intel Merom FSB 533/667/800 MHz 15. ODD & HDD. Num. System Block Diagram 14. Charger. WLAN.768 KHz CD ROM PATA SATA/PATA HDD AZALIA LPC BUS MII BUS PHY 10/100 LAN VIA VT6103L 25 KHz MDC Module Audio codec ALC268 SYSTEM BIOS 512 K 6 LEDs AC+Battery.4” WXGA DVO Quick Keys E-mail Internet PI (Reserved) USB 0/1/2/3 PWR S/W G577D5U NEW CARD Mini-PCIE Wireless THM Sensor G781f Fan 12 MHz Keyboard BIOS WINBOND W83L951D KEY MATRIX t t n e e r c m e u S c c Do a iT ial M t n e id f n o C DDR2 400/533/667 MHz U513 North Bridge VIA VN896 VIA VT1637 LVDS LCD PANEL RGB CRT V-Link 4X/8X 533 MHz USB PCI-EXPRESS/USB PCI-EXPRESS/USB U514 South Bridge VIA VT8237A 32. Caps RJ45/RJ11 AMPLIFIER APA2056 EXT MIC HP SPEAKER SPEAKER JACK PS/2 I-LIMIT TOUCH PAD 93 . 13 Express Card Socket Test Error t t n e e r c m e u S c c Do a iT ial M t n e id f n o C 94 .8 ODD Drive Test Error ‰ 7.8515 N/B Maintenance 7.3 Graphics Controller Test Error LCD No Display ‰ 7.5 Memory Test Error ‰ 7.1 No Power (*1) ‰ 7.7 Hard Disk Drive Test Error ‰ 7.2 No Display (*2) ‰ 7.4 External Monitor No Display ‰ 7.12 Mini Express (Wireless) Socket Test Error ‰ 7.11 LAN Test Error ‰ 7.9 USB Port Test Error ‰ 7. Trouble Shooting ‰ 7.10 Audio Test Error ‰ 7.6 Keyboard (K/B) or Touch-Pad (T/P) Test Error ‰ 7. 95 . ¾ Check which Clock signal will cause no display. Base on these three conditions to analyze the schematic and edit the no display chapter. t t n e e r c m *2: No Display Definition e u S c c Do a iT ial M t n e id f n o C Judge condition: ¾ Check which power will cause no display. Clock. Base on the digital IC three basic working conditions: working power. If there are not any diagram match these condition. ¾ Check whether no CPU power will cause system can’t leave S5 status.8515 N/B Maintenance *1: No Power Definition Base on ACPI Spec. Judge condition: ¾ Check whether there are any voltage feedback control to turn off the power. If yes. we should stop analyzing the schematic in power supply sending out the PG signal. We define the no display as while system leave S5 status but can’t get into S0 status. we should add the effected analysis into no power chapter. reset. the system can’t leave S5 status or none the PG signal send out from power supply. Keyword: ¾ S5: Soft Off ¾ S0: Working For detail please refer the ACPI specification. ¾ Check which reset signal will cause no display. We define the no power as while we press the power button. no fan activity is heard and power indicator is not light up. Connect AC adaptor or battery. No t t n e e r c m e u S c c Do a iT ial M t n e id f n o C Board-level Troubleshooting Where from power source problem (first use AC to power it)? AC Power Replace Motherboard Battery Parts: Signals: +PWR_VDDIN +DVMAIN ADINP LEARNING ADEN# I_LIMIT U10 PU501 PU506 PF1 PQ1 PQ2 PD4 PD2 PR5 EL545 Check following parts and signals: Parts: Signals: BATT BATT_T BATT_V BATT_C BATT_D U10 PU506 PJ502 PF502 PQ516 PD512 PD501 PQ520 PL505 96 . nothing happens.1 No Power -1 When the power button is pressed.8515 N/B Maintenance 7. Power OK? Yes Replace the faulty AC adaptor or battery. No Power Check following parts and signals: Is the notebook connected to power (either AC adaptor or battery)? No Yes Try another known good battery or AC adapter. PL503.PQ518.PQ507.8515 N/B Maintenance 7.EL534. PD708 : Through by part PD708. nothing happens.PQ504B PL501 P24 +3V_P P24 PQ503.PR46.PQ509.PR45.PU3 PQ519.PL505 PU506.5S NOTE : P30 : Page 30 on M/B circuit diagram.PL504 P25 +CPU_CORE BATT Charge PQ520. 97 .PD512 P26 PU502. PQ8.8V_P Q502 P21 +VDD3_AVREF P11 Q507 +VDD3S Q504 P21 PR37 P23 +3V +0.PQ7 Discharge P27 P27 ADINP PD4 EL514.F2 P21 +VDD3_ALW t t n e e r c m e u S c c Do a iT ial M t n e id f n o C PF501.PQ508.PL506 P23 EL524 +VDD3_KBC_AVREF P21 +1.PQ512.PQ516.PQ505 PL502 +5V_P Discharge PD501 P19 EL544.EL523.9V_P EL6 P12 D11 +VDD3S_SB P19 +VDD3_RTC EL525 +VDD3S_KBC P21 U510 +VDD2.PQ510 PQ511. no fan activity is heard and power indicator is not light up.1 No Power -2 When the power button is pressed. Main Voltage Map P27 POWER IN PF1 PR5 PQ1 PJ501 PD2 P27 +PWR_VDDIN U9.PU503 +DVMAIN PQ504A. 1U PR62 0 PR501 10 GND PC502 1U GND 98 .7K 3 4 PR2 4. PD2 EC10QS04 A K +PWR_VDDIN PD4 PDS1040 3 PC579 1000P PC583 PC577 1000P 1000P POWER IN 1 2 PF1 6.7K G GND PC29 470P PR44 226K GND PR4 100K GND ADEN# 3 2 1 S PQ520 AO4409 D 8 7 6 5 G PQ7 DTC144WK PR46 33K PQ8 2N7002K PQ2 2N7002K PJO1 OPENSMT4 GND BATT PC582 1000P PC580 1000P GND PR7 1M PR502 10 4 5 6 RS+ RS- P27 VCC 3 GND GND OUT1 PU501 GND1 2 1 GND0 PC504 0. no fan activity is heard and power indicator is not light up.1 No Power -3 When the power button is pressed.01 ADINP 1 2 +DVMAIN PR45 100K PC587 1000P D S PC589 1000P PR3 470K PR1 4.8515 N/B Maintenance 7. nothing happens.5A/32VDC PD1 PD3 BZV55C24 BZV55C24 EL545 120Z/100M PJ501 EC1 18P EC560 18P P19 U10 KBC W83L951D 35 LEARNING PR6 0 110 I_LIMIT t t n e e r c m e u S c c Do a iT ial M t n e id f n o C PQ1 AO4419 3 2 1 8 7 6 5 PR5 0. Charge PQ516 AO4419 P26 ADINP PF501 TR/3216FF-3A EL534 120Z/100M 4 PC556 1000P PC557 1000P D CHARGING G S From P19 U10 PC565 0.01U PC566 0.7U PD512 B340A PR24 20K PC574 1000U PR22 23.7U PC573 4.7K PC569 4.7U PR556 4.7U PC571 4. nothing happens.7U PD509 B340A PQ514 MMBT2222A PR564 100K PD508 BAS32L BATTERY_TYPE To P19 U10 D G PQ4 DTA144WK S I_CTRL From P19 U10 8.1 No Power -4 When the power button is pressed.1U REF PC564 1U PR567 100K PC567 0.49K 14 REF DTC 4 PJS2 SHORT-SMT3 PR570 10K PC10 0.1U 99 .7K PR21 13.1U PQ3 2N7002K PC563 1000P PR566 10K t t n e e r c m e u S c c Do a iT ial M t n e id f n o C D G S PC558 4.8515 N/B Maintenance 7. no fan activity is heard and power indicator is not light up.11 PR568 0 12 13 C1.19K PR572 2.7K PR558 4.C2 VCC 3 2 1 8 7 6 5 PL505 33UH BATT PC570 4.7K PR20 332K PQ6 2N7002K D G S PQ5 2N7002K P26 2IN+ 16 2 2IN+ CHARGING PR571 47K OUTPUTCTRL CT RT 1IN- From P19 U10 5 6 PU506 TL594C 2IN15 FEEDBACK 3 PR573 6. 1U PR42 20K PC575 0.1 No Power -5 When the power button is pressed.7K BAT_CLK BAT_DATA R48 22 BATT_C BATT_D R41 22 PR48 0 3 4 PR47 0 ZD15 BAV99 +VDD3_KBC_AVREF ZD14 BAV99 +VDD3_KBC_AVREF 100 .1U PR575 100K W83L951D 41 42 R42 2.1U D9 BAV70LT1 PR576 499K Battery Connector R61 22 BATT_T 5 PR43 0 BATT_V C69 0.1U PC578 0.1U P27 BATT +VDD3_KBC_AVREF PR41 4.1U R63 22 PC28 0.2 PC576 0.1U 2 Keyboard BIOS 111 +VDD3S_KBC t t n e e r c m e u S c c Do a iT ial M t n e id f n o C D S PC29 470P PQ520 AO4409 G 4 PR45 100K ADINP PR44 226K PQ7 DTC144WK PR46 33K PJ502 PQ8 2N7002K PF502 TR/SFT-10A 1. no fan activity is heard and power indicator is not light up.99K PC33 0. Discharge +PWR_VDDIN 8 7 6 5 PD501 EC10QS04 +DVMAIN 3 2 1 3 ADEN# +VDD3S_KBC P19 3 U10 1 107 BAT_TEMP BAT_VOLT C68 0.8515 N/B Maintenance 7.7K R49 2. nothing happens. 8515 N/B Maintenance 7. DIMM module. ODD…….Remove all of I/O device ( HDD. No Display Yes Refer to port error code description section to find out which part is causing the problem. reset circuit and reference power Check following parts and signals: Signals: SMBDATA SMBCLK USBCLK_SB OSC_SB VCLK_SB PCICLK_SB CPU_STOP# STOP_PCI# HCLK_CPU+/PCICLK_KBC PCICLK_FWM PCIECLK_NCARD+/PCIEREQ_NCARD# PCIECLK_MINI+/PCIEREQ_MINI# VCLK_NB PCIECLK_NB+/HCLK_NB+/SB_PWRGD PCI_RESET# KBC_PCIRST# FWM_PCIRST# NB_PCIRST# RSMRST# Display OK? No Yes 1. Display OK? No Yes Correct it. Replace faulty part.Try another known good CPU module.) from motherboard except LCD or monitor. 2. Connect the I/O device to the M/B one at a time to find out which part is causing the problem. DIMM memory are installed Properly. t t n e e r c m e u S c c Do a iT ial M t n e id f n o C System BIOS writes error code to port by Mini PCI-E debug card? No Board-level Troubleshooting Parts: Replace Motherboard U507 U10 U21 U516 U513 U512 U514 U511 J511 X504 SW5 Q10A Q10B Q17A Q17B J4 J516 Check system clock. 1. Make sure that CPU module. 2. 101 . Monitor or LCD module OK? Yes No Replace monitor or LCD.2 No Display -1 There is no display on both LCD and VGA monitor after power on although the LCD and monitor is known-good. 2 No Display -2 ****** System Clock Check ****** +3VS EL532 120Z/100M +VDD3S_SB Q10B 2N7002DW R98 4.8515 N/B Maintenance 7. 48 R84 4.7K +3VS C573 22U VCLK_NB R638 R616 R620 R594 R597 R116 22 33 33 33 33 22 P5 P6 PCIECLK_NB+ PCIECLK_NBHCLK_NB+ HCLK_NB- U513 North Bridge VIA VN896 19 GUICLK PCIECLK_NCARD+ PCIECLK_NCARDPCIEREQ_NCARD# R137 R140 Express Card Connector P15 18 16 J4 P15 13 PCIECLK_MINI+ PCIECLK_MINIPCIEREQ_MINI# R624 R628 Wireless LAN Card Connector 11 J516 7 C579 10P t t n e e r c m e u S c c Do a iT ial M t n e id f n o C 31 27 44 43 54 23 5 R631 22 R589 22 27 R636 22 22 P11 SMBCLK P12 USBCLK_SB OSC_SB VCLK_SB PCICLK_SB U514 South Bridge P8 11 R608 53 4 34 D503 BAT54 D504 BAT54 CPU_STOP# VIA VT8237A U512 33 STOP_PCI# 33 33 42 41 36 Clock Generator 51 R600 33 HCLK_CPU+ P3 U507 CPU Intel Merom 33 33 38 ICS953009 37 50 R605 33 HCLK_CPU- 35 17 R623 22 PCICLK_KBC 51 6 1 X504 14.7K R582 4.3VS_CLK 1.318MHz 2 7 18 R627 22 PCICLK_FWM 31 C578 10P U10 Keyboard Controller W83L951D P19 P20 U21 System BIOS 102 .7K SMBDATA Q10A 2N7002DW +3.3.7K R83 4.. 2 No Display -3 ****** Power Good & Reset Circuit Check ****** JL501 JP_NET10 KBC_PCIRST# +VDD3_ALW R543 10K 6 PWRBTN# C13 1000P R17 1K P19 3 U10 50 KBC_RESET# R541 100K 2 1 U508 RESET# GND VCC KBC W83L951D 29 37 30 53 P21 MN SB_PWRBTN# SB_PWRGD RSMRST# KBC_PCIRST# IDE_PCIRST# t t n e e r c m e u S c c Do a iT ial M t n e id f n o C SW5 P11 P12 1 3 2 4 5 ZJO14 JL506 JP_NET10 FWM_PCIRST# R508 100 P20 22 U21 System BIOS U514 +3VS 5 U511 AHC1G08DBV 1 2 P6 SB_PWRGD 4 +VDD3S_KBC South PCI_RESET# JL505 JP_NET10 NB_PCIRST# U513 North Bridge VIA VN896 4 3 R544 10K Bridge C548 0.01U VIA JL502 JP_NET10 R286 0 MINIPCIE_PCIRST# 22 P15 J516 Wireless LAN Card Connector VT8237A JL504 JP_NET10 +5VS Q17B DDC144TU Q17A DDC144TU R218 10K R211 33 +5VS J511 5 R204 10K P13 ODD Connector 103 .8515 N/B Maintenance 7. 8515 N/B Maintenance 7. Graphics Controller Test Error LCD No Display 1. Confirm LCD panel or monitor is good and check the cable are connected properly. t t n e e r c m e u S c c Do a iT ial M t n e id f n o C Board-level Troubleshooting Parts Replace Motherboard U513 U504 U514 U10 U6 J1 EL540 EL541 EL542 EL543 Check if J1 is cold solder? No Yes Re-soldering. Display OK? No Yes Replace faulty LCD or monitor. 104 . Remove all the I/O device & cable from motherboard except LCD panel or extended monitor. Try another known good monitor or LCD module.3 Graphics Controller Test Error LCD No Display -1 There is no display or picture abnormal on LCD although power-on-self-test is passed. use an oscilloscope to check the following signal or replace the parts one at a time and test after each replacement. Signals LCD_A_TXD0+/LCD_A_TXD1+/LCD_A_TXD2+/LCD_A_CLK+/LTX0+/LTX1+/LTX2+/LCLK+/ENVDD_NB PANEL_ID0/1 LCD_SPCLK LCD_SPD +DVMAIN BLADJ ENABKL_LCD H8_ENABKL +3VS EL4 EL1 Q5 Q4 ER512 ER513 Display OK? No Yes Connect the I/O device & cable to the M/B one at a time to find out which part is causing the problem. 2. One of the following parts on the mother-board may be defective. 17.29 LTX[0.8515 N/B Maintenance 7.16 +D/VMAIN P19 U10 H8_ENABKL Change to ENABKL_LCD 22 KBC W83L951D BLADJ BLADJ 24 105 .15.27 LCD 11.2]+..3 Graphics Controller Test Error LCD No Display -2 There is no display or picture abnormal on LCD although power-on-self-test is passed.2]+..20..LCLK- 9.18.2]-.2 LCD_SPCLK 6 P10 8 LTX[0.23 LVDS Encoder VT1637 P11 U514 PANEL_ID0 PANEL_ID1 South Bridge VIA VT8237A t t n e e r c m e u S c c Do a iT ial M t n e id f n o C LCD_SPD LCD_A_TXD[0.24 15.21.21.17.LCLK+ LCD/Inverter Connector PANEL_ID0 PANEL_ID1 5 4 Inverter Board 14.LCD_A_CLKChange to LCD_A_TXD[0.LCD_A_CLK+ Change to ENVDD_NB 1.. J1 P6 ENVDD_NB U513 LCD_SPCLK North Bridge VIA VN896 LCD_SPD P9 U504 16.2]-.23. Confirm monitor is good and check the cable are connected properly. Signals: +5VS +3VS CON_DDDA CON_HSYNC CON_VSYNC CON_DDCK CON_RED CON_GREEN CON_BLUE CRT_BLUE CRT_GREEN CRT_RED CRT_DDC_DATA CRT_DDC_CLK CRT_VSYNC CRT_HSYNC CRT_IN# Replace Motherboard Display OK? No Yes Connect the I/O device & cable to the M/B one at a time to find out which part is causing the problem.8515 N/B Maintenance 7. but it is OK for LCD. Remove all the I/O device & cable from motherboard except monitor. No One of the following parts on the mother-board may be defective. 2. Try another known good monitor. t t n e e r c m e u S c c Do a iT ial M t n e id f n o C Board-level Troubleshooting Parts: U513 U517 U518 J501 Q1A/B EL501 EL502 EL505 EL506 EL507 EL22 EL28 Check if J501 is cold solder? Yes Re-soldering. 106 . Display OK? No Yes Replace faulty monitor. External Monitor No Display 1.4 External Monitor No Display -1 There is no display or picture abnormal on CRT monitor. use an oscilloscope to check the following signal or replace the parts one at a time and test after each replacement. but it is OK for LCD. CRT_DDC_DATA P6 CRT_DDC_CLK U513 CRT_VSYNC CRT_HSYNC VIA VN896 North Bridge CRT_RED CRT_GREEN CRT_BLUE U10 KBC W83L951D P19 CRT_IN# t t n e e r c m e u S c c Do a iT ial M t n e id f n o C Change to Change to Change to Change to Change to Change to Change to J501 CON_DDDA 12 P10 CON_DDCK 15 CON_VSYNC 14 External CRT Connector CON_HSYNC 13 CON_RED 1 CON_GREEN 2 CON_BLUE 3 CRT_IN# 11 107 .8515 N/B Maintenance 7.4 External Monitor No Display -2 There is no display or picture abnormal on CRT monitor. 3]SMB_DATA SMB_CLK +1.Use an oscilloscope to check the signals or replace the parts one at a time and test after each replacement. ( J513. J515) is ok. Check the extend SO-DIMM module is installed properly.7] DDR_A_BS[0.3] DDR_A_DQS[0..7] DDR_CLK[0. Confirm the SO-DIMM socket (J513. 108 .....8515 N/B Maintenance 7.. Replace Motherboard U513 U19 U514 J513 J515 Q10A/B R249 R250 R251 R252 R254 R253 R256 R255 One of the following components or signals on the motherboard may be defective .. t t n e e r c m e u S c c Do a iT ial M t n e id f n o C Board-level Troubleshooting Parts: Correct it.7] DDR_A_DQS#[0...3] DDR_CKE[0. no band pins.3] DDR_ODT[0. Signals: DDR_A_DQ[0.5 Memory Test Error -1 Extend DDR2 SO-DIMM is test error or system hangs up. Memory Test Error 1.2] DDR_A_MA[0..3]+ DDR_CLK[0.. Test OK? No Yes If your system host bus clock running at 533/667 MHZ then make sure that SO-DIMM module meet require of PC4200/PC5400.8V +3VS Test OK? No Yes Replace the faulty DDR2 SODIMM module. J515) 2.13] DDR_A_RAS# DDR_A_CAS# DDR_A_WE# DDR_CS#[0.63] DDR_A_DM[0. DDR_A_DQS[0...1]- U19 ICS9P956 DDR_CLK[2.. DDR_A_WE# DDR_A_DM[0. DDR_A_DQS[0. DDR_A_DQS[0.. DDR_A_BS[0.. DDR_ODT[0.. DDR_ODT[0.3] U513 North Bridge VIA VN896 DDR_A_RAS#. DDR_ODT[0.3]- P12 U514 South Bridge VIA VT8237A SMBCLK SMBDATA t t n e e r c m e u S c c Do a iT ial M t n e id f n o C SMB_DATA SMB_CLK Change to SMB_CLK Change to SMB_DATA DDR_A_MA[0. DDR_A_DQS#[0. DDR_CKE[0. DDR_A_BS[0.. DDR_A_DQS#[0.7].3]- DDR_A_DQ[0. DDR_CS#[0.3] 109 . DDR_CS#[0.7]. DDR_CKE[0. DDR_A_CAS#.2]. DDR_A_CAS#.2]. DDR_CLK[2. DDR_A_BS[0.3] P8 DDR_CLK[0...7]...3]+...3] DDR_A_RAS#....3].5 Memory Test Error -2 Extend DDR2 SO-DIMM is test error or system hangs up..7].3].8515 N/B Maintenance 7... P5 J513 DDR_A_DQ[0.3] DDR_A_RAS#. DDR_CLK[0. DDR_A_WE# DDR_A_DM[0...7]..13].7] DDR_A_MA[0.3] P7 DIMM1 DDR_CLK[0..13]. DDR_CLK[0. DDR_A_CAS#..7] DDR_A_DQ[0.1]+.7] DDR_A_MA[0.1]- J515 P7 DIMM0 DDR_CLK[2...63].7]. DDR_CLK[2. DDR_CS#[0.3].13]. DDR_A_DQS#[0.2].3]+.63]. DDR_A_WE# DDR_A_DM[0.63].. DDR_CKE[0.1]+. 6 Keyboard (K/B) or Touch-Pad (T/P) Test Error -1 Error message of keyboard or touch-pad test error is shown or any key does not work.. Signals +5V KI[0. J3 are cold solder? Yes Re-soldering. Replace Motherboard Parts U514 U10 J2 J3 SW6 SW7 EL30 EL31 EL26 Check J2. t t n e e r c m e u S c c Do a iT ial M t n e id f n o C Board-level Troubleshooting Correct it.8515 N/B Maintenance 7. No One of the following parts or signals on the motherboard may be defective. Test Ok? No Yes Replace the faulty Keyboard or Touch-Pad. use an oscilloscope to check the signals or replace the parts one at a time and test after each replacement.15] T_CLK T_DATA TP_CLK TP_DATA TP_LEFT TP_RIGHT LPC_AD[0.7] KO[0.3] LPC_FRAME# 110 ... Keyboard(K/B) or Touch-Pad(T/P) Test Error Is K/B or T/P cable connected to notebook properly? No Yes Try another known good Keyboard or Touch-pad. 94 77 KI[0.. P11 P12 LPC_FRAME# SERIRQ LPC_AD[0.6 SW7 +5V 1..15] 11..8 TP_RIGHT 5..10 48 47 T_CLK Change to TP_CLK T_DATA Change to TP_DATA P20 SW6 SW_LEFT 2 4 5 1 3 TP_LEFT 7.3] RSMRST# U514 South Bridge VIA VT8237A t t n e e r c m e u S c c Do a iT ial M t n e id f n o C 95.6 Keyboard (K/B) or Touch-Pad (T/P) Test Error -2 Error message of keyboard or touch-pad test error is shown or any key does not work..7] J2 3...12 9.8515 N/B Maintenance 7..59 30 Keyboard BIOS W83L951D J3 11.10 Internal Keyboard Connector P19 P19 KO[0.26 2 KBD_US/JP# U10 52 54 56.2 1 3 2 4 5 SW_RIGHT Touch-Pad 111 .102 79. Re-boot OK? No Yes Replace the faulty parts. Hard Disk Drive Test Error 1. or the drive motor spins non-stop.Test OK? No Yes End 112 . Try another working drive..3]# IDE_PDACK# HDD_DACK# IDE_PIRDY HDD_IRDY IDE_PIRQ HDD_IRQ HDD_DIOR# IDE_PDIOR# HDD_DREQ IDE_PDREQ IDE_PDIOW# HDD_DIOW# Re . 2.2] IDE_PDA[0..7 Hard Disk Drive Test Error -1 Either an error message is shown.. Signals: SATA_RX0+/SATA_TX0+/HDD_DD[0.15] IDE_PDD[0.8515 N/B Maintenance 7. Check the system driver for proper installation.2] IDE_PDCS[1. t t n e e r c m e u S c c Do a iT ial M t n e id f n o C Board-level Troubleshooting Parts: Replace Motherboard U514 J510 J509 R269 R268 R267 R266 One of the following parts or signals on the motherboard may be defective..15] HDD_DA[0. while reading data from or writing data to hard disk. use an oscilloscope to check the signals or replace the parts one at a time and test after each replacement.3]# HDD_DCS[1. Check if BIOS setup is OK?. 8515 N/B Maintenance 7. or the drive motor spins non-stop. P12 U514 South Bridge VIA VT8237A t t n e e r c m e u S c c Do a iT ial M t n e id f n o C SATA_RX0+ SATA_RX0SATA_TX0+ SATA_TX0- J510 P13 SATA HDD Connector 113 .7 Hard Disk Drive Test Error -2 Either an error message is shown. while reading data from or writing data to hard disk. ..12 8 18 7 14 22 20 20 IDE_PIRDY IDE_PDCS3# IDE_PIRQ IDE_PDIOW# IDE_PDIOR# IDE_PDACK# 114 .4 +5VS IDE_PDD[0.2] IDE_PDCS1# P13 Primary EIDE Connector 27~42 24 9.2] HDD_DCS1# HDD_IRDY HDD_DCS3# HDD_IRQ HDD_DIOW# HDD_DIOR# HDD_DACK# t t n e e r c m e u S c c Do a iT ial M t n e id f n o C Change to Change to Change to Change to Change to Change to Change to Change to Change to Change to J509 3.8515 N/B Maintenance 7. P11 HDD_DD[0..10.15] HDD_DREQ U514 South Bridge VIA VT8237A HDD_DA[0.. or the drive motor spins non-stop.15] IDE_PDREQ IDE_PDA[0. while reading data from or writing data to hard disk.7 Hard Disk Drive Test Error -3 Either an error message is shown. Check install for correctly.Test OK? No Yes t t n e e r c m e u S c c Do a iT ial M t n e id f n o C Board-level Troubleshooting Parts: U514 U511 J511 R648 Q17A Q17B One of the following parts or signals on the motherboard may be defective.15] ODD_DA[0..2] ODD_DCS[1.8515 N/B Maintenance 7.3]# ODD_DIOR# ODD_DIOW# ODD_DACK# ODD_IRDY ODD_DREQ ODD_RST# ODD_LED# ODD_IRQ Replace Motherboard End 115 . Check the ODD drive for proper installation. Test OK? No Yes Replace the faulty parts.. Try another known good compact disk. 2. Signals: +5VS +3VS ODD_DD[0. Re . ODD Drive Test Error 1.8 ODD Drive Test Error -1 An error message is shown when reading data from ODD drive. use an oscilloscope to check the signals or replace the parts one at a time and test after each replacement. 2] ODD_IRQ ODD_DACK# ODD_DIOR# ODD_DIOW# ODD_DREQ ODD_IRDY ODD_DCS[1.34 29 28 24 25 22 27 35.3]# 5 31. ODD_DD[0..21 ODD Connector ODD_RST# Refer Section 8.15] P12 U514 ODD_DA[0..2] ODD_IRQ ODD_DACK# South Bridge ODD_DIOR# ODD_DIOW# ODD_DREQ VIA VT8237A ODD_IRDY ODD_DCS[1..2(No display-3) ODD_RST# ODD_DA[0..3]# t t n e e r c m e u S c c Do a iT ial M t n e id f n o C D5 CL-190G J511 +5VS 32 D7 BAT54A +3VS ODD_LED# 37 P13 ODD_DD[0..8515 N/B Maintenance 7.33.36 116 .8 ODD Drive Test Error -2 An error message is shown when reading data from ODD drive.15] 6. Replace another known good USB device. Re-test OK? No Yes Correct it. Signals: USBP0+/USBP1+/USBP2+/USBP3+/+5V_USB_1 +5V_USB_2 +5V_USB_3 +5V_USB_4 USB_OC0 USB_OC1 SW_VDD3 Replace Motherboard 117 . Test OK? No Yes Correct it. USB Port Test Error Check if the USB device is installed properly. t t n e e r c m e u S c c Do a iT ial M t n e id f n o C Board-level Troubleshooting Parts: U514 U505 U4 J504 J506 J503 EL509 EL510 EL521 EL508 EL2 EL516 EL3 EL515 Check the following parts for cold solder or one of the following parts on the mother-board may be defective. use an oscilloscope to check the following signal or replace the parts one at a time and test after each replacement.8515 N/B Maintenance 7.9 USB Port Test Error -1 An error occurs when a USB I/O device is installed. 9 USB Port Test Error -2 An error occurs when a USB I/O device is installed. P14 J503 USBP3USBP32 USB Port USBP3+ P11 USB_OC1 USBP2- U514 USBP2+ South Bridge USBP0USBP0+ VIA VT8237A USBP1USBP1+ t t n e e r c m e u S c c Do a iT ial M t n e id f n o C U10 Page 19 USBP3+ 3 1 +3V U505 VOUT 5 3 +5V_USB_4 +5V 4 VIN CE SW_VDD3 1 P14 GND FLG P14 J506 +5V_USB_3 1 USB Port USBP2- 2 USBP2+ 3 J504 USBP02 USBP0+ 3 P14 USB Port USBP1- A2 USBP1+ A3 1 A1 +3V U4 VOUT 5 3 +5V_USB_1 +5V_USB_2 U10 Page 19 +5V SW_VDD3 4 1 VIN CE P14 GND FLG USB_OC0 118 .8515 N/B Maintenance 7. Test OK? No Try another known good speaker. CD-ROM.use an oscilloscope to check the following signal or replace parts one at a time and test after each replacement. Check if speaker cables are connected properly. If no sound cause of MIC. 2. Audio Test error 1. 2. check the following parts & signals: Parts: Signals: U10 U14 U17 J519 J518 J512 EL537 EL536 EL539 EL538 EL24 EL27 Check the following parts for cold solder or one of the following parts on the motherboard may be defective. ROUTP/N LOUTP/N HP_OUTR/L HP_SENSE# SPK_OFF AMP_RIGHT AMP_LEFT HP_RIGHT HP_LEFT 119 . check the following parts & signals: Parts: U17 U514 U10 U14 J514 EL34 EL35 R236 R231 R238 R226 Signals: +5VS +3VS MIC1_VREFR MIC1_VREFL MIC1_R MIC1_L MIC_SENSE# ACZ_RST# ACZ_SYNC ACZ_SDIN0 ACZ_BITCLK ACZ_SDOUT Replace Motherboard Correct it. Make sure all the drivers are installed properly.10 Audio Test Error -1 No sound from speaker after audio driver is installed. Re-test OK? No Yes t t n e e r c m e u S c c Do a iT ial M t n e id f n o C Board-level Troubleshooting 1. Yes Correct it.8515 N/B Maintenance 7.If no sound cause of line out. 8515 N/B Maintenance 7.10 Audio Test Error -2 (Audio In) No sound from speaker after audio driver is installed. +3VS P12 ACZ_SDIN0 ACZ_SDOUT ACZ_SYNC U514 South Bridge VIA VT8237A ACZ_RST# ACZ_BITCLK SPK_OFF To next page P19 U10 72 KBC_BEEP Change to KBC W83L951D t t n e e r c m e u S c c Do a iT ial M t n e id f n o C 13 SENSE_A Change to 1,9 DVDD1,2 32 MIC1_VREFR MIC1_VREFL 8 5 HP_SENSE# From next page MIC_SENSE# MIC1_VREFR MIC1_VREFL P17 J514 5 4 3 6 2 1 7 8 P17 28 10 11 6 U17 21 MIC1_L 22 MIC1_R External MIC Audio Codec 36 AMP_RIGHT ALC268 AMP_RIGHT To next page 35 AMP_LEFT HP_RIGHT AMP_LEFT To next page 41 HP_RIGHT To next page 39 HP_LEFT PC_BEEP 12 PCBEEP HP_LEFT To next page 120 8515 N/B Maintenance 7.10 Audio Test Error -3 (Audio Out) No sound from speaker after audio driver is installed. +5V AMP_LEFT From previous page AMP_RIGHT From previous page AMP_LEFT AMP_RIGHT HP_RIGHT From previous page HP_LEFT From previous page HP_RIGHT HP_LEFT Change to SPK_OFF From previous page t t n e e r c m e u S c c Do a iT ial M t n e id f n o C 19 HVDD P18 ROUT+ ROUT- 22 21 ROUTP J519 1 2 ROUTN P18 U14 J518 1 2 5 LOUT+ LOUT- 8 9 LOUTP Internal Speaker Connector INL_A LOUTN P18 3 INR_A Audio 4 6 Amplifier APA2056 P18 INR_H INL_H J512 5 4 3 6 2 1 7 8 HP_SENSE# To previous page 17 18 HP_OUTR HP_OUTL SPK_OFF# 26 HP Jack 121 8515 N/B Maintenance 7.11 LAN Test Error -1 An error occurs when a LAN device is installed. LAN Test Error 1.Check if the driver is installed properly. 2.Check if the notebook connect with the LAN properly. Test OK? No Check if BIOS setup is ok. Yes Correct it. Re-test OK? No Yes t t n e e r c m e u S c c Do a iT ial M t n e id f n o C Board-level Troubleshooting Parts: Replace Motherboard U514 U506 U503 J502 EL518 EL519 X501 R519 RP503 Check the following parts for cold solder or one of the following parts on the mother-board may be defective, use an oscilloscope to check the following signal or replace the parts one at a time and test after each replacement. Signals: RJ45_PJ7 RJ45_PJ4 PJRX+/PJTX+/LAN_TXP/N LAN_RXP/N LAN_DATAIO LAN_DCLK LAN_MTXC LAN_MRXD[0..3] LAN_MTXD[0..3] LAN_MTXE LAN_COL LAN_CRS LAN_MRXC LAN_MRXDV LAN_MRXER +3V Correct it. 122 .8515 N/B Maintenance 7.. LAN_DATAIO LAN_DCLK P11 LAN_MRXDV LAN_MRXC U514 LAN_MRXER LAN_MRXD[0.5 15 LAN EL520 130Z/100M 16 +3V_LAN 6 14 R505 75 C504 1000P R504 75 RJ45_PJ7 1.48 26 LAN_RXN 2 NS681680P 11 R506 75 R503 75 RJ45_PJ4 4.3] LAN_MTXE t t n e e r c m e u S c c Do a iT ial M t n e id f n o C 43 20..22..23 +3V 44 P16 J502 PJTX+ PJTXPJRX+ PJRX8 7 35 LAN_TXP 7 10 9 16 15 3 P16 P16 RJ45 LAN Connector 34 LAN_TXN 8 4 6 3 5 27 LAN_RXP 1 U506 U503 45.11 LAN Test Error -2 An error occurs when a LAN device is installed.2 Controller C526 0.14 39 10 VT6103L XO R519 300K R518 300 2 1 C529 22P X501 25MHZ C533 22P 123 .3] South Bridge LAN_COL LAN_CRS VIA VT8237A LAN_MTXC LAN_MTXD[0.21.1U 9 40 XI 11. use an oscilloscope to check the following signal or replace the parts one at a time and test after each replacement.. Check if the wireless card device is installed properly. Yes Correct it t t n e e r c m e u S c c Do a iT ial M t n e id f n o C Replace Motherboard Parts: U512 U513 U514 J516 C605 C605 C606 R653. 2.3] LPC_FRAME# LPC_DRQ#0 SERIRQ LPC_DBG_CLK WLAN_PD# USBP4+/SMB_CLK SMB_DATA Re-test OK? No Yes Change the faulty part then end. Test OK? No Try another known good wireless card device. Signals +3VS PCIEREQ_MINI# PCIECLK_MINI+/SIO_48M PCI_EXP_RX0+/PCI_EXP_TX0+/LPC_AD[0. Confirm wireless driver is installed ok. Mini Express (Wireless) Socket Test Error 1. 124 .8515 N/B Maintenance 7. R654 R655 R656 R657 R658 R659 R624 R628 Board-level Troubleshooting Check the following parts for cold solder or one of the following parts on the mother-board may be defective.12 Mini Express (Wireless) Socket Test Error -1 An error occurs when a wireless card device is installed. J516 P8 24 35 37 38 31 48 SIO_48M PCIEREQ_MINI# PCIECLK_MINI17 7 11 13 30 32 U512 Clock Generator ICS953009 U513 P6 North Bridge VIA VN896 P11 U514 P12 South Bridge VIA VT8237A t t n e e r c m e u S c c Do a iT ial M t n e id f n o C PCIECLK_MINI+ SMB_CLK SMB_DATA MINIPCIE_PCIRST# Refer Section 8.43 45 47 49 20 36 38 .12 Mini Express (Wireless) Socket Test Error -2 An error occurs when a wireless card device is installed..3] LPC_FRAME# LPC_DRQ#0 SERIRQ WLAN_PD# USBP4USBP4+ P15 Mini Express (Wireless) Connector 125 22 31 33 23 25 37.2(No display-3) PCI_EXP_TX0PCI_EXP_TX0+ PCI_EXP_RX0PCI_EXP_RX0+ LPC_AD[0.8515 N/B Maintenance 7.. 8515 N/B Maintenance 7. use an oscilloscope to check the following signal or replace the parts one at a time and test after each replacement. Test OK? No Try another known good express card device.3VS_CARD USBP5+/SMB_CLK SMB_DATA PCIEREQ_NCARD# PCIECLK_NCARD+/PCI_EXP_RX16+/PCI_EXP_TX16+/CPUSB# CARD_RST# CPPE# PCIE_WAKE_UP# NCARD_TX16+/- Re-test OK? Yes Change the faulty part then end.13 Express Card Socket Test Error -1 An error occurs when a express card device is installed. Confirm express card driver is installed ok. 2. No 126 . Express Card Socket Test Error 1. Signals +3V +3VS +3. Yes Correct it t t n e e r c m e u S c c Do a iT ial M t n e id f n o C Replace Motherboard Parts: U512 U513 U514 U516 U20 J4 C322 C333 R278 R693 Board-level Troubleshooting Check the following parts for cold solder or one of the following parts on the mother-board may be defective. Check if the express card device is installed properly. J4 U512 P8 36 41 42 31 48 PCIEREQ_NCARD# PCIECLK_NCARDPCIEREQ_NCARD# PCIECLK_NCARD16 18 19 7 8 Clock Generator ICS953009 U513 P6 North Bridge VIA VN896 P11 P12 U514 South Bridge t t n e e r c m e u S c c Do a iT ial M t n e id f n o C PCIECLK_NCARD+ SMB_CLK PCIECLK_NCARD+ SMB_CLK SMB_DATA SMB_DATA PCI_EXP_TX16Change to Change to NCARD_TX16PCI_EXP_TX16+ PCI_EXP_RX16NCARD_TX16+ PCI_EXP_RX16+ P15 24 Express Card Connector 25 21 22 +3V 5 U516 AHC1G08DBV 1 2 4 SB_CARD_PCIRST# 1 P15 8 CARD_RST# CPUSB# CPPE# 13 4 17 PCI_RESET# 3 U20 11 12 G577D5U PCIE_WAKE_UP# USBP5- PCIE_WAKE_UP# USBP5- 11 2 3 USBP5+ VIA VT8237A USBP5+ 127 .13 Express Card Socket Test Error -2 An error occurs when a express card device is installed.8515 N/B Maintenance 7. Corp.Inc VIA.Corp.Inc Technology./MITAC .Inc VIA./MITAC Technology.Reference Material ™ Intel Merom Processor ™ VIA VN896 North Bridge ™ VIA VT8237A South Bridge ™ 8515 Hardware Engineering Specification ™ System Explode Views Intel. 269.com Fax : 086-512-57385099 .SERVICE MANUAL FOR Sponsoring Editor : Ally Yuan Author : Guangna Zhang 8515 Publisher : MiTAC Technology Corp.mtc.R. P.C Tel : 086-512-57367777 Second Edition : Oct.mitacservice.com.com http: //www.tw Web : http: //www.2007 E-mail : Ally. Road 2. Export Processing Zone.mitac. Address : No.Yuan @ mic. Kunshan.
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