22LK230-LP92R

Internal Use OnlyNorth/Latin America Europe/Africa Asia/Oceania http://aic.lgservice.com http://eic.lgservice.com http://biz.lgservice.com LCD TV SERVICE MANUAL CHASSIS : LP92R MODEL : 22LK230 CAUTION 22LK230-MA BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL. P/NO : MFL67263001 (1107-REV00) Printed in Korea CONTENTS CONTENTS .............................................................................................. 2 PRODUCT SAFETY ................................................................................. 3 SPECIFICATION ...................................................................................... 6 ADJUSTMENT INSTRUCTION ............................................................... 7 EXPLODED VIEW .................................................................................. 10 SCHEMATIC CIRCUIT DIAGRAM .............................................................. Copyright © 2011 LG Electronics. Inc. All right reserved. Only for training and service purposes -2- LGE Internal Use Only SAFETY PRECAUTIONS IMPORTANT SAFETY NOTICE Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer. General Guidance An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks. It will also protect the receiver and it's components from being damaged by accidental shorts of the circuitry that may be inadvertently introduced during the service operation. If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified. When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1 W), keep the resistor 10 mm away from PCB. Keep wires away from high voltage or high temperature parts. Leakage Current Hot Check (See below Figure) Plug the AC cord directly into the AC outlet. Do not use a line Isolation Transformer during this check. Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exposed metallic part. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to 0.5 mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer. Leakage Current Hot Check circuit AC Volt-meter Before returning the receiver to the customer, always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock. Leakage Current Cold Check(Antenna Cold Check) With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1 MΩ and 5.2 MΩ. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer. To Instrument’s exposed METALLIC PARTS 0.15 uF Good Earth Ground such as WATER PIPE, CONDUIT etc. 1.5 Kohm/10W When 25A is impressed between Earth and 2nd Ground for 1 second, Resistance must be less than 0.1 Ω *Base on Adjustment standard Copyright © 2011 LG Electronics. Inc. All right reserved. Only for training and service purposes -3- LGE Internal Use Only Heat the component lead until the solder melts. low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500 °F to 600 °F. First. clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner. NOTE: If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication. Do not spray chemicals on or near this receiver or any of its assemblies. and hold it there only until the solder flows onto and around both the component lead and the foil.5 inch. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam. 6. cotton-tipped stick or comparable non-abrasive applicator. 3. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity. -4- LGE Internal Use Only . Do not use freon-propelled chemicals. or 1. Such components commonly are called Electrostatically Sensitive (ES) Devices. suctiontype solder removal device or with solder braid. These can generate electrical charges sufficient to damage ES devices.99 % strength) CAUTION: This is a flammable mixture. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Use only a grounded-tip soldering iron to solder or unsolder ES devices. 3. 6. Inc. aluminum foil or comparable conductive material). Copyright © 2011 LG Electronics. Thoroughly clean the surfaces to be soldered. 5. c. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead. Unless specified otherwise in this service manual. Use the following soldering technique. Remember: Safety First. c. 7. Immediately before handling any semiconductor component or semiconductor-equipped assembly. drain off any electrostatic charge on your body by touching a known earth ground. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM. which should be removed to prevent potential shock reasons prior to applying power to the unit under test. 4. Some solder removal devices not classified as "anti-static" can generate electrical charges sufficient to damage ES devices. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard. c. a. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device. d. 4. Use the following unsoldering technique a. FETVOM. 2. Disconnecting or reconnecting any receiver electrical plug or other electrical connection. General Servicing Precautions 1. Connecting a test substitute in parallel with an electrolytic capacitor in the receiver. 5. Minimize bodily motions when handling unpackaged replacement ES devices. 6. always follow the safety precautions. Use a mall wirebristle (0. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped. 3. a. 2. Electrostatically Sensitive (ES) Devices Some semiconductor (solid-state) devices can be damaged easily by static electricity. lubrication of contacts in not required. Quickly draw the melted solder with an anti-static. Removing or reinstalling any component. All right reserved. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components.25 cm) brush with a metal handle. 1. 10 % (by volume) Acetone and 90 % (by volume) isopropyl alcohol (90 % . (500 °F to 600 °F) b. Closely inspect the solder area and remove any excess or splashed solder with a small wire-bristle brush. place the assembly on a conductive surface such as aluminum foil. read and follow the SAFETY PRECAUTIONS on page 3 of this publication. Quickly move the soldering iron tip to the junction of the component lead and the printed circuit foil. 7. Use only an anti-static type solder removal device. circuit board module or any other receiver assembly. Unless specified otherwise in this service manual. Keep the soldering iron tip clean and well tinned. touch the protective material to the chassis or circuit assembly into which the device will be installed. Alternatively. CAUTION: Work quickly to avoid overheating the circuit board printed foil. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed. hold the soldering iron tip and solder the strand against the component lead until the solder melts. and observe all other safety precautions. b. 4. 5. Do not test high voltage by "drawing an arc". Always unplug the receiver AC power cord from the AC power source before. Do not use freon-propelled spray-on cleaners. Use with this receiver only the test fixtures specified in this service manual. to prevent electrostatic charge buildup or exposure of the assembly. CAUTION: Be sure no power is applied to the chassis or circuit. Always remove the test receiver ground lead last. 8. Allow the soldering iron tip to reach a normal temperature (500 °F to 600 °F) b. Only for training and service purposes 2. After removing an electrical assembly equipped with ES devices. CAUTION: Work quickly to avoid overheating the circuit board printed foil. obtain and wear a commercially available discharging wrist strap device.) General Soldering Guidelines 1. 8. Use a grounded-tip. Allow the soldering iron tip to reach normal temperature. CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver. etc) equipped with a suitable high voltage probe.SERVICING PRECAUTIONS CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda. Immediately before removing the protective material from the leads of a replacement ES device. When working with boards using the familiar round hole. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges. use the standard technique as outlined in paragraphs 5 and 6 above. 3. Clip each fuse or resistor lead at top of the circuit board hollow stake. If they are not shiny. "Small-Signal" Discrete Transistor Removal/Replacement 1. 3. Only for training and service purposes Circuit Board Foil Repair Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. Copyright © 2011 LG Electronics. Remove the defective transistor by clipping its leads as close as possible to the component body. Diode Removal/Replacement 1. Power Output. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection. Securely crimp each connection and solder it. to ensure that a hazardous condition will not exist if the jumper wire opens. Inc. Removal 1. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. 3. 4. -5- LGE Internal Use Only . 2. Solder the IC connection. Remove the heat sink mounting screw (if so equipped). Observing diode polarity. 3. (Use this technique only on IC connections). 2. apply additional solder. Solder the connections. Clean the soldered areas with a small wire-bristle brush. Bend into a "U" shape the end of each of three leads remaining on the circuit board. Carefully crimp and solder the connections. Carefully insert the replacement IC in the circuit board. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. 4. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern. Carefully remove the transistor from the heat sink of the circuit board. (Remove only as much copper as absolutely necessary). 3. At IC Connections To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board.IC Remove/Replacement Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. At Other Connections Use the following technique to repair the defective copper pattern at connections other than IC Pins. Fuse and Conventional Resistor Removal/Replacement 1. Transistor Device Removal/Replacement 1. 1. When holes are the slotted type. 2. Solder the overlapped area and clip off any excess jumper wire. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts. 5. and clip off excess lead. Bend into a "U" shape the replacement transistor leads. This technique involves the installation of a jumper wire on the component side of the circuit board. Heat and remove all solder from around the transistor leads. wrap each lead of the new diode around the corresponding lead on the circuit board. 4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC. Replacement 1. reheat them and if necessary. (It is not necessary to reapply acrylic coating to the areas). 2. 2. All right reserved. Remove defective diode by clipping its leads as close as possible to diode body. 5. Solder each transistor lead. the following technique should be used to remove and replace the IC. 2. Bend the two remaining leads perpendicular y to the circuit board. Replace heat sink. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern. 6. Carefully remove the damaged copper pattern with a sharp knife. Carefully bend each IC lead against the circuit foil pad and solder it. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures. 3. 3. 1. 2. Securely crimp the leads of replacement component around notch at stake top. Remove at least 1/4 inch of copper. 2. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Insert new transistor in the circuit board. The following guidelines and procedures should be followed whenever this condition is encountered. Remove the defective copper pattern with a sharp knife. 4. 500 27 27. 1 2 3 4 5 6 7 8 9 Specification Resolution 720*480 720*480 720*576 720*480 720*480 720*576 1280*720 1280*720 1280*720 H-freq(kHz) 15. 7.00 50.625 31.027 27 74.75 15. 1 2 3 Market Broadcasting system Available Channel 4. IEC specification . 50 / 60 Hz) * Standard Voltage of each products is marked by models.00 Pixel Clock(MHz) 13. Only PCM MODE AV (1EA) 5. 9.94 60.25 Proposed SDTV. 3. DVD 576I(625I) 50Hz SDTV 480P SDTV 480P SDTV 576P HDTV 720P HDTV 720P HDTV 720P Remarks Spec. 5. sheet is applied to LCD TV used LP92R chassis. Application range This spec. 5) The receiver must be operated for about 5 minutes prior to the adjustment.73 15.96 45 37. Inc.176 74. 4. Model specification No.25 44. 4) Specification and performance of each parts are followed each drawing and specification by part number in accordance with BOM. 1.00 50.94 60. Test method 1) Performance: LGE TV test method followed 2) Demanded other specification .514 13. DVD 480I(525I) SDTV. BAND VHF/UHF Cable Receiving system Video Input AV Audio Output RGB Input HDMI Input Audio Input (1EA) Item Non-EU PAL/SECAM B/G/D/K. 8. Specification Each part is tested as below without special appointment. DVD 480I(525I) SDTV. out but display.5 V-freq(Hz) 59.47 31.5 31.EMC : CE.00 59. CST: 40 ºC ± 5 ºC 2) Relative Humidity : 65 % ± 10 % 3) Power Voltage : Standard input voltage(AC 100-240 V~. SECAM. Copyright © 2011 LG Electronics.SPECIFICATION NOTE : Specifications and others are subject to change without notice for improvement. PAL I/II. 6. 1) Temperature: 25 ºC ± 5 ºC(77 ºF ± 9 ºF).00 50. NTSC-M PAL E2~C69 S21~47 NTSC 2~78 1~71 China(DK) C1~C62 S1~S41 Rear (1EA) Rear (1EA) Rear (1EA) Rear (1EA) L/R Input Specification Measurement Remark Upper Heterodyne PAL.00 59.25 74.500 13. NTSC RF/AV/HDMI Audio Output S/W Upgrade Only HDMI-DTV. All right reserved.94 60.Spec out) No.Safety: CE. HDMI Input(DTV)(HDMI DVI . Only for training and service purposes -6- LGE Internal Use Only . IEC 2. G In case of keeping module is in the circumstance of below -20 °C. PCB assembly adjustment method 4. (2) Download steps 1) Execute ‘ISP Tool’ program. the use of isolation transformer will help protect test instrument. LP92R chassis. I2C Speed setting : 350 Khz ~ 400 Khz Copyright © 2011 LG Electronics. Application Range This specification sheet is applied to all of the LCD TV.1.1. However. (4) The input voltage of the receiver must keep AC 100-220 V~. Inc.1 Using D/L Jig (1) Preliminary steps 1) Connect the download jig to D-sub(JK302) jack or P301(4P) Wafer. 2) Click the “Connect” button and confirm “Dialog Box”. (6) The receiver must be operated for over 5 minutes prior to the adjustment when module is in the circumstance of above 15 ºC.ADJUSTMENT INSTRUCTION 1. 4. G In case of keeping module is in the circumstance of 0 °C. SET assembly adjustment items (1) Input Area option (2) Adjustment of White Balance : Auto & Manual (3) Input Tool-Option/Area option (4) Preset CH information (5) Factoring Option Data input 3) Click the “Config” button and Change speed. Mstar Main S/W program download 4. 2. (5) The standard signal level is approved in 65 ± 1 dB µV. it should be placed in the circumstance of above 15 °C for 3 hours. PCB assembly adjustment items (1) Download the MSTAR main software(IC604.1. Adjustment items 3.2.b . Mstar ISP Utility) 1) Using D/L Jig (2) Input Tool-Option (3) Check SW Version. 3. it is not necessary to use an isolation transformer. (3) The adjustment must be performed in the circumstance of 25 °C ± 5 °C of temperature and 65 % ± 10 % of relative humidity if there is no specific designation. 50 / 60 Hz. 3. it should be placed in the circumstance of above 15 °C for 2 hours. Specification (1) Because this is not a hot chassis. (2) Adjustment must be done in the correct order. the main window(Mstar ISP utility Vx.x) will be opened. Only for training and service purposes -7- LGE Internal Use Only 1 Filexxx. All right reserved.x. Adjust tool option refer to the BOM. set can operate abnormally) (1) Profile : Must be changed the option value because being different with some setting value depend on module maker. 1 Filexxx.EDID D/L method: The EDID data is automatically saved. 6) Click “(3)Run”.5. inch and market. Downloading of EDID could be failed. 4.) Refer to Job Expression of each main chassis assembly (EBTxxxxxxxx) for Option value.The input methods are same as other chassis. Check the updated SW Version and Tool Option. the input menu can differ the model spec. EDID Data . 2) SW Version check Check “Main : Vx. [Caution] .2.Tool Option Input : PCBA Check Process .4) Read and write bin file. Check SW Version (1) Method 1) Push In-star key on Adjustment remote control. . If the cables are connected. * 22LK230 ** HDMI : 256Bytes 0 0 10 20 0 1 0F 1 55 B8 3D 0 2 12 8A 0A 98 0 18 0 1 FF 15 49 1 0 28 0F 4C 3 84 20 A0 8C 0 11 0 2 FF 1 4B 1 E0 55 2E 47 1D 93 E0 20 0A 18 0 0 3 FF 3 20 1 0E 40 8 20 72 83 2D 51 D0 8C 0 0 4 FF 80 0 1 11 E0 0 54 23 1 10 20 90 0A 0 0 5 FF 30 0 1 0 0E 0A 56 9 0 10 18 20 A0 0 0 6 FF 1B 1 1 0 11 20 0A 7 0 3E 10 40 14 0 0 7 0 78 1 1D 1A 0 20 20 7 65 96 18 31 51 0 0 8 1E 0A 1 0 1 0 20 20 4A 3 0 7E 20 F0 0 0 9 6D F3 1 72 1D 1E 20 20 6 0C E0 23 0C 16 0 0 A 1 30 1 51 0 0 20 20 7 0 0E 0 40 0 0 0 B 0 A4 1 D0 BC 0 20 20 15 10 11 E0 55 26 0 0 C 1 54 1 1E 52 0 0 20 16 0 0 0E 0 7C 0 0 D 1 46 1 20 D0 FD 0 20 2 8C 0 11 E0 43 0 0 E 1 96 1 6E 1E 0 0 1 3 0A 18 0 0E 0 0 0 F 1 26 1 28 20 31 FC A2 11 D0 8C 0 11 E0 0 14 1 Filexxx.bin 4. you have to change the Tool option and have to AC off/on (Plug out and in) (If missing this process.3. 7) After downloading.Don’t connect HDMI cable when downloading the EDID.Don’t Press “IN-STOP” key after completing the function inspection.(Use INSTART key on the Adjustment remote control.Area Option Input : Set Assembly Process After Input Tool Option and AC off Before PCBA check. Inc. you can see the “4)Pass” message. . and then load download file (XXXX.bin 30 40 50 60 70 80 90 A0 B0 C0 D0 E0 F0 5) Click “(2)Auto” tab and set as below.bin) by clicking “Read”.LK230 * If TV is Turn On. 4. Only for training and service purposes -8- LGE Internal Use Only . Copyright © 2011 LG Electronics.) (If not changed the option. All right reserved. Input tool option. (2) Equipment : Adjustment remote control (3) Adjustment method .xx” . Click “(1)Read” tab. 290 ± 0. y < target i) First decrease B. then stick sensor to the module when adjusting. (3) For manual adjustment.Need to transmit the aging off command to TV set after finishing the adjustment. y). 00.Maintain the DDC adjustment mode with same condition of Heat-run => Maintain after AC off/on in status of Heatrun pattern display) (2) Release the DDC adjustment mode .295 ± 0.LCD TV(ch : 9) (should be used in the calibrated ch by CS-1000) 3) Auto W/B adjustment instrument(only for auto adjustment) 5. All right reserved. Picture Mode : User 1 Dynamic Contrast : Off Dynamic Colour : Off (If you miss the upper condition. Adjustment of White Balance (for Manual adjustment) (1) Color analyzer(CA100+.1. 00) (4) Release the adjust mode of white balance . 3) Change to the AV mode by remote control.1. y > target i) Decrease the R.The input methods are same as other chassis.280 ± 0. (If not executed this step. 1) x. 7) Adjust R/ G/ B Gain using F/G(VOL +/-) key on R/C. 4) Input external pattern (85 % white pattern) 5) Push the ADJ key two time(entering White Balance mode) -> Enter “04 13” (Password) 6) Stick the sensor to the center of the screen and select each items (Red/Green/Blue Gain and Offset) using D/E(CH +/-) key on R/C.308 ± 0. CA210) should be used in the calibrated ch by CS-1000 (2) Operate the zero-calibration of the CA100+ or CA-210.) -9- LGE Internal Use Only . you have to measure at the below conditions.000 0. (3) Adjustment method .Enter the white balance adjustment mode with aging command (F3.Purpose : Adjust the color temperature to reduce the deviation of the module color temperature.Release the Adjust mode when receiving the aging off command(WB 00 FF) from adjustment equipment.Required Equipment 1) Remote control for adjustment 2) Color Analyzer : CA100+ or CA-210 or same product . (2) Equipment : Adjustment remote control.002 y 0.300 K 8. 8) Adjust three modes all (Cool/ Medium/ Warm) : Fix the one of R/G/B gain and change the others.Adjustment mode : Three modes .Cool / Medium / Warm (Medium data is automatically calibrated by the Cool data) . Inc. FF) Copyright © 2011 LG Electronics.002 0.) Refer to Job Expression of each main chassis assembly (EBTxxxxxxxx) for Option value. SET assembly adjustment method 5.. .) 2) Push “Exit” key.) Coordinate Mode Cool Medium Warm x 0. So use below table. . (1) Enter the adjustment mode of DDC . 1) Select white pattern of heat-run by pressing “POWER ON” key on remote control for adjustment then operate heat run longer than 15 minutes. * CASE First adjust the coordinate far away from the target value(x. . so make y a little more than the target.002 0. Only for training and service purposes To check the Coordinates of White Balance. 3) x > target.2. y < target i) First decrease the B gain. Fix the one of R/G/B gain to 192 (default data) and decrease the others. ii) Decrease the one of the others.Release the white balance adjustment mode with aging command(F3.000 5. 00. G.Check DDC adjust mode release by exit key and release DDC adjust mode) (3) Enter the adjust mode of white balance . 2) x. the coordinates of W/B can be lower than the spec.2. Adjustment of White Balance .283 ± 0.Enter the DDC adjustment mode at the same time heatrun mode when pushing the power on by power only key.2. so make x a little more than the target. Exit adjustment mode using EXIT key on R/C.Principle : To adjust the white balance without the saturation.5. Input Area-Option (1) Profile : Must be changed the Area option value because being different of each Country’s Language and signal Condition.002 Temp 9.(Use INSTART key on the Adjustment remote control.319 ± 0. ii) Adjust x value by decreasing the R 4) x < target.22 Set command delay time : 50 ms .2. 9) When adjustment is completed. .002 0.500 K uv∆ 0. Connecting diagram of equipment for measuring (For Automatic Adjustment) * LP92A Support I2C Interface For ADC/DDC Adjustment. ii) Adjust x value by decreasing the G (4) Standard color coordinate and temperature when using the CA100+ or CA210 equipment (Small size inch’s color coordinate is different from others.000 K 6. the condition for W/B may be different.Release the adjust mode after AC off/on or std-by off/on in status of finishing the Hear-run mode .000 0. y > target i) First decrease B. * Luminance min value is 150cd in the Cool/Medium/Warm mode(For LCD) 5. . it is also possible by the following sequence.002 0. Fire. Shock. All right reserved.EXPLODED VIEW IMPORTANT SAFETY NOTICE Many electrical and mechanical parts in this chassis have special safety-related characteristics. Do not modify the original design without permission of manufacturer.10 - 510 A2 A10 900 LGE Internal Use Only . Only for training and service purposes . 400 910 401 LV1 530 540 120 810 820 200 300 Copyright LG Electronics. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent X-RADIATION. These parts are identified by in the Schematic Diagram and EXPLODED VIEW. Inc. or other Hazards. INPUT AV IN/OUT JK101 PPJ234-03 [YL]E-LUG [YL]O-SPRING CVBS_VIN R110 75 ZD101 SD05 ZD102 SD05 6E 5E 4E 5D 4C 5C 7C 5B 7B 4A 5A 6A [YL]CONTACT [WH2]O-SPRING CVBS_LIN READY C106 560pF 50V R101 12K R103 10K R108 220K D101 30V [RD2]CONTACT [RD2]O-SPRING CVBS_RIN READY C107 560pF 50V R102 12K R104 10K R109 220K D102 30V [RD2]E-LUG-S [WH1]O-SPRING C105 10uF 16V MNT_LOUT MUTE_LINE POP NOISE MMBT3904(NXP) Q106 C B E R127 1K C103 5600pF 50V D108 30V [WH1]E-LUG-S [RD1]CONTACT B Q104 MMBT3904(NXP) C E MNT_ROUT MUTE_LINE POP NOISE C104 10uF 16V R128 1K MMBT3904(NXP) Q105 B C E C102 5600pF 50V D107 30V [RD1]O-SPRING [RD1]E-LUG B Q103 MMBT3904(NXP) C E 16. All rights reserved. WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.5V_AOUT FOR DEBUG FOR DEBUG R111 470 MMBT3904(NXP) Q102 FOR DEBUG R114 47 FOR DEBUG GAIN X 4 FOR DEBUG E B C C JP101 FOR DEBUG R106 220 E B ISA1530AC1 Q101 MNT_VOUT_T FOR DEBUG R112 68 THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. [AV] EAX64207701 INPUT 2011/5/6 1 7 Copyright © 2011 LG Electronics. Only for training and service purposes LGE Internal Use Only . Inc. FILRE AND ELECTRICAL SHOCK HAZARDS. 6V 7 LED_POWER READY ZD200 5.6V TXCE0+ TXCE0- 6 25 5 26 4 27 3 28 2 29 1 30 31 .1uF 50V READY C206 100pF 50V READY ZD202 5.7K LED_KEY ST_3. WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.3V_M ZD201 5. All rights reserved. FILRE AND ELECTRICAL SHOCK HAZARDS.TXCE1-. 8 9 R203 10K LED_POWER C201 0.TXCLKE- 5V_LCD HD(22") P204 FF10001-30 30 1 29 2 28 3 27 4 26 5 22"LGD/Tsinghua KEY1 READY C209 100pF 50V READY C212 100pF 50V IR & LED KEY1 READY ZD204 5.TXCE0-. EAX64207701 LVDS/IR/KEY 2011/5/6 2 7 Copyright © 2011 LG Electronics.TXCE3-.1uF 50V C205 READY 47pF 50V +ST_5V 4 TXCLKE+ TXCLKE- 15 16 14 17 13 18 GND 5 TXCE2+ TXCE2- 12 19 11 20 10 21 IR 3.TXCE3+. Inc.1uF 50V C208 100pF 50V R230 0 READY ZD205 5.TXCLKE+.TXCE1+.6V GND 3 TXCE3+ TXCE3- 18 13 17 14 16 15 IR READY C202 0.6V 6 TXCE1+ TXCE1- 9 22 8 23 7 24 LED_KEY R206 4. Only for training and service purposes LGE Internal Use Only .1uF 50V READY C204 100pF 50V THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.3V C203 0.TXCE2+.TXCE2-.6V 12507WR-08L P201 25 6 24 7 23 8 22 9 KEY2 R229 0 1 KEY2 MBW3216-501TF JEIDA 21 10 20 11 19 12 2 L203 ST_5V 500-ohm C207 0.LVDS/IR_LED_KEY TXCE0+. All rights reserved.7K ENKMC2838-T112 D302 A1 C A2 C302 0.6 R_TX2+ JK301 YKF45-7058V JK302 SPG09-DB-010 6630TGA004Q I2C Control 6 1 7 2 8 3 9 4 10 5 15 14 13 12 11 RED_GND GND_2 RED GREEN_GND DDC_DATA GREEN BLUE_GND H_SYNC BLUE NC V_SYNC GND_1 SYNC_GND DDC_CLOCK DDC_GND D304 30V C306 33pF READY D303 30V C305 33pF READY DSUB_SDA DSUB_SCL 16 SHILED THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS.6 G_TX1+ R_TX2- R311 3 2 R312 1 5. Only for training and service purposes LGE Internal Use Only .7K HDMI_SDA HDMI_SCL 10 10 C304 33pF READY R305 5.6 5.HDMI HDMI ฀ C R302 1K HD_5V R320 4. WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.6 5.7K R303 R304 15 14 13 READY R301 10K E 2SC3052 Q301 R313 B 10K HPDCTL SHIELD 20 R323 10K R321 10K 19 18 17 16 HDMI_5V_DET 5V_M HD_5V C303 33pF READY R331 4.6 B_TX0+ G_TX1- R309 6 5 R310 4 5. Inc.1uF 50V R329 4.6 5. EAX64207701 HDMI/RGB 2011/5/6 3 7 Copyright © 2011 LG Electronics.6 TXCLK- 12 11 R306 10 5.6 TXCLK+ B_TX0- R307 9 8 R308 7 5. 5K 0.01uF 50V R404 0 PRE-AMP 5 3 CHIP_CARRIER OUTPUT2 R407 820 READY C410 0.8K C415 0. Only for training and service purposes LGE Internal Use Only .8K TU_SW_VIF D403 KDS114E(KEC) 35V TU_SW_VIF R429 0 1 4 OUTPUT1 VIF1 READY L404 2. WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.01uF 50V 5V_M TU_SW_VIF R425 3.01uF 50V C407 10uF 10V C413 0.01uF 50V R410 220 C B PRE-AMP C414 0. FILRE AND ELECTRICAL SHOCK HAZARDS. PAL(w/o NT) M3953 K7257 EAX64207701 TUNER L402 M9370 K9653 2011/5/6 4 7 Copyright © 2011 LG Electronics.1uF 16V VIF2 PRE-AMP READY R412 R427 22 22 NO_SW_VIF R430 0 TU_CTL_VIF B Layout placement Close to Tuner ONLY_MA TU401-*1 TDTK-H701F ONLY_TA(NO_SW) L402 K9362M INPUT 1 4 OUTPUT1 SIF1 TU_SW_SIF R422 6.DK.7K R415 C411 47pF 50V 47 R433 4.3K C TU_SW_VIF 2SC3875S(ALY) Q403 5V_M TU_SW_VIF R420 6.7K TUNER_SDA TUNER_SCL R414 C412 47pF 50V 47 READY R445 0 5V_M PRE-AMP R409 0 Layout placement Close to Mstar IC PRE-AMP PRE-AMP AIF- L401 820nH R411 680 READY C755 22pF 50V No PRE-AMP 5V_M TU_SW_VIF R419 6.3K TU_SW_SIF R443 10K E C TU_SW_SIF 2SC3875S(ALY) Q402 TU_SW_SIF D402 KDS114E(KEC) INPUT-GND 2 35V TU_SW_SIF R428 0 NO_SW_SIF R431 0 5 OUTPUT2 SIF2 3 CHIP_CARRIER-GND TU_CTL_SIF B ONLY_TA(SW) L402-*2 K9653D INPUT ONLY_MA L403-*1 M3953M 4 OUTPUT_1 ONLY_MA L402-*1 M9370M 4 OUTPUT_1 INPUT 1 4 OUTPUT_1 1 INPUT 1 SWITCHING_INPUT 2 PAL-BG. Inc.8K R403 PRE-AMP 0 C409 ONLY_TA L403 K7257M INPUT PRE-AMP(TA) PRE-AMP PRE-AMP PRE-AMP(TA) SHIELD R406 1.1uF 16V R432 4.2uH SWITCHING_INPUT 2 C401 0.1uF 16V C417 0. All rights reserved.I TU_CTL_VIF High NTSC-M 5 OUTPUT_2 INPUT-GND 2 CHIP_CARRIER-GND 3 5 OUTPUT_2 INPUT-GND 2 5 OUTPUT_2 3 CHIP_CARRIER-GND Low 3 INPUT-GND/CHIP_CARRIER_GND L403 NTSC THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.01uF 50V BFS17W Q401 E 5V_M TU_SW_VIF R424 10K TU_SW_VIF R417 10K E TU_SW_SIF R421 6.TUNER ONLY_TA TU401 TDTK-G701D 1 2 3 4 5 6 7 8 9 10 11 12 NC_1 NC_2 NC_3 RF_AGC R418 100 D401 R423 ONLY_MA 30V 12K TU_AGC 5V_M 5V_M B+[+5V] SDA SCL NC_4 NC_5 NC_6 READY R444 0 5V_TUNER ONLY_MA Near the pin C404 0.8K 1 2 3 4 5 6 7 8 9 10 11 12 SHIELD NC_1 NC_2 NC_3 RF_AGC B+[+5V] SDA SCL NC_4 NC_5 NC_6 DIF[-]/AIF5V_M TU_SW_SIF R436 10K 5V_M TU_SW_SIF R416 3. 6K 16.3V_M 16.01uF R505 3. All rights reserved.6K 5 INPUT2+ INPUT3+ 10 6 INPUT2C556 33pF 50V R544 12K R547 6.5V_AOUT C551 0.47uF 50V C544 0.5V_SAMP VR_ANA OC_ADJ C523 BST_A OUT_A 0.7K R515 4. Inc.7uF 10V C514 1000pF 50V READY R524 22K PULL DOWN C527 0.13 MNT_L_AMP R542 5.33uF 50V R503 3.AUDIO R502 0 This parts are Located on AVSS area.033uF 50V 2S C525 0.3 C518 0.5V_AOUT R543 5.7K 2 INPUT1R546 6.3V_DVDD C516 0.3 R506 3.3 C517 0.033uF 50V 2S TESTOUT MCLK OSC_RES DVSS_1 VR_DIG PDN AD-9060 L506 15uH 2F C542 0. FILRE AND ELECTRICAL SHOCK HAZARDS.1uF LRCLK SCLK SDIN SDA AD-9060 L507 15uH C519 0. Only for training and service purposes LGE Internal Use Only . WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.3 120-ohm MLB-201209-0120P-N2 1S 1F R510 I2S_MCLK +3.8K INPUT4.01uF 2F C541 0.7K 33 GND GVDD_OUT_2 DVSS_2 RESET STEST BST_D PVDD_D_1 33 C503 33pF READY C502 33pF READY PVDD_D_2 OUT_D DVDD AGND VREG 3.01uF 50V GND 11 MNT_R_AMP 16.1uF 50V C MMBT3904(NXP) Q503 B E R537 4. R526 470 4700pF 2200pF C536 0.33uF 50V R504 3.33uF 50V C524 0. EAX64207701 AUDIO 2011/5/6 5 7 Copyright © 2011 LG Electronics.047uF C548 C545 PLL_FLTP PLL_FLTM PVDD_A_2 PVDD_A_1 470 GVDD_OUT_1 SSTIMER R523 C532 C531 1uF 25V 16.047uF 4700pF R525 0.01uF C537 0.7K C555 6800pF 50V R539 1K 7 OUT2 OUT3 8 MNT_ROUT THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.01uF AVSS C512 10uF 25V READY C511 10uF 25V 12 11 10 9 8 7 6 5 4 3 2 1 3.01uF 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 TAS5709PHPR IC501 48 47 46 45 44 43 42 41 40 39 38 37 PGND_AB_2 PGND_AB_1 OUT_B PVDD_B_2 PVDD_B_1 BST_B BST_C PVDD_C_2 PVDD_C_1 OUT_C PGND_CD_2 1S C520 0.9 C554 0.033uF 50V C508 10uF 10V C521 0.3V_M L501 120-ohm MLB-201209-0120P-N2 0.01uF 120-ohm MLB-201209-0120P-N2 SMAW250-H04R P501 R511 I2S_WS I2S_SCK 100 100 100 1F R512 R513 SCL PGND_CD_1 I2S_SDO L511 120-ohm MLB-201209-0120P-N2 AUAMP_SDA AUAMP_SCL R509 R507 R514 4.01uF C509 10uF 25V C529 1uF 25V C535 C526 0.01uF AMP:GAIN X 4 16.1uF C510 10uF 25V READY 3.3V_M L504 120-ohm MLB-201209-0120P-N2 NC L508 AVDD C504 10uF 10V C522 0.033uF 50V 22K Separate DGND AND AVSS C546 C547 0.5V_SAMP SW_RESET R508 33 C501 1000pF READY +3.33uF 50V C543 0.01uF JP504 SPK_L+ L509 120-ohm MLB-201209-0120P-N2 JP503 SPK_LJP501 SPK_R+ JP502 L510 SPK_R1 .1uF 50V MMBT3904(NXP) C Q502 B C552 6800pF 50V R538 1K C553 33pF 50V IC502 1 OUT1 R541 12K SN324 OUT4 14 MNT_LOUT E R536 4. 2 3 4 R516 1K C549 4.01uF C538 0.8K INPUT3.5V_AOUT 3 INPUT1+ INPUT4+ 12 4 VCC C550 0.47uF 50V C540 0.3V_DVDD 100 R520 200 1% 1% 18K R519 C539 0. 047uF IC604 LGE7873-LF C662 0.7K R672 R673 22 DSUB_SDA Closed IC AVDDP1 B_TX0+ G_TX1- TXCLK- B_TX0- TXCLK+ I2S_MCLK HPDCTL G_TX1+ POWER_SW I2S_SCK I2S_WS HWRESET HDMI_SDA I2S_SDO HDMI_SCL VDDC MAIN(MARIA8) ST_3.01uF C632 C634 C635 22K 22K PANEL_ON PANEL_STATUS LED_KEY P_DIM TUNER_SCL TUNER_SDA HDMI_5V_DET DDC_CTL Close to IC as close as possible THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.3V_M TU_CTL_VIF L602 120-ohm C638 10uF 10V 5V_M SIF2 L601 120-ohm C655 1uF 10V C607 0.01uF 50V AVDD_MPLL AVDD_VIF AVDD_VIF_2 C645 0.1uF READY R660 100 C656 0.7K GND 4 5 SI/SIO0 SPI_DI 128 127 126 125 124 123 122 121 120 119 118 117 116 115 114 113 112 111 110 109 108 107 106 105 104 103 RXA2N R_TX2- 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 102 101 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 DDCA_CLK AVDD_5 GND_3 LVA0P LVA0N R675 22 Closed IC R674 DSUB_SCL RXA2P R_TX2+ AVDDP1 C644 0.1uF AVSS_1 AVDD_ADC C641 0. Only for training and service purposes LGE Internal Use Only .01uF 50V A2 3 6 SCL C621 33pF READY C622 33pF READY LVA2N LVACLKP LVACLKN LVA3P LVA3N VDD_4 LVB0P LVB0N LVB1P LVB1N LVB2P LVB2N LVBCLKP LVBCLKN LVB3P LVB3N VSS_1 VDDC_2 GPIOD[0] GPIOD[1] SW_RESET R650 C666 0.ST_3.3V 2 4 R621 100 HWRESET C604 0.01uF C637 0.7uF 10V C643 10uF 10V C654 0.1uF C665 C659 Closed IC 100 R667 R666 100 Closed IC R664 R684 DDCD_SDA DDCD_SCL R665 R608 10K SPI_CZ DDCA_DAT R610 100 R611 CS# 1 8 VCC C606 0. FILRE AND ELECTRICAL SHOCK HAZARDS.5V R698 1K READY R699 1K R604 1K R603 1K R606 6.2uF C631 0.7K SERIAL FLASH 2M IC603 MX25L1606EM2I-12G 3.TXCLKEA1 2 7 WP C602 0.1uF 3.1uF SPI_CZ SPI_CZ TAGC AVDD_4 SPI_DI SPI_DI TU_AGC READY C642 0.1uF C633 10uF 4.3V_M TU_SW_SIF C653 0.3V 4.Park C636 0.1uF TU_SW_VIF R615 22 R616 22 MAIN_SCL MAIN_SDA GND 4 5 SDA VSYNC0 AVDD_ADC CVBS0 VCOM0 CVBSOUT AVSS_ADC AVDD_2 XTAL_OUT XTAL_IN AVSS_2 AVSS_3 AVDD_3 AVDD_ADC CVBS_VIN R633 MNT_VOUT_T C648 0.1uF 16V R620 C625 100 33pF READY R622 100 SO/SIO1 AVDD_6 VDDC_3 AUMCKO WAKEUP SPI_DO 2 7 HOLD# HOTPLUG RXA1P RXA1N RXA0P RXA0N RXACP RXACN VSS_2 VDD_6 AUSCK AUSDO RESET VDD_5 ST_3.3V_M ST_3.TXCE0-.1uF 16V C610 100pF 50V C615 0.1uF EEPROM(A0) IC601 AT24C64D-SSHM-T A0 1 8 VCC AVDD_1 BIN0 GIN0M GIN0 SOGIN0 RIN0 C651 0.3V L605 120-ohm C649 10uF 10V C663 0.7K R696 R662 0 1.7K 100 LED_POWER Closed IC R671 100 Closed IC IR 4.1uF AVDDP2 R663 4.01uF 50V AVDDP2 AVSS_VIF_2 R625 5.1uF 16V D603 KDS181 R624 33K R659 0 3.3V AVDD_ADC KEY2 100 Closed IC 0. All rights reserved.7K READY R693 4.3V_M 4.2uF 2.7uF 1uF READY R690 1K 10k=>6.047uF C620 0. MNT_L_AMP MNT_R_AMP TU_CTL_SIF INV_ON R643 R646 A_DIM EAX64207701 MARIA8 128PIN 2011/5/6 6 7 Copyright © 2011 LG Electronics.1uF 0.1uF A2 L606 600 AVDD_VIF_1 AVSS_VIF_1 VIFIP VIFIM SIFIM 3 6 SCL VSS 4 5 SDA VIF2 VIF1 SIF1 READY R658 0 C624 22 33pF READY VDDC 3.3V_M AVDD_MPLL C612 27pF 14.3V L604 120-ohm C650 10uF 10V C664 0.3V_M LVA1P LVA1N LVA2P TXCE0+.1uF Closed IC Closed IC 1K 1K C658 0.8k.3V 3.1uF 16V AVDDP1 TXCE0TXCE0+ TXCE1TXCE1+ TXCE2TXCE2+ TXCLKETXCLKE+ TXCE3TXCE3+ HDCP EEPROM(A8) 3.TXCE2-.8K KDS181 D601 R609 150 C601 47uF 25V ISA1530AC1 Q601 100 KDS181 D602 R612 2K R613 10K READY R644 R645 C661 R601 0 VDDC AVDDP1 AVDDP1 AVDDP1 FLASH_WP R669 100 R670 100 0.TXCE2+.3V FLASH_WP 100 R607 100 WP#/AGC 3 6 SCLK SPI_CLK AUWS SAR0 SAR1 SAR2 IRIN INT 4.3V_M C667 0.7K KEY1 R668 4.1uF R628 1M R642 200 R602 4.01uF 100 R661 Closed IC 100 R682 Closed IC 100 R649 Closed IC READY 100 R656 Closed IC R681 100 Closed IC R651 0.01uF 50V VDDC CVBS_LIN CVBS_RIN R630 R631 33 33 C627 C628 2.2V_VDDC_M8 L603 120-ohm C640 4.7uF 10V LINE_OUT_0L LINE_OUT_0R GPIOB[12] GPIOB[11] GPIOB[10] GPIOB[9] GPIOB[8] GPIOB[3] GPIOB[2] GPIOB[1] GPIOB[0] PWM3 PWM2 PWM1 PWM0 TESTPIN AVSS_4 VDDC_1 AUVRP AUVAG GND_1 VDD_1 VDD_2 GND_2 VDD_3 ALE 3.1uF 16V C614 10uF 10V C608 0. WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.1uF AVDD_AUSDM SPI_DO SPI_DO ST_3.1uF 16V SIFIP R676 0 R683 0 R686 0 READY R691 0 100 Closed IC AVDDP1 AVDD_ADC AVDD_VIF AVDD_AUSDM ST_3.TXCE3+.31818MHz X601 C613 27pF C646 0.1uF 16V Seperate with IC ground NC_2 2 7 WP R655 100 R614 4.7K R697 4.TXCLKE+.7K NC_1 1 IC602 CAT24C08WI-GT3-H-RECV(TV) 8 VCC C603 0.1uF R632 33 68 C619 0.7K READY R653 0 R617 C623 22 33pF READY R618 DDC_CTL MAIN_SCL MAIN_SDA AVDD_VIF AVDD_VIF C652 0.TXCE3-.1uF R689 1K P_16.1uF 100 R654 Closed IC R619 100 Closed IC C660 0.6K VR27 SPI_CK SPI_CLK ST_3.TXCE1-. Inc.1uF LINE_IN_0L LINE_IN_0R LINE_IN_1L LINE_IN_1R AUCOM AUVRM AD[0] AD[1] AD[2] AD[3] WRZ RDZ R627 R626 R695 R694 OLP 100 Closed IC 100 Closed IC 100 Closed IC 100 Closed IC 100 Closed IC 100 Closed IC R692 4.7K AUAMP_SCL AUAMP_SDA MAIN_SCL MAIN_SDA OLP MUTE_LINE R687 R685 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 DEBUG RESET ST_5V JTP-1127WEM SW601 1 3 C611 4.7K READY R648 R647 100 MUTE_LINE READY 4.TXCE1+. 2uF 16V R711 4.6K C R728 10K E 5V_M C734 10uF 10V C737 0.3V R754 10K 5 C723 0. FILRE AND ELECTRICAL SHOCK HAZARDS.1uF 16V VIN_3 PWRGD BOOT C774 0.022uF 16V FOR DEBUG SAM2333 LD701 THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.1uF 16V OUT:1.1uF 16V GND_1 GND_2 1 2 3 4 THERMAL 17 12 11 PH_3 PH_2 PH_1 SS C775 0.Dim 11 S2 READY C718 47uF 16V R732 33K C721 1uF 25V NC READY R706 0 C706 2.3V C729 100uF 16V 1 R743 C733 10uF 10V R784 R1 50V 100pF C779 3.3TRE1 IC701 ST_5V VIN 3 2 MAX 300mA 1 GND VOUT L701 ST_3.7K R749 4.8uH 1 8 499 R770 20K R771 1% R736 4.01uF 25V READY C714 1uF 25V P_16.1uF 50V EN 3 6 COMP C767 47pF 50V C768 4700pF 50V R742 27K SS/TR 4 5 VSENSE 100K R741 R701 10K R703 1.5V_SAMP READY IC706 AP1117EG-13 IN 3 READY C740 10uF 16V READY **DC-DC CONVERTER 16.01uF 50V ST_5V P_16.3V 120-ohm G2 S1 PANEL A_DIM R725 10K R756 10K R765 10K C R764 B 10K R733 10K C MMBT3904(NXP) Q703 E C719 1uF 25V G1 PANEL_STATUS C702 0.2K C762 0.01uF 50V C711 0. 3.1uF 16V EP[GND] EN 5V_M VIN_1 C771 10uF 10V VIN_2 C772 0.27V P703 SMAW200-12 22K 1% 24K 1% R783 10 IC702 SN1007054RTER 9 5 6 7 8 COMP VSENSE 16.1uF 50V PARK 3. EAX64207701 POWER 2011/5/6 7 7 Copyright © 2011 LG Electronics.6uH 16 15 14 13 1.5V->5V_TUNER 16.1uF 16V AP2121N-3.9K R772 Power indicator ST_5V 5V_M FOR DEBUG FOR DEBUG C760 10uF 25V C761 0.5V 500 C703 68uF 35V C707 0.1uF C763 IC703 TPS54331D 40V BOOT PH D701 SMAB34 L709 6.3V_M 5V 3. P5V -> 5V_12V_LCD Q705 AO4813 EBK60706901 L705 **Switch 5V:P5V -> 5V_M PWM_Dim 10 A.7K R752 4. Only for training and service purposes LGE Internal Use Only .3V_M 10K R780 C773 0.5K C776 3300pF 50V L711 3.7K DC_DIM R709-*1 1K P_5V 1 2 3 4 8 7 6 5 D2_2 D2_1 D1_2 D1_1 MLB-201209-0120P-N2 L708 5V_LCD C731 0.01uF 50V 16.3V R745 1 C710 10uF 10V C713 0.5V_AOUT 5V_M 16V 0.2V_VDDC_M8 LQH88PN3R6N38K C777 22uF 10V C778 22uF 10V C780 0.5V 2 7 GND READY C769 0.2uF 16V P_5V R734 22K R735 1.1uF 16V 2 OUT READY 1 R759 ADJ/GND 110 READY 5V_TUNER READY C750 47uF 16V READY R757 330 DCDC_5V_TUNER L706 120-ohm R740 1 READY C749 0.01uF 50V 12 ST_3.5V 120-ohm C704 47uF 25V C708 0.2V_VDDC_M8.5V 1 P_16.1uF 50V 120-ohm R747 4.01uF 50V C712 0.01uF 50V POWER_SW B MMBT3904(NXP) Q704 TUNER VOLTAGE L703 P_5V 120-ohm C705 10uF 16V C709 0.7K C764 47uF 16V C765 22uF 10V C766 0.1uF 50V VIN P_16.01uF 50V R781 1/10W 330K 5% R782 7.7K C745 100uF 16V C748 0.3TR/E1 5V P_5V 5V_M ST_3.2K PWM_DIM R709 100 READY C701 2. All rights reserved.5V TO 5V DCDC CONVERTER C741 10uF 16V READY C743 0. Inc.5V RT/CLK AGND 2 1/16W 5% GND 3A Vout=0.5V 16.47uF 25V PANEL_ON READY R727 10K R729 10K B Q706 E MMBT3904(NXP) P_DIM R715 1K R716 6.Power STAND_BY VOLTAGE 5V_M -> 1. WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.1uF 50V INPUT 3 MAX 3A 2 OUTPUT 1 ADJ/GND OUT:3.1uF 50V L702 16.8*(1+R1/R2) R2 R785 75K 1/8W 1% 3 GND 4 IC704 AZ1085S-3.3V_M R712 3K READY 6 GND 2SC3875S Q701 R713 2 10K 3 1 R755 10K 7 INV_ON OLP OLP 8 MULTI VOLTAGE Inverter_ON 9 **Switch 12V:P12V. . [ DESIGN CONCEPT ] BIG-BANG (MSTAR) Module (HD) Speaker BIG-BANG Revision (MSTAR) Module (HD) Speaker MSTAR (MARIA8) LGE7871 Audio Amplifier (Digital) NPT3200L Hotel speaker out MSTAR (MARIA8) LGE7873 Audio Amplifier (Digital) TAS5709PHPR Analog AUDIO out Digital Inputs Analog Inputs Digital Inputs Analog Inputs HDMI RF/AV/COMPONENT Option HDMI RF/AV . 5 (2 Layer) N N (Support up to 720p for Component/HDMI ) N X (Only Support AV Audio Output) Optional 1EA 1EA 1EA X X X X X 1EA Maria8-Revision (HD) MSTAR Maria8(LGE7873) WXGA PSU (22” Lips) 130 x 103 (2 Layer) N N (Support up to 720p for Component/HDMI ) N X (Only Support AV Audio Output) X 1EA X 1EA X X X X X 1EA . Comparison TV Minimalist & Value Maximizers Spec Main Chip Module PSU PCB Size PIP 1080p input support 1080p Panel support AV Output Hotel Speaker Out HDMI Component AV S-Video RGB_PC RS-232 USB (Function) USB(D/L SVC) Tuner Maria8 (HD) MSTAR Maria8(LGE7871) WXGA PSU (19”/22” Lips) 206 x 90.Spec. Each items support User Mode) Picture Mode value can be changed for all mode Standard/Music/Cinema (In Standard/Music/Cinema. Support Treble & Bass setting for all input) Not Support Input List appearance in vertical box Not Available Picture Picture Mode Advanced Control Audio Sound Mode Clear Voice Input PIP . Each items support User Mode) Picture Mode value can be changed for all mode Standard/Music/Cinema (In Standard/Music/Cinema.UI Comparison Item UI Setup Detailed Item OSD Program Edit Font Type GUI Favorite Channel: supports 8 favorite channel Vivid/Standard/Cinema (In Vivid/Standard/Cinema. Support Treble & Bass setting for all input) Not Support Input List appearance in vertical box Not Available BigBang BigBang-Revision Font Type GUI Favorite Channel: supports 8 favorite channel Vivid/Standard/Cinema (In Vivid/Standard/Cinema. 5V VIF_12V IC603 Serial Flash 2M IC601 EEPROM 24C64 ST_3.5V VIF SAW K7257M 67 68 Input MST7873KM 17 14.3V IC602 HDCP 24C08 74 72 73 71 P_5V Q705 DUAL FET AO4813 LVDS Output 79~88 66 55 58 59 SPI_CLK SPI_DI SPI_CZ SPI_DO Main SDA Main SCL 105 107 52 106 KEY IR 26 27 25 24 4 5 4 5 SIF SAW K9362M 1 Input 1 Audio R-Out Audio L-Out Video In Audio In Audio In (( (( Low Pass FILTER P501 IC501 Audio_SCL ] LCD_5V A_OUT_16.3V REG IC702 DCDC Main_3.5V 5 Tuner_5V Audio Out 23 24 IC703 DCDC Converter JK201 P_16.5V S_AMP_16.3V Main_1. ON 10 11 P Dim A Dim Module P204 P201 Led_Power Led_Key IR/KEY P_16.2V 49 Tuner SDA Tuner SCL TUNER 114115 116 117 70 69 102 103 110 111 12 35 36 42 43 S_AMP_19V 2 3 15 20 21 22 1 46 36 39 Sound AMP TAS5709PH I2S_MCLK I2S_WS I2S_SCK I2S_SDO Audio_SDA D-SUB SCL/SDA HDMI SCL/SDA OP-AMP IC502 x4 Gain B+ A_OUT_16.3V REG IC604 AIF+ AIF10 4 RF_AGC 6 7 11 Main_5V IC704 3.5V .31818Mhz 18 4 50 ST_5V IC701 3.[ BLOCK DIAGRAM ] POWER BOARD P703 8 OLP 9 Inv. 45. 44.2V / L702 16.[ POWER FLOW DIAGRAM(1) ] SMAW200-11 Q705 L708 P204 : HD P703 5 5V P_5V 5. 30.11V / P201 : IR + LED 4 : ST_5V TU401 : TDTK-G701D(B+) 19V 1 DCDC 1A 1A Vol Reg 5. 11. 35. 109.09V / IC604 : MST7873KM IC604 : MST7873KM ----------------------------4 : AVDD_ADC 11 : AVDD_ADC 16 : AVDD_MPLL 21 : AVDD_VIF 22 : AVDD_VIF 30 : AVDD_VIF 32 : AVDD_AUSDM 44 : VDDC_1 46 : AVDDP1 60 : PWM1 61 : PWM2 63 : AVDDP1 77 : VDDC_2 89 : AVDDP1 101 : AVDDP1 109 : AVDDP2 118 : AVDDP1 120 : VDDC_3 125 : AVDD_ADC 1. DCDC AS7812ADTR-E1 IF Pre-amp 12.Dim 11 IC707 16. 3. 27 Inverter_On 9 PWM_Dim 10 TPS54331D IC703 IC706 L203 5. 1.5V 16. 89. 5 5V_M 5V 6 5. 61. 118. 41. 2.08V / 5V_TUNER 5 : Tuner B+ IC502 : Audio Amp 4 : VCC IC501 : TAS5709PHPR IC501 : TAS5709 -----------------------2 : PVDD_A_1. 101. 4. 63. 34. 125 16.1V / 1A 16V_S-Amp 12V_VIF 2. 3 : PVDD_A_2 13 : AVDD 27 : DVDD 34 : PVDD_D1 35 : PVDD_D2 40 : PVDD_C1 41 : PVDD_C2 44 : PVDD_B_1.33V / GND 3 IC704 3. 46.1V / 16V_A-Out A.3V 3. 40. 120 4.3V / . 3.2V_VDDC_M8 DCDC 44 .42V / IC601 : EEPROM 8 : VCC IC501 : Audio Amp 13.42V / NC NC 7 8 L703 IC701 ST_5V LDO ST_3. 21.98V / 1. 32.13V / 1A AO4813(Switching) 5V_LCD IC702 4. 22.3V_M GND 4 LDO IC602 : HDCP EEPROM 8 : VCC IC603 : Serial Flash 8 : VCC 3. 60. 77. 45 : PVDD_B_2 L701 19V 2 P_16. 3V Sound Amp IC501 (TAS5709PHPR) L504 L602 ST_3.30) 32 : AVDD_AUSDM 60 : PWM1 61 : PWM0 M-Star IC IC604 (MST7873KM) .5V_SAMP C516 C509 C523 C602 (0.118) 4 : AVDD_ADC (11.5V_AOUT Q503 MNT_R OUT R537 Q502 MNT_R OUT R536 C550 6 : INPUT2R539 C555 R539 C552 C511 C523 R541 C553 C525 R544 C556 1 : OUT1 4 : INPUT12 : PVDD_A_1 3 : PVDD_A_2 44 : PVDD_B_1 45 : PVDD_B_2 40 : PVDD_C_1 41 : PVDD_C_2 34 : PVDD_D_1 35 : PVDD_D_2 7 : OUT2 Audio Amp IC502 Sound Amp IC501 TAS5709PHPR 16.3V R698(1K) R689(1K) 46 : AVDDP1 (56.89.63.125) 21 : AVDD_VIF (22.01uF/50V) 3.101.1uF/16V) R602 HDCP EEPROM(A8) IC602 (CAT24C08WI-GT3-H-RECV) R614 R608(10K) C508 C504 C638 R691 (Ready) Serial Flash 2M IC603 (MX25L1606EM2I-12G) L501 + 3.109.3V_M 8 : VCC 8 : VCC 3 : A2 7 : WP 8 : VCC 7 : HOLD 3 : AGC 27 : DVDD 13 : AVDD EEPROM(A0) IC601 (AT24C64D-SSHM-T) C603 (0.[ POWER FLOW DIAGRAM (2) ] 4 : VCC 16. PLUG DownLoad JIG to PC with USB Cable.[ ISP METHOD ] ISP Program Download Method 1. USB Cable to PC Move Switch to the Left-end & Right RED LED On PLUG USB Cable RGB(D-Sub) Cable to VSC(H5 TV) . Unzip H5 Mstar Program.zip file to HDD 2. then JIG RED LED on. 4. this window will be disappeared. – Ignore this window (No Need to push anything).3. After a few seconds later.exe in DB07-6 driver directory. You’ll see this window several times until finishing install DownLoad Program. Execute Setup. but no need to push anything for this window.(The location of directory can be different. new HardWare setup wizard window will pop up. After finishing Installation.) Double Click ! . 5. (5-1) Click ! (5-2) Click ! (5-3) Click ! 6. Push Next(5-1). Select appropriate Directory Path and Push Next(5-2). (6-2) Click ! (6-3) Click ! (6-4) Click ! (6-5) Click ! . then push continue. While installation. and Push Next(5-3). Warning Windows pop up. (7-1) Click ! (7-2) Click ! 8. (8-1) Right Click ! (8-2) Fix the cursor to send(N) ! (8-3) Click “Make a short cut to desktop” ! . Make a ISP_tool. After a minute.7. install will be finished.exe short cut to desktop. x. Click the “Connect” button and confirm “Dialog Box” . the main window (M star ISP utility Vx. Execute ‘ISP Tool’ program.S/W ISP Method 1. Connect the download jig to D-sub (RGB) jack 2.x) will be opened 3. and then load download file(XXXX. Click “(1)Read” tab.” button and Change speed. Read and write bin file. .4. I2C Speed setting : 350Khz~400Khz 5.bin) by clicking “Read”. Click the “Config. Click “(3)Run”. 8. you can see the “(4)Pass” message. .6. Click “(2)Auto” tab and set as below 7. After downloading. [ TROUBLE SHOOTING GUIDE ] No power (LED indicator off) : [A] PROCESS Check 5V of Power B/D Pass Fail Change Power B/D Check Voltage of P201#4 St_5V Fail Change Main B/D Pass Fail Check LED Assy Pass Change LED Assy Check P201 Connector . No Raster Pass [B]: Process Check LED status On Display Unit Pass Fail Repeat A PROCESS Check Panel Link Cable Or Module Pass Fail Change Panel Link Cable Or Module Check Inverter Connector Or Inverter Pass Fail Change Inverter Connector Or Inverter Check Output of Q705 Pass Check LVDS Cable Fail Change Q705 Fail Change Module . & [B] Process Fail . & [B] Process Re-soldering or Change the defect part Fail Re-soldering or Change the defect part Repeat [A].No Raster on COMPONENT Signal Pass No Raster on HDMI Signal Pass Check Input source Cable And Jack Pass Check the Input/Output Of JK301 Re-soldering or Change the defect part Check Input source Cable And Jack Pass Check The Input/Output Of JK101 Re-soldering or Change the defect part Fail Fail Pass Pass Check the Input/Output Of IC604 Re-soldering or Change the defect part Check EDID state in SVC Mode Fail Re-Download software Fail Pass Check the Input/Output Of IC602 Pass Check the Input/Output Of IC604 Pass Repeat [A]. No Raster On AV Signal Pass Check Input source Cable And Jack Pass No Signal On TV(RF) Signal Pass Check Input source Cable And Jack Pass Check The Input/Output Of TU401 Pass Re-soldering or Change the defect part Check The Input/Output Of JK101 Fail Re-soldering or Change the defect part Fail Pass Check the Input/Output Of IC604 Re-soldering or Change the defect part Check the Input/Output Of IC703 Fail Pass Fail Re-soldering or Change the defect part Pass Repeat [A].L403 Pass Repeat [A]. & [B] Process Check the Input/Output Of L402. & [B] Process Fail Re-soldering or Change the defect part . No Sound Check The Input Sourse Fail Change The Source Input Pass Check The Input/Output Of IC501 Pass Fail Re-soldering or Change the defect part Check The Speaker Pass Fail Change Speaker Check The Speaker Wire .